正基科技股份有限公司
SPECIFICATION
PRODUCT NAME：AP6256
REVISION： 2.8
DATE： Jul. 15th, 2021
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DCC ISSUE
C-RD-047F
AP6256
Data Sheet
Address:
8F, No.15-1 Zhonghua Road,Hsinchu Industrial Park, Hukou,
Hsinchu,Taiwan, 30352
http://www.ampak.com.tw
AP6256 Datasheet
Revision
Revision
Date
Description
1.0
2017 / 06 / 13
- Preliminary
1.1
2017 / 09 / 07
- Modify WLAN Specification
Harry
1.2
2017 / 12 / 15
- Modify WLAN/BT Specification
Harry
1.3
2017 / 12 / 20
- Modify WLAN/BT Specification
Harry
1.4
2018 / 08 / 03
- Modify Overview block diagram / General
Specification Dimension
Harry
1.5
2018 / 10 / 03
- Modify Bluetooth Specification & format
Harry
1.6
2018 / 12 / 12
- Modify 2.2.2 Voltages/ add PCM & UART
Interface Description Timing Diagram Spec
Harry
1.7
2018 / 12 / 28
- Modify 2.2.1 Absolute Maximum Ratings
VBAT MAX / ADD ESD Condition
Harry
1.8
2019 / 01 / 08
- Modify 6. Dimensions pin45,46,47 diameter
Harry
1.9
2019 / 03 / 25
- Modify version number C-RD-047D
Harry
2.0
2019 / 09 / 19
- Modify Layout recommended Footprint
- Modify Package Information
Richard
2.1
2019 / 09 / 24
- Modify Module Dimensions
Richard
2.2
2019 / 12 / 13
- Modify Bluetooth Specification
Richard
2.5
2020 /03 /02
- Modify 5GHz RF Specification
2.6
2021 /01 /12
- Modify recommended Footprint
Eason
2.7
2021 /07 /05
- Update Bluetooth Specification
Richard
2.8
2021 /07 /15
- Modify Physical Dimension
Richard
AMPAK Technology Inc.
8F, No.15-1 Zhonghua Road, Hsinchu Industrial Park, Hukou, Hsinchu, Taiwan, 30352
Revised By
Richard
i
Ali
http://www.ampak.com.tw
AP6256 Datasheet
Contents
1. Introduction ........................................................................................................... 2
1.1 Overview........................................................................................................ 2
1.2 Product Features ............................................................................................. 3
2. General Specification ............................................................................................... 4
2.1 General Specification ....................................................................................... 4
2.2 DC Characteristics ........................................................................................... 4
2.2.1 Absolute Maximum Ratings...................................................................... 4
2.2.2 Recommended Operating Rating .............................................................. 5
3. Wi-Fi RF Specification .............................................................................................. 6
3.1 2.4GHz RF Specification ................................................................................... 6
3.2 5GHz RF Specification ...................................................................................... 8
4. Bluetooth Specification .......................................................................................... 11
4.1 Bluetooth Specification .................................................................................. 11
5. Pin Definition ........................................................................................................ 12
5.1 Pin Outline ................................................................................................... 12
5.2 Pin Assignment ............................................................................................. 13
6. Dimensions........................................................................................................... 15
6.1 Module Dimensions ...................................................................................... 15
6.2 Recommended Footprint ............................................................................... 16
7. External clock reference ......................................................................................... 17
8. Host Interface Timing Diagram ............................................................................... 18
8.1 Power-up Sequence Timing Diagram ............................................................... 18
8.2 SDIO Interface Description ............................................................................. 20
8.3 PCM Interface Description ............................................................................. 27
8.4 UART Interface Description ............................................................................ 33
9. Recommended Reflow Profile................................................................................. 35
10. Package Information .............................................................................................. 36
10.1 Label .......................................................................................................... 36
10.2 Dimension .................................................................................................. 37
10.3 MSL Level / Storage Condition ...................................................................... 39
AMPAK Technology Inc.
