Shouding
GS5812G
21V, 2A Synchronous Step-Down DC/DC Converter
Description
Features
The GS5812G is a synchronous step-down DC/DC
converter with fast constant on time (FCOT) mode
control. The device provides 4.5V to 21V input voltage
range and 2A continuous load current capability. It
is constant on time pulse width modulation (PWM)
controller that supports FCOT mode control. Operation
frequency depends on Input and output voltage
condition.
The GS5812G fault protection includes cycle-bycycle
current limit, short circuit protection, UVLO and
thermal shutdown. The soft-start function prevents
inrush current at turn-on. The GS5812G use fast
constant on time control that provides fast transient
response, the noise immunity and all kinds of very
low ESR output capacitor for ensuring performance
stabilization.
The GS5812G is offered in SOT-23-6 package,
which provides good thermal conductance.
Low RDS(ON) Integrated Power MOSFET
(145mΩ/90mΩ)
Wide Input Voltage Range: 4.5V to 21V
Output Voltage Range: 0.6V to 8V
2A Output Current
FCOT Mode Enables Fast Transient Response
Pseudo 850kHz Frequency
Input Under Voltage Lockout
Internal 1.5ms Soft-Start
Cycle-by-Cycle Current Limit
Hiccup Short Circuit Protection
Over Temperature Protection with Auto Recovery
SOT-23-6 Package
Applications
STB (Set-Top-Box)
LCD Display, TV
Distributed Power System
Networking, XDSL Modem
Pin Assignments
Package (SOT-23-6)
LX VIN SHDN
6
1
4
5
(Marking)
2
3
BST GND FB
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GS5812G
Typical Application Circuit
C3
0.1μF
R3
100kΩ
4
1
SHDN
5
VIN
L1
1.5μH
BST
LX 6
VIN
VOUT
1.05V
4.5V to 21V
GS5812G
C1
22μF/25V
FB
C5
0.1μF
R1
7.5kΩ 1%
3
GND
2
C4
(optional)
C2
22μF/6.3V
R2
10kΩ 1%
Figure 2. GS5812G Application Circuit
VIN=12V, the recommended BOM list is as below.
C1
R1
VOUT
1.05V
22μF MLCC
7.5kΩ
R2
C4
L1
C2
10kΩ
5pF~220pF
1.5μH
22μF MLCC
1.2V
22μF MLCC
10kΩ
10kΩ
5pF~220pF
1.5μH
22μF MLCC
1.8V
22μF MLCC
20kΩ
10kΩ
5pF~220pF
2.2μH
22μF MLCC
2.5V
22μF MLCC
31.6kΩ
10kΩ
5pF~220pF
3.3μH
22μF MLCC
3.3V
22μF MLCC
45.3kΩ
10kΩ
5pF~220pF
4.7μH
22μF MLCC
5V
22μF MLCC
73.2kΩ
10kΩ
5pF~220pF
4.7μH
22μF MLCC
Table 1. Recommended Component Values
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GS5812G
Functional Pin Description
Pin Name
Pin No.
Pin Function
BST
1
High side gate drive boost pin. A capacitor rating between 0.1uF~1uF must be connected from this pin to
LX. It can boost the gate drive to fully turn on the internal high side NMOS.
GND
2
Ground pin.
FB
3
Voltage feedback input pin. Connect FB and VOUT with a resistive voltage divider. This IC senses
feedback voltage via FB and regulates it at 0.6V.
4
Enable input pin. Pull high to turn on IC, and pull low to turn off IC. Connect VIN with a 100kΩ resistor for
self-startup.
VIN
5
Power supply input pin. Placed input capacitors as close as possible from VIN to GND to avoid noise
influence.
LX
6
Power switching node. Connect an external inductor to this switching node.
Block Diagram
VIN
UVLO
&
POR
SHDN
OTP
Internal
Regulator
VCC
VCC
1M
Off Time
Generator
BST
High-Side
MOSFET
FB
Internal
Soft Start
On Time
Generator
OTP
Vref
Logic
Control
Driver
Logic
LX
UVLO
LX
OCP
Low-Side
MOSFET
Cycle by Cycle
Current Limit
GND
Figure 3. Block Diagram of GS5812G
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GS5812G
Absolute Maximum Ratings (Note 1)
● Supply Voltage VIN ------------------------------------------------------------------------------------------- -0.3V to +22V
● Enable Voltage
H
------------------------------------------------------------------------------------- -0.3V to +22V
● LX Voltage VLX ------------------------------------------------------------------------------------------------ -0.3 to VIN +0.3V
● Dynamic LX Voltage in 15ns Duration------------------------------------------------------------------- -5V to VIN +5V
● BST Pin Voltage VBST --------------------------------------------------------------------------------------- -0.3V to VLX +6.5V
● All Other Pins Voltage -------------------------------------------------------------------------------------- -0.3V to +6V
● Maximum Junction Temperature (TJ) ------------------------------------------------------------------- +150°C
● Storage Temperature (TS) --------------------------------------------------------------------------------- -65°C to +150°C
● Lead Temperature (Soldering, 10sec.) ----------------------------------------------------------------- +260°C
● Package Thermal Resistance, (θJA)
(Note 2)
SOT-23-6 ------------------------------------------------------------------------------------------ 250°C/W
● Package Thermal Resistance, (θJC)
SOT-23-6 ------------------------------------------------------------------------------------------ 110°C/W
Note 1: Stresses beyond this listed under “Absolute Maximum Ratings" may cause permanent damage to the device.
