PESD1V2Y1BSF
Extremely low clamping bidirectional ESD protection diode
12 March 2021
Short data sheet
1. General description
Extremely low clamping, extremely low capacitance bidirectional ElectroStatic Discharge
(ESD) protection diode, which is part of the TrEOS protection family. The device is housed in a
DSN0603-2 (SOD962-2) leadless ultra small Surface-Mounted Device (SMD) package designed to
protect one signal line from damage caused by ESD and other transients.
2. Features and benefits
•
•
•
•
•
•
•
Bidirectional ESD protection of one line
Extremely low diode capacitance Cd = 0.26 pF typ.
Extremely low clamping voltage to protect sensitive transceivers
Extremely low leakage current IRM < 1 nA typ. at 1.2 V
Extremely low inductance protection path to ground
Low trigger voltage Vt1 = 3.4 V TLP
Ultra small SMD package
3. Applications
•
•
•
•
Cellular handsets and accessories
Portable electronics
Communication systems
Computers and peripherals
4. Quick reference data
Table 1. Quick reference data
Symbol
Parameter
VRWM
reverse standoff
voltage
Cd
diode capacitance
Conditions
f = 1 MHz; VR = 0 V; Tamb = 25 °C
Min
Typ
Max
Unit
-1.2
-
1.2
V
-
0.26
0.31
pF
5. Pinning information
Table 2. Pinning information
Pin
Symbol
Description
1
K1
cathode
2
K2
cathode
Simplified outline
1
2
Graphic symbol
K1
K2
sym045
Transparent
top view
DSN0603-2 (SOD962-2)
PESD1V2Y1BSF
Nexperia
Extremely low clamping bidirectional ESD protection diode
6. Ordering information
Table 3. Ordering information
Type number
Package
PESD1V2Y1BSF
Name
Description
Version
DSN0603-2
silicon, leadless ultra small package; 2 terminals; 0.4 mm pitch;
0.6 mm x 0.3 mm x 0.3 mm body
SOD962-2
7. Application information
The device is designed for the protection of one bidirectional data line from surge pulses and ESD
damage. The device is suitable on lines where the signal polarities are both positive and negative
with respect to ground.
The device uses an advanced clamping structure showing a negative dynamic resistance.
This snap-back behavior strongly reduces the clamping voltage to the system behind the ESD
protection during an ESD event. Do not connect unlimited DC current sources to the data lines to
avoid keeping the ESD protection device in snap-back state after exceeding breakdown voltage
(due to an ESD pulse for instance).
Due to the very low trigger voltage Vt1, it needs to be ensured that VRWMis not exceeded under
normal application conditions. If the device is used in an USB 3.2 environment, place the device
between the AC coupling capacitor and the transceiver. Refer to the USB 3.2 specification for
maximum working voltages.
line to be protected
ESD protection diode
GND
aaa-002737
Fig. 1.
Application diagram
Circuit board layout and protection device placement
Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT) and surge
transients. The following guidelines are recommended:
1.
2.
3.
4.
5.
6.
7.
8.
PESD1V2Y1BSF_SDS
Short data sheet
Place the device as close to the input terminal or connector as possible.
Minimize the path length between the device and the protected line.
Keep parallel signal paths to a minimum.
Avoid running protected conductors in parallel with unprotected conductors.
Minimize all Printed-Circuit Board (PCB) conductive loops including power and ground loops.
Minimize the length of the transient return path to ground.
Avoid using shared transient return paths to a common ground point.
Use ground planes whenever possible. For multilayer PCBs, use ground vias.
All information provided in this document is subject to legal disclaimers.
12 March 2021
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Nexperia B.V. 2021. All rights reserved
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PESD1V2Y1BSF
Nexperia
Extremely low clamping bidirectional ESD protection diode
8. Package outline
Leadless ultra small package; 2 terminals; body 0.6 x 0.3 x 0.3 mm
SOD962-2
L
1
2
b
e1
A
A1
E
D
(1)
0
0.5 mm
scale
Dimensions (mm are the original dimensions)
Unit
mm
A
max 0.32
nom
min 0.28
A1
0.03
b
D
E
e1
0.25 0.325 0.625
0.23 0.275 0.575
0.4
L
0.15
0.13
Note
1. The marking bar indicates the cathode.
Outline
version
sod962-2_po
References
IEC
JEDEC
JEITA
European
projection
Issue date
13-07-12
13-07-17
SOD962-2
Fig. 2.
Package outline DSN0603-2 (SOD962-2)
PESD1V2Y1BSF_SDS
Short data sheet
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12 March 2021
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PESD1V2Y1BSF
Nexperia
Extremely low clamping bidirectional ESD protection diode
9. Soldering
Footprint information for reflow soldering of leadless ultra small package; 2 terminals
SOD962-2
0.85
0.6
0.2
0.2
0.2
0.4
0.4 0.28
0.256
0.16
0.256
recommended stencil thickness: 0.1 mm
occupied area
solder paste
solder lands
Dimensions in mm
Issue date
Fig. 3.
16-02-01
20-09-15
sod962-2_fr
Reflow soldering footprint for DSN0603-2 (SOD962-2)
PESD1V2Y1BSF_SDS
Short data sheet
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PESD1V2Y1BSF
Nexperia
Extremely low clamping bidirectional ESD protection diode
10. Revision history
Table 4. Revision history
Data sheet ID
Release date
PESD1V2Y1BSF_SDS 20210312
v.2
Modifications:
•
Short data sheet
Change notice
Supersedes
Short data sheet
-
PESD1V2Y1BSF_SDS
v.1
-
-
Figure "Reflow soldering footprint" updated
PESD1V2Y1BSF_SDS 20200406
v.1
PESD1V2Y1BSF_SDS
Data sheet status
Short data sheet
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PESD1V2Y1BSF
Nexperia
Extremely low clamping bidirectional ESD protection diode
11. Legal information
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Data sheet status
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
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Document status
[1][2]
Product
status [3]
Definition
Objective [short]
data sheet
Development
This document contains data from
the objective specification for
product development.
Preliminary [short]
data sheet
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This document contains data from
the preliminary specification.
Product [short]
data sheet
Production
This document contains the product
specification.
[1]
[2]
[3]
Please consult the most recently issued document before initiating or
completing a design.
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PESD1V2Y1BSF_SDS
Short data sheet
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. Nexperia makes no representation
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Nexperia B.V. 2021. All rights reserved
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PESD1V2Y1BSF
Nexperia
Extremely low clamping bidirectional ESD protection diode
Contents
1. General description...................................................... 1
2. Features and benefits.................................................. 1
3. Applications.................................................................. 1
4. Quick reference data....................................................1
5. Pinning information......................................................1
6. Ordering information....................................................2
7. Application information............................................... 2
8. Package outline............................................................ 3
9. Soldering....................................................................... 4
10. Revision history..........................................................5
11. Legal information........................................................6
©
Nexperia B.V. 2021. All rights reserved
For more information, please visit: http://www.nexperia.com
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Date of release: 12 March 2021
PESD1V2Y1BSF_SDS
Short data sheet
All information provided in this document is subject to legal disclaimers.
12 March 2021
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Nexperia B.V. 2021. All rights reserved
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