Product Specification
Part Name:
OEL Display Module
Customer Part ID:
Allvision Part ID: UN-2864KLBLG23
Ver: A
Customer:
Approved by
From: Unvision technology Inc.
Approved by
Unvision technology Inc.
https://unvision.1688.com
Notes:
1. Please contact Unvision technology Inc. before assigning your product based on this module specification
2. The information contained herein is presented merely to indicate the characteristics and performance of
our products. No responsibility is assumed by Unvision technology Inc. for any intellectual property claims
or other problems that may result from application based on the module described herein.
Unvision technology Inc.
Ver:A
Revised History
Part Number
Revision
UN-2864KLBLG23
A
Revision Content
New
Revised on
20131106
i
Unvision technology Inc.
Ver:A
Contents
Revision History
Contents
1. Basic Specifications
1.1
1.2
1.3
1.4
1.5
Display Specifications
Mechanical Specifications
Active Area / Memory Mapping & Pixel Construction
Mechanical Drawing
Pin Definition
2. Absolute Maximum Ratings
3. Optics & Electrical Characteristics
3.1 Optics Characteristics
3.2 DC Characteristics
3.3 AC Characteristics
3.3.1 68XX-Series MPU Parallel Interface Characteristics
3.3.2 80XX-Series MPU Parallel Interface Characteristics
3.3.3 Serial Interface Characteristics (4-wire SPI)
3.3.4 Serial Interface Characteristics (3-wire SPI)
3.3.5 I2C Interface Characteristics
4. Functional Specification
4.1 Commands
4.2 Power down and Power up Sequence
4.2.1 Power up Sequence
4.2.2 Power down Sequence
4.3 Reset Circuit
4.4 Actual Application Example
4.4.1 VCC Supplied Externally
4.4.2 VCC Generated by Internal DC/DC Circuit
5. Reliability
5.1 Contents of Reliability Tests
5.2 Failure Check Standard
6. Outgoing Quality Control Specifications
6.1 Environment Required
6.2 Sampling Plan
6.3 Criteria & Acceptable Quality Level
6.3.1 Cosmetic Check (Display Off) in Non-Active Area
6.3.2 Cosmetic Check (Display Off) in Active Area
6.3.3 Pattern Check (Display On) in Active Area
7. Package Specifications
8. Precautions When Using These OEL Display Modules
8.1
8.2
8.3
8.4
8.5
Handling Precautions
Storage Precautions
Designing Precautions
Precautions when disposing of the OEL display modules
Other Precautions
Warranty
Notice
ii
Unvision technology Inc.
Ver:A
1. Basic Specifications
1.1 Display Specifications
1)
2)
3)
Display Mode:
Display Color:
Drive Duty:
Passive Matrix
Monochrome (Blue)
1/64 Duty
1.2 Mechanical Specifications
1)
2)
3)
4)
5)
6)
7)
Outline Drawing:
Number of Pixels:
Panel Size:
Active Area:
Pixel Pitch:
Pixel Size:
Weight:
According to the annexed outline drawing
128 64
34.5 23.0 1.4 (mm)
29.42 14.7 (mm)
0.23 0.23(mm)
0.21 0.21(mm)
2.18 (g)
1.3 Active Area / Memory Mapping & Pixel Construction
P0.23x128-0.02=29.42
"A"
0.23
0.21
P0.23x64-0.02=14.7
0.23
0.21
Segment 129
( Column 1 )
Common 1
( Row 63 )
Common 63
( Row 1 )
Detail "A"
Scale (10:1)
Segment 2
( Column 128 )
Common 0
( Row 64 )
Common 62
( Row 2 )
1
6
P0.23x128-0.02=29.42
"A"
Polarizer
t=0.2mm
P0.23x64-0.02=14.7
14.7± 0.2 (A/A)
16.7± 0.2 (V/A)
18.2± 0.2 (Polarizer)
19.2± 0.2 (Cap Size)
23± 0.2 (Panel Size)
Active Area 1.3"
128 x 64 Pixels
1.4± 0.1
Remove Tape
t=0.15mm Max
5
11.25± 0.3
Segment 2( Column 128 )
Common 0( Row 64 )
Common 63 ( Row 1 )
Common 62( Row 2 )
Protective Tape
15x8x0.06mm
Glue
Segment 129( Column 1 )
Common 1( Row 63 )
12± 0.1
0.23
9.5± 0.3
0.23
0.5
1.75± 0.1
3.3± 0.1
W=0.28± 0.03
P0.50x(30-1)=14.5± 0.1
0.5± 0.1
15.5± 0.1
Detail "A"
Scale (20:1)
N .C. (GND)
V LSS
V CC
V COMH
IREF
D6
D7
D5
D3
D4
D1
D2
D0
E/RD#
R/W#
V SS
VDD
RES#
D/C#
N .C.
BS2
CS#
V BAT
BS0
BS1
C1N
C1 P
C2N
C2 P
N .C. (GND)
Contact Side
1
6± 0.5
7± 0.1
30
1
1. Color: White
2. Driver IC: CH1116
3. FPC Number: TAB
4. Interface:
8-bit 68XX/80XX ，3/4-wire SPI, I 2C
5. General Tolerance: ± 0.30
±0
0.8
14± 0.1
2-?
15
16.75
0.75
0.21
(40)
2
Notes:
Pin
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
0.21
0.3± 0.03
Customer Approval
Signature
Symbol
N.C. (GND)
C2P
C2N
C1P
C1N
VBAT
N.C.
VSS
VDD
BS0
BS1
BS2
CS#
RES#
D/C#
R/W#
E/RD#
D0
D1
D2
D3
D4
D5
D6
D7
IREF
VCOMH
VCC
VLSS
N.C. (GND)
Drawing Number
UN-2864KLBLG23
mm
Title
UN-2864KLBLG23 Folding Type OEL Display Module
Pixel Number: 128 x 64, Monochrome, COG Package
Soda Lime / Polyimide
General Roughness
Tolerance
± 0.3
Dimension
Angle
±1
By
Date
Drawn
Jesen
20131030
E.E.
