XL-2012UWC-A

XL-2012UWC-A Technical Data Sheet haracteristics * 外观尺寸（L/W/H）:2.1*1.15*0.8mm Qutline Dimensions (L / w / h):2.1x1 . 1 5 x 0 . 8 mm * 发光颜色及胶体: 白光/黄色雾状 Luminous color and colloid: white light/Yellow Diffused * 环保工艺符合ROHS要求 Environmental protection products Complied With ROHS Directive * EIA规范标准包装 EIA standard packaging * 适用于SMT贴片自动化生产 Suitable for SMT automatic production * 适用于红外线回流焊制程 Suitable for infrared reflow soldering process roduct application * 医用设备：内窥镜、血氧仪 Medical equipment: endoscope、oximeter * 汽车电子： 背光按键灯、指示灯 Automotive electronics: backlight key light、 indicator light * 工业产品：电子仪表盘、工业设备 Industrial products: electronic instrument panel、industrial equipment * 智能家居： 白色家电、数码管LED Smart home: white appliances, nixie tube LED * 通讯产品： 手机按键灯、路由器、电视盒 Communication products: mobile phone button lamp, router 1 Catalogue Electrical Characteristics...........................................................................................................................3 Typical Characteristic Curves...................................................................................................................6 Reliability Test Items And Conditions.......................................................................................................7 Outline Dimensions......................................................................................................................................9 Packaging......................................................................................................................................................10 Guideline for Soldering..............................................................................................................................12 Precautions....................................................................................................................................................14 2 Electrical Characteristics （Ta=25℃） Electro-Optical Characteristics（Ta=25℃） 数据 Data 参数 Parameter 符号 Symbol 消耗功率 Power Dissipation PD 75 MW 最大脉冲电流 Peak Forward Current (1/10占空比, 0.1ms脉宽) IFP 100 mA 正向直流工作电流 DC Forward Current IF 30 mA 反向电压 Backward Voltage VR 5 V 存储环境温度 Storage Temperature Range Tstg 25℃±5℃ 工作环境温度 Operating Temperature Range Topr 25℃±5℃ 焊接条件 Soldering Condition Tsol 单位 Unit 白光 white 回流焊/Reflow soldering : 255°C ，10s max 手动焊/Hand soldering : 300°C ，3s max 3 极限参数（Ta=25℃） Absoiute Maximum Ratings (ta=25 ℃) 参数 Parameter 符号 Symbol 正向电压 Forward Voltage 数据 Data 单位 Symbol 测试条件 Test Condition 最小值 Min 平均 Average 最大值 Max Vf 2.7 2.9 3.1 V IF=5mA 光强 Light Intensity Iv 180 --- 380 mcd IF=5mA 色温 Color temperature T 6000 ﹍ 10000 (K) IF=5mA X 0.2827 ﹍ 0.3211 ﹍ IF=5mA Y 0.285 ﹍ 0.3515 ﹍ IF=5mA 反向电流 Reverse current Ir ﹍ ﹍ 10 μA VR=8V 半光强视角 Viewing Angle 2θ1/2 ﹍ 120 ﹍ Deg IF=5mA 色坐标值 Coordinate values （CIE1931版） 4 亮度分档： Brightness grading 代码 Code 最小值 最大值 Min Max Q22 180 220 Q23 220 260 Q24 260 320 Q25 320 380 代码 Code M16 M17 最小值 Min 2.7 2.8 最大值 Max 2.8 2.9 M18 2.9 3.0 M19 3.0 3.1 测试条件 单位 unit Test conditions mcd IF=5mA 单位 unit 测试条件 Test conditions V IF=5mA 电压分档： Voltage grading 波长分档： Wavelength division 5 Typical Characteristics Curves 6 Reliability Test Items And Conditions 类别 Category 测试项目 Test Item 测试环境 The test environment 测试时间 The test of time 参考标准 The reference standard 室温条件下以最大额定电流持续点亮； 1000小时（- MIL-STD750D:1026 工作寿命 以20mA测试。 