ASDM100R160NP
100V N-Channel Power MOSFET
General Description
Product Summary
● Low RDS(on) & FOM
● Extremely low switching loss
● Excellent stability and uniformity
● Fast switching and soft recovery
Applications
● Power switching application
● Hard switched and high frequency circuits
● Uninterruptible power supply
V DS
100
V
R DS(on),Typ@ VGS=10 V
12
mΩ
ID
45
A
Absolute Maximum Ratings (TA=25℃unless otherwise noted)
Parameter
Symbol
Limit
Drain-source Voltage
VDS
100
V
Gate-source Voltage
VGS
±20
V
45
TC=25℃
Drain Current
Unit
ID
A
28.5
TC=100℃
Pulsed Drain Current A
IDM
180
A
Avalanche energy B
EAS
81
mJ
72
Tc=25℃
Total Power Dissipation C
PD
W
28.8
Tc=100℃
Junction and Storage Temperature Range
TJ ,TSTG
℃
-55~+150
Thermal resistance
Parameter
Symbol
Thermal Resistance Junction-to-Ambient D
t≤10S
Typ
Max
15
20
40
50
1.35
1.7
Units
RθJA
Thermal Resistance Junction-to-Ambient D
Steady-State
Thermal Resistance Junction-to-Case
Steady-State
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RθJC
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ASDM100R160NP
100V N-Channel Power MOSFET
Electrical Characteristics (Tj=25℃ unless otherwise noted)
Parameter
Symbol
Conditions
Min
Typ
Max
Units
Drain-Source Breakdown Voltage
BVDSS
VGS= 0V, ID=250μA
100
Zero Gate Voltage Drain Current
IDSS
VDS=100,VGS=0V
1
μA
IGSS
VGS= ±20V, VDS=0V
±100
nA
Gate Threshold Voltage
VGS(th)
VDS= VGS, ID=250μA
1.7
3
V
VGS= 10V, ID=20A
12
17
mΩ
Static Drain-Source On-Resistance
RDS(ON)
VGS= 4.5V, ID=20A
17
21.5
mΩ
1.3
V
45
A
Static Parameter
Gate-Body Leakage Current
Diode Forward Voltage
VSD
Maximum Body-Diode Continuous Current
IS
Gate resistance
RG
1
V
IS=20A,VGS=0V
f= 1 MHz, Open drain
Ω
1
Dynamic Parameters
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
17
Total Gate Charge
Qg
16
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Reverse Recovery Chrage
Qrr
1064
VDS=50V,VGS=0V,f=1MHZ
374
pF
Switching Parameters
VGS=10V,VDS=50V,ID=25A
5.6
nC
2.4
42
IF=20A, di/dt=100A/us
Reverse Recovery Time
trr
39.8
Turn-on Delay Time
tD(on)
39.2
Turn-on Rise Time
tr
11
ns
VGS=10V, VDD=50V,ID=25A
RGEN=2.2Ω
Turn-off Delay Time
Turn-off fall Time
A.
B.
C.
D.
tD(off)
53.2
tf
15.8
Repetitive rating; pulse width limited by max. junction temperature.
VDD=50V, RG=25Ω, L=0.5mH, IAS=25A,.
Pd is based on max. junction temperature, using junction-case thermal resistance.
The value of RqJA is measured with the device mounted on 1in2 FR-4 board with 2oz. Copper, in a still air environment with TA =25°C. The
Power dissipation PDSM is based on R qJA t≤ 10s and the maximum allowed junction temperature of 150°C. The value in any given
application depends on the user's specific board design.
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ASDM100R160NP
100V N-Channel Power MOSFET
Typical Performance Characteristics
Figure1. Output Characteristics
Figure3. Capacitance Characteristics
Figure5. : On-Resistance vs. Drain Current and Gate Voltage
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Figure2. Transfer Characteristics
Figure4. Gate Charge
Figure6.Normalized On-Resistance
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ASDM100R160NP
100V N-Channel Power MOSFET
Figure7. Drain current
Figure8.Safe Operation Area
Figure9.Normalized Maximum Transient thermal impedance
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ASDM100R160NP
100V N-Channel Power MOSFET
Ordering and Marking Information
Ordering Device No.
Marking
ASDM100R160NP-T
100R160N
Packing
TO-220
Tube
Quantity
50/Tube
MARKING
PACKAGE
TO-220
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Package
100R160N
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ASDM100R160NP
100V N-Channel Power MOSFET
TO-220
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ASDM100R160NP
100V N-Channel Power MOSFET
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Incorporated does not assume any liability arising out of the application or use of this document or any product described herein; neither
does ShenZhen Ascend Semiconductor Incorporated convey any license under its patent or trademark rights, nor the rights of others. Any
Customer or user of this document or products described herein in such applications shall assume .
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ShenZhen Ascend Semiconductor Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased
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