Panel / E.
Rev.
A
Material
Unless Otherwise Specified
Unit
Unvision technology Inc.
10
Remark
Original Drawing
Mechanical Drawing
(2.1)
(1.1)
0.5± 0.5
0.5± 0.5
(1.54)
(2.54)
Date
20131030
1.4
Item
A
34.5± 0.2 (Panel Size)
34.5± 0.2 (Cap Size)
33.5± 0.2 (Polarizer)
31.42± 0.2 (V/A)
29.42± 0.2 (A/A)
P.M.
Scale
1:1
Sheet
1 of 1
Size
A3
Ver:A
Unvision technology Inc.
1.5
Ver:A
Pin Definition
Pin Number
Symbol
I/O
Function
9
VDD
P
8
VSS
P
28
VCC
P
29
VLSS
P
Power Supply for Logic
This is a voltage supply pin. It must be connected to external source.
Ground of Logic Circuit
This is a ground pin. It acts as a reference for the logic pins. It must be
connected to external ground.
Power Supply for OEL Panel
This is the most positive voltage supply pin of the chip. A stabilization capacitor
should be connected between this pin and V SS when the converter is used. It
must be connected to external source when the converter is not used.
Ground of Analog Circuit
This is an analog ground pin. It should be connected to V SS externally.
26
IREF
I
27
VCOMH
O
Power Supply
Driver
Current Reference for Brightness Adjustment
This pin is segment current reference pin. A resistor should be connected
between this pin and V SS . Set the current at 12.5A maximum.
Voltage Output High Level for COM Signal
This pin is the input pin for the voltage output high level for COM signals. A
capacitor should be connected between this pin and V SS .
DC/DC Converter
6
VBAT
P
4/5
2/3
C1P / C1N
C2P / C2N
I
Power Supply for DC/DC Converter Circuit
This is the power supply pin for the internal buffer of the DC/DC voltage converter.
It must be connected to external source when the converter is used. It should be
connected to V DD when the converter is not used.
P o s i t i v e T e r m i n a l o f t h e F l y i n g I n v e r ti n g C a p a c i t o r
Negative Terminal of the Flying Boost Capacitor
The charge-pump capacitors are required between the terminals. They must be
floated when the converter is not used.
Interface
10
11
12
BS0
BS1
BS2
I
14
RES#
I
13
CS#
I
15
D/C#
I
17
E/RD#
I
Communicating Protocol Select
These pins are MCU interface selection input. See the following table:
BS0
BS1
BS2
I2C
0
1
0
3-wire SPI
1
0
0
4-wire SPI
0
0
0
8-bit 68XX Parallel
0
0
1
8-bit 80XX Parallel
0
1
1
Power Reset for Controller and Driver
This pin is reset signal input. When the pin is low, initialization of the chip is
executed. Keep this pin pull high during normal operation.
Chip Select
This pin is the chip select input. The chip is enabled for MCU communication only
when CS# is pulled low.
Data/Command Control
This pin is Data/Command control pin. When the pin is pulled high, the input at
D7~D0 is treated as display data. When the pin is pulled low, the input at D7~D0
will be transferred to the command register.
When the pin is pulled high and serial interface mode is selected, the data at SDIN
will be interpreted as data. When it is pulled low, the data at SDIN will be
transferred to the command register. In I2C mode, this pin acts as SA0 for slave
address selection.
For detail relationship to MCU interface signals, please refer to the Timing
Characteristics Diagrams.
Read/Write Enable or Read
This pin is MCU interface input.
When interfacing to a 68XX-series
microprocessor, this pin will be used as the Enable (E) signal. Read/write operation
is initiated when this pin is pulled high and the CS# is pulled low.
When connecting to an 80XX-microprocessor, this pin receives the Read (RD#)
signal. Data read operation is initiated when this pin is pulled low and CS# is
pulled low.
When serial or I2C mode is selected, this pin must be connected to V SS .
3
Unvision technology Inc.
Ver:A
1.5 Pin Definition (Continued)
Pin Number
Symbol
I/O
Function
Interface (Continued)
16
R/W#
I
18~25
D0~D7
I/O
7
N.C.
-
1, 30
N.C. (GND)
-
Read/Write Select or Write
This pin is MCU interface input.
When interfacing to a 68XX-series
microprocessor, this pin will be used as Read/Write (R/W#) selection input. Pull
this pin to “High” for read mode and pull it to “Low” for write mode.
When 80XX interface mode is selected, this pin will be the Write (WR#) input.
Data write operation is initiated when this pin is pulled low and the CS# is pulled
low.
When serial or I2C mode is selected, this pin must be connected to V SS .
Host Data Input/Output Bus
These pins are 8-bit bi-directional data bus to be connected to the
microprocessor’s data bus. When serial mode is selected, D1 will be the serial
data input SDIN and D0 will be the serial clock input SCLK. When I2C mode is
selected, D2 & D1 should be tired together and serve as SDA out & SDA in in
application and D0 is the serial clock input SCL.
Unused pins must be connected to V SS except for D2 in serial mode.
Reserve
Reserved Pin
The N.C. pin between function pins are reserved for compatible and flexible
design.
Reserved Pin (Supporting Pin)
The supporting pins can reduce the influences from stresses on the function pins.
These pins must be connected to external ground as the ESD protection circuit.
4
Unvision technology Inc.
Ver:A
2. Absolute Maximum Ratings
Parameter
Symbol
Min
Max
Unit
Notes
Supply Voltage for Logic
V DD
-0.3
4
V
1, 2
Supply Voltage for Display
V CC
0
14
V
1, 2
Supply Voltage for DC/DC
V BAT
-0.3
5
V
1, 2
Operating Temperature
T OP
-40
85
C
Storage Temperature
T STG
-40
85
C
3
10,000
-
hour
4
Life Time (80 cd/m )
30,000
-
hour
4
Life Time (60 cd/m2)
50,000
-
hour
4
Life Time (120 cd/m2)
2
Note 1: All the above voltages are on the basis of “V SS = 0V”.
