ASDM30P35E
-30V P-Channel MOSFET
Product Summary
Features
• Low RDS(ON)
• High Current capability
V DS
• Reliable and Rugged
R
• ROHS Compliant & Halogen-Free
@ VGS=10 V
DS(on),TYP
ID
Application
-30
V
8.2
mΩ
-35
A
• Notebook AC-in load switch
• Battery protection charge/discharge
top view
PDFN3.3*3.3-8
Absolute Maximum Ratings (TJ=25°C Unless Otherwise Noted)
Symbol
Parameter
Rating
Unit
VDSS
Drain-Source Voltage
-30
VGSS
Gate-Source Voltage
±20
Maximum Junction Temperature
150
°C
-55 to 150
°C
-35
A
Tc=25°C
-140
A
Tc=25°C
-35
Tc=100°C
-19
Tc=25°C
27
W
Rating
Unit
TJ
TSTG
IS
IDM
Storage Temperature Range
Diode Continuous Forward Current
①
Pulse Drain Current Tested
ID
Continuous Drain Current
PD
Maximum Power Dissipation
V
A
Thermal Characteristics
Symbol
RJC
③
RJA
Parameter
Thermal Resistance-Junction to Case
Steady State
3.6
°C/W
Thermal Resistance-Junction to Ambient
Steady State
37
°C/W
Note ①:Max. current is limited by bonding wire
Note ②:UIS tested and pulse width are limited by maximum junction temperature 150 oC
Note ③:Surface Mounted on 1in2 FR-4 board with 1oz.
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ASDM30P35E
-30V P-Channel MOSFET
Electrical Characteristics (TJ=25°C Unless Otherwise Noted)
Symbol
Parameter
Min.
Typ.
Max.
Unit
VGS=0V, ID=-250A
-30
-
-
V
VDS=-27V, VGS=0V
-
-
-1
uA
Gate Threshold Voltage
VDS=VGS, ID=-250uA
-1.0
-1.4
- 2. 5
V
Gate Leakage Current
VGS=±20V, VDS=0V
-
-
±100
nA
VGS=-10V, ID=-10A
-
8.2
10
VGS=-4.5V, ID=-8A
-
11.3
15
VDS=-10V, ID=-8A
-
6.8
-
VGS=0V,VDS=0V,
F=1MHz
-
10
-
-
1445
-
172
-
-
105
-
-
15.8
-
-
28.8
-
-
46.9
-
-
12.3
-
-
32
-
Static Electrical Characteristics
Drain-Source Breakdown Voltage
BVDSS
IDSS
Zero Gate Voltage Drain Current
VGS(th)
IGSS
RDS(ON)
gfs
④
Drain-Source On-state Resistance
Forward Transconductance
Dynamic Characteristics
Gate Resistance
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Turn-on Dela y Time
tr
Turn-on Rise Time
td(OFF)
Turn-off Delay Time
tf
Turn-off Fall Time
Qg
Total Gate Charge
Qg
Qgs
m
S
⑤
RG
td(ON)
Test Conditions
VGS=0V,
VDS=-15V,
Freq.=1MHz
VDD=-15V,
ID=-1A,
VGS=-4.5V,
RGEN=2.7
VDS=-25V, VGS=-4.5V,
ID=-13A
Total Gate Charge
Gate-Source Charge
Qgd
Gate-Drain Charge
Source-Drain Characteristics
④
Diode Forward Voltage
VSD
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
pF
nS
-
43
-
VDS=-15V,
VGS=-10V, ID=-10A
-
8.4
-
-
14
-
IS=-3A, VGS=0V
-
-0.8
-1.0
V
19.2
-
0.8
-
nS
nC
IF=-20A,VGS=0,
dlF/dt=100A/us
-
nC
Note ④:Pulse test (pulse width300us, duty cycle2%).
Note ⑤:Guaranteed by design, not subject to production testing.
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ASDM30P35E
Normalized On Resistance (m)
ID , Continuous Drain Current (A)
-30V P-Channel MOSFET
TJ , Junction Temperature (℃)
Fig.2 Normalized RDSON vs. TJ
-VGS , Gate to Source Voltage (V)
Normalized Gate Threshold Voltage (V)
TC , Case Temperature (℃)
Fig.1 Continuous Drain Current vs. TC
Fig.5
Fig.4
Qg , Gate Charge (nC)
Gate Charge Waveform
-ID , Continuous Drain Current (A)
Normalized Thermal Response (RθJC)
TJ , Junction Temperature (℃)
Fig.3 Normalized Vth vs. TJ
Square Wave Pulse Duration (s)
Normalized Transient Impedance
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-VDS , Drain to Source Voltage (V)
Fig.6 Maximum Safe Operation Area
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ASDM30P35E
-30V P-Channel MOSFET
Fig.7 Switching Time Waveform
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Fig.8
Gate Charge Waveform
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ASDM30P35E
-30V P-Channel MOSFET
Ordering and Marking Information
Ordering Device No.
Marking
ASDM30P35E-R
30P35
Package
PDFN3.3*3.3-8
Packing
Quantity
Tape&Reel
5000/Reel
PACKAGE
MARKING
PDFN3.3*3.3-8
30P35
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ASDM30P35E
-30V P-Channel MOSFET
*
Symbol
A
A1
A2
D
D1
E
E1
E2
b
e
L
L1
L2
L3
H
θ
NOV 2020 Version1.0
Dimensions In Millimeters
Min.
Max.
0.650
0.850
0.152 REF.
0~0.05
2.900
3.100
2.300
2.600
2.900
3.100
3.150
3.450
1.535
1.935
0.200
0.400
0.550
0.750
0.300
0.500
0.180
0.480
0~0.100
0~0.100
0.315
0.515
9°
13°
6/7
Dimensions In Inches
Min.
Max.
0.026
0.033
0.006 REF.
0~0.002
0.114
0.122
0.091
0.102
0.114
0.122
0.124
0.136
0.060
0.076
0.008
0.016
0.022
0.030
0.012
0.020
0.007
0.019
0~0.004
0~0.004
0.012
0.020
9°
13°
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ASDM30P35E
-30V P-Channel MOSFET
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