ASDM100R066NQ
100V N-CHANNEL MOSFET
Features
Product Summary
100 V
VDS
RDS(on),Typ @ VGS=10V 5.9 mΩ
68
ID
A
Advanced Trench MOS Technology
Low Gate Charge
Low RDS(ON)
100% EAS Guaranteed
Green Device Available
Applications
Power Management in Desktop Computer or
DC/DC Converters.
Isolated DC/DC Converters in Telecom and
Industrial.
D
G
S
DFN5x6-8
Absolute Maximum Ratings
Symbol
Parameter
Rating
Units
VDS
Drain-Source Voltage
100
V
VGS
Gate-Source Voltage
±20
V
ID@TC=25℃
Continuous Drain Current1,6
68
A
ID@TC=70℃
Current1,6
48
A
140
A
61
mJ
35
A
108
W
Continuous Drain
IDM
Pulsed Drain
Current2
EAS
Single Pulse Avalanche Energy
IAS
Avalanche Current
Total Power
PD@TC=25℃
3
Dissipation4
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
Thermal Data
Symbol
RθJA
Parameter
Thermal Resistance Junction-Ambient
Typ.
1(t≦10s)
1
Thermal Resistance Junction-Ambient
RθJC
NOV 2018 Version1.1
Thermal Resistance
1/7
Junction-Case1
Max.
Unit
---
25
℃/W
---
55
℃/W
---
1.15
℃/W
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ASDM100R066NQ
100V N-CHANNEL MOSFET
Electrical Characteristics (TJ=25 ℃, unless otherwise noted)
Symbol
BVDSS
RDS(ON)
VGS(th)
IDSS
Parameter
Conditions
Drain-Source Breakdown Voltage
Min.
Typ.
Max.
Unit
V
VGS=0V , ID=250uA
100
---
---
Static Drain-Source
On-Resistance 2
VGS=10V , ID=13.5A
---
5.9
8
Static Drain-Source
On-Resistance2
VGS=4.5V , ID=11.5A
---
7.6
10.5
VGS=VDS , ID =250uA
1.2
---
2.3
VDS=80V , VGS=0V , TJ=25℃
---
---
1
VDS=80V , VGS=0V , TJ=55℃
---
---
5
Gate Threshold Voltage
Drain-Source Leakage Current
m
V
uA
IGSS
Gate-Source Leakage Current
VGS=±20V , VDS=0V
---
---
±100
nA
gfs
Forward Transconductance
VDS=5V , ID=20A
---
85
---
S
Qg
Total Gate Charge (10V)
---
45
---
Qg
Total Gate Charge (4.5V)
---
19.3
---
Qgs
Gate-Source Charge
---
9.5
---
Qgd
Gate-Drain Charge
---
4.8
---
Td(on)
Turn-On Delay Time
---
10
---
Tr
Td(off)
Tf
VDS=50V , VGS=10V , ID=13.5A
Rise Time
VDD=50V , VGS=10V , RG=3,
---
6.5
---
Turn-Off Delay Time
ID=13.5A
---
45
---
---
7.5
---
Fall Time
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
VDS=50V , VGS=0V , f=1MHz
nC
ns
---
3320
---
---
605
---
---
20
---
Min.
Typ.
Max.
Unit
---
---
48
A
pF
Diode Characteristics
Symbol
IS
Parameter
Continuous Source Current
Conditions
1,5,6
VG=VD=0V , Force Current
Voltage2
VGS=0V , IS=1A , TJ=25℃
---
---
1.1
V
trr
Reverse Recovery Time
IF=13.5A , di/dt=100A/µs ,
---
33
---
nS
Qrr
Reverse Recovery Charge
TJ=25℃
---
150
---
nC
VSD
Diode Forward
Note :
1.The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
2.The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2%
3.The EAS data shows Max. rating . The test condition is V DD=25V,VGS=10V,L=0.3mH,IAS=35A
4.The power dissipation is limited by 150℃ junction temperature
5.The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.
6.The maximum current rating is package limited.
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ASDM100R066NQ
100V N-CHANNEL MOSFET
Typical Characteristics
Fig.1 Typical Output Characteristics
Fig.2 On-Resistance vs. G-S Voltage
Fig.3 Source-Drain Forward Characteristics
Fig.4 Gate-Charge Characteristics
Fig.5 Normalized VGS(th) vs. TJ
Fig.6 Normalized RDSON vs. TJ
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ASDM100R066NQ
100V N-CHANNEL MOSFET
Fig.8 Safe Operating Area
Fig.7 Capacitance
Normalized Thermal Response (RθJC)
1
DUTY=0.5
0.2
0.1
0.1
0.05
0.02
0.01
0.01
P DM
T ON
SINGLE
T
D = TON/T
TJpeak = TC+P DMXRθJC
0.001
0.00001
0.0001
0.001
0.01
0.1
1
t , Pulse Width (s)
Fig.9 Normalized Maximum Transient Thermal Impedance
EAS=
VDS
90%
1
L x IAS2 x
2
BVDSS
BVDSS-VDD
BVDSS
VDD
IAS
10%
VGS
Td(on)
Tr
Td(off)
Ton
Tf
Toff
Fig.10 Switching Time Waveform
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VGS
Fig.11 Unclamped Inductive Switching Waveform
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ASDM100R066NQ
100V N-CHANNEL MOSFET
Ordering and Marking Information
Ordering Device No.
Marking
Package
Packing
Quantity
ASDM100R066NQ-R
100R066N
DFN5x6-8
Tape&Reel
4000/Reel
MARKING
PACKAGE
DFN5x6-8
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100R066N
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0755-86970486
ASDM100R066NQ
100V N-CHANNEL MOSFET
DFN5x6-8 PACKAGE IN FORMATION
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ASDM100R066NQ
100V N-CHANNEL MOSFET
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