DATA SHEET
THIN FILM CHIP RESISTORS
AUTOMOTIVE GRADE
RP series
0.1% TO 1%, TC10 TO TC50
sizes 0402/0603/0805/1206
Product specification – May 15, 2023 V. 2
RoHS compliant
Product specification
Chip Resistor Surface Mount
SERIES
RP
2
9
0402 to 1206
SCOPE
ORDERING INFORMATION - GLOBAL PART NUMBER
This specification describes RP0402 to
RP1206 high precision-high stability
chip resistors made by thin film
process.
Part number is identified by the series name, size, tolerance, packaging
type, temperature coefficient, taping reel and resistance value.
GLOBAL PART NUMBER
RP XXXX X X X XX XXXXX L
(1)
APPLICATIONS
⚫
Automotive electronics
⚫
Industrial and medical equipment
⚫
Test and measuring equipment
⚫
Telecommunications
(2) (3) (4)
(5)
(6)
(7)
(1) SIZE
0402 / 0603 / 0805 / 1206
(2) TOLERANCE
B = ± 0.1%
C = ± 0.25%
FEATURES
⚫
AEC-Q200 qualified
⚫
Total lead free without RoHS
exemption
⚫
Halogen free epoxy
⚫
Superior resistance against sulfur
containing atmosphere
⚫
Moisture sensitivity level: MSL 1
⚫
Reducing environmentally
hazardous wastes
⚫
High component and equipment
reliability
⚫
Non-forbidden materials used in
products/production
D = ± 0.5%
F = ± 1%
(3) PACKAGING TYPE
R = Paper taping reel
(4) TEMPERATURE COEFFICIENT OF RESISTANCE
B = ± 10 ppm/°C
C = ± 15 ppm/°C
D = ± 25 ppm/°C
E = ± 50 ppm/°C
(5) TAPING REEL
07 = 7 inch dia. Reel
(6) RESISTANCE VALUE
There are 2~4 digits indicated the resistor value.
Letter R/K/M is decimal point
Example: 100R = 100Ω
1K = 1,000Ω
(7) DEFAULT CODE
Letter L is the system default code for ordering only. (NOTE)
O RDERING EXAMPLE
The ordering code of a RP0402 chip resistor, TCR 25 value 56Ω with ±
0.5% tolerance, supplied in 7-inch tape reel is: RP0402DRD0756RL.
NOTE
1. All our Rchip products meet RoHS compliant and Halogen Free. "LFP" of the
internal 2D reel label mentions "Lead Free Process".
2. On customized label, "LFP" or specific symbol can be printed.
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May, 15, 2023 V.2
Product specification
Chip Resistor Surface Mount
RP
SERIES
3
9
0402 to 1206
MARKING
RP0402
No marking
ynsc007
Fig. 1
RP0603
E-96 series: including values 10/11/13/15/20/75 of E-24 series, 3 digits
Fig. 2
Value = 12.4 Ω
ynsc003
Fig. 3
Value = 56 KΩ
E-24 series: exception values 10/11/13/15/20/75 of E -24 series, one short bar
under marking letter
RP0805 / RP1206
YNSC004
Fig. 4 Value = 10 KΩ
Both E-24 and E-96 series: 4 digits
First three digits for significant figure and 4th digit for number of zeros
NOTE
For further marking information, please see special data sheet “Chip resistors marking”.
CONSTRUCTION
The resistors are constructed out of a high
grade ceramic body. Internal metal
electrodes are added at each end
connected by a resistive layer.
This resistive layer is trimmed to its
nominal value and on both ends a contact
is made which will guarantee optimum
solderability. This is achieved by applying
several layers and for ease of soldering the
outer layer consists of Ni/matte tin.
Adding a special protective layer,
passivation coating, on this series to
enhance moisture resistance of the
environment.
