S-1212B/D Series
www.ablic.com
105°C OPERATION,
36 V INPUT, 250 mA VOLTAGE REGULATOR
Rev.3.2_00
© ABLIC Inc., 2015-2023
The S-1212B/D Series, developed by using high-withstand voltage CMOS process technology, is a positive voltage regulator
with a high-withstand voltage, low current consumption and high-accuracy output voltage, and has a built-in ON / OFF
circuit.
The S-1212B/D Series operates at the maximum operation voltage of 36 V and a low current consumption of 6.5 μA typ.,
and has a built-in low on-resistance output transistor which provides a very small dropout voltage and a large output current.
Also, a built-in overcurrent protection circuit to limit overcurrent of the output transistor and a built-in thermal shutdown circuit
to limit heat are included.
Features
• Output voltage:
• Input voltage:
• Output voltage accuracy:
• Current consumption:
• Output current:
• Input capacitor:
• Output capacitor:
• Built-in overcurrent protection circuit:
• Built-in thermal shutdown circuit:
• Built-in ON / OFF circuit:
• Operation temperature range:
• Lead-free (Sn 100%), halogen-free
2.5 V to 16.0 V, selectable in 0.1 V step
3.0 V to 36 V
±2.0% (Ta = +25°C)
During operation: 6.5 μA typ. (Ta = +25°C)
During power-off: 0.1 μA typ. (Ta = +25°C)
Possible to output 250 mA (at VIN ≥ VOUT(S) + 2.0 V)*1
A ceramic capacitor can be used. (1.0 μF or more)
A ceramic capacitor can be used. (1.0 μF to 100 μF)
Limits overcurrent of output transistor.
Detection temperature 165°C typ.
Ensures long battery life.
Discharge shunt function is available.
Ta = −40°C to +105°C
*1. Please make sure that the loss of the IC will not exceed the power dissipation when the output current is large.
Applications
• Constant-voltage power supply for industrial equipment
• Constant-voltage power supply for home electric appliance
Packages
• TO-252-5S(A)
• HSOP-8A
• HSOP-6
• SOT-89-5
• HTMSOP-8
• SOT-23-5
1
105°C OPERATION, 36 V INPUT, 250 mA VOLTAGE REGULATOR
S-1212B/D Series
Rev.3.2_00
Block Diagram
*1
VIN
VOUT
Overcurrent protection
circuit
Thermal shutdown circuit
ON / OFF
*2
ON / OFF circuit
+
−
Reference
voltage circuit
*1
VSS
*1.
*2.
Parasitic diode
The ON / OFF circuit controls the internal circuit and the output transistor.
Figure 1
2
105°C OPERATION, 36 V INPUT, 250 mA VOLTAGE REGULATOR
S-1212B/D Series
Rev.3.2_00
Product Name Structure
Users can select the output voltage and package type for the S-1212B/D Series. Refer to "1. Product name" regarding
the contents of product name, "2. Function list of product types" regarding the product type, "3. Packages"
regarding the package drawings and "4. Product name list" for details of product names.
1. Product name
S-1212
x
xx
-
xxxx
U
Environmental code
U:
Lead-free (Sn 100%), halogen-free
Package abbreviation and IC packing specifications
V5T2: TO-252-5S(A), Tape
E8T1: HSOP-8A, Tape
E6T1: HSOP-6, Tape
U5T1: SOT-89-5, Tape
S8T1: HTMSOP-8, Tape
M5T1: SOT-23-5, Tape
*1
Set output voltage
25 to G0
(e.g., when the set output voltage is 2.5 V, it is expressed as 25.
when the set output voltage is 10.0 V, it is expressed as A0.
when the set output voltage is 11.0 V, it is expressed as B0.
when the set output voltage is 16.0 V, it is expressed as G0.)
*2
Product type
B, D
*1.
*2.
Refer to the tape drawing.
Refer to "2. Function list of product types" and "3.
ON / OFF pin" in " Operation".
2. Function list of product types
Product Type
B
D
ON / OFF Logic
Table 1
ON / OFF Pin Input Voltage "H" ON / OFF Pin Input Voltage "L"
Active "H"
Active "H"
1.5 V min.
2.0 V min.
0.25 V max.
0.8 V max.
3. Packages
Package Name
TO-252-5S(A)
HSOP-8A
HSOP-6
SOT-89-5
HTMSOP-8
SOT-23-5
Dimension
Table 2 Package Drawing Codes
Tape
VA005-A-P-SD
FH008-A-P-SD
FH006-A-P-SD
UP005-A-P-SD
FP008-A-P-SD
MP005-A-P-SD
VA005-A-C-SD
FH008-A-C-SD
FH006-A-C-SD
UP005-A-C-SD
FP008-A-C-SD
MP005-A-C-SD
Reel
Land
VA005-A-R-SD
FH008-A-R-SD
FH006-A-R-S1
UP005-A-R-SD
FP008-A-R-SD
MP005-A-R-SD
VA005-A-L-SD
FH008-A-L-SD
FH006-A-L-SD
−
FP008-A-L-SD
−
3
105°C OPERATION, 36 V INPUT, 250 mA VOLTAGE REGULATOR
S-1212B/D Series
Rev.3.2_00
4. Product name list
4. 1 S-1212B/D Series B type
ON / OFF logic:
Active "H"
ON / OFF pin input voltage "H" (VSH) = 1.5 V min., ON / OFF pin input voltage "L" (VSL) = 0.25 V max.