24小时，+72 MIL-STDThe working life Continuously lit with maximum rated 883D:1005 小时） current at room temperature;Test at 20mA. JIS C 7021:B-1 高温高湿储存 IR-Reflow In-Board, 2 Times 240小时（± 2 High temperature 环境温度Ta= 85±5℃,相对湿度RH= MIL-STD85±5% and high 小时） 202F:103B humidity storage Ambient temperature Ta= 85±5℃, relative JIS C 7021:B-11 humidity RH=85±5% 1000小时（- MIL-STD高温储存 环境温度/The environment temperature 24小时，+72 883D:1008 High temperature Ta= 85±5℃ JIS C 7021:B-10 storage 小时） 环境温度/The environment 1000小时（低温储存 Low Temperature temperatureTa= -40±5℃ 24小时，+72 JIS C 7021:B-12 Storage 小时） MIL-STDIR-Reflow In-Board, 2 Times 冷热冲击 202F:107D 50次循环 Cold and hot 100± 5℃ ～ -40℃ ± 5℃ MIL-STDshock 30mins 30mins 耐久性测试 750D:1051 MIL-STD焊锡温度/Soldering temperatureT.sol= 抗锡试验 Durability test 10±1secs2次 202F:210A 260 ± 5℃ Tin test MIL-STD升温速度(183℃到最高值) ：最大3℃/秒 维持温度在125(±25)℃： 不超过120秒 维持温度在183℃以上： 60-150秒 最高温度限制范围：225℃+5/-0℃ 维持在225℃+5/-0℃时间：10-15 秒 红外回流焊 降温速度： 最大6℃/秒 MIL-STDHeating rate (183℃ to maximum) : -------750D:2031.2 有铅制程 maximum 3℃/ s J-STD-020C Infrared reflow Maintain temperature at 125(±25)℃ : not welding more than 120 seconds Maintain temperature above 183℃ : 60On a lead 150 seconds Maximum temperature limit: 225 ° C +5/0°C Maintain at 225 ° C +5/-0 ° C time: 10-15 seconds Cooling rate: maximum 6℃/ s 7 升温速度(217℃到最高值) ：最大3℃/秒 维持温度在175(±25)℃： 不超过180秒 维持温度在217℃以上： 60-120秒 最高温度限制范围： 255℃+0/-5℃ 维持在255℃+0/-5℃时间：5-10秒 红外回流焊 降温速度： 最大6℃/秒 无铅制程 Heating rate (217℃ to maximum) : Infrared reflow maximum 3℃/ s Maintain temperature at 175(±25)℃ : not welding more than 180 seconds On a lead-free Maintain temperature above 217℃ for 60120 seconds Maximum temperature limit: 255℃+0/5℃ Maintain at 255℃+0/-5℃ time: 5-10 seconds 焊锡温度T.sol= 235 ± 5℃ 浸入速度： 25±2.5 mm/秒 上锡率 ≧95% 焊盘面积 可焊性试验 Weldability test Solder temperature t.OL = 235 ± 5℃ Immersion speed: 25± 2.5mm/s Tin loading rate ≥ 95% of plate area -------- MIL-STD750D:2031.2 J-STD-020C MIL-STD202F:208D 浸入时间 MIL-STDImmersion 750D:2026 time：2±0.5 MIL-STD883D:2003 秒 IEC 68 Part 2-20 JIS C 7021:A-2 8 Outline Dimension 备注： Remarks: 1.以上尺寸单位均为mm All dimensions are in millimeters. 2.未特别标注公差的尺寸公差均为±0.25mm Tolerance is ±0.25mm unless otherwise noted 9 1 Packaging (1) Carrier Tape 单位： mm ，未注公差： ±0. 1 mm All dimensions in mm, tolerances unless mentioned is ±0. 1 mm. Details Of Carrier Tape 前进方向 Progressive Direction A：盖带，300 mm；B：引导，空带，200mm；C：编载产品 3000 只； D：尾部，空带，200mm A: Top Cover Tape, 300mm; B: Leader, Empty, 200mm; C:3000 Lamps Loaded; D: Trailer, Empty, 200mm. Reel Dimension 10 2 Packaging (2) 11 1 Guideline for Soldering (1) 1. Hand Soldering 推荐使用功率低于 20W 的烙铁，焊接时烙铁的温度必须保持在 300℃以下，且每个电极只能进行一次焊 接，每次焊接的持续时间不得超过 3 秒。 