AG
GM4005L
LL
L
● General Description
Product Summary
The AGM4005LL combines advanced trench
MOSFET technology with a low resistance package
to provide extremely low RDS(ON) .
This device is ideal for load switch and battery
protection applications.
● Features
■ Advance
high cell density Trench technology
RDSON
ID
40V
0.82mΩ
350A
TOLL-8L Pin Configuration
■ Low
RDS(ON) to minimize conductive loss
■ Low Gate Charge for fast switching
■ Low
BVDSS
D
Thermal resistance
● Application
■ MB/VGA Vcore
■ SMPS
■ POL
G
2nd Synchronous Rectifier
S
application
■ BLDC
Pin
Motor driver
Package Marking and Ordering Information
Device Marking
Device
Device Package
AGM4005LL
AGM4005LL
TOLL-8L
Table 1.
Description
1
Gate(G)
2,3,4,5,6,7,8
Source(S)
9
Drain(D)
Reel Size
Quantity
Tape width
----
----
2000
Absolute Maximum Ratings (TA=25℃)
Symbol
Parameter
VDS
Drain-Source Voltage (VGS=0V)
VGS
Gate-Source Voltage (VDS=0V)
ID
IDM (pluse)
PD
EAS
TJ,TSTG
Table 2.
Value
Unit
40
V
±20
V
Drain Current-Continuous(Tc=25℃) (Note 1)
350
A
Drain Current-Continuous(Tc=100℃)
247
A
1330
A
Maximum Power Dissipation(Tc=25℃)
250
w
Maximum Power Dissipation(Tc=100℃)
100
w
Drain Current-Continuous@ Current-Pulsed (Note 2)
Avalanche energy (Note 3)
Operating Junction and Storage Temperature Range
1052
mJ
-55 To 150
℃
Thermal Characteristic
Symbol
Parameter
Typ
Max
Unit
RθJA
Thermal Resistance Junction-ambient (Steady State)1
---
40
℃/W
RθJC
Thermal Resistance Junction-Case1
---
0.5
℃/W
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1
VER2.51
AG
GM4005L
LL
L
Table 3.
Electrical Characteristics (TA=25℃unless otherwise noted)
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
On/Off States
BVDSS
Drain-Source Breakdown Voltage
VGS=0V ID=250μA
40
45
--
V
IDSS
Zero Gate Voltage Drain Current
VDS=32V,VGS=0V
--
--
1
μA
IGSS
Gate-Body Leakage Current
VGS=±20V,VDS=0V
--
--
±100
nA
VGS(th)
Gate Threshold Voltage
VDS=VGS,ID=250μA
1.2
1.7
2.3
V
gFS
Forward Transconductance
VDS=5V,ID=12A
--
--
--
S
RDS(on)
Drain-Source On-State Resistance
VGS=10V, ID=40A
--
0.82
1.3
mΩ
VGS=4.5V, ID=20A
--
1.7
3
mΩ
--
5440
--
pF
--
1815
--
pF
--
120
--
pF
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
Rg
Gate resistance
VDS=20V,VGS=0V,
F=1MHZ
VGS=0V,
VDS=0V,f=1.0MHz
--
1.3
--
Ω
Switching Times
td(on)
Turn-on Delay Time
--
15.7
--
nS
tr
Turn-on Rise Time
--
48
--
nS
--
75
--
nS
--
42
--
nS
--
81
--
nC
--
18
--
nC
--
15
--
nC
--
--
350
A
td(off)
Turn-Off Delay Time
tf
Turn-Off Fall Time
Qg
Total Gate Charge
Qgs
Gate-Source Charge
Qgd
Gate-Drain Charge
VGS=10V,VDS=20V
ID=40A,RGEN=3Ω
VGS=10V, VDS=20V,
ID=40A
Source-Drain Diode Characteristics
ISD
Source-Drain Current(Body Diode)
VSD
Forward on Voltage
VGS=0V,IS=40A
--
0.8
1.3
V
trr
Reverse Recovery Time
IF=25A , dI/dt=100A/µs ,
--
--
--
ns
Qrr
Reverse Recovery Charge
TJ=25℃
--
--
--
nc
Notes 1.The maximum current rating is package limited.
Notes 2.Repetitive Rating: Pulse width limited by maximum junction temperature
Notes 3.EAS condition: TJ=25℃
www.agm-mos.com
2
VER2.51
AG
GM4005L
LL
L
. Typical Characteristics
Power Capability
Current Capability
500
350
300
ID - Drain Current (A)
400
Ptot - Power (W)
250
200
150
100
300
200
100
50
o
TC=25 C,VG=10V
o
TC=25 C
0
0
0
20 40 60 80 100 120 140 160 180
Tmp – Mounting Point Temp. (°C)
0
20
60
80 100 120 140 160
Tmp – Mounting Point Temp. (°C)
Safe Operating Area
Transient Thermal Impedance
3000
Normalized Effective Transient
2
1000
)L
im
it
100us
s(
on
300us
Rd
ID - Drain Current (A)
40
100
1ms
10
10ms
DC
1
o
TC=25 C
0.1
0.01
0.1
1
10
Duty = 0.5
0.2
0.1
0.1
0.05
0.02
0.01
2
Single Pulse
0.01
1E-4
100 300
VDS - Drain-Source Voltage (V)
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1
1E-3
Mounted on 1in pad
o
RJC :0.5 C/W
0.01
0.1
1
10
Square Wave Pulse Duration (sec)
3
VER2.51
AG
GM4005L
LL
L
. Typical Characteristics (Cont.)