8F, No.15-1 Zhonghua Road, Hsinchu Industrial Park, Hukou, Hsinchu, Taiwan, 30352
http://www.ampak.com.tw
ii
AP6256 Datasheet
1. Introduction
1.1
Overview
The AMPAK Technology® AP6256 is a fully Wi-Fi and Bluetooth functionalities module with
seamless roaming capabilities and advance security, also it could interact with different vendors’
802.11a/b/g/n/ac 1x1 Access Points with SISO standard and can accomplish up to speed of
433.3Mbps with single stream in 802.11ac to connect the wireless LAN. Furthermore AP6256
included SDIO interface for Wi-Fi, UART/ PCM interface for Bluetooth.
In addition, this compact module is a total solution for a combination of Wi-Fi + BT technologies.
The module is specifically developed for tablet, OTT box and portable devices.
AMPAK Technology Inc.
8F, No.15-1 Zhonghua Road, Hsinchu Industrial Park, Hukou, Hsinchu, Taiwan, 30352
2
http://www.ampak.com.tw
AP6256 Datasheet
1.2
Product Features
Lead Free design which is compliant with ROHS requirements.
TX and RX low-density parity check (LDPC) support for improved range and power efficiency.
Single-stream spatial multiplexing up to 433.3 Mbps data rate.
20, 40, 80 MHz channels with optional SGI (256 QAM modulation)
Supports 1antenna with one for WLAN & Bluetooth shared port. Also, shared Bluetooth and
WLAN receive signal path eliminates the need for an external power splitter while
maintaining excellent sensitivity for both Bluetooth and WLAN.
- Supports standard SDIO v3.0, compatible with SDIO v2.0 HOST interfaces.
BT host digital interface:
- HCI UART (up to 4 Mbps)
- PCM for audio data
Complies with Bluetooth Core Specification Version 5.2 with provisions for supporting future
specifications. With Bluetooth Class 1 or Class2 transmitter operation.
Supports extended synchronous connections (eSCO), for enhanced voice quality by allowing
for retransmission of dropped packets.
Adaptive frequency hopping (AFH) for reducing radio frequency interference.
A simplified block diagram of the module is depicted in the figure above.
AMPAK Technology Inc.
8F, No.15-1 Zhonghua Road, Hsinchu Industrial Park, Hukou, Hsinchu, Taiwan, 30352
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http://www.ampak.com.tw
AP6256 Datasheet
2. General Specification
2.1
General Specification
Model Name
AP6256
Product Description
1Tx/1Rx 802.11 ac/a/b/g/n Wi-Fi + BT 5.2 Module
L x W: 12 x 12(Typ.)mm、H : 1.65 (Max.) mm
Dimensionnote 2
(with shielding cover)
Wi-Fi Interface
SDIO V3.0/ 2.0
BT Interface
UART / PCM
Operating temperaturenote 1
-30°C to 85°C
Storage temperature
-40°C to 125°C
Humidity
Operating Humidity : Less than 85% Non-Condensing
Storage Humidity 5% to 95% Non-Condensing
Note 1: The optimal RF performance specified in the data sheet, however, is guaranteed
only -20 °C to +75 °C and 3.2V < VBAT < 4.8V without derating performance.
Note 2: The Dimension = L x W: 12 x 12(Typ.)mm、H : 1.37 (Max.) mm (without the shielding cover)
2.2
DC Characteristics
2.2.1 Absolute Maximum Ratings
Symbol
VBAT
VDDIO
Description
Min. Max.
Unit
Input supply Voltage
-0.5
5
V
Digital/Bluetooth/SDIO/ I/O Voltage
-0.5
3.9
V
Extreme caution must be exercised to prevent electrostatic discharge (ESD) damage.
Symbol
ESD_HAND_HBM
ESD_HAND_CDM
Condition
Human body model contact discharge per JEDEC
EID/JESD22-A114
Charged device model contact discharge per JEDEC
EIA/JESD22-C101
AMPAK Technology Inc.
