BAS116

BAS116-HAF Silicon Epitaxial Planar Switching Diode Features 3 • Low leakage switching diode • Plastic SMD package • Low leakage current • Halogen and Antimony Free(HAF), RoHS compliant 1 2 1. Anode 2. NC 3. Cathode TO-236 Plastic Package Application • Low leakage current applications in surface mounted circuits. Absolute Maximum Ratings (Ta = 25 OC) Parameter Symbol Value Unit VRRM 85 V Continuous Reverse Voltage VR 75 V Continuous Forward Current IF 215 mA IFRM 500 mA Repetitive Peak Reverse Voltage Repetitive Peak Forward Current Non-Repetitive Peak Forward Surge Current t = 1 µs t = 1 ms t=1s Power Dissipation Junction Temperature Storage Temperature Range Ptot 4 1 0.5 250 Tj 150 O C Tstg - 65 to + 150 O C Symbol Max. Unit RθJA 500 /W IFSM A mW Thermal Characteristics Parameter Thermal Resistance from Junction to Ambient 1) 1) Device mounted on FR-4 PCB with minimum recommended pad layout. ® 1/4 Dated: 18/11/2021 Rev: 01 BAS116-HAF Characteristics at Ta = 25 OC Parameter Symbol Min. Max. Unit VF VF VF VF - 0.9 1 1.1 1.25 V V V V IR - 5 80 nA V(BR)R 75 - V Diode Capacitance at VR = 0, f = 1 MHz Cd - 2 pF Reverse Recovery Time at IF = IR = 10 mA, RL = 100 Ω, Irr = 0.1 x IR trr - 3 µs Forward Voltage at IF = 1 mA at IF = 10 mA at IF = 50 mA at IF = 150 mA Reverse Current at VR = 75 V at VR = 75 V, Tj = 150 OC Reverse Breakdown Voltage at IR = 10 µA ® 2/4 Dated: 18/11/2021 Rev: 01 BAS116-HAF Electrical Characteristics Curves Fig 2. Capacitance Characteristics Curve PD, Power Dissipation (mW) Cj, Junction Capacitance(pF) Fig 1. Power Derating Curve Ta, Ambient Temperature VR, Reverse Voltage (V) Fig 4. Forward Characteristics Curve IF, Forward Current(mA) IR, Reverse Current (µA) Fig 3. Reverse Characteristics Curve TJ=125 TJ=25 TJ=75 TJ=-55 VR, Reverse Voltage (V) VF, Forward Voltage (V) ® 3/4 Dated: 18/11/2021 Rev: 01 BAS116-HAF Package Outline (Dimensions in mm) Unit mm A 1.20 0.89 A1 0.100 0.013 B 1.40 1.20 C 0.19 0.08 TO-236 D 3.04 2.80 E 2.6 2.2 F 1.02 0.89 G 2.04 1.78 L 0.51 0.37 L1 0.2 MIN Recommended Soldering Footprint 2.0 1.0 0.8 1.0 0.8 1.9 Packing information Pitch Reel Size Package Tape Width (mm) mm inch mm inch TO-236 8 4 ± 0.1 0.157 ± 0.004 178 7 Per Reel Packing Quantity 3,000 Marking information " JV " = Part No. " • " = HAF (Halogen and Antimony Free) "YM" = Date Code Marking "Y" = Year • "M" = Month JV Font type: Arial ® 4/4 Dated: 18/11/2021 Rev: 01