.
Table 3
Output Voltage
TO-252-5S(A)
HSOP-8A
HSOP-6
SOT-89-5
HTMSOP-8
SOT-23-5
3.3 V ± 2.0%
S-1212B33-V5T2U
S-1212B33-E8T1U
S-1212B33-E6T1U
S-1212B33-U5T1U
S-1212B33-S8T1U
S-1212B33-M5T1U
5.0 V ± 2.0%
S-1212B50-V5T2U
S-1212B50-E8T1U
S-1212B50-E6T1U
S-1212B50-U5T1U
S-1212B50-S8T1U
S-1212B50-M5T1U
6.0 V ± 2.0%
8.0 V ± 2.0%
−
S-1212B80-V5T2U
−
S-1212B80-E8T1U
−
S-1212B80-E6T1U
−
S-1212B80-U5T1U
−
S-1212B80-S8T1U
S-1212B60-M5T1U
S-1212B80-M5T1U
S-1212BC0-V5T2U
S-1212BC0-E8T1U
S-1212BC0-E6T1U
S-1212BC0-U5T1U
S-1212BC0-M5T1U
12.0 V ± 2.0%
S-1212BC0-S8T1U
Remark Please contact our sales representatives for products with specifications other than the above output voltage.
4. 2 S-1212B/D Series D type
ON / OFF logic:
Active "H"
ON / OFF pin input voltage "H" (VSH) = 2.0 V min., ON / OFF pin input voltage "L" (VSL) = 0.8 V max.
Table 4
Output Voltage
TO-252-5S(A)
HSOP-8A
HSOP-6
SOT-89-5
HTMSOP-8
SOT-23-5
3.3 V ± 2.0%
S-1212D33-V5T2U
S-1212D33-E8T1U
S-1212D33-E6T1U
S-1212D33-U5T1U
S-1212D33-S8T1U
S-1212D33-M5T1U
5.0 V ± 2.0%
S-1212D50-V5T2U
S-1212D50-E8T1U
S-1212D50-E6T1U
S-1212D50-U5T1U
S-1212D50-S8T1U
S-1212D50-M5T1U
6.0 V ± 2.0%
8.0 V ± 2.0%
−
S-1212D80-V5T2U
−
S-1212D80-E8T1U
−
S-1212D80-E6T1U
−
S-1212D80-U5T1U
−
S-1212D80-S8T1U
S-1212D60-M5T1U
S-1212D80-M5T1U
S-1212DC0-V5T2U
12.0 V ± 2.0%
S-1212DC0-E8T1U
S-1212DC0-E6T1U
S-1212DC0-U5T1U
S-1212DC0-S8T1U
S-1212DC0-M5T1U
Remark Please contact our sales representatives for products with specifications other than the above output voltage.
4
105°C OPERATION, 36 V INPUT, 250 mA VOLTAGE REGULATOR
S-1212B/D Series
Rev.3.2_00
Pin Configurations
1. TO-252-5S(A)
Top view
Table 5
3
1
2
Pin No.
4
Symbol
Description
1
VOUT
Output voltage pin
2
ON / OFF
ON / OFF pin
3
VSS
GND pin
4
NC*1
No connection
5
VIN
Input voltage pin
5
Figure 2
*1.
The NC pin is electrically open.
The NC pin can be connected to the VIN pin or the VSS pin.
2. HSOP-8A
Top view
Table 6
1
8
2
7
3
6
4
5
Bottom view
8
1
7
2
6
3
5
4
Pin No.
Symbol
Description
1
VOUT
Output voltage pin
2
NC*2
No connection
3
NC*2
No connection
4
ON / OFF
ON / OFF pin
5
VSS
GND pin
6
NC*2
No connection
7
NC*2
No connection
8
VIN
Input voltage pin
*1
Figure 3
*1.
*2.
Connect the heat sink of backside at shadowed area to the board, and set electric potential GND.
However, do not use it as the function of electrode.
The NC pin is electrically open.
The NC pin can be connected to the VIN pin or the VSS pin.
5
105°C OPERATION, 36 V INPUT, 250 mA VOLTAGE REGULATOR
S-1212B/D Series
Rev.3.2_00
3. HSOP-6
Top view
6
Table 7
5
1
4
2
Pin No.
3
Symbol
Description
1
VOUT
Output voltage pin
2
VSS
GND pin
3
ON / OFF
ON / OFF pin
4
NC*1
No connection
5
VSS
GND pin
6
VIN
Input voltage pin
Figure 4
*1.
The NC pin is electrically open.
The NC pin can be connected to the VIN pin or the VSS pin.
4. SOT-89-5
Top view
5
Table 8
4
Pin No.
2
3
Description
NC*1
No connection
2
VSS
GND pin
3
VIN
Input voltage pin
4
VOUT
Output voltage pin
5
ON / OFF
ON / OFF pin
1
1
Symbol
Figure 5
*1.
The NC pin is electrically open.
The NC pin can be connected to the VIN pin or the VSS pin.
5. HTMSOP-8
Top view
1
2
3
4
Table 9
8
7
6
5
Bottom view
1
2
3
4
8
7
6
5
*1
Pin No.
Symbol
Description
1
VOUT
Output voltage pin
2
NC*2
No connection
3
NC*2
No connection
4
ON / OFF
ON / OFF pin
5
VSS
GND pin
6
NC*2
No connection
7
NC*2
No connection
8
VIN
Input voltage pin
Figure 6
*1.