人手焊接过程中的不慎操作易引起 LED 产品的损坏，应当小心谨慎。 A soldering iron of less than 20W is recommended to be used in Hand Soldering. Please keep the temperature of the soldering iron under 300℃ while soldering. Each terminal of the LED is to go for less than 3 second and for one time only. Be careful because the damage of the product is often started at the time of the hand soldering. 2. 推荐使用以下无铅回流焊接温度图进行。 Reflow Soldering: Use the conditions shown in the under Figure ofPb-Free Reflow Soldering. 有铅制程Lead process 无铅制程lead free · 回流焊接最多只能进行两次。 Reflow soldering should not be done more than two times. · 在回流焊接升温过程中，请不要对 LED 施加任何压力。 Stress on the LEDs should be avoided during heating in soldering process. · 在焊接完成后，待产品温度下降到室温之后，再进行其他处理。 After soldering, do not deal with the product before its temperature drop down to room temperature. 12 2 Guideline for Soldering (2) 3. Cleaning 在焊接后推荐使用酒精进行清洗，在温度不高于 30℃的条件下持续 3 分钟， 不高于 50℃的条件下持续 30 秒。使用其他类似溶剂清洗前，请先确认使用的溶剂不会对 LED 的封装和环氧树脂部分造成损伤。 超声波清洗也是有效的方法，一般最大功率不应超过 300W ，否则可能对 LED 造成损伤。请根据具体的 情况预先测试清洗条件是否会对 LED 造成损伤。 It is recommended that alcohol be used as a solvent for cleaning after soldering. Cleaning is to go under 30℃ for 3 minutes or 50℃ for 30 seconds. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not. Ultrasonic cleaning is also an effective way for cleaning. But the influence of Ultrasonic cleaning on LED depends on factors such as ultrasonic power. Generally, the ultrasonic power should not be higher than 300W. Before cleaning, a pretest should be done to confirm whether any damage to LEDs will occur. 此一般指导原则并不适用于所有 PCB 设计和焊接设备的配置。具体工艺受到诸多因素的影响， 请根据特定的PCB设计和焊接设备来确定焊接方案。 Note: This general guideline may not apply to all PCB designs and configurations of all soldering equipment. The technics in practise is influenced by many factors, it should be specialized base on the PCB designs and configurations of the soldering equipment.. 13 1 Precautions (1) 1. Storage · 本产品使用密封防潮抗静电袋包装，并附有干燥剂，未开封的产品有一年的保存时间。 Moisture proof and anti-electrostatic package with moisture absorbent material is used, to keep moisture to a minimum. · 开封前，产品须存放在温度不高于 30℃，湿度不高于 60%RH 的环境中。 Before opening the package, the product should be kept at 30℃ or less and humidity less than 60% RH, and be used within a year. · 开封后，产品须存放在温度不高于 30℃，湿度不高于 10%RH 的环境中，且应该在 168 小时（7 天） 内使 用完。建议工作环境为温度不高于 30℃，湿度不高于 60%RH。 After opening the package, the product should be stored at 30℃ or less and humidity less than 10%RH, and be soldered within 168 hours (7 days). It is recommended that the product be operated at the workshop condition of 30℃ or less and humidity less than 60%RH. · 对于尚未焊接的 LED，如果吸湿剂或包装失效，或者产品没有符合以上有效存储条件，烘焙可以起到一定 的性能恢复效果。烘焙条件： （60±5）℃，持续 24 小时。 