Output Characteristics
On Resistance
4
50
RDS(ON) - On Resistance (mΩ)
VGS= 4,5,6,7,8,9,10V
45
ID - Drain Current (A)
40
35
30
25
20
15
3V
10
5
3
VGS= 4.5V
2
VGS=10V
1
2V
0
0.0
0.2
0.4
0.6
0.8
0
0
1.0
10
20
30
40
50
VDS - Drain-Source Voltage (V)
ID - Drain Current (A)
Transfer Characteristics
Normalized Threshold Voltage
1.8
50
IDS =250A
IDS=20A
Normalized Threshold Voltage
RDS(ON) - On Resistance (mΩ)
1.6
40
30
20
10
0
1
2
3
4
5
6
7
8
9
1.2
1.0
0.8
0.6
0.4
0.2
0.0
-50 -25
10
VGS - Gate-Source Voltage (V)
www.agm-mos.com
1.4
0
25
50
75 100 125 150
Tj - Junction Temperature (°C)
4
VER2.51
AG
GM4005L
LL
L
. Typical Characteristics (Cont.)
Normalized On Resistance
Diode Forward Current
2.2
40
VGS = 10V
IDS = 20A
1.8
IS - Source Current (A)
Normalized On Resistance
2.0
1.6
1.4
1.2
1.0
0.8
0.6
0.4
10
o
Tj=25 C
1
o
RON@Tj=25 C: 1.2m
0.2
-50 -25
0
25
50
75
0.1
0.0
100 125 150
0.4
0.6
0.8
1.0
1.2
VSD - Source-Drain Voltage (V)
Capacitance
Gate Charge
10
Frequency=1MHz
VDS= 20V
VGS - Gate-Source Voltage (V)
7000
Ciss
6000
5000
4000
3000
Coss
2000
1000
Crss
0
0.2
Tj - Junction Temperature (°C)
8000
C - Capacitance (pF)
o
Tj=150 C
0
5
10
15
20
25
30
35
6
4
2
0
40
VDS - Drain-Source Voltage (V)
www.agm-mos.com
IDS= 20A
8
0
20
40
60
80
QG - Gate Charge (nC)
5
VER2.51
AG
GM4005L
LL
L
Package Dimensions
TOLL-8L Package
L1
A
b1
E1
A1
R
b3(3x)
D1
H2
H1
c
e(6x)
e1(2x)
E
b(6x)
Q
L2
b2(2x)
L
L3
K
H
D
D2(2x)
D4
E2
BOTTOM VIEW
TOP VIEW
SYMBOL
j
i
Detail "Z"
Detail "Z"
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6
A
A1
b
b1
b2
b3
c
D
D1
D2
D4
E
E1
E2
e
e1
H
H1
H2
i
j
K
L
L1
L2
L3
Q
R
0
MILLIMETER
NOM.
2.300
1.800
0.700
9.800
0.750
1.200
0.500
10.400
11.100
3.300
4.570
9.900
8.100
0.600
1.200 BSC
1.225 BSC
11.600
11.700
6.950 BSC
5.900 BSC
0.100 REF.
0.350 REF.
3.100 REF.
1.550
1.650
0.600
0.700
0.500
0.600
0.400
0.500
7.950 REF.
3.000
3.100
10˚REE.
MIN.
2.200
1.700
0.600
9.700
0.650
1.100
0.400
10.300
11.000
3.200
4.470
9.800
8.000
0.500
MAX.
2.400
1.900
0.800
9.900
0.850
1.300
0.600
10.500
11.200
3.400
4.670
10.000
8.200
0.700
11.800
1.750
0.800
0.700
0.600
3.200
VER2.51
AG
GM4005L
LL
L
Disclaimer:
The information provided in this document is believed to be accurate and reliable.
however,Shenzhen Core Control Electronics Technology Co., Ltd. does not assume
any responsibility for the following consequencesDo not consider the use of such
information or use beyond its scope.
The information mentioned in this document may be changed at any time without
notice.
The products and information provided in this document do not infringe patents.
Shenzhen Core Control Electronics Technology Co., Ltd. assumes no responsibility
for any infringement of any other rights of third parties.The result of using such
products and information.
This document is the second version issued on May 10, 2022. This document
replaces andReplace all previously provided information.
It is a registered trademark of Shenzhen Core Control Electronics
Technology Co., Ltd.
Copyright © 2017 Shenzhen Core Control Electronics Technology Co., Ltd. all rights
reserved.
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7
VER2.51
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