OUTLINES
Marking layer
Overcoat
Passivation layer
Resistive layer
Conductor layer
Inner electorde
Sputter conductor layer
H
Termination (Ni / matte tin)
I2
Backside electorde (Ag)
Ceramic substrate
YNSC064-1
Fig. 5 Chip resistor outlines
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May, 15, 2023 V.2
Product specification
Chip Resistor Surface Mount
RP
SERIES
4
9
0402 to 1206
DIMENSIONS
Table 1
TYPE
L (mm)
W (mm)
H (mm)
I1 (mm)
I2 (mm)
RP0402
1.00 ± 0.10
0.50 ± 0.05
0.30 ± 0.05
0.20 ± 0.10
0.25 ± 0.10
RP0603
1.60 ± 0.10
0.80 ± 0.10
0.45 ± 0.10
0.25 ± 0.15
0.25 ± 0.15
RP0805
2.00 ± 0.10
1.25 ± 0.10
0.50 ± 0.10
0.35 ± 0.20
0.35 ± 0.20
RP1206
3.10 ± 0.10
1.60 ± 0.10
0.55 ± 0.10
0.45 ± 0.20
0.40 ± 0.20
ELECTRICAL CHARACTERISTICS
Table 2
Resistance Range (E-24/E-96 series)(Ω) & Tolerance(1)
TYPE
Operating
Temperature Range
Max.
Power Working
Rating Voltage
Max.
Overload
Voltage
T.C.R.
(ppm/°C)(2)
±0.1% ±0.25%
(B)
(C)
±0.5%
(D)
±1% Unit weight
(F)
(mg/pcs)
± 50 (E)
RP0402
1/16W
50 V
100 V
± 25 (D)
± 15 (C)
10 ≤ R ≤ 240K
0.572
10 ≤ R ≤ 1M
2.128
10 ≤ R ≤ 1M5
4.642
10 ≤ R ≤ 1M5
10.116
± 10 (B)
± 50 (E)
RP0603
1/10W
75V
150 V
± 15 (C)
± 10 (B)
± 50 (E)
–55 °C to +155 °C
RP0805
± 25 (D)
1/8W
150 V
300 V
± 25 (D)
± 15 (C)
± 10 (B)
± 50 (E)
RP1206
1/4W
200 V
400 V
± 25 (D)
± 15 (C)
± 10 (B)
NOTE : 1. Global part number (code 7)
2. Global part number (code 9)
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May, 15, 2023 V.2
Product specification
Chip Resistor Surface Mount
RP
SERIES
5
9
0402 to 1206
FOOTPRINT AND SOLDERING PROFILES
For recommended footprint and soldering profiles, please see the special data sheet “Chip resistors moun ting”.
PACKING STYLE AND PACKAGING QUANTITY
Table 3 Packing style and packaging quantity
REEL DIMENSION
QUANTITY PER REEL
Paper taping reel
7" (178 mm)
10,000 Units
RP0603
Paper taping reel
7" (178 mm)
5,000 Units
RP0805
Paper taping reel
7" (178 mm)
5,000 Units
RP1206
Paper taping reel
7" (178 mm)
5,000 Units
PRODUCT TYPE
PATKING STYLE
RP0402
NOTE: for paper tape and reel specification/dimensions, please see the special data sheet “packing” document.
TEMPERATURE COEFFICIENT OF RESISTANCE
RESISTANCE
RANGE DESCRIPTION
FUNCTIONAL
toE910 mΩ
PT040
OPERATING TEMPERATUR100
E RmΩ
ANG
2
± 200 ppm/°C
Range: –55 °C to +155 °C
PT060
± 200 ppm/°C
P
3 OWER RATING
Each
PT080type rated power at 70 °C:
± 200 ppm/°C
RP0402=1/16
W
5
100 MΩ
RP0603=1/10
WTO 910 MΩ
PT120
RP0805=1/8 W
100 mΩ
6
RP1206=1/4 W
PT201
0
R ATED VOLTAGE
± 100 ppm/°C
PT251
The DC or AC (rms) continuous
working voltage
± 100 ppm/°C
2
corresponding to the rated power is determined by
the following formula:
V=
handbook, halfpage
MLB206_1
P
(%Prated)
100
50
> 100 mΩ
0
±5575 ppm/°C0
50
70
100
155
o
Tamb ( C)
± 75 dissipation
ppm/°C (P max) in percentage of rated power
Fig. 6 Maximum
as a function of the operating ambient temperature (T amb)
(PxR)
Or max. working voltage whichever is less
Where
V=Continuous rated DC
or AC (rms) working voltage (v)
P=Rated power
R=Resistance value (Ω)
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May, 15, 2023 V.2
Product specification
Chip Resistor Surface Mount
RP
SERIES
6
9
0402 to 1206
TESTS AND REQUIREMENTS
Table 4 Test condition, procedure and requirements
