ASDM30P11TD
-30V P-Channel MOSFET
Features
Product Summary
● Low FOM RDS(on)×Qgd
● 100% avalanche tested
● Easy to use/drive
● RoHS compliant
-30
V
R DS(on),TYP@ VGS=10 V
6.4
mΩ
I
-55
A
V
Application
● Power Switch Circuit of Adaptor and Charger
● Battery Protection Charge/Discharge
● Notebook AC-in Load Switch
DS
D
PDFN3*3-8
Maximum Ratings TA = 25ºC, unless otherwise noted
-Source voltage(VGS=0V)
Drain Current2)
C
Symbol
Values
Unit
VDS
-30
V
= 25ºC
-55
ID
C
= 100ºC
Drain Current3)
A
-34.6
ID,pulse
-220
A
VGSS
±25
V
EAS
200
mJ
PD
31.2
W
TJ, Tstg
-55~+150
ºC
Symbol
Max.
Unit
Thermal Resistance, Junction-to-Case
RthJC
4
ºC/W
Thermal Resistance, Junction-to-Ambient
RthJA
35
ºC/W
-Source Voltage
Dissipation
Junction and Storage Temperature Range
Parameter
Notes
1) L=0.5mH,VDD=-15V,Start TJ=25℃
2) Limited by maximum junction temperature.
3) Repetitive Rating: Pulse width limited by maximum junction temperature.
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ASDM30P11TD
-30V P-Channel MOSFET
Electrical Characteristics TJ = 25ºC, unless otherwise noted
Value
Parameter
Symbol
Test Conditions
Unit
Min.
Typ.
Max.
VGS = 0V, ID = -250µA
-30
--
--
VDS = -30V
VGS = 0V, TJ = 25ºC
--
--
-1
VDS = -24V,
VGS = 0V, TJ = 125ºC
--
--
-100
IGSS
VGS = ±25V
--
--
±100
nA
Gate-Source Threshold Voltage
VGS(th)
VDS = VGS, ID = -250µA
-1.2
-1.8
-2.5
V
VGS = -10V, ID = -20A
--
6.4
8
mΩ
Drain-Source On-State-Resistance
RDS(on)
VGS = -4.5V, ID = -10A
--
10.5
13
mΩ
--
3482
--
--
400
--
Static Characteristics
Drain-Source Breakdown Voltage
V(BR)DSS
Zero Gate Voltage Drain Current
μA
IDSS
Gate-Source Leakage Current
V
Dynamic Characteristics
Input Capacitance
Ciss
VGS = 0V,
VDS = -15V
f = 1.0MHz
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
--
309
--
Total Gate Charge
Qg
--
61
--
Gate-Source Charge
Qgs
--
12
--
Gate-Drain Charge
Qgd
--
10
--
VPlateau
--
3.1
--
Turn-on Delay Time
td(on)
--
19
--
Turn-on Rise Time
tr
--
33
--
Turn-off Delay Time
td(off)
--
38
--
--
15
--
--
--
-1.2
V
--
--
-55
A
--
45
--
ns
--
29
--
nC
Gate Plateau Voltage
Turn-off Fall Time
VDS = -15V , ID = -10A
VGS = -10V
VDS = -15V , VGS = -10V
RG = 3Ω, ID = -10A
tf
pF
nC
V
ns
Drain-Source Body Diode Characteristics
Body Diode Forward Voltage
VSD
Continuous Diode Forward Current
IS
Reverse Recovery Time
trr
TJ = 25ºC, ISD = -10A,
VGS = 0V
IF = -10A,diF/dt = -100A/μs
Reverse Recovery Charge
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ASDM30P11TD
-30V P-Channel MOSFET
Typical Characteristics TJ = 25ºC, unless otherwise noted
35
1000
100μs
10
Limited by RDS(on)
1ms
10ms
1
SINGLE PULSE
TC=25℃
TJ=150℃
0.1
DC
PD,Power Dissipation,[W]
-ID,Drain Current,[A]
30
10μs
100
25
20
15
10
5
0
0.01
0.1
1
10
-VDS,Drain-to-Source Voltage,[V]
0
100
Figure 1. Maximum Safe Operating Area
50
75
100
125
TC,CaseTemperature,[℃]
150
Figure 2. Maximum Power Dissipation
vs Case Temperature
80
60
Vgs=-10V
70
-ID,Drain Current[A]
50
-ID,Drain Current,[A]
25
40
30
20
10
60
Vgs=-4.5V
Vgs=-4V
50
40
Vgs=-3.5V
30
20
Vgs=-3V
10
0
0
25
50
75
100