*2.
6
Connect the heat sink of backside at shadowed area to the board, and set electric potential GND.
However, do not use it as the function of electrode.
The NC pin is electrically open.
The NC pin can be connected to the VIN pin or the VSS pin.
105°C OPERATION, 36 V INPUT, 250 mA VOLTAGE REGULATOR
S-1212B/D Series
Rev.3.2_00
6. SOT-23-5
Top view
5
4
1 2 3
Figure 7
Table 10
Pin No.
Symbol
Description
1
VIN
Input voltage pin
2
VSS
GND pin
3
NC*1
No connection
4
ON / OFF
ON / OFF pin
5
VOUT
Output voltage pin
*1. The NC pin is electrically open.
The NC pin can be connected to the VIN pin or the VSS pin.
7
105°C OPERATION, 36 V INPUT, 250 mA VOLTAGE REGULATOR
S-1212B/D Series
Rev.3.2_00
Absolute Maximum Ratings
Table 11
(Ta = +25°C unless otherwise specified)
Item
Symbol
Absolute Maximum Rating
VSS − 0.3 to VSS + 45
Unit
VON / OFF
VSS − 0.3 to VIN + 0.3 ≤ VSS + 45
V
Output voltage
VOUT
VSS − 0.3 to VIN + 0.3 ≤ VSS + 45
V
Output current
IOUT
280
mA
Junction temperature
Tj
−40 to +150
°C
Operation ambient temperature
Topr
−40 to +105
°C
Storage temperature
Tstg
−40 to +150
°C
VIN
Input voltage
V
Caution The absolute maximum ratings are rated values exceeding which the product could suffer physical
damage. These values must therefore not be exceeded under any conditions.
Thermal Resistance Value
Table 12
Item
Symbol
Condition
Board A
Board B
TO-252-5S(A) Board C
Board D
Board E
Board A
Board B
HSOP-8A
Board C
Board D
Board E
Board A
Board B
HSOP-6
Board C
Board D
Board E
Junction-to-ambient thermal resistance*1 θJA
Board A
Board B
SOT-89-5
Board C
Board D
Board E
Board A
Board B
HTMSOP-8
Board C
Board D
Board E
Board A
Board B
SOT-23-5
Board C
Board D
Board E
*1. Test environment: compliance with JEDEC STANDARD JESD51-2A
Remark
8
Refer to " Power Dissipation" and "Test Board" for details.
Min.
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
Typ.
90
58
38
30
29
115
82
42
43
35
106
82
−
51
48
123
90
−
53
41
161
116
44
44
35
180
143
−
−
−
Max.
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
−
Unit
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
105°C OPERATION, 36 V INPUT, 250 mA VOLTAGE REGULATOR
S-1212B/D Series
Rev.3.2_00
Electrical Characteristics
Table 13
Item
Output voltage*1
Output
current*2
Dropout
voltage*3
Line regulation
Load regulation
Current consumption
during operation
Current consumption
during power-off
Input voltage
Symbol
VOUT(E)
VIN = VOUT(S) + 2.0 V, IOUT = 10 mA
IOUT
VIN ≥ VOUT(S) + 2.0 V
IOUT = 125 mA
IOUT = 250 mA
VOUT(S) + 0.5 V ≤ VIN ≤ 36 V, IOUT = 10 mA,
Tj = +25°C
VIN = VOUT(S) + 2.0 V,
2.5 V ≤ VOUT(S) < 5.1 V, 0.1 mA ≤ IOUT ≤ 40 mA,
Tj = +25°C
VIN = VOUT(S) + 2.0 V,
5.1 V ≤ VOUT(S) < 12.1 V, 0.1 mA ≤ IOUT ≤ 40 mA,
Tj = +25°C
VIN = VOUT(S) + 2.0 V,
12.1 V ≤ VOUT(S) ≤ 16.0 V, 0.1 mA ≤ IOUT ≤ 40 mA,
Tj = +25°C
VIN = 18.0 V,
VON / OFF = VIN, IOUT = 0.01 mA
VIN = 18.0 V,
VON / OFF = 0 V, no load
−
B type
(ON / OFF logic active "H")
VIN = 18.0 V, RL = 1.0 kΩ,
determined by VOUT output level D type
(ON / OFF logic active "H")
B type
(ON / OFF logic active "H")
VIN = 18.0 V, RL = 1.0 kΩ,
determined by VOUT output level D type
(ON / OFF logic active "H")
Vdrop
ΔVOUT1
ΔVIN • VOUT
ΔVOUT2
ISS1
ISS2
VIN
ON / OFF pin
input voltage "H"
VSH
ON / OFF pin
input voltage "L"
VSL
ON / OFF pin
input current "H"
ON / OFF pin
input current "L"
Ripple rejection
Short-circuit current
Condition
(Ta = +25°C unless otherwise specified)
Test
Min.
Typ.