If the moisture absorbent material has fade away or the LEDs have exceeded the storage time, baking treatment should be performed based on the following condition: (60±5)℃ for 24 hours. 2. Static Electricity 静电和电涌会导致产品特性发生改变，例如正向电压降低等，如果情况严重甚至会损毁产品。所以在使用时必须采 取有效的防静电措施。 所有相关的设备和机器都应该正确接地，同时必须采取其他防止静电和电涌的措施。 使用防静电手环，防静电垫子，防静电工作服、工作鞋、手套，防静电容器，都是有效的防止静电和电涌的措施。 Static electricity or surge voltage damages the LEDs. Damaged LEDs will show some unusual characteristic such as the forward voltage becomes lower, or the LEDs do not light at the low current. even not light. All devices, equipment and machinery must be properly grounded. At the same time, it is recommended that wrist bands or anti-electrostatic gloves, anti-electrostatic containers be used when dealing with the LEDs. 14 2 Precautions (2) 3. Design Consideration 设计电路时，通过 LED 的电流不能超过规定的最大值，同时，还需使用保护电阻，否则，微小的电压变 化将会引起较大的电流变化，可能导致产品损毁。 建议使用以下（A）电路，该电路能够很好的调节通过每个 LED 的电流； 不推荐使用（B）电路，该电路 在持续的电压驱动下，LED 的正向电压（VF ）发生变化，电流会随之而发生变化，可能使某些 LED 承受高于 规定的电流值。 In designing a circuit, the current through each LED must not exceed the absolute maximum rating specified for each LED. In the meanwhile, resistors for protection should be applied, otherwise slight voltage shift will cause big current change, burn out may happen. It is recommended to use Circuit A which regulates the current flowing through each LED rather than Circuit B. When driving LEDs with a constant voltage in Circuit B, the current through the LEDs may vary due to the variation in Forward Voltage (VF) of the LEDs. In the worst case, some LED may be subjected to stresses in excess of the Absolute Maximum Rating. (A) (B) LED 的特性容易因为自身的发热和环境的温度的改变而发生改变。温度的升高会降低 LED 的发光效率、 影响发光颜色等，所以在设计时应充分考虑散热的问题。 Thermal Design is paramount importance because heat generation may result in the Characteristics decline, such as brightness decreased, Color changed and so on. Please consider the heat generation of the LEDs when making the system design. 15 3 Precautions (3) 4. Others 直接用手拿取产品不但会污染封装树脂表面，也可能由于静电等因素导致产品性能的改变。过度的压力也 直接影响封装内部的管芯和金线，因此请勿对产品施加过度压力，特别当产品处于高温状态下，例如在回 可能 流焊接过 程中。 When handling the product, touching the encapsulant with bare hands will not only contaminate its surface, but also affect on its optical characteristics. Excessive force to the encapsulant might result in catastrophic failure of the LEDs due to die breakage or wire deformation. For this reason, please do not put excessive stress on LEDs, especially when the LEDs are heated such as during Reflow Soldering. LED 的环氧树脂封装部分相当脆弱，请勿用坚硬、尖锐的物体刮、擦封装树脂部分。在用镊子夹取的时 候也应当小心注意。 The epoxy resin of encapsulant is fragile, so please avoid scratch or friction over the epoxy resin surface. While handling the product with tweezers, do not hold by the epoxy resin, be careful. 5. Safety Advice For Human Eyes LED 发光时，请勿直视发光光源，特别是对于一些光强较高的 LED ，强光可能伤害你的眼睛。 Viewing direct to the light emitting center of the LEDs, especially those of great Luminous Intensity, will cause great hazard to human eyes. Please be careful. 16