Note 2: When this module is used beyond the above absolute maximum ratings, permanent breakage of the
module may occur. Also, for normal operations, it is desirable to use this module under the
conditions according to Section 3. “Optics & Electrical Characteristics”. If this module is used
beyond these conditions, malfunctioning of the module can occur and the reliability of the module
may deteriorate.
Note 3: The defined temperature ranges do not include the polarizer.
The maximum withstood
temperature of the polarizer should be 80C.
Note 4: V CC = 12.0V, T a = 25°C, 50% Checkerboard.
Software configuration follows Section 4.4 Initialization.
End of lifetime is specified as 50% of initial brightness reached. The average operating lifetime at
room temperature is estimated by the accelerated operation at high temperature conditions.
5
Unvision technology Inc.
Ver:A
3. Optics & Electrical Characteristics
3.1 Optics Characteristics
Characteristics
Symbol
Conditions
Min
Typ
Max
Unit
Brightness
(V CC Supplied Externally)
L br
Note 5
100
-
-
cd/m2
L br
Note 6
90
110
130
cd/m2
C.I.E. (Blue)
(x)
(y)
C.I.E. 1931
0.12
0.22
0.16
0.26
0.20
0.30
Dark Room Contrast
CR
-
2000:1
-
-
Free
-
degree
Min
Typ
Max
Unit
1.65
2.8
3.3
V
-
12.0
-
V
-
4.2
V
Brightness
(V CC Generated by Internal DC/DC)
Viewing Angle
* Optical measurement taken at V DD = 2.8V, V CC = 12V & 7.25V.
Software configuration follows Section 4.4 Initialization.
3.2 DC Characteristics
Characteristics
Symbol
Supply Voltage for Logic
V DD
Supply Voltage for Display
(Supplied Externally)
V CC
Supply Voltage for DC/DC
Supply Voltage for Display
(Generated by Internal DC/DC)
V BAT
Conditions
Note 5
(Internal DC/DC Disable)
High Level Input
V IH
Internal DC/DC Enable
3.5
Note 6
6.4
(Internal DC/DC Enable)
I OUT = 100μA, 3.3MHz 0.8V DD
Low Level Input
V IL
I OUT = 100μA, 3.3MHz
High Level Output
V OH
I OUT = 100μA, 3.3MHz 0.9V DD
-
V DD
V
Low Level Output
V OL
I OUT = 100μA, 3.3MHz
0
-
0.1V DD
V
Operating Current for V DD
I DD
-
180
300
μA
Operating Current for V CC
(V CC Supplied Externally)
I CC
Note 7
-
23
32
mA
Operating Current for V BAT
(V CC Generated by Internal DC/DC)
I BAT
Note 8
-
45
50
mA
Sleep Mode Current for V DD
I DD, SLEEP
-
1
5
μA
Sleep Mode Current for V CC
I CC, SLEEP
-
2
10
μA
V CC
0
-
9
V
-
V DD
V
-
0.2V DD
V
Note 5 & 6: Brightness (L br ) and Supply Voltage for Display (V CC ) are subject to the change of the panel
characteristics and the customer’s request.
Note 7:
V DD = 2.8V, V CC = 12V, IREF=910K 100% Display Area Turn on.
Note 8:
V DD = 2.8V, V CC = 8V, IREF=560K 100% Display Area Turn on.
* Software configuration follows Section 4.4 Initialization.
Unvision technology Inc.
Ver:A
3.3 AC Characteristics
3.3.1.1 68XX-Series MPU Parallel Interface Timing Characteristics:
Symbol
t cycle
Description
Min
Max
Unit
Clock Cycle Time
300
-
ns
t AS
Address Setup Time
5
-
ns
t AH
Address Hold Time
0
-
ns
t DSW
Write Data Setup Time
40
-
ns
t DHW
Write Data Hold Time
7
-
ns
t DHR
Read Data Hold Time
20
-
ns
t OH
Output Disable Time
-
70
ns
t ACC
Access Time
-
140
ns
-
ns
-
ns
PW CSL
PW CSH
Chip Select Low Pulse Width (Read)
120
Chip Select Low Pulse width (Write)
60
Chip Select High Pulse Width (Read)
60
Chip Select High Pulse Width (Write)
60
tR
Rise Time
-
40
ns
tF
Fall Time
-
40
ns
* (V DD - V SS = 1.65V to 3.3V, T a = 25°C)
7
Unvision technology Inc.
Ver:A
3.3.1.2 68XX-Series MPU Parallel Interface with Internal Charge Pump
68xx parallel interface
Vin
R2
D
C2
Q1
G
Q2
G
GPIO
S
C1
D
S
R3
C6
C5
CS#
RES#
D/C#
R/W#
E
D[7:0]
R1
C4
C3
N.C. (GND)
C2P
C2N
C1P
C1N
VBAT
N.C.
VSS
VDD
BS0
BS1
BS2
CS#
RES#
D/C#
R/W#
E/RD#
D0
D1
D2
D3
D4
D5
D6
D7
IREF
VCOMH
VCC
VLSS
N.C. (GND)
UT-0206-P05
VDD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
GND
Recommended Components:
C1, C2:
1μF / 16V, X5R
C3:
2.2μF
C4:
4.7μF / 16V, X7R
C5, C6:
1μF
R1:
560kΩ, R1 = (Voltage at IREF - VSS) / IREF
R2, R3:
47kΩ
Q1:
FDN338P
Q2:
FDN335N
Notes:
VDD:
1.65~3.3V, it should be equal to MPU I/O voltage.
Vin:
3.5~4.2V
* VBAT will be connected to VDD when VCC be connected to external source (12V), R1 should be
replaced as 910 kΩ.
8
Unvision technology Inc.