Max. Unit
Circuit
VOUT(S)
VOUT(S)
VOUT(S)
V
1
× 0.980
× 1.020
*4
250
−
−
mA
3
−
0.35
−
V
1
−
0.80
−
V
1
−
0.01
0.03
%/V
1
−
16
30
mV
1
−
16
35
mV
1
−
16
40
mV
1
−
6.5
8.5
μA
2
−
0.1
3.5
μA
2
3.0
−
36
V
−
1.5
−
−
V
4
2.0
−
−
V
4
−
−
0.25
V
4
−
−
0.8
V
4
ISH
VIN = 18.0 V, VON / OFF = VIN
−0.1
−
0.1
μA
4
ISL
VIN = 18.0 V, VON / OFF = 0 V
−0.1
−
0.1
μA
4
2.5 V ≤ VOUT(S) < 3.6 V
−
45
−
dB
5
|RR|
VIN = VOUT(S) + 2.0 V,
f = 100 Hz,
ΔVrip = 0.5 Vrms,
IOUT = 10 mA
3.6 V ≤ VOUT(S) < 6.1 V
−
40
−
dB
5
6.1 V ≤ VOUT(S) < 10.1 V
−
35
−
dB
5
10.1 V ≤ VOUT(S) ≤ 16.0 V
−
30
−
dB
5
−
120
−
mA
3
Ishort
VIN = VOUT(S) + 2.0 V,
VON / OFF = VIN, VOUT = 0 V
Thermal shutdown
TSD
Junction temperature
−
165
−
°C
−
detection temperature
Thermal shutdown
TSR
Junction temperature
−
140
−
°C
−
release temperature
Discharge shunt
VIN = 18.0 V, VON / OFF = 0 V, VOUT = 2.0 V
−
70
−
kΩ
6
resistance during
RLOW
power-off
*1. VOUT(S): Set output voltage
VOUT(E): Actual output voltage
The output voltage when VIN = VOUT(S) + 2.0 V, IOUT = 10 mA
*2. The output current at which the output voltage becomes 95% of VOUT(E) after gradually increasing the output current.
*3. Vdrop = VIN1 − (VOUT3 × 0.98)
VIN1 is the input voltage at which the output voltage becomes 98% of VOUT3 after gradually decreasing the input voltage.
VOUT3 is the output voltage when VIN = VOUT(S) + 2.0 V, and IOUT = 125 mA or 250 mA.
*4. Due to limitation of the power dissipation, this value may not be satisfied. Attention should be paid to the power
dissipation when the output current is large.
This specification is guaranteed by design.
9
105°C OPERATION, 36 V INPUT, 250 mA VOLTAGE REGULATOR
S-1212B/D Series
Test Circuits
VIN
+
VOUT
ON / OFF
V
VSS
A
+
Set to ON
Figure 8 Test Circuit 1
VIN
VOUT
ON / OFF
VSS
Set to VIN or GND A +
Figure 9 Test Circuit 2
VIN
VOUT
+
ON / OFF
VSS
A
V
+
Set to ON
Figure 10 Test Circuit 3
VIN
+
A
VOUT
ON / OFF
VSS
V
+
RL
Figure 11 Test Circuit 4
VIN
VOUT
ON / OFF
VSS
Set to ON
Figure 12 Test Circuit 5
10
V
+
RL
Rev.3.2_00
Rev.3.2_00
105°C OPERATION, 36 V INPUT, 250 mA VOLTAGE REGULATOR
S-1212B/D Series
VIN
VOUT
A
ON / OFF
VSS
+
V
+
Set to OFF
Figure 13 Test Circuit 6
11
105°C OPERATION, 36 V INPUT, 250 mA VOLTAGE REGULATOR
S-1212B/D Series
Rev.3.2_00
Standard Circuit
Input
Output
VOUT
VIN
CIN
*1
ON / OFF
VSS
Single GND
CL
*2
GND
*1. CIN is a capacitor for stabilizing the input.
*2. CL is a capacitor for stabilizing the output.
Figure 14
Caution The above connection diagram and constants will not guarantee successful operation. Perform
thorough evaluation using an actual application to set the constants.
Condition of Application
Input capacitor (CIN):
Output capacitor (CL):
A ceramic capacitor with capacitance of 1.0 μF or more is recommended.
A ceramic capacitor with capacitance of 1.0 μF to 100 μF is recommended.
Caution Generally, in a voltage regulator, an oscillation may occur depending on the selection of the external
parts. Perform thorough evaluation including the temperature characteristics with an actual
application using the above capacitors to confirm no oscillation occurs.
Selection of Input Capacitor (CIN) and Output Capacitor (CL)
The S-1212B/D Series requires CL between the VOUT pin and the VSS pin for phase compensation. The operation is
stabilized by a ceramic capacitor with capacitance of 1.0 μF to 100 μF. When using an OS capacitor, a tantalum
capacitor or an aluminum electrolytic capacitor, the capacitance also must be 1.0 μF to 100 μF. However, an oscillation
may occur depending on the equivalent series resistance (ESR).
Moreover, the S-1212B/D Series requires CIN between the VIN pin and the VSS pin for a stable operation.
Generally, an oscillaiton may occur when a voltage regulator is used under the conditon that the impedance of the power
supply is high.
Note that the output voltage transient characteristics varies depending on the capacitance of CIN and CL and the value of
ESR.
Caution Perform thorough evaluation including the temperature characteristics with an actual application to
select CIN and CL.
12
105°C OPERATION, 36 V INPUT, 250 mA VOLTAGE REGULATOR
S-1212B/D Series
Rev.3.2_00
Explanation of Terms
1. Low dropout voltage regulator
This is a voltage regulator which made dropout voltage small by its built-in low on-resistance output transistor.
2. Output voltage (VOUT)
This voltage is output at an accuracy of ±2.0% when the input voltage, the output current and the temperature are in
a certain condition*1.
