XL-A504RGBC

Technical Data Sheet 外形图 Package Dimensions * 发光颜色及胶体:高亮RGB/无色透明胶体 Luminous color and colloid: Highlight RGB/Colorless transparent colloid * 外观尺寸: 5mm/5.9*8.6*2.54 Appearance dimension :5mm/5.9*8.6*2.54 * 环保产品，符合ROHS要求 Environmentally friendly products, meeting ROHS requirements * 3C产品（通讯和消费电子）的指示灯和背光源 Indicator light and backlight of 3C products (communication and consumer electronics) 1 Catalogue Electrical Characteristics............................................................................................................................. 3 Outline Dimensions.......................................................................................................................................4 Packaging.......................................................................................................................................................5 Precautions....................................................................................................................................................6 2 Electrical Characteristics 极限参数（Absolute Maximum Ratings）（Ta=25℃） 项目参数Parameter 符号 Symbol 数值Value 单位Unit IFP 100 mA 最大脉冲峰值电流（Peak Forward Current） 焊接温度/时间（Lead Soldering Temperature/Time） TSOL 260℃ for 5 second 工作环境（Operating Temperature Range） TOPR --30℃~ +85℃ 储存温度（Storage Temperature Range） TSTR -30℃~ +85℃ 光电参数（Initial Electrical Optical Characteristics）（Ta=25℃） 项目参数 Parameter 光强 （ Light intensity） 半光强视角 （Half light angle） 主波长 （Dominant Wave Length） 符号 Symbo l IV 2θ1/2 λD 正向电压 （ Forward Voltage） VF 反向电流 （ Reverse Current） IR 颜色 Colour 最小值 Min 代表值 Represe ntative 最大值 Max R -- 1200 -- G -- 3000 -- B -- 1500 -- R 625 -- 630 G 515 -- 520 B 465 -- 470 R -- 625 630 G -- 515 517.5 B -- 465 470 R -- 2.0 2.4 G -- 3.2 3.4 B -- 3.2 3.4 -- -- -- 100 单位 Unit 测试条件 Condition mcd IF=20mA deg IF=20mA nm IF=20mA V IF=20mA μA VR=5V 备注（Note）: 1.此发光亮度为根据人眼对发光亮度之感应曲线之模拟发光强度符合CIE（国际光委会组织） The luminous intensity is the simulated luminous intensity according to the response curve of human eyes to luminous intensity, which conforms to CIE (International Light Commission) 2.此发光角度之测量为其发光亮度一半时所测试之数据 The measurement of the luminous angle is the data measured when the luminous brightness is half. 3.发光亮度保证误差正负15% Guaranteed error of luminous brightness is plus or minus 15%. 3 Outline Dimension 备注(Note)： 1. 标注尺寸单位为毫米 Dimensions are in millimeters. 2. 除特别标注外，所有尺寸允许公差± 0.10mm . Tolerances unless mentioned are ± 0.10mm. 4 Packaging *袋装 In Bags *防潮抗静电包装 Moisture Proof and Anti-Electrostatic Foil Bag 5 1 Precautions (1) 1. 应用 APPLY 此LED可使用于一些普通的电子设备，例如办公设备，通信设备、房屋装饰，若LED用在一些可靠性要求较高的情 况下，如航空运输，交通控制及医辽器械时，一定需参考销售提供之资料进行使用。 This LED can be used in some ordinary electronic equipment, such as office equipment, communication equipment, house decoration, if LED is used in some high reliability requirements, such as air transportation, traffic control and medical liao equipment, must refer to the information provided by sales. 2. 储存 Keep in storage 贮存LED的环境，温度不超过30℃，相对湿度不超过70%。 建议LED在原包装箱里日期不超过三个月 进行使用，如果 需加长贮存时间，建议放在干燥箱内，并加放干燥剂， 或者充入氮气。 Storage environment of LED with temperature not exceeding 30℃ and relative humidity not exceeding 70%.It is recommended that LDE be used in the original box for no more than three months. If longer storage time is required, put it in the drying box and add desiccant or filled with nitrogen. 3. 清洗 Clean 当用化学品清洗胶体时必须特别小心，因为有些化学品对胶体表面有损伤并引起褪色如三氯乙烯、丙、酮等。可用 乙醇擦拭、浸渍，时间在常温下不超过3分钟。 Special care must be taken when cleaning colloids with chemicals, as some chemicals have damage to the colloidal surface and cause fading such as trichloroethylene, propylene, ketone, etc.It can be wiped and soaked with ethanol for no more than 3 minutes at room temperature. 4. 引脚配置 Feet assembly （1）必需离胶体2毫米才能折弯支架。 It must be 2 mm from the colloid to bend the bracket. （2）支架成形必须用夹具或由专业人员来完成。 Support forming must be done with fixtures or by a professional. （3）支架成形必须在焊接前完成。 Support forming must be completed before welding. （4）支架成形需保证引脚和间距与线路板上一致。 The pins and spacing are the same as on the circuit board. （5）焊接必须在正常温度下进行，当LED正常焊接到PCB板上后，应尽量避免在LED引脚处施加机械压力。 Welding must be performed at normal temperature and when LED is normally welded to the PCB plate, avoid applying mechanical pressure at LED pins at a minimum. 6 2 Precautions (2) 5. 焊接 Weld 当焊接时，必需在胶体底部2mm以下进行焊接，在焊接时，应尽力避免浸渍LED胶体，在刚焊接完后，应避免在 引脚上加外力或者摇动LED胶体。 When welding, welding must be conducted below 2mm of colloid bottom. When welding, try to avoid soaking LED colloid. After welding, avoid adding external force on the pin or shaking LED colloid. 推荐的焊接条件 波峰焊 烙铁焊接 温度 焊接时间 260℃ Max 100℃ Pre-heat 5 sec.Max Pre-heat time (one time only) Solder wave Max 60sec.Max 260℃ Soldering time 过高的焊接温度和长时间的焊接会导致LED变形和失效 Max 10sec.Max Excessive welding temperature and prolonged welding can lead to LED deformation and failure. 6. 驱动方式 Drive way LED的当前驱动方式，若LED为多颗并联时，建议采用线路A，在每颗LED，处加一限流电阻，以保证LED之亮 度一致。 In the current driving mode of LED, if LED is multiple in parallel, it is recommended to use line A and add a flow limit resistance to each LED to ensure the consistent brightness of LED. Circuit model A Circuit model B 7. 静电防护 Electrostatic protection 静电和电流的急剧升高将会对LED产生损害，InGaN系列产品使用时请使用防静电装置，如防护带和手套注意：使 用时人体放电模式HBM