TEST
TEST METHOD
PROCEDURE
REQUIREMENTS
Short Time
Overload
IEC60115-1 4.13
2.5 times of rated voltage or maximum
± (0.05%+0.05Ω)
High
Temperature
Exposure
AEC-Q200 Test 3
Moisture
Resistance
overload voltage, the less of the above, for 5 sec
at room temperature
1,000 hours at Tamb = 155 °C, unpowered
± (0.3%+0.05Ω)
AEC-Q200 Test 6
Each temperature / humidity cycle is defined at
± (0.1%+0.05Ω)
MIL-STD-202 Method 106
8 hours (method 106F), 3 cycles / 24 hours for
MIL-STD-202 Method 108
10d. with 25 °C / 65 °C 95% R.H, without steps
7a & 7b, unpowered
Parts mounted on test-boards, without
condensation on parts
Biased
Humidity
AEC-Q200 Test 7
1,000 hours; 85 °C / 85% RH
MIL-STD-202 Method 103
10% of operating power
± (0.1%+0.05Ω)
Measurement at 24± 4 hours after test conclusion
Life
AEC-Q200 Test 8
MIL-STD-202 Method 108
Resistance to
Soldering
Heat
AEC-Q200 Test 15
Thermal
Shock
AEC-Q200 Test 16
Solderability
- Wetting
AEC-Q200 Test 18
MIL-STD-202 Method 210
MIL-STD-202 Method 107
J-STD-002
1,000 hours at 70± 5 °C, RCWV applied for 1.5
hours on, 0.5 hour off, still air required
± (0.1%+0.05Ω)
Condition B, no pre-heat of samples
Lead-free solder, 260± 5 °C, 10± 1 seconds
immersion time
Procedure 2 for SMD: devices fluxed and
cleaned with isopropanol
± (0.05%+0.05Ω)
-55/+125 °C
Number of cycles is 300. Devices mounted
Maximum transfer time is 20 seconds.
Dwell time is 15 minutes. Air – Air
± (0.1%+0.05Ω)
Electrical Test not required Magnification 50X
SMD conditions:
(a) Method B, aging 4 hours at 155 °C dry heat,
dipping at 235± 3 °C for 5± 0.5 seconds.
(b) Method B, steam aging 8 hours, dipping at
215± 3 °C for 5± 0.5 seconds.
(c) Method D, steam aging 8 hours, dipping at
260± 3 °C for 7± 0.5 seconds
Well tinned
No visible damage
(>95% covered)
No visible damage
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May, 15, 2023 V.2
Product specification
Chip Resistor Surface Mount
TEST
RP
SERIES
TEST METHOD
PROCEDURE
REQUIREMENTS
Board Flex /
Bending
AEC-Q200 Test 21
Chips mounted on a 90mm glass epoxy resin
PCB (FR4)
Bending for 0402: 5 mm
0603/0805: 3 mm
1206: 2mm
Holding time: minimum 60 second
± (0.1%+0.05Ω)
Temperature
Coefficient of
Resistance
(T.C.R.)
IEC 60115-1 4.8
At +25/–55 °C and
+25/+125°C Formula:
Refer to table 2
AEC-Q200-005
T.C.R=
7
9
0402 to 1206
R2 - R1
× 106(ppm/°C)
R1( t 2 − t1)
Where
t1=+25 °C or specified room temperature
t2=–55 °C or +125 °C test temperature
R1=resistance at reference temperature in ohms
R2=resistance at test temperature in ohms
Flower of
Sulfur
ASTM-B-809-95*
Sulfur 750 hours, 105°C, unpowered.
± (2.0%+0.05Ω)
* Modified
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May, 15, 2023 V.2
Product specification
Chip Resistor Surface Mount
RP
SERIES
8
9
0402 to 1206
REVISION HISTORY
REVISION
DATE
CHANGE NOTIFICATION
DESCRIPTION
Version 2
May 15, 2023
-
- Extend Resistance value of 0603 to 1M
Version 1
Nov. 07, 2022
-
- Extend temperature coefficient of resistance range (B=± 10ppm/°C)
- Add unit weight
Version 0
Jul. 25, 2022
-
- First issue of this specification
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May, 15, 2023 V.2
Product specification
Chip Resistor Surface Mount
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