ASDM40N15S
40V N-CHANNEL MOSFET
Product Summary
General Features
● High density cell design for ultra low Rdson
V DS
40
V
● Good stability and uniformity with high EAS
R DS(on),Typ@ VGS=10 V
6.0
mΩ
● Excellent package for good heat dissipation
ID
15
A
● Fully characterized avalanche voltage and current
● Special process technology for high ESD capability
Application
● Load switching
● Hard switched and high frequency circuits
● Uninterruptible power supply
Top View
SOP-8
N-Channel
Absolute Maximum Ratings (TA=25℃unless otherwise noted)
Parameter
Symbol
Limit
Unit
Drain-Source Voltage
VDS
40
V
Gate-Source Voltage
VGS
±20
V
ID
15
A
ID (100℃)
10.6
A
Pulsed Drain Current
IDM
60
A
Maximum Power Dissipation
PD
3.1
W
TJ,TSTG
-55 To 150
℃
Thermal Resistance,Junction-to-Ambient
RθJA
50
℃/W
Thermal Resistance,Junction-to-Case
RθJC
20
℃/W
Drain Current-Continuous
Drain Current-Continuous(TC=100℃)
Operating Junction and Storage Temperature Range
Thermal Characteristic
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ASDM40N15S
40V N-CHANNEL MOSFET
Electrical Characteristics (TA=25℃unless otherwise noted)
Parameter
Symbol
Condition
Min
Typ
Max
Unit
Drain-Source Breakdown Voltage
BVDSS
VGS=0V ID=250μA
40
-
-
V
Zero Gate Voltage Drain Current
IDSS
VDS=32V,VGS=0V
-
-
1
μA
Gate-Body Leakage Current
IGSS
VGS=±20V,VDS=0V
-
-
±100
nA
Gate Threshold Voltage
VGS(th)
VDS=VGS,ID=250μA
1.2
1.6
2.5
V
Drain-Source On-State Resistance
RDS(ON)
VGS=10V, ID=10A
-
6.0
10
mΩ
VGS=4.5V, ID=8A
-
7.4
15
mΩ
VDS=5V,ID=10A
-
80
-
S
-
1718
-
PF
-
182
-
PF
-
152
-
PF
-
7
-
nS
Off Characteristics
On Characteristics
(Note 3)
Forward Transconductance
Dynamic Characteristics
gFS
(Note4)
Input Capacitance
Clss
Output Capacitance
Coss
Reverse Transfer Capacitance
Switching Characteristics
VDS=20V,VGS=0V,
F=1.0MHz
Crss
(Note 4)
Turn-on Delay Time
td(on)
Turn-on Rise Time
tr
VDD=20V, RL=2Ω
-
20
-
nS
td(off)
VGS=10V,RG=3Ω
-
34
-
nS
-
19
-
nS
-
60
-
nC
-
8.1
-
nC
-
16.9
-
nC
-
-
1.2
V
-
-
15
A
TJ = 25°C, IF = 10A
-
31
-
nS
(Note3)
-
33
-
nC
Turn-Off Delay Time
Turn-Off Fall Time
tf
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
VDS=20V,ID=10A,
VGS=10V
Drain-Source Diode Characteristics
Diode Forward Voltage
(Note 3)
VSD
Diode Forward Current
(Note 2)
IS
Reverse Recovery Time
Reverse Recovery Charge
VGS=0V,IS=10A
trr
di/dt = 100A/μs
Qrr
Notes:
1. Repetitive Rating: Pulse width limited by maximum junction temperature.
2. Surface Mounted on FR4 Board, t ≤ 10 sec.
3. Pulse Test: Pulse Width ≤ 300μs, Duty Cycle ≤ 2%.
4. Guaranteed by design, not subject to production
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ASDM40N15S
40V N-CHANNEL MOSFET
ID- Drain Current (A)
Normalized On-Resistance
Typical Electrical and Thermal Characteristics (Curves)
TJ-Junction Temperature(℃)
Vds Drain-Source Voltage (V)
Figure 4 Rdson-JunctionTemperature
ID- Drain Current (A)
Vgs Gate-Source Voltage (V)
Figure 1 Output Characteristics
Qg Gate Charge (nC)
Figure 2 Transfer Characteristics
Figure 5 Gate Charge
Is- Reverse Drain Current (A)
Rdson On-Resistance(mΩ)
Vgs Gate-Source Voltage (V)
ID- Drain Current (A)
Vsd Source-Drain Voltage (V)
Figure 3 Rdson- Drain Current
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Figure 6 Source- Drain Diode Forward
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ASDM40N15S
C Capacitance (pF)
Power Dissipation (W)
40V N-CHANNEL MOSFET
TJ-Junction Temperature (℃)
Figure 7 Capacitance vs Vds
Figure 9 Power De-rating
ID- Drain Current (A)
Vds Drain-Source Voltage (V)
TJ-Junction Temperature(℃)
Figure 8 Safe Operation Area
Figure 10 Current De-rating
r(t),Normalized Effective
Transient Thermal Impedance
Vds Drain-Source Voltage (V)
Square Wave Pluse Duration(sec)
Figure 11 Normalized Maximum Transient Thermal Impedance
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ASDM40N15S
40V N-CHANNEL MOSFET
Test circuit
1) EAS Test Circuit
2) Gate Charge Test Circuit
3) Switch Time Test Circuit
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ASDM40N15S
40V N-CHANNEL MOSFET
Ordering and Marking Information
Ordering Device No.
Marking
Package
ASDM40N15S-R
40N15
SOP-8
PACKAGE
MARKING
SOP-8
40N15
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Packing
Quantity
Tape&Reel
4000/Reel
Ascend Semicondutor Co.,Ltd
ASDM40N15S
40V N-CHANNEL MOSFET
SOP-8 PACKAGE IN FORMATION
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ASDM40N15S
40V N-CHANNEL MOSFET
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