ASDM100DN35Q
100V Dual N-Channel MOSFET
Features
●
Excellent gate charge x RDS(on) product(FOM)
Very low on-resistance RDS(on)
150 °C operating temperature
●
Pb-free lead plating
●
●
Product Summary
VDS
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●
DC/DC Converter
●
Ideal for high-frequency switching
and synchronous rectification
100
V
RDS(on),max.@VGS=10V
17
mΩ
ID
35
A
Dual N-Channel
DFN5*6-8
Absolute Maximum Ratings (TC=25℃unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
VDS
100
V
Gate-Source Voltage
VGS
±20
V
ID
35
A
ID (100℃)
24.8
A
Pulsed Drain Current
IDM
140
A
Maximum Power Dissipation
PD
50
W
0.4
W/℃
EAS
200
mJ
TJ,TSTG
-55 To 150
℃
Thermal Resistance,Junction-to-Case
RθJC
2.5
℃/W
Thermal Resistance,Junction-to-Ambient
RθJA
62
℃/W
Drain Current-Continuous
Drain Current-Continuous(TC=100℃)
Derating factor
Single pulse avalanche energy
(Note 5)
Operating Junction and Storage Temperature Range
Thermal Characteristic
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ASDM100DN35Q
100V Dual N-Channel MOSFET
Electrical Characteristics (TC=25℃unless otherwise noted)
Parameter
Symbol
Condition
Min
Drain-Source Breakdown Voltage
BVDSS
VGS=0V ID=250μA
100
Zero Gate Voltage Drain Current
IDSS
VDS=100V,VGS=0V
-
Gate-Body Leakage Current
IGSS
VGS=±20V,VDS=0V
Gate Threshold Voltage
VGS(th)
Drain-Source On-State Resistance
RDS(ON)
Typ
Max
Unit
-
V
-
1
μA
-
-
±100
nA
VDS=VGS,ID=250μA
1.0
1.9
2.5
V
VGS=10V, ID=20A
-
16.5
17
mΩ
VGS=4.5V, ID=20A
-
20
21
mΩ
VDS=5V,ID=20A
-
35
-
S
-
1080
-
PF
-
94
-
PF
-
7.4
-
PF
-
6
-
nS
Off Characteristics
On Characteristics
(Note 3)
Forward Transconductance
Dynamic Characteristics
gFS
(Note4)
Input Capacitance
Clss
Output Capacitance
Coss
Reverse Transfer Capacitance
Switching Characteristics
Crss
VDS=50V,VGS=0V,
F=1.0MHz
(Note 4)
Turn-on Delay Time
td(on)
Turn-on Rise Time
tr
VDD=50V,ID=20A
-
2
-
nS
td(off)
VGS=10V,RG=1.6Ω
-
18
-
nS
-
2
-
nS
-
26
-
nC
-
7.4
nC
-
3.8
nC
Turn-Off Delay Time
Turn-Off Fall Time
tf
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
VDS=50V,ID=20A,
VGS=10V
Drain-Source Diode Characteristics
Diode Forward Voltage (Note 3)
Diode Forward Current
VSD
(Note 2)
VGS=0V,IS=35A
IS
Reverse Recovery Time
trr
Reverse Recovery Charge
Qrr
-
1.2
V
35
A
-
26
nS
-
98
nC
TJ = 25°C, IF = 20A
di/dt = 500A/μs
(Note3)
-
Notes:
1. Repetitive Rating: Pulse width limited by maximum junction temperature.
2. Surface Mounted on FR4 Board, t ≤ 10 sec.
3. Pulse Test: Pulse Width ≤ 300μs, Duty Cycle ≤ 2%.
4. Guaranteed by design, not subject to production
5. EAS condition : Tj=25℃,VDD=20V,VG=10V,L=0.5mH,Rg=25Ω
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ASDM100DN35Q
100V Dual N-Channel MOSFET
ID- Drain Current (A)
Normalized On-Resistance
Typical Performance Characteristics
TJ-Junction Temperature(℃)
Vds Drain-Source Voltage (V)
Figure 4 Rdson-Junction Temperature
ID- Drain Current (A)
Vgs Gate-Source Voltage (V)
Figure 1 Output Characteristics
Vgs Gate-Source Voltage (V)
Qg Gate Charge (nC)
Figure 5 Gate Charge
Rdson On-Resistance(mΩ)
Is- Reverse Drain Current (A)
Figure 2 Transfer Characteristics
ID- Drain Current (A)
Figure 3 Rdson- Drain Current
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Vsd Source-Drain Voltage (V)
Figure 6 Source- Drain Diode Forward
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ASDM100DN35Q
Capacitance (pF)
Power Dissipation (W)
100V Dual N-Channel MOSFET
TJ-Junction Temperature(℃)
Figure 7 Capacitance vs Vds
Figure 9 Power De-rating
ID- Drain Current (A)
ID- Drain Current (A)
Vds Drain-Source Voltage (V)
TJ-Junction Temperature (℃)
Figure 8 Safe Operation Area
Figure 10 Current De-rating
r(t),Normalized Effective
Transient Thermal Impedance
Vds Drain-Source Voltage (V)
Square Wave Pluse Duration(sec)
Figure 11 Normalized Maximum Transient Thermal Impedance
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ASDM100DN35Q
100V Dual N-Channel MOSFET
Ordering and Marking Information
Ordering Device No.
Marking
Package
Packing
Quantity
ASDM100DN35Q-R
100DN35
DFN5*6-8
Tape&Reel
4000/Reel
PACKAGE
MARKING
100DN35
DFN5*6-8
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ASDM100DN35Q
100V Dual N-Channel MOSFET
Dual DFN5x6-8 Package Outline Data
DIMENSIONS ( unit : mm )
Symbol
Notes:
Min
Typ
Max
A
0.9
1
1.1
b
0.33
0.41
0.51
protrusions or gate burrs.
C
0.2
0.25
0.3
3. Dimensions "D1" and "E1" include interterminal flash or
D1
4.8
4.9
5
protrusion. Interterminal flash or protrusion shall not exceed
D2
3.61
3.81
3.96
E
5.9
6
6.1
E1
5.7
5.75
5.8
E2
3.38
3.58
3.78
1. Refer to JEDEC MO-240 variation AA.
2. Dimensions "D1" and "E1" do NOT include mold flash
0.25mm per side.
1.27 BSC
e
H
0.41
0.51
0.61
K
1.1
--
--
L
0.51
0.61
0.71
L1
0.06
0.13
0.2
M
0.5
--
--
α
0°
--
12°
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ASDM100DN35Q
100V Dual N-Channel MOSFET
IMPORTANT NOTICE
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DOCUMENT, INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR
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does ShenZhen Ascend Semiconductor Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any
Customer or user of this document or products described herein in such applications shall assume .
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ShenZhen Ascend Semiconductor Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased
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