Ver:A
3.3.2.1 80XX-Series MPU Parallel Interface Timing Characteristics:
Symbol
Description
Min
Max
Unit
Clock Cycle Time
300
-
ns
t AS
Address Setup Time
10
-
ns
t AH
Address Hold Time
0
-
ns
t DSW
Write Data Setup Time
40
-
ns
t DHW
Write Data Hold Time
7
-
ns
t DHR
Read Data Hold Time
20
-
ns
t OH
Output Disable Time
-
70
ns
t ACC
Access Time
-
140
ns
t PWLR
Read Low Time
120
-
ns
t PWLW
Write Low Time
60
-
ns
t PWHR
Read High Time
60
-
ns
t PWHW
Write High Time
60
-
ns
t CS
Chip Select Setup Time
0
-
ns
t CSH
Chip Select Hold Time to Read Signal
0
-
ns
t CSF
Chip Select Hold Time
20
-
ns
t cycle
tR
Rise Time
-
40
ns
tF
Fall Time
-
40
ns
* (V DD - V SS = 1.65V to 3.3V, T a = 25°C)
( Read Timing )
( Write Timing )
9
Unvision technology Inc.
3.3.2.2
Ver:A
80XX-Series MPU Parallel Interface with Internal Charge Pump
80xx parallel interface
Vin
R2
D
C2
Q1
G
Q2
G
GPIO
S
C1
D
S
R3
C6
C5
CS#
RES#
D/C#
WR#
RD#
D[7:0]
R1
C4
C3
N.C. (GND)
C2P
C2N
C1P
C1N
VBAT
N.C.
VSS
VDD
BS0
BS1
BS2
CS#
RES#
D/C#
R/W#
E/RD#
D0
D1
D2
D3
D4
D5
D6
D7
IREF
VCOMH
VCC
VLSS
N.C. (GND)
UT-0206-P05
VDD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
GND
Recommended Components:
C1, C2:
1μF / 16V, X5R
C3:
2.2μF
C4:
4.7μF / 16V, X7R
C5, C6:
1μF
R1:
560kΩ, R1 = (Voltage at IREF - VSS) / IREF
R2, R3:
47kΩ
Q1:
FDN338P
Q2:
FDN335N
Notes:
VDD:
1.65~3.3V, it should be equal to MPU I/O voltage.
Vin:
3.5~4.2V
* VBAT will be connected to VDD when VCC be connected to external source (12V), R1 should be
replaced as 910 kΩ.
10
Unvision technology Inc.
Ver:A
3.3.3.1 Serial Interface Timing Characteristics: (4-wire SPI)
Symbol
Description
Min
Max
Unit
Clock Cycle Time
100
-
ns
t AS
Address Setup Time
15
-
ns
t AH
Address Hold Time
15
-
ns
t CSS
Chip Select Setup Time
20
-
ns
t CSH
Chip Select Hold Time
10
-
ns
t DSW
Write Data Setup Time
15
-
ns
t DHW
Write Data Hold Time
15
-
ns
t CLKL
Clock Low Time
20
-
ns
t CLKH
Clock High Time
20
-
ns
t cycle
tR
Rise Time
-
40
ns
tF
Fall Time
-
40
ns
* (V DD - V SS = 1.65V to 3.3V, T a = 25°C)
11
Unvision technology Inc.
3.3.3.2
Ver:A
4-wire Serial Interface with Internal Charge Pump
4-w ire serial interface
V in
R2
D
Q2
C2
Q1
G
G
G PIO
S
C1
D
S
R3
C5
C6
C S#
R E S#
D /C #
R4
R5
SCLK
S D IN
R1
C4
C3
N .C . (G N D )
C 2P
C 2N
C 1P
C 1N
VDDB
N .C .
V SS
VDD
B S0
B S1
B S2
CS#
RES#
D /C #
R /W #
E /R D #
D0
D1
D2
D3
D4
D5
D6
D7
IR E F
VCOM H
VCC
V LSS
N .C . (G N D )
UT-0206-P05
VDD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
GND
Recommended Components:
C1, C2:
1μF / 16V, X5R
C3:
2.2μF
C4:
4.7μF / 16V, X7R
C5, C6:
1μF
R1:
560kΩ, R1 = (Voltage at IREF - VSS) / IREF
R2, R3:
47kΩ
R4, R5:
4.7kΩ
Q1:
FDN338P
Q2:
FDN335N
Notes:
VDD:
1.65~3.3V, it should be equal to MPU I/O voltage.
Vin:
3.5~4.2V
* VBAT will be connected to VDD when VCC be connected to external source (12V), R1 should be
replaced as 910 kΩ.
12
Unvision technology Inc.
Ver:A
3.3.4.1 Serial Interface Timing Characteristics: (3-wire SPI)
Symbol
Description
Min
Max
Unit
t cycle
Clock Cycle Time
100
-
ns
t CSS
Chip Select Setup Time
20
-
ns
t CSH
Chip Select Hold Time
10
-
ns
t DSW
Write Data Setup Time
15
-
ns
t DHW
Write Data Hold Time
15
-
ns
t CLKL
Clock Low Time
20
-
ns
t CLKH
Clock High Time
20
-
ns
tR
Rise Time
-
40
ns
tF
Fall Time
-
40
ns
* (V DD - V SS = 1.65V to 3.3V, T a = 25°C)
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Unvision technology Inc.
3.3.4.2
Ver:A
3-wire Serial Interface with Internal Charge Pump
3-wire serial interface
Vin
R2
D
Q2
C2
Q1
G
G
GPIO
S
C1
D
S
R3
C5
C6
CS#
RES#
R4
R5
SCLK
SDIN
R1
C4
C3
N.C. (GND)
C2P
C2N
C1P
C1N
VDDB
N.C.
VSS
VDD
BS0
BS1
BS2
CS#
RES#
D/C#
R/W#
E/RD#
D0
D1
D2
D3
D4
D5
D6
D7
IREF
VCOMH
VCC
VLSS
N.C. (GND)
UT-0206-P05
VDD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
GND
Recommended Components:
C1, C2:
1μF / 16V, X5R
C3:
2.2UF/16V
C4:
4.7μF / 16V, X7R
C5, C6:
1μF/16V
R1:
560kΩ, R1 = (Voltage at IREF - VSS) / IREF
R2, R3:
47kΩ
R4, R5:
4.7kΩ
Q1:
FDN338P
Q2:
FDN335N
Notes:
VDD:
1.65~3.3V, it should be equal to MPU I/O voltage.