Note 2: θJA is measured at 25°C ambient with the component mounted on a high effective thermal conductivity 4-layer
board of JEDEC-51-7. The thermal resistance greatly varies with layout, copper thickness, number of layers and PCB size.
Recommended Operating Conditions
● Supply Voltage VIN ------------------------------------------------------------------------------------------ +4.5V to +21V
● Operation Temperature Range --------------------------------------------------------------------------- -40°C to +85°C
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GS5812G
Electrical Characteristics
(VIN=12V, TA=25°C, unless otherwise specified.)
Parameter
Symbol
Conditions
Min
=2V, VFB=1V
VIN Quiescent Current
IDDQ
H
VIN Shutdown Supply Current
ISD
H
Feedback Voltage
VFB
4.5V≦VIN≦21V
Feedback Input Current
IFB
VFB=1V
Typ
Max
0.3
=0V
0.591
Unit
mA
1
10
μA
0.6
0.609
V
0.01
0.1
μA
High-Side MOSFET RDS(ON)
RDS(ON)
145
mΩ
Low-Side MOSFET RDS(ON)
RDS(ON)
90
mΩ
ILIMIT
3
A
VIN=12V, VOUT=1.05V
150
ns
Valley Current Limit
(Note 3)
On Time
TON
Minimum Off Time
TOFF(MIN)
VFB=0.4V
180
ns
Input Supply Voltage UVLO Threshold
VUVLO(Vth)
VIN Rising
4.3
V
UVLO Threshold Hysteresis
VUVLO(HYS)
0.35
V
TSS
1.5
ms
Internal Soft-Start Period
(Note 3)
H
Input Low Voltage
H
Input High Voltage
H
Input Current
Thermal Shutdown Threshold
Thermal Shutdown Hysteresis
H
(L
H
(H
(Note 3)
1.5
V
V
2
μA
TSD
160
°C
THYS
30
°C
H
(Note 3)
0.5
H
=2V
Note 3: Not production tested.
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GS5812G
Function Description
The GS5812G is a synchronous step-down DC/DC
converter with fast constant on time (FCOT) mode
control. It has integrated high-side (145mΩ, typ and
low-side (90mΩ, typ) power switches, and provides
2A continuous load current. It regulates input voltage
from 4.5V to 21V, and down to an output voltage as
low as 0.6V. Using FCOT control scheme provides
fast transient response, which can minimize the component size without additional external compensation
network.
Enable
Over Current Protection
The GS5812G over current protection function is
implemented using cycle-by-cycle current limit
architecture. The inductor current is monitored by
Low-side MOSFET. When the load current increases,
the inductor current also increases. When the valley
inductor current reaches the current limit threshold,
the output voltage starts to drop. When the over
current condition is removed, the output voltage
returns to the regulated value.
Short Circuit Protection
The GS5812G H
pin provides digital control
to turn on/turn off the regulator. When the voltage of
H
exceeds the threshold voltage, the regulator
starts the soft start function. If the H
pin voltage
is below than the shutdown threshold voltage, the
regulator will turn into the shutdown mode and the
shutdown current will be smaller than
1μA. For auto start-up operation, connect H
to
VIN through a 100kΩ resistor.
The GS5812G provides short circuit protection
function to prevent the device damage from short
condition. When the short condition occurs and the
feedback voltage drops lower than 0.33V, the
oscillator frequency will be reduced naturally and
hiccup mode will be triggered to prevent the inductor
current increasing beyond the current limit. Once the
short condition is removed, the frequency will return
to normal.
Soft Start
Over Temperature Protection
The GS5812G employs internal soft start function to
reduce input inrush current during start up. The typical
value of internal soft start time is 1.5ms.
The GS5812G incorporates an over temperature
protection circuit to protect itself from overheating.
When the junction temperature exceeds the thermal
shutdown threshold temperature, the regulator will be
shutdown. And the hysteretic of the over temperature
protection is 30°C (typ).
Input Under Voltage Lockout
When the GS5812G is power on, the internal circuits
are held inactive until VIN voltage exceeds the input
UVLO threshold voltage. And the regulator will be
disabled when VIN is below the input UVLO threshold
voltage. The hysteretic of the UVLO comparator is
350mV (typ).