8F, No.15-1 Zhonghua Road, Hsinchu Industrial Park, Hukou, Hsinchu, Taiwan, 30352
Minimum
ESD Rating
Unit
1
kV
250
V
4
http://www.ampak.com.tw
AP6256 Datasheet
2.2.2 Recommended Operating Rating
The module requires two power supplies: VBAT and VDDIO.
Voltage rails
Min.
Typ.
Max.
Unit
VBAT
3.2
3.3
4.8
V
VDDIO
1.6
1.8 / 3.3
3.6
V
VBAT current consumption 1A (Peak), when VBAT = 3.3V
The module requires two power supplies: other Digital I/O Pins.
For VDDIO=1.8V
Min.
Max.
Unit
VIL/VIH
0.35×VDDIO
0.65×VDDIO
V
VOL/VOH output@2mA
0.4
VDDIO-0.4
V
For VDDIO=3.3V
Min.
Max.
Unit
VIL/VIH
0.80
2
V
VOL/VOH output@2mA
0.4
VDDIO-0.4
V
AMPAK Technology Inc.
8F, No.15-1 Zhonghua Road, Hsinchu Industrial Park, Hukou, Hsinchu, Taiwan, 30352
5
http://www.ampak.com.tw
AP6256 Datasheet
3. Wi-Fi RF Specification
3.1
2.4GHz RF Specification
Conditions : VBAT=3.3V ; VDDIO=3.3V ; Temp:25°C
Feature
Description
WLAN Standard
IEEE 802.11b/g/n & Wi-Fi compliant
Frequency Range
2.400 GHz ~ 2.4835 GHz (2.4GHz ISM Band)
Number of Channels
2.4GHz：Ch1 ~ Ch13
Modulation
802.11b : DQPSK、DBPSK、CCK
802.11 g/n : OFDM /64-QAM、16-QAM、QPSK、BPSK
Output Power , tolerance ± 1.5 dB
The transmit EVM quality & spectrum mask are compliant with IEEE 802.11 standard
1Mbps
802.11b
2Mbps
17
5.5Mbps
17
6、9Mbps
17
12、18Mbps
24Mbps
17
36Mbps
48Mbps
16
16
16
15
MCS0~2
MCS3
MCS4
MCS5
MCS6
802.11n
17
17
16
15
14
20MHz
MCS7
802.11g
16
11Mbps
54Mbps
15
14
Note： The specifications of RF output power are subject to change to fulfill the safety regulation and requirements in end-user product.
Sensitivity, tolerance ± 2 dB
CCK modulation PER ≦ 8%、OFDM modulation PER ≦ 10%
Data Rate
802.11b
802.11g
Spec.(dBm)
1Mbps
-96
2Mbps
-90
5.5Mbps
-88
11Mbps
-87
Data Rate
Spec.(dBm)
Data Rate
Spec.(dBm)
6Mbps
-91
24Mbps
-83
9Mbps
-88
36Mbps
-80
12Mbps
-87
48Mbps
-76
AMPAK Technology Inc.
8F, No.15-1 Zhonghua Road, Hsinchu Industrial Park, Hukou, Hsinchu, Taiwan, 30352
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AP6256 Datasheet
802.11n_20MHz
Maximum Input
Level
18Mbps
-85
54Mbps
-73
Data Rate
Spec.(dBm)
Data Rate
Spec.(dBm)
MCS0
-90
MCS4
-77
MCS1
-85
MCS4
-75
MCS2
-84
MCS6
-72
MCS3
-80
MCS7
-71
802.11b : -10 dBm
802.11g/n : -20 dBm
AMPAK Technology Inc.
