RB551V-40

RB551V-40-HAF Silicon Epitaxial Planar Schottky Barrier Diode PINNING Features • Small surface mounting type • Halogen and Antimony Free(HAF), RoHS compliant DESCRIPTION PIN 1 Cathode 2 Anode 2 1 Top View Simplified outline SOD-323 and symbol Absolute Maximum Ratings (Ta = 25℃) Parameter Symbol Value Unit Peak Reverse Voltage VRM 40 V Average Forward Rectifying Current IF(AV) 500 mA Peak Forward Surge Current (t = 8.3 ms) IFSM 2 A Power Dissipation PD 200 mW Junction Temperature Tj 125 ℃ Tstg - 55 to + 150 ℃ Symbol Value Unit RθJA 500 ℃/W Storage Temperature Range Thermal Resistance Ratings Parameter Typical Thermal Resistance from Junction Ambient 1) 1) Device mounted on FR-4 substrate PC board, 2oz copper, with minimum recommended pad layout. Characteristics at Ta = 25℃ Parameter Reverse Breakdown Voltage at IR = 100 µA Forward Voltage at IF = 500 mA Reverse Current at VR = 20 V 1/3 Symbol Min. Max. Unit V(BR)R 40 - V VF - 0.47 V IR - 100 µA ® Dated: 19/04/2023 Rev : 01 RB551V-40-HAF Electrical Characteristics Curves Fig 2. Forward Characteristics Curve Forward Current (A) Reverse Current (µA) Fig 1. Reverse Characteristics Curve Reverse Voltage (V) Forward Voltage (V) Fig 3. Junction Capacitance Junction Capacitance (pF) Average Rectified Current (mA) Fig 4. Average Rectified Current Derating Curve 600 500 400 300 200 100 0 0 25 50 75 100 125 150 Ambient Temperature (℃) Reverse Voltage (V) 2/3 ® Dated: 19/04/2023 Rev : 01 RB551V-40-HAF PACKAGE OUTLINE Plastic surface mounted package; 2 leads SOD-323 A c HE A D E bp UNIT A bp C D E HE mm 1.10 0.80 0.40 0.25 0.15 0.10 1.80 1.60 1.35 1.15 2.80 2.30 Recommended Soldering Footprint Packing information Package SOD-323 Tape Width (mm) 8 Pitch Reel Size Per Reel Packing Quantity mm inch mm inch 4 ± 0.1 0.157 ± 0.004 178 7 3,000 Marking information " SS " = Part No. " III " = Cathode line " • " = HAF(Halogen and Antimony Free) Font type: Arial . SS 3/3 ® Dated: 19/04/2023 Rev : 01