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GS5812G
Application Information
Output Voltage Setting
The output voltage VOUT is set using a resistive
divider from the output to FB. The FB pin regulated
voltage is 0.6V. Thus the output voltage equation is:
.
T
1
R1
R2
Table 2 lists recommended values of R1 and R2 for
most used output voltage.
Table 2 Recommended Resistance Values
VOUT
R1
R2
5V
73.2kΩ
10kΩ
3.3V
45.3kΩ
10kΩ
2.5V
31.6kΩ
10kΩ
1.8V
20kΩ
10kΩ
1.2V
10kΩ
10kΩ
1.05V
7.5kΩ
10kΩ
A low ESR capacitor is required to keep the noise
minimum. Ceramic capacitors are better, but
tantalum or low ESR electrolytic capacitors may also
suffice. When using tantalum or electrolytic
capacitors, a 0.1μF ceramic capacitor should be
placed as close to the IC as possible.
Output Capacitor Selection
The output capacitor is used to keep the DC output
voltage and supply the load transient current.
When operating in constant current mode, the
output ripple is determined by four components:
R PPL
t
R PPL
R PPL (
t
C
L
R PPL
t
R
t
t
The following figures show the form of the ripple
contributions.
VRIPPLE(ESR)(t)
Place resistors R1 and R2 close to FB pin to prevent
stray pickup.
Input Capacitor Selection
The use of the input capacitor is filtering the input
voltage ripple and the MOSFETS switching spike
voltage. Because the input current to the step-down
converter is discontinuous, the input capacitor is
required to supply the current to the converter to
keep the DC input voltage. The capacitor voltage
rating should be 1.25 to 1.5 times greater than the
maximum input voltage. The input capacitor ripple
current RMS value is calculated as:
C (RM
(t)
+
VRIPPLE(C) (t)
(t)
+
VNOISE (t)
(t)
1
T
T
Where D is the duty cycle of the power MOSFET.
This function reaches the maximum value at D=0.5
and the equivalent RMS current is equal to IOUT/2.
The
following
diagram
is
the
graphical
representation of above equation.
1.25
=
VRIPPLE(t)
2A
1
ICIN(RMS) (A)
+
VRIPPLE(ESL) (t)
1.5A
0.75
1A
0.5
(t)
0.25
0
10 20 30 40 50 60 70 80 90
D (%)
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GS5812G
Application Information (Continued)
R PPL (
R
R PPL (
L
T
F
C
T
1
L
R
L
R PPL (C
That will lower ripple current and result in lower
output ripple voltage. The Δ L is inductor
peak-to-peak ripple current:
L
L
T
F
C2
L C
1
T
F
C
T
1
L
T
T
Where FOSC is the switching frequency, L is the
inductance value, VIN is the input voltage, ESR is the
equivalent series resistance value of the output
capacitor, ESL is the equivalent series inductance
value of the output capacitor and the COUT is the
output capacitor.
Low ESR capacitors are preferred to use.
Ceramic, tantalum or low ESR electrolytic capacitors
can be used depending on the output ripple
requirement. When using the ceramic capacitors,
the ESL component is usually negligible.
It is important to use the proper method to eliminate
high frequency noise when measuring the output
ripple. The figure shows how to locate the probe
across the capacitor when measuring output ripple.
Removing the scope probe plastic jacket in order to
expose the ground at the tip of the probe. It gives a
very short connection from the probe ground to the
capacitor and eliminating noise.
A good compromise value between size and
efficiency is to set the peak-to-peak inductor ripple
current Δ L equal to 30% of the maximum load
current. But setting the peak-to-peak inductor ripple
current Δ L between 20%~50% of the maximum load
current is also acceptable. Then the inductance can
be calculated with the following equation:
T(MA
T
L
F
T
C
L
External Diode Selection
For 5V input applications, it is recommended to add
an external boost diode. This helps improving the
efficiency. The boost diode can be a low cost one
such as 1N4148.
D1
1N4148
VIN
5V
Probe Ground
.
L
VIN
BST
GS5812G
C3
LX
VOUT
GND
Ceramic Capacitor
Inductor Selection
The output inductor is used for storing energy and
filtering output ripple current. But the trade-off
condition often happens between maximum energy
storage and the physical size of the inductor. The
first consideration for selecting the output inductor is
to make sure that the inductance is large enough to
keep the converter in the continuous current mode.
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GS5812G
Outline Information
SOT-23-6 Package (Unit: mm)
SYMBOLS
UNIT
DIMENSION IN MILLIMETER
MIN
MAX
A
A1
A2
0.90
0.00
0.90
1.45
0.15
1.30
B
D
0.30
2.80
0.50
3.00
E
E1
2.60
1.50
3.00
1.70
e
e1
0.90
1.80
1.00
2.00
L
0.30
0.60
Note: Followed From JEDEC MO-178-C.
Carrier Dimensions
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