*1. Differs depending on the product.
Caution
If the certain condition is not satisfied, the output voltage may exceed the accuracy range of ±2.0%.
Refer to " Electrical Characteristics" and " Characteristics (Typical Data)" for details.
ΔVOUT1
ΔVIN • VOUT
3. Line regulation
Indicates the dependency of the output voltage against the input voltage. That is, the value shows how much the
output voltage changes due to a change in the input voltage after fixing output current constant.
4. Load regulation (ΔVOUT2)
Indicates the dependency of the output voltage against the output current. That is, the value shows how much the
output voltage changes due to a change in the output current after fixing input voltage constant.
5. Dropout voltage (Vdrop)
Indicates the difference between input voltage (VIN1) and the output voltage when the output voltage becomes 98% of
the output voltage value (VOUT3) at VIN = VOUT(S) + 2.0 V after the input voltage (VIN) is decreased gradually.
Vdrop = VIN1 − (VOUT3 × 0.98)
13
105°C OPERATION, 36 V INPUT, 250 mA VOLTAGE REGULATOR
S-1212B/D Series
Rev.3.2_00
Operation
1. Basic operation
Figure 15 shows the block diagram of the S-1212B/D Series to describe the basic operation.
The error amplifier compares the feedback voltage (Vfb) whose output voltage (VOUT) is divided by the feedback
resistors (Rs and Rf) with the reference voltage (Vref). The error amplifier controls the output transistor, consequently,
the regulator starts the operation that holds VOUT constant without the influence of the input voltage (VIN).
VIN
*1
Current
supply
VOUT
Error amplifier
Vref
−
+
Rf
Vfb
Reference voltage
circuit
Rs
VSS
*1.
Parasitic diode
Figure 15
2. Output transistor
In the S-1212B/D Series, a low on-resistance P-channel MOS FET is used between the VIN pin and the VOUT pin as
the output transistor. In order to hold VOUT constant, the on-resistance of the output transistor varies appropriately
according to the output current (IOUT).
Caution Since a parasitic diode exists between the VIN pin and the VOUT pin due to the structure of the
transistor, the IC may be damaged by a reverse current if VOUT becomes higher than VIN.
Therefore, be sure that VOUT does not exceed VIN + 0.3 V.
14
Rev.3.2_00
105°C OPERATION, 36 V INPUT, 250 mA VOLTAGE REGULATOR
S-1212B/D Series
3. ON / OFF pin
The ON / OFF pin controls the internal circuit and the output transistor in order to start and stop the regulator. When
the ON / OFF pin is set to OFF, the internal circuit stops operating and the output transistor between the VIN pin and
the VOUT pin is turned off, reducing current consumption significantly.
The internal equivalent circuit related to the ON / OFF pin is configured as shown in Figure 16. Since the ON / OFF
pin is neither pulled down nor pulled up, do not use it in the floating status. When not using the ON / OFF pin, connect
it to the VIN pin. Note that the current consumption increases when a voltage of VSL max.*1 to VIN − 0.3 V is applied to
the ON / OFF pin.
Table 14
Product Type
ON / OFF Pin
Internal Circuit
VOUT Pin Voltage
Current Consumption
*2
B/D
"H": ON
Operate
Constant value
ISS1
B/D
"L": OFF
Stop
Pulled down to VSS*3
ISS2
*1. Refer to Table 13 in " Electrical Characteristics".
*2. The constant value is output due to the regulating based on the set output voltage value.
*3. The VOUT pin voltage of the S-1212B/D Series is pulled down to VSS due to combined resistance
(RLOW = 70 kΩ typ.) of the discharge shunt circuit and the feedback resistors, and a load.
VIN
ON / OFF
VSS
Figure 16
15
105°C OPERATION, 36 V INPUT, 250 mA VOLTAGE REGULATOR
S-1212B/D Series
Rev.3.2_00
4. Discharge shunt function
The S-1212B/D Series has a built-in discharge shunt circuit to discharge the output capacitance. The output
capacitance is discharged as follows so that the VOUT pin reaches the VSS level.
(1) The ON / OFF pin is set to OFF level.
(2) The output transistor is turned off.
(3) The discharge shunt circuit is turned on.
(4) The output capacitor discharges.
S-1212B/D Series
Output transistor : OFF
*1
VOUT
VIN
Discharge shunt circuit
: ON
*1
ON / OFF
ON / OFF circuit
Output
capacitor
(CL)
ON / OFF pin
: OFF
Current flow
GND
VSS
*1. Parasitic diode
Figure 17
5. Overcurrent protection circuit
The S-1212B/D Series has a built-in overcurrent protection circuit to limit the overcurrent of the output transistor.
When the VOUT pin is shorted with the VSS pin, that is, at the time of the output short-circuit, the output current is
limited to 120 mA typ. due to the overcurrent protection circuit operation. The S-1212B/D Series restarts regulating
when the output transistor is released from the overcurrent status.
Caution 1. This overcurrent protection circuit does not work as for thermal protection. For example, when
the output transistor keeps the overcurrent status long at the time of output short-circuit or
due to other reasons, pay attention to the conditions of the input voltage and the load current
so as not to exceed the power dissipation.
2. Note that any interference may be caused in the output voltage start-up when a load heavier
VOUT(S)
than
is connected.