8F, No.15-1 Zhonghua Road, Hsinchu Industrial Park, Hukou, Hsinchu, Taiwan, 30352
7
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AP6256 Datasheet
3.2
5GHz RF Specification
Conditions : VBAT=3.3V ; VDDIO=3.3V ; Temp:25°C
Feature
Description
WLAN Standard
IEEE 802.11a/n/ac & Wi-Fi compliant
Frequency Range
5.15~5.35GHz、5.47~5.725GHz、5.725~5.85GHz (5GHz UNII Band)
Number of Channels
5.18~5.35GHz：Ch36 ~ Ch64
5.5~5.72GHz：Ch100 ~ Ch144
5.745~5.825GHz：Ch149 ~ Ch165
Modulation
802.11a : OFDM /64-QAM、16-QAM、QPSK、BPSK
802.11n : OFDM /64-QAM、16-QAM、QPSK、BPSK
802.11ac : OFDM /256-QAM、OFDM /64-QAM、16-QAM、QPSK、BPSK
Output Power , tolerance ± 2 dB
The transmit EVM quality & spectrum mask are compliant with IEEE 802.11 standard
Frequency (MHz)
6~9Mbps
12~18Mbps
24Mbps
36Mbps
5180~5350
17
17
17
16
5500~5720
17
17
17
16
5745~5825
17
17
17
16
Frequency (MHz)
48Mbps
54Mbps
5180~5350
16
15
5500~5720
16
15
5745~5825
16
15
Frequency (MHz)
MCS0~2
MCS3
MCS4
MCS5
5180~5350
17
17
16
16
5500~5720
17
17
16
16
802.11n
5745~5825
17
17
16
16
20MHz
Frequency (MHz)
MCS6
MCS7
5180~5350
15
14
5500~5720
15
14
5745~5825
15
14
Frequency (MHz)
MCS0~2
MCS3
MCS4
MCS5
5180~5350
17
17
16
16
5500~5720
17
17
16
16
5745~5825
17
17
16
16
Frequency (MHz)
MCS6
MCS7
802.11a
802.11n
40MHz
AMPAK Technology Inc.
8F, No.15-1 Zhonghua Road, Hsinchu Industrial Park, Hukou, Hsinchu, Taiwan, 30352
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AP6256 Datasheet
5180~5350
15
14
5500~5720
15
14
5745~5825
15
14
Frequency (MHz)
MCS0~2
MCS3
MCS4
MCS5
5180~5350
17
17
16
16
5500~5720
17
17
16
16
802.11ac
5745~5825
17
17
16
16
20MHz
Frequency (MHz)
MCS6
MCS7
MCS8
5180~5350
15
14
12
5500~5720
15
14
12
5745~5825
15
14
12
Frequency (MHz)
MCS0~2
MCS3
MCS4
MCS5
5180~5350
17
17
16
16
5500~5720
17
17
16
16
802.11ac
5745~5825
17
17
16
16
40MHz
Frequency (MHz)
MCS6
MCS7
MCS8
MCS9
5180~5350
15
14
12
10.5
5500~5720
15
14
12
10.5
5745~5825
15
14
12
10.5
Frequency (MHz)
MCS0~2
MCS3
MCS4
MCS5
5180~5350
17
17
16
16
5500~5720
17
17
16
16
802.11ac
5745~5825
17
17
16
16
80MHz
Frequency (MHz)
MCS6
MCS7
MCS8
MCS9
5180~5350
15
14
12
10.5
5500~5720
15
14
12
10.5
5745~5825
15
14
12
10.5
Note：The specifications of RF output power are subject to change to fulfill the safety regulation and requirements in end-user product.
Sensitivity, tolerance ± 2 dB
OFDM modulation PER ≦ 10%
802.11a
Data Rate
Spec.(dBm)
Data Rate
Spec.(dBm)
6Mbps
-92
24Mbps
-82
9Mbps
-89
36Mbps
-79
12Mbps
-88
48Mbps
-75
18Mbps
-86
54Mbps
-74
AMPAK Technology Inc.