Vin:
3.5~4.2V
* VBAT will be connected to VDD when VCC be connected to external source (12V), R1 should be
replaced as 910 kΩ.
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Unvision technology Inc.
Ver:A
3.3.5.1 I2C Interface Timing Characteristics:
Symbol
t cycle
t HSTART
Description
Min
Max
Unit
Clock Cycle Time
2.5
-
μs
Start Condition Hold Time
0.6
-
μs
-
ns
Data Hold Time (for “SDA OUT ” Pin)
0
Data Hold Time (for “SDA IN ” Pin)
300
Data Setup Time
100
-
ns
t SSTART
Start Condition Setup Time
(Only relevant for a repeated Start condition)
0.6
-
μs
t SSTOP
Stop Condition Setup Time
0.6
-
μs
t HD
t SD
tR
Rise Time for Data and Clock Pin
300
ns
tF
Fall Time for Data and Clock Pin
300
ns
-
μs
t IDLE
Idle Time before a New Transmission can Start
1.3
* (V DD - V SS = 1.65V to 3.3V, T a = 25°C)
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Unvision technology Inc.
3.3.5.2
Ver:A
I2C Interface with Internal Charge Pump
I 2 C in te r f a c e
V in
R2
D
Q2
C2
Q1
G
G
G P IO
S
C1
D
S
R3
C5
C6
RES#
R4
R5
SCL
SDA
R1
C4
C3
N .C . ( G N D )
C 2P
C 2N
C 1P
C 1N
VDDB
N .C .
V SS
VDD
BS0
BS1
BS2
CS#
RES#
D /C #
R /W #
E /R D #
D0
D1
D2
D3
D4
D5
D6
D7
IR E F
VCOM H
VCC
V LSS
N .C . ( G N D )
UT-0206-P05
VDD
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
GND
Recommended Components:
C1, C2:
1μF / 16V, X5R
C3:
2.2μF
C4:
4.7μF / 16V, X7R
C5, C6:
1μF
R1:
560kΩ, R1 = (Voltage at IREF - VSS) / IREF
R2, R3:
47kΩ
R4, R5:
4.7kΩ
Q1:
FDN338P
Q2:
FDN335N
Notes:
VDD:
1.65~3.3V, it should be equal to MPU I/O voltage.
Vin:
3.5~4.2V
The I2C slave address is 0111100b’. If the customer ties D/C# (pin 15) to VDD, the I2C slave address
will be 0111101b’.
* VBAT will be connected to VDD when VCC be connected to external source (12V), R1 should be
replaced as 910 kΩ.
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Unvision technology Inc.
Ver:A
4. Functional Specification
4.1 Commands
Refer to the Technical Manual for the SH1106
4.2 Power down and Power up Sequence
To protect OEL panel and extend the panel life time, the driver IC power up/down routine should include
a delay period between high voltage and low voltage power sources during turn on/off. It gives the
OEL panel enough time to complete the action of charge and discharge before/after the operation.
4.2.1 Power up Sequence:
Power up V DD
Send Display off command
Initialization
Clear Screen
Power up V CC / V BAT
Delay 100ms
(When V CC is stable)
7. Send Display on command
1.
2.
3.
4.
5.
6.
V DD on
V CC /VBAT on
Display on
V CC
V DD
V SS /Ground
Display off
4.2.2 Power down Sequence:
1. Send Display off command
2. Power down V CC / V BAT
3. Delay 100ms
(When V CC / V BAT is reach 0 and panel is
completely discharges)
4. Power down V DD
V CC / V BAT off
V DD off
V CC /V BAT
V DD
V SS /Ground
Note 13:
1) Since an ESD protection circuit is connected between V DD and V CC inside the driver IC, V CC
becomes lower than V DD whenever V DD is ON and V CC is OFF.
2) V CC / V BAT should be kept float (disable) when it is OFF.
3) Power Pins (V DD , V CC , V BAT ) can never be pulled to ground under any circumstance.
4) V DD should not be power down before V CC / V BAT power down.
4.3 Reset Circuit
When RES# input is low, the chip is initialized with the following status:
1. Display is OFF
2. 12864 Display Mode
3. Normal segment and display data column and row address mapping (SEG0 mapped to column
address 00h and COM0 mapped to row address 00h)
4. Shift register data clear in serial interface
5. Display start line is set at display RAM address 0
6. Column address counter is set at 0
7. Normal scan direction of the COM outputs
8. Contrast control register is set at 7Fh
9. Normal display mode (Equivalent to A4h command)
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Unvision technology Inc.
Ver:A
4.4
Actual Application Example
Command usage and explanation of an actual example
4.4.1 V CC Supplied Externally
V DD /V CC off State
Set Display Offset
0xD3, 0x00
set VPP
0x32
Power up V DD
(RES# as Low State)
Set Display Start Line
0x40
Set Normal/Inverse Display
0xA6
Power Stabilized
(Delay Recommended)
Set Charge Pump
0xad, 0x8b
Clear Screen
Set RES# as High
(3μs Delay Minimum)
Set Segment Re-Map
0xA1
Power up V CC & Stabilized
(Delay Recommended)
Initialized State
(Parameters as Default)
Set COM Output Scan Direction
0xC8
Set Display On
0xAF
Set Display Off
0xAE
Set COM Pins Hardware Configuration
0xDA, 0x12
(100ms Delay Recommended)
Initial Settings
Configuration
Set Contrast Control
0x81, 0XBF
Display Data Sent
Set Display Clock Divide Ratio/Oscillator Frequency
0xD5, 0x80
Set Pre-Charge Period
0xD9, 0X22
Set Multiplex Ratio
0xA8, 0x3F
Set VCOMH Deselect Level
0xDB, 0x40
If the noise is accidentally occurred at the displaying window during the operation, please reset
the display in order to recover the display function.