100 mA
16
Rev.3.2_00
105°C OPERATION, 36 V INPUT, 250 mA VOLTAGE REGULATOR
S-1212B/D Series
6. Thermal shutdown circuit
The S-1212B/D Series has a built-in thermal shutdown circuit to limit overheating. When the junction temperature
increases to 165°C typ., the thermal shutdown circuit becomes the detection status, and the regulating is stopped.
When the junction temperature decreases to 140°C typ., the thermal shutdown circuit becomes the release status,
and the regulator is restarted.
If the thermal shutdown circuit becomes the detection status due to self-heating, the regulating is stopped and VOUT
decreases. For this reason, the self-heating is limited and the temperature of the IC decreases. The thermal
shutdown circuit becomes release status when the temperature of the IC decreases, and the regulating is restarted,
thus the self-heating is generated again. Repeating this procedure makes the waveform of VOUT into a pulse-like
form. This phenomenon continues unless decreasing either or both of the input voltage and the output current in
order to reduce the internal power consumption, or decreasing the ambient temperature. Note that the product may
suffer physical damage such as deterioration if the above phenomenon occurs continuously.
Caution 1. When the heat radiation of the application is not in a good condition, the self-heating cannot be
limited immediately, and the IC may suffer physical damage. Perform thorough evaluation
including the temperature characteristics with an actual application to confirm no problems
happen.
2. If a large load current flows during the restart process of regulating after the thermal shutdown
circuit changes to the release status from the detection status, the thermal shutdown circuit
becomes the detection status again due to self-heating, and a problem may happen in the restart
of regulating. A large load current, for example, occurs when charging to the CL whose
capacitance is large.
Perform thorough evaluation including the temperature characteristics with an actual application
to select CL.
Table 15
Thermal Shutdown Circuit
Release: 140°C typ.*1
Detection: 165°C typ.*1
*1.
*2.
*3.
VOUT Pin Voltage
Constant value*2
Pulled down to VSS*3
Junction temperature
The constant value is output due to the regulating based on the set output voltage value.
The VOUT pin voltage is pulled down to VSS due to the feedback resistors (Rs and Rf) and a load.
17
105°C OPERATION, 36 V INPUT, 250 mA VOLTAGE REGULATOR
S-1212B/D Series
Rev.3.2_00
Precautions
• Generally, when a voltage regulator is used under the condition that the load current value is small (0.1 mA or less),
the output voltage may increase due to the leakage current of an output transistor.
• Generally, when a voltage regulator is used under the condition that the temperature is high, the output voltage may
increase due to the leakage current of an output transistor.
• Generally, when the ON / OFF pin is used under the condition of OFF, the output voltage may increase due to the
leakage current of an output transistor.
• Generally, when a voltage regulator is used under the condition that the impedance of the power supply is high, an
oscillation may occur. Perform thorough evaluation including the temperature characteristics with an actual application
to select CIN.
• Generally, in a voltage regulator, an oscillation may occur depending on the selection of the external parts. The
following use conditions are recommended in the S-1212B/D Series, however, perform thorough evaluation including
the temperature characteristics with an actual application to select CIN and CL.
Input capacitor (CIN):
Output capacitor (CL):
A ceramic capacitor with capacitance of 1.0 μF or more is recommended.
A ceramic capacitor with capacitance of 1.0 μF to 100 μF is recommended.
• Generally, in a voltage regulator, the values of an overshoot and an undershoot in the output voltage vary depending
on the variation factors of input voltage start-up, input voltage fluctuation and load fluctuation etc., or the capacitance
of CIN or CL and the value of the equivalent series resistance (ESR), which may cause a problem to the stable
operation. Perform thorough evaluation including the temperature characteristics with an actual application to select
CIN and CL.
• Generally, in a voltage regulator, an overshoot may occur in the output voltage momentarily if the input voltage steeply
changes when the input voltage is started up or the input voltage fluctuates etc. Perform thorough evaluation including
the temperature characteristics with an actual application to confirm no problems happen.
• Generally, in a voltage regulator, if the VOUT pin is steeply shorted with GND, a negative voltage exceeding the
absolute maximum ratings may occur in the VOUT pin due to resonance phenomenon of the inductance and the
capacitance including CL on the application. The resonance phenomenon is expected to be weakened by inserting a
series resistor into the resonance path, and the negative voltage is expected to be limited by inserting a protection
diode between the VOUT pin and the VSS pin.
• If the input voltage is started up steeply under the condition that the capacitance of CL is large, the thermal shutdown
circuit may be in the detection status by self-heating due to the charge current to CL.
• Make sure of the conditions for the input voltage, output voltage and the load current so that the internal loss does not
exceed the power dissipation.
• Do not apply an electrostatic discharge to this IC that exceeds the performance ratings of the built-in electrostatic
protection circuit.
• When considering the output current value that the IC is able to output, make sure of the output current value specified
in Table 13 in " Electrical Characteristics" and footnote *4 of the table.
• Wiring patterns on the application related to the VIN pin, the VOUT pin and the VSS pin should be designed so that the
impedance is low. When mounting CIN between the VIN pin and the VSS pin and CL between the VOUT pin and the
VSS pin, connect the capacitors as close as possible to the respective destination pins of the IC.
• In the package equipped with heat sink of backside, mount the heat sink firmly. Since the heat radiation differs
according to the condition of the application, perform thorough evaluation with an actual application to confirm no
problems happen.