8F, No.15-1 Zhonghua Road, Hsinchu Industrial Park, Hukou, Hsinchu, Taiwan, 30352
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AP6256 Datasheet
802.11n_20MHz
802.11n_40MHz
802.11ac_20MHz
802.11ac_40MHz
802.11ac_80MHz
Data Rate
Spec.(dBm)
Data Rate
Spec.(dBm)
MCS0
-91
MCS4
-78
MCS1
-88
MCS5
-74
MCS2
-85
MCS6
-73
MCS3
-82
MCS7
-72
Data Rate
Spec.(dBm)
Data Rate
Spec.(dBm)
MCS0
-89
MCS4
-76
MCS1
-85
MCS5
-71
MCS2
-83
MCS6
-70
MCS3
-79
MCS7
-68
Data Rate
Spec.(dBm)
Data Rate
Spec.(dBm)
MCS0
-90
MCS5
-73
MCS1
-87
MCS6
-71
MCS2
-84
MCS7
-70
MCS3
-81
MCS8
-67
MCS4
-77
Data Rate
Spec.(dBm)
Data Rate
Spec.(dBm)
MCS0
-88
MCS5
-70
MCS1
-83
MCS6
-68
MCS2
-81
MCS7
-66
MCS3
-78
MCS8
-65
MCS4
-75
MCS9
-63
Data Rate
Spec.(dBm)
Data Rate
Spec.(dBm)
MCS0
-85
MCS5
-69
MCS1
-82
MCS6
-65
MCS2
-78
MCS7
-63
MCS3
-74
MCS8
-61
MCS4
-71
MCS9
-60
Maximum Input
802.11a/n : -20 dBm
Level
802.11ac : -30 dBm
AMPAK Technology Inc.
8F, No.15-1 Zhonghua Road, Hsinchu Industrial Park, Hukou, Hsinchu, Taiwan, 30352
10
http://www.ampak.com.tw
AP6256 Datasheet
4. Bluetooth Specification
4.1
Bluetooth Specification
Conditions : VBAT=3.3V ; VDDIO=3.3V ; Temp:25°C
Feature
Description
General Specification
Bluetooth Standard
BDR(1Mbps)、EDR(2、3Mbps)、LE(1Mbps、2Mbps)
Host Interface
UART
Frequency Band
2402 MHz ~ 2480 MHz
Number of Channels
79 channels for classic、40 channels for BLE
Modulation
GFSK, π/4-DQPSK, 8DPSK
RF Specification
CL1 (dBm)
CL2 (dBm)
BDR Output Power
6
2
EDR Output Power
4
2
LE Output Power
5
2
Typical.
Sensitivity @ BER=0.1%
for GFSK (1Mbps)
-86 dBm
Sensitivity @ BER=0.01%
for π/4-DQPSK (2Mbps)
-87 dBm
Sensitivity @ BER=0.01%
-83 dBm
for 8DPSK (3Mbps)
Sensitivity @ PER=30.8%
for LE (1Mbps)
-90 dBm
Sensitivity @ PER=30.8%
for LE (2Mbps)
-90 dBm
GFSK (1Mbps):-20dBm
Maximum Input Level
π/4-DQPSK (2Mbps) :-20dBm
8DPSK (3Mbps) :-20dBm
Note*：The Bluetooth output power is able to be configured by firmware (hcd file).
AMPAK Technology Inc.
8F, No.15-1 Zhonghua Road, Hsinchu Industrial Park, Hukou, Hsinchu, Taiwan, 30352
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AP6256 Datasheet
5. Pin Definition
5.1
Pin Outline
AMPAK Technology Inc.