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Unvision technology Inc.
Normal Operation
Power down V CC
(100ms Delay Recommended)
Set Display Off
0xAE
Power down V DD
V DD /V CC off State
Normal Operation
Power down V CC
Set Display Off
0xAE
Sleep Mode
Sleep Mode
Set Display On
0xAF
Power up V CC & Stabilized
(Delay Recommended)
(100ms Delay Recommended)
Normal Operation
External setting
{
RES=1;
delay(1000);
RES=0;
delay(1000);
RES=1;
delay(1000);
write_i(0xAE);
/*display off*/
write_i(0x02);
write_i(0x10);
/*set lower column address*/
/*set higher column address*/
write_i(0x40);
/*set display start line*/
write_i(0xB0);
/*set page address*/
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Ver:A
Unvision technology Inc.
write_i(0x81);
write_i(0xBF);
/*contract control*/
/*128*/
write_i(0xA1);
/*set segment remap*/
write_i(0xA6);
/*normal / reverse*/
write_i(0xA8);
write_i(0x3F);
/*multiplex ratio*/
/*duty = 1/64*/
write_i(0xad);
write_i(0x8a);
/*set charge pump enable*/
/*
0x8a
外供 VCC
*/
write_i(0x32);
write_i(0xC8);
/*0X30---0X33
set VPP
/*Com scan direction*/
write_i(0xD3);
write_i(0x00);
/*set display offset*/
/*
0x20 */
write_i(0xD5);
write_i(0x80);
/*set osc division*/
write_i(0xD9);
write_i(0x22);
/*set pre-charge period*/
/*0x22*/
write_i(0xDA);
write_i(0x12);
/*set COM pins*/
write_i(0xdb);
write_i(0x40);
write_i(0xAF);
}
8V */
/*set vcomh*/
/*display ON*/
void write_i(unsigned char ins)
{
}
DC=0;
CS=0;
WR=1;
P1=ins;
WR=0;
WR=1;
CS=1;
/*inst*/
void write_d(unsigned char dat)
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Ver:A
Unvision technology Inc.
{
}
DC=1;
CS=0;
WR=1;
P1=dat;
WR=0;
WR=1;
CS=1;
/*data*/
void delay(unsigned int i)
{
while(i>0)
{
i--;
}
}
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Ver:A
Unvision technology Inc.
Ver:A
4.4.2 V CC Generated by Internal DC/DC Circuit
V DD /V CC off State
Set Display Offset
0xD3, 0x00
set VPP
0x33
Power up V DD
(RES# as Low State)
Set Display Start Line
0x40
Set Normal/Inverse Display
0xA6
Power Stabilized
(Delay Recommended)
Set Charge Pump
0xad, 0x8a
Clear Screen
Set RES# as High
(3μs Delay Minimum)
Set Segment Re-Map
0xA1
Power up V CC & Stabilized
(Delay Recommended)
Initialized State
(Parameters as Default)
Set COM Output Scan Direction
0xC8
Set Display On
0xAF
Set Display Off
0xAE
Set COM Pins Hardware Configuration
0xDA, 0x12
(100ms Delay Recommended)
Initial Settings
Configuration
Set Contrast Control
0x81, 0Xff
Display Data Sent
Set Display Clock Divide Ratio/Oscillator Frequency
0xD5, 0x80
Set Pre-Charge Period
0xD9, 0X1f
Set Multiplex Ratio
0xA8, 0x3F
Set VCOMH Deselect Level
0xDB, 0x40
If the noise is accidentally occurred at the displaying window during the operation, please reset
the display in order to recover the display function.
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Unvision technology Inc.
Ver:A
Normal Operation
Power Stabilized
(100ms Delay Recommended)
Set Display Off
0xAE
Power down V BAT
(50ms Delay Recommended)
Set Charge Pump
0x8D, 0x10
Power down V DD
V DD /V BAT off State
Normal Operation
Set Charge Pump
0xad, 0x8b
Set Display Off
0xAE
Power down V BAT
Sleep Mode
Sleep Mode
Set Charge Pump
0xaD, 0x8a
Power Stabilized
(100ms Delay Recommended)
Power up V BAT
(100ms Delay Recommended)
Set Display On
0xAF
Normal Operation
Internal setting（Charge pump）
{
RES=1;
delay(1000);
RES=0;
delay(1000);
RES=1;
delay(1000);
write_i(0xAE);
/*display off*/
write_i(0x02);
write_i(0x10);
/*set lower column address*/
/*set higher column address*/
Unvision technology Inc.
write_i(0x40);
/*set display start line*/
write_i(0xB0);
/*set page address*/
write_i(0x81);
write_i(0xff);
/*contract control*/
/*128*/
write_i(0xA1);
/*set segment remap*/
write_i(0xA6);
/*normal / reverse*/
write_i(0xA8);
write_i(0x3F);
/*multiplex ratio*/
/*duty = 1/64*/
write_i(0xad);
write_i(0x8b);
/*set charge pump enable*/
/*
0x8B
内供 VCC
*/
write_i(0x33);
write_i(0xC8);
set VPP
9V */
/*Com scan direction*/
write_i(0xD3);
write_i(0x00);
/*set display offset*/
/*
0x20 */
write_i(0xD5);
write_i(0x80);
/*set osc division*/
write_i(0xD9);
write_i(0x1f);
}
/*0X30---0X33
/*set pre-charge period*/
/*0x22*/
write_i(0xDA);
write_i(0x12);
/*set COM pins*/
write_i(0xdb);
write_i(0x40);
/*set vcomh*/
write_i(0xAF);
/*display ON*/
void write_i(unsigned char ins)
{
DC=0;
CS=0;
WR=1;
P1=ins;
WR=0;
/*inst*/
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Ver:A
Unvision technology Inc.
WR=1;
CS=1;
}
void write_d(unsigned char dat)
{
DC=1;
CS=0;
WR=1;
P1=dat;
/*data*/
WR=0;
WR=1;
CS=1;
}
void delay(unsigned int i)
{
while(i>0)
{
i--;
}
}
27
Ver:A
Unvision technology Inc.