• ABLIC Inc. claims no responsibility for any disputes arising out of or in connection with any infringement by products
including this IC of patents owned by a third party.
18
105°C OPERATION, 36 V INPUT, 250 mA VOLTAGE REGULATOR
S-1212B/D Series
Rev.3.2_00
Characteristics (Typical Data)
1. Output voltage vs. Output current (When load current increases) (Ta = +25°C)
3.0
6.0
2.5
5.0
2.0
VIN = 3.0 V
VIN = 3.5 V
VIN = 4.5 V
VIN = 9.0 V
1.5
1.0
0.5
0.0
VOUT [V]
1. 2 VOUT = 5.0 V
VOUT [V]
1. 1 VOUT = 2.5 V
0
4.0
VIN = 5.5 V
VIN = 6.0 V
VIN = 7.0 V
VIN = 9.0 V
3.0
2.0
1.0
0.0
100 200 300 400 500 600 700 800
IOUT [mA]
0
100 200 300 400 500 600 700 800
IOUT [mA]
Remark In determining the output current, attention should be paid to the following.
1. The minimum output current value and footnote *4 of Table 13 in " Electrical Characteristics"
2. Power dissipation
2. Output voltage vs. Input voltage (Ta = +25°C)
2.9
5.4
2.7
5.2
2.5
5.0
2.3
IOUT = 0.1 mA
IOUT = 10 mA
IOUT = 40 mA
2.1
1.9
1.7
VOUT [V]
2. 2 VOUT = 5.0 V
VOUT [V]
2. 1 VOUT = 2.5 V
0
6
12
18
VIN [V]
4.8
IOUT = 0.1 mA
IOUT = 10 mA
IOUT = 40 mA
4.6
4.4
24
30
36
4.2
0
6
12
18
VIN [V]
24
30
36
2. 3 VOUT = 16.0 V
16.4
VOUT [V]
16.2
16.0
IOUT = 0.1 mA
IOUT = 10 mA
IOUT = 40 mA
15.8
15.6
15.4
15.2
0
6
12
18
VIN [V]
24
30
36
19
105°C OPERATION, 36 V INPUT, 250 mA VOLTAGE REGULATOR
S-1212B/D Series
Rev.3.2_00
3. Dropout voltage vs. Output current
3. 1 VOUT = 2.5 V
3. 2 VOUT = 5.0 V
1.2
1.2
0.8
0.6
Tj = +25°C
0.4
0.2
0.0
1.0
Tj = +150°C
Vdrop [V]
Vdrop [V]
1.0
50
100
150
IOUT [mA]
200
0.6
Tj = +25°C
0.4
0.2
Tj = −40°C
0
Tj = +150°C
0.8
0.0
250
Tj = −40°C
0
50
100
150
IOUT [mA]
200
250
3. 3 VOUT = 16.0 V
1.2
Vdrop [V]
1.0
Tj = +150°C
0.8
0.6
Tj = +25°C
0.4
0.2
0.0
Tj = −40°C
0
50
100
150
IOUT [mA]
200
250
4. Dropout voltage vs. Junction temperature
4. 1 VOUT = 2.5 V
4. 2 VOUT = 5.0 V
0.6
0.6
IOUT = 125 mA
0.4
0.3
0.2
IOUT = 10 mA
0.1
0.0
−40 −25
0
25
50 75 100 125 150
Tj [°C]
4. 3 VOUT = 16.0 V
0.6
Vdrop [V]
0.5
IOUT = 125 mA
0.4
0.3
0.2
IOUT = 10 mA
0.1
0.0
−40 −25
20
0
25
50 75 100 125 150
Tj [°C]
0.5
Vdrop [V]
Vdrop [V]
0.5
IOUT = 125 mA
0.4
0.3
0.2
IOUT = 10 mA
0.1
0.0
−40 −25
0
25
50 75 100 125 150
Tj [°C]
105°C OPERATION, 36 V INPUT, 250 mA VOLTAGE REGULATOR
S-1212B/D Series
Rev.3.2_00
5. Dropout voltage vs. Set output voltage (Ta = +25°C)
1.0
Vdrop [V]
0.8
0.6
0.4
0.2
0.0
IOUT = 250 mA
IOUT = 125 mA
IOUT = 40 mA
IOUT = 10 mA
IOUT = 0.1 mA
0.0
4.0
8.0
VOUT(S) [V]
12.0
16.0
6. Output voltage vs. Junction temperature
6. 1 VOUT = 2.5 V
6. 2 VOUT = 5.0 V
VIN = 7.0 V
2.55
5.10
2.53
5.06
VOUT [V]
VOUT [V]
VIN = 4.5 V
2.51
2.49
2.47
2.45
−40 −25
5.02
4.98
4.94
0
25
50 75 100 125 150
Tj [°C]
4.90
−40 −25
0
25
50 75 100 125 150
Tj [°C]
6. 3 VOUT = 16.0 V
VIN = 18.0 V
16.28
VOUT [V]
16.18
16.08
15.98
15.88
15.78
15.68
−40 −25
0
25
50 75 100 125 150
Tj [°C]
21
105°C OPERATION, 36 V INPUT, 250 mA VOLTAGE REGULATOR
S-1212B/D Series
Rev.3.2_00
7. Current consumption during operation vs. Input voltage (When ON / OFF pin is ON, no load)
7. 1 VOUT = 2.5 V