125
TC,Case Temperature,[℃]
150
Figure 3. Maximum Continuous Drain
Current vs Case Temperature
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0
1
2
-VDS,Drain-to-Source Voltage,[V]
3
Figure 4. Typical output Characteristics
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ASDM30P11TD
-30V P-Channel MOSFET
Typical Characteristics TJ = 25ºC, unless otherwise noted
ZθJC,Thermal Response,[℃/W]
10
1
D = 1.0
D = 0.5
D = 0.2
D = 0.1
D = 0.05
D = 0.02
D = 0.01
Single Pulse
0.1
Notes:
Notes:
1.DutyCycle,
Cycle,
D=t1/t2
1.Duty
D=t1/t2
2.TJM
2.T
==
P PDM
*R*RθJC
++
T TC
0.01
JM
0.001
0.000001
0.00001
0.0001
0.001
0.01
0.1
DM
θJA
A
1
10
T , Rectangular Pulse Duration, [sec]
Figure 5 Maximum Effective Thermal Impedance , Junction to Case
100
Note:
1.VDS=-5V
2.250us Pulse Test
-Is,Source Current,[A]
-ID,Drain Current,[A]
100
10
Tj=150℃
Tj=25℃
1
0.1
10
Tj=150℃
Tj=25℃
1
0.1
0
1
2
3
-VGS,Gate-to-Source Voltage,[V]
4
Figure 6 Typical Transfer Characteristics
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0
0.2
0.4
0.6
0.8
1
1.2
-VSD,Source-to-Drain Voltage,[V]
Figure 7 Typical Body Diode Transfer
Characteristics
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0755-86970486
ASDM30P11TD
-30V P-Channel MOSFET
Typical Characteristics TJ = 25ºC, unless otherwise noted
14
1.8
12
VGS = -4.5V
RDS(on),[mΩ]
10
8
VGS = -10V
6
4
1.4
1.2
1
0.8
0.6
0.4
2
0
5
10
15
20
-ID,Drain Current,[A]
25
-50
30
Figure 8. Drain-to-Source On Resistance vs
Drain Current
0
50
100
TJ,Junction Temperature,[℃]
150
Figure 9. Normalized On Resistance vs
Junction Temperature
1.12
1.2
1.1
1.1
1.08
1
BVDSS,(Normalized)
VGS(th),(Normalized)
PULSED TEST
VGS = -10V
ID = -20A
1.6
RDS(on),(Normalized)
PULSED TEST
Tj = 25℃
0.9
0.8
0.7
VGS = VDS
ID = -250μA
0.6
0.5
1.06
1.04
1.02
1
0.98
0.96
0.94
0.4
0.92
-50
0
50
100
TJ,Junction Temperature,[℃]
150
-50
0
50
100
150
TJ,Junction Temperature,[℃]
Figure10. Normalized Threshold Voltage vs Figure 11. Normalized Breakdown Voltage vs
Junction Temperature
Junction Temperature
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ASDM30P11TD
-30V P-Channel MOSFET
Typical Characteristics TJ = 25ºC, unless otherwise noted
10
Vgs,Gate-to-Source Voltage,V
Capacitance,pF
10000
Ciss
f = 1MHz
Ciss = Cgs+Cgd
Coss = Cds+Cgd
Crss = Cgd
1000
Coss
Crss
100
0
10
20
-VDS,Drain-to-Source Voltage,V
30
Figure 12. Capacitance Characteristics
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8
6
VDS=-15V
ID=-10A
4
2
0
0
20
40
60
Qg,Gate Charge,nC
80
Figure 13 Typical Gate Charge vs Gate
to Source Voltage
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ASDM30P11TD
-30V P-Channel MOSFET
Ordering and Marking Information
Ordering Device No.
Marking
Package
Packing
Quantity
ASDM30P11TD-R
30P11
PDFN3*3-8
Tape&Reel
5000/Reel
MARKING
PACKAGE
PDFN3*3-8
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ASDM30P11TD
-30V P-Channel MOSFET
PDFN3*3_8 Package
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ASDM30P11TD
-30V P-Channel MOSFET
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