Ver:A
5. Reliability
5.1 Contents of Reliability Tests
Item
Conditions
High Temperature Operation
70C, 240 hrs
Low Temperature Operation
-40C, 240 hrs
High Temperature Storage
85C, 240 hrs
Low Temperature Storage
-40C, 240 hrs
High Temperature/Humidity Operation
60C, 90% RH, 120 hrs
Thermal Shock
-40C 85C, 24 cycles
60 mins dwell
Criteria
The operational
functions work.
* The samples used for the above tests do not include polarizer.
* No moisture condensation is observed during tests.
5.2 Failure Check Standard
After the completion of the described reliability test, the samples were left at room temperature for 2
hrs prior to conducting the failure test at 235C; 5515% RH.
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Unvision technology Inc.
6. Outgoing Quality Control Specifications
6.1 Environment Required
Customer’s test & measurement are required to be conducted under the following conditions:
Temperature:
23 5C
Humidity:
55 15% RH
Fluorescent Lamp:
30W
≥ 50cm
Distance between the Panel & Lamp:
Distance between the Panel & Eyes of the Inspector: ≥ 30cm
Finger glove (or finger cover) must be worn by the inspector.
Inspection table or jig must be anti-electrostatic.
6.2 Sampling Plan
Level II, Normal Inspection, Single Sampling, MIL-STD-105E
6.3 Criteria & Acceptable Quality Level
Partition
AQL
Definition
Major
0.65
Defects in Pattern Check (Display On)
Minor
1.0
Defects in Cosmetic Check (Display Off)
6.3.1 Cosmetic Check (Display Off) in Non-Active Area
Check Item
Classification
Criteria
X > 6 mm (Along with Edge)
Y > 1 mm (Perpendicular to edge)
X
Panel General Chipping
Y
Minor
X
Y
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Ver:A
Unvision technology Inc.
Ver:A
6.3.1 Cosmetic Check (Display Off) in Non-Active Area (Continued)
Check Item
Classification
Criteria
Any crack is not allowable.
Panel Crack
Minor
Copper Exposed
(Even Pin or Film)
Minor
Film or Trace Damage
Minor
Terminal Lead Prober Mark
Acceptable
Glue or Contamination on Pin
(Couldn’t Be Removed by Alcohol)
Minor
Ink Marking on Back Side of panel
(Exclude on Film)
Acceptable
Not Allowable by Naked Eye Inspection
Ignore for Any
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Unvision technology Inc.
Ver:A
6.3.2 Cosmetic Check (Display Off) in Active Area
It is recommended to execute in clear room environment (class 10k) if actual in necessary.
Check Item
Classification
Criteria
Any Dirt & Scratch on Polarizer’s
Protective Film
Acceptable
Ignore for not Affect the Polarizer
Scratches, Fiber, Line-Shape Defect
(On Polarizer)
Minor
Dirt, Black Spot, Foreign Material,
(On Polarizer)
Minor
Dent, Bubbles, White spot
(Any Transparent Spot on Polarizer)
Minor
Fingerprint, Flow Mark
(On Polarizer)
Minor
Ignore
W ≤ 0.1
W > 0.1
n≤1
L≤2
L>2
n=0
Φ ≤ 0.1
Ignore
n≤1
0.1 < Φ ≤ 0.25
0.25 < Φ
n=0
Φ ≤ 0.5
Ignore if no Influence on Display
0.5 < Φ
n=0
Not Allowable
* Protective film should not be tear off when cosmetic check.
** Definition of W & L & Φ (Unit: mm): Φ = (a + b) / 2
L
W
b: Minor Axis
a: Major Axis
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Unvision technology Inc.
6.3.3 Pattern Check (Display On) in Active Area
Check Item
Classification
No Display
Major
Missing Line
Major
Pixel Short
Major
Darker Pixel
Major
Wrong Display
Major
Un-uniform
Major
Criteria
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Ver:A
Unvision technology Inc.
7. Package Specifications
EPE COVER FOAM 351x212x1,
ANTISTATIC x 1 Pcs
x 1 pcs (Empty)
1B6 Pcs Tray Vacuum packing
Module
EPE PROTECTTIVE
x 15
A pcs
Staggered Stacking
Tray 420x285 mm
T=0.8mm
Exsiccator x 2 pcs
Brimary
Primary Box
Box C4 SET
SET
Wrapped with adhesive tape
x 16
B pcs
Vacuum packing bag
EPE PROTECTTIVE
370mm x 280mm x 20mm
CARTON BOX
Label
Primary L450mm x W296 x H110, B wave
x C4Pcs
Univision Technology Inc.
Part ID :
Label
Lot ID :
Q'ty :
QC :
Carton Box L464mm x W313mm x H472mm, AB wave
(Major / Maximum)
Item
Quantity
Module
810
per Primary Box
Holding Trays
(A)
15
per Primary Box
Total Trays
(B)
16
per Primary Box (Including 1 Empty Tray)
Primary Box
(C)
1~4
per Carton (4 as Major / Maximum)
33
Ver:A
Unvision technology Inc.
Ver:A
8. Precautions When Using These OEL Display Modules
8.1 Handling Precautions
1)
2)
3)
4)
5)
6)
Since the display panel is being made of glass, do not apply mechanical impacts such us dropping
from a high position.
If the display panel is broken by some accident and the internal organic substance leaks out, be
careful not to inhale nor lick the organic substance.
If pressure is applied to the display surface or its neighborhood of the OEL display module, the cell
structure may be damaged and be careful not to apply pressure to these sections.
The polarizer covering the surface of the OEL display module is soft and easily scratched. Please
be careful when handling the OEL display module.
When the surface of the polarizer of the OEL display module has soil, clean the surface. It takes
advantage of by using following adhesion tape.
* Scotch Mending Tape No. 810 or an equivalent
Never try to breathe upon the soiled surface nor wipe the surface using cloth containing solvent
such as ethyl alcohol, since the surface of the polarizer will become cloudy.