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AP6256 Datasheet
5.2
Pin Assignment
NO
Name
Type
Description
1
GND
－
Ground connections
2
WL_BT_ANT
I/O
RF I/O port
3
GND
－
Ground connections
4
NC
－
Floating (Don’t connected to ground)
5
NC
－
Floating (Don’t connected to ground)
6
BT_WAKE
I
HOST wake-up Bluetooth device
7
BT_HOST_WAKE
O
Bluetooth device to wake-up HOST
8
NC
－
Floating (Don’t connected to ground)
9
VBAT
P
Main power voltage source input
10
XTAL_IN
I
Crystal input
11
XTAL_OUT
O
Crystal output
12
WL_REG_ON
I
Power up/down internal regulators used by WiFi section
13
WL_HOST_WAKE
O
WLAN to wake-up HOST
14
SDIO_DATA_2
I/O
SDIO data line 2
15
SDIO_DATA_3
I/O
SDIO data line 3
16
SDIO_DATA_CMD
I/O
SDIO command line
17
SDIO_DATA_CLK
I/O
SDIO clock line
18
SDIO_DATA_0
I/O
SDIO data line 0
19
SDIO_DATA_1
I/O
SDIO data line 1
20
GND
－
Ground connections
21
VIN_LDO_OUT
P
Internal Buck voltage generation pin
22
VDDIO
P
I/O Voltage supply input
23
VIN_LDO
P
Internal Buck voltage generation pin
24
LPO
I
External Low Power Clock input (32.768KHz)
25
PCM_OUT
O
PCM Data output
26
PCM_CLK
I/O
PCM clock
27
PCM_IN
I
PCM data input
28
PCM_SYNC
I/O
PCM sync signal
29
SDIO_VSEL
I
SDIO mode selection pin
1：When VDDIO=1.8V , 0：When VDDIO=3.3V
30
NC
－
Floating (Don’t connected to ground)
31
GND
－
Ground connections
AMPAK Technology Inc.
8F, No.15-1 Zhonghua Road, Hsinchu Industrial Park, Hukou, Hsinchu, Taiwan, 30352
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AP6256 Datasheet
32
NC
－
Floating (Don’t connected to ground)
33
GND
－
Ground connections
34
BT_REG_ON
I
Power up/down internal regulators used by BT section
35
NC
－
Floating (Don’t connected to ground)
36
GND
－
Ground connections
37
GPIO_6
I/O
GPIO configuration pin
38
GPIO_3
I/O
GPIO configuration pin
39
GPIO_5
I/O
GPIO configuration pin
40
GPIO_2
I/O
GPIO configuration pin
41
UART_RTS_N
O
Bluetooth UART interface
42
UART_TXD
O
Bluetooth UART interface
43
UART_RXD
I
Bluetooth UART interface
44
UART_CTS_N
Bluetooth UART interface
45
TP1(NC)
I
－
Floating (Don’t connected to ground)
46
TP2(NC)
－
Floating (Don’t connected to ground)
47
TP3(NC)
－
Floating (Don’t connected to ground)
AMPAK Technology Inc.
8F, No.15-1 Zhonghua Road, Hsinchu Industrial Park, Hukou, Hsinchu, Taiwan, 30352
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AP6256 Datasheet
6. Dimensions
6.1
Module Dimensions
X = 1.65mm
AMPAK Technology Inc.
8F, No.15-1 Zhonghua Road, Hsinchu Industrial Park, Hukou, Hsinchu, Taiwan, 30352
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AP6256 Datasheet
6.2
Recommended Footprint
Solder paste layer design is generally the same as recommended footprint.
(錫膏層設計通常建議和焊墊尺寸相同)
If soldering quality with good wetting on upright side is essential for PQC, how to optimize the
aperture design in the stencil to adjust the amount of solder paste would be crucial.
In addition, a kind of stencil design with stepped thickness in partial area would be considered
if the thickness of stencil is about 0.1mm or thinner. Please optimize the stencil design by
manufacture engineer or contact AMPAK FAE for assistance.
(如果模組吃錫品質考量側面爬錫，如何優化鋼網開孔設計以調整適當的錫膏量是非常重
要的。尤其鋼網的厚度大約是 0.1mm 或更薄時，可考慮局部加厚鋼網的設計。請諮詢製
程工程師以優化鋼網的設計,或是聯絡正基科技技術支持團隊).
AMPAK Technology Inc.
8F, No.15-1 Zhonghua Road, Hsinchu Industrial Park, Hukou, Hsinchu, Taiwan, 30352
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AP6256 Datasheet
7. External clock reference
External LPO signal characteristics
Parameter
Specification
Units
Nominal input frequency
32.768
kHz
Frequency accuracy
+/-30
ppm
Duty cycle
30 - 70
%
400 to 3300
mV, p-p
Square-wave or sine-wave
-
Input signal amplitude
Signal type
Input impedance
>100k
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