Also, pay attention that the following liquid and solvent may spoil the polarizer:
* Water
* Ketone
* Aromatic Solvents
Hold OEL display module very carefully when placing OEL display module into the system housing.
Do not apply excessive stress or pressure to OEL display module. And, do not over bend the film
with electrode pattern layouts. These stresses will influence the display performance. Also,
secure sufficient rigidity for the outer cases.
7)
8)
9)
10)
Do not apply stress to the driver IC and the surrounding molded sections.
Do not disassemble nor modify the OEL display module.
Do not apply input signals while the logic power is off.
Pay sufficient attention to the working environments when handing OEL display modules to prevent
occurrence of element breakage accidents by static electricity.
* Be sure to make human body grounding when handling OEL display modules.
* Be sure to ground tools to use or assembly such as soldering irons.
* To suppress generation of static electricity, avoid carrying out assembly work under dry
environments.
* Protective film is being applied to the surface of the display panel of the OEL display module.
Be careful since static electricity may be generated when exfoliating the protective film.
11) Protection film is being applied to the surface of the display panel and removes the protection film
before assembling it. At this time, if the OEL display module has been stored for a long period of
time, residue adhesive material of the protection film may remain on the surface of the display
panel after removed of the film. In such case, remove the residue material by the method
introduced in the above Section 5).
12) If electric current is applied when the OEL display module is being dewed or when it is placed under
high humidity environments, the electrodes may be corroded and be careful to avoid the above.
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Unvision technology Inc.
Ver:A
8.2 Storage Precautions
1)
2)
When storing OEL display modules, put them in static electricity preventive bags avoiding exposure
to direct sun light nor to lights of fluorescent lamps. and, also, avoiding high temperature and high
humidity environment or low temperature (less than 0C) environments. (We recommend you to
store these modules in the packaged state when they were shipped from Allvision technology Inc.)
At that time, be careful not to let water drops adhere to the packages or bags nor let dewing occur
with them.
If electric current is applied when water drops are adhering to the surface of the OEL display
module, when the OEL display module is being dewed or when it is placed under high humidity
environments, the electrodes may be corroded and be careful about the above.
8.3 Designing Precautions
1)
2)
3)
4)
5)
6)
7)
8)
The absolute maximum ratings are the ratings which cannot be exceeded for OEL display module,
and if these values are exceeded, panel damage may be happen.
To prevent occurrence of malfunctioning by noise, pay attention to satisfy the V IL and V IH
specifications and, at the same time, to make the signal line cable as short as possible.
We recommend you to install excess current preventive unit (fuses, etc.) to the power circuit (V DD ).
(Recommend value: 0.5A)
Pay sufficient attention to avoid occurrence of mutual noise interference with the neighboring
devices.
As for EMI, take necessary measures on the equipment side basically.
When fastening the OEL display module, fasten the external plastic housing section.
If power supply to the OEL display module is forcibly shut down by such errors as taking out the
main battery while the OEL display panel is in operation, we cannot guarantee the quality of this
OEL display module.
The electric potential to be connected to the rear face of the IC chip should be as follows: SSD1306
* Connection (contact) to any other potential than the above may lead to rupture of the IC.
8.4 Precautions when disposing of the OEL display modules
1)
Request the qualified companies to handle industrial wastes when disposing of the OEL display
modules. Or, when burning them, be sure to observe the environmental and hygienic laws and
regulations.
8.5 Other Precautions
1)
2)
3)
4)
When an OEL display module is operated for a long of time with fixed pattern may remain as an
after image or slight contrast deviation may occur.
Nonetheless, if the operation is interrupted and left unused for a while, normal state can be
restored. Also, there will be no problem in the reliability of the module.
To protect OEL display modules from performance drops by static electricity rapture, etc., do not
touch the following sections whenever possible while handling the OEL display modules.
* Pins and electrodes
* Pattern layouts such as the FPC
With this OEL display module, the OEL driver is being exposed.
Generally speaking,
semiconductor elements change their characteristics when light is radiated according to the
principle of the solar battery. Consequently, if this OEL driver is exposed to light, malfunctioning
may occur.
* Design the product and installation method so that the OEL driver may be shielded from light in
actual usage.
* Design the product and installation method so that the OEL driver may be shielded from light
during the inspection processes.
Although this OEL display module stores the operation state data by the commands and the
indication data, when excessive external noise, etc. enters into the module, the internal status may
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Unvision technology Inc.
5)
Ver:A
be changed. It therefore is necessary to take appropriate measures to suppress noise generation
or to protect from influences of noise on the system design.
We recommend you to construct its software to make periodical refreshment of the operation
statuses (re-setting of the commands and re-transference of the display data) to cope with
catastrophic noise.
Warranty:
The warranty period shall last twelve (12) months from the date of delivery. Buyer shall be completed to
assemble all the processes within the effective twelve (12) months. WiseChip Semiconductor Inc. shall be
liable for replacing any products which contain defective material or process which do not conform to the
product specification, applicable drawings and specifications during the warranty period. All products must be
preserved, handled and appearance to permit efficient handling during warranty period. The warranty
coverage would be exclusive while the returned goods are out of the terms above.
Notice:
No part of this material may be reproduces or duplicated in any form or by any means without the written
permission of Allvision technology Inc. Allvision technology Inc. reserves the right to make changes to this
material without notice. Allvision technology Inc. does not assume any liability of any kind arising out of any
inaccuracies contained in this material or due to its application or use in any product or circuit and, further, there
is no representation that this material is applicable to products requiring high level reliability, such as, medical
products. Moreover, no license to any intellectual property rights is granted by implication or otherwise, and
there is no representation or warranty that anything made in accordance with this material will be free from any
patent or copyright infringement of a third party. This material or portions thereof may contain technology or
the subject relating to strategic products under the control of Foreign Exchange and Foreign Trade Law of
Taiwan and may require an export license from the Ministry of International Trade and Industry or other
approval from another government agency.
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