7. 2 VOUT = 5.0 V
50.0
50.0
30.0
Tj = +25°C
Tj = −40°C
20.0
10.0
0.0
40.0
Tj = +150°C
ISS1 [μA]
ISS1 [μA]
40.0
0
6
12
18
VIN [V]
24
30
Tj = +150°C
30.0
Tj = +25°C
Tj = −40°C
20.0
10.0
0.0
36
0
6
12
18
VIN [V]
24
30
36
7. 3 VOUT = 16.0 V
50.0
Tj = −40°C
Tj = +25°C
ISS1 [μA]
40.0
30.0
20.0
Tj = +150°C
10.0
0.0
0
6
12
18
VIN [V]
24
30
36
8. Current consumption during operation vs. Junction temperature
8. 1 VOUT = 2.5 V
8. 2 VOUT = 5.0 V
VIN = 18.0 V
10.0
8.0
ISS1 [μA]
ISS1 [μA]
8.0
6.0
4.0
2.0
0.0
0
25
50
75
100
Tj [°C]
125
150
VIN = 18.0 V
10.0
ISS1 [μA]
8.0
6.0
4.0
2.0
22
6.0
4.0
2.0
8. 3 VOUT = 16.0 V
0.0
VIN = 18.0 V
10.0
0
25
50
75
100
Tj [°C]
125
150
0.0
0
25
50
75
100
Tj [°C]
125
150
105°C OPERATION, 36 V INPUT, 250 mA VOLTAGE REGULATOR
S-1212B/D Series
Rev.3.2_00
9. Current consumption during operation vs. Output current (Ta = +25°C)
9. 1 VOUT = 2.5 V
9. 2 VOUT = 5.0 V
50.0
50.0
40.0
VIN = 3.5 V
30.0
ISS1 [μA]
ISS1 [μA]
40.0
VIN = 13.5 V
20.0
10.0
0.0
VIN = 6.0 V
30.0
VIN = 13.5 V
20.0
10.0
0
50
100
150
IOUT [mA]
200
250
200
250
0.0
0
50
100
150
IOUT [mA]
200
250
9. 3 VOUT = 16.0 V
50.0
ISS1 [μA]
40.0
VIN = 17.0 V
30.0
VIN = 20.0 V
20.0
10.0
0.0
0
50
100
150
IOUT [mA]
10. Ripple rejection (Ta = +25°C)
10. 2 VOUT = 5.0 V
10. 1 VOUT = 2.5 V
VIN = 4.5 V, CL = 1.0 μF
120
100
60
0
100
1k
10k
Frequency [Hz]
100k
IOUT = 10 mA
60
40
20
IOUT = 250 mA
10
IOUT = 0.01 mA
80
IOUT = 10 mA
40
20
100
IOUT = 0.01 mA
80
VIN = 7.0 V, CL = 1.0 μF
120
0
IOUT = 250 mA
10
100
1k
10k
Frequency [Hz]
100k
10. 3 VOUT = 16.0 V
VIN = 18.0 V, CL = 1.0 μF
120
100
IOUT = 0.01 mA
80
IOUT = 10 mA
60
40
20
0
IOUT = 250 mA
10
100
1k
10k
Frequency [Hz]
100k
23
105°C OPERATION, 36 V INPUT, 250 mA VOLTAGE REGULATOR
S-1212B/D Series
Rev.3.2_00
Reference Data
1. Characteristics of input transient response (Ta = +25°C)
1. 1 VOUT = 2.5 V
IOUT = 40 mA, CIN = 1.0 μF, VIN = 11.5 V ↔ 13.5 V, tr = tf = 5.0 μs
3.3
15
3.1
2.9
VIN
2.7
2.5
CL = 10.0 μF
CL = 22.0 μF
VOUT
1. 2 VOUT = 5.0 V
IOUT = 40 mA, CIN = 1.0 μF, VIN = 11.5 V ↔ 13.5 V, tr = tf = 5.0 μs
5.8
15
13
5.6
11
5.4
9
5.2
7
5.0
2.3
5
−0.4 0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8
t [ms]
13
VIN
CL = 10.0 μF
CL = 22.0 μF
11
9
7
VOUT
4.8
5
−0.4 0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8
t [ms]
1. 3 VOUT = 16.0 V
IOUT = 40 mA, CIN = 1.0 μF, VIN = 18.0 V ↔ 19.5 V, tr = tf = 5.0 μs
16.8
21
19
16.6
16.4
VIN
16.2
16.0
CL = 10.0 μF
CL = 22.0 μF
17
15
13
VOUT
15.8
11
−0.4 0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8
t [ms]
2. Characteristics of load transient response (Ta = +25°C)
2. 2 VOUT = 5.0 V
VIN = 13.5 V, CIN = 1.0 μF, IOUT = 50 mA ↔ 100 mA
5.4
150
2.7
2.6
2.5
IOUT
5.3
50
5.2
0
VOUT
−50
CL = 22.0 μF
CL = 10.0 μF
2.4
100
IOUT [mA]
2.8
−100
16.0
15.9
50
0
VOUT
−50
CL = 22.0 μF
CL = 10.0 μF
−100
15.8
−150
−0.4 0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8
t [ms]
24
IOUT [mA]
16.1
100
IOUT
50
0
VOUT
−50
CL = 22.0 μF
CL = 10.0 μF
−100
4.8
−150
−0.4 0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8
t [ms]
2. 3 VOUT = 16.0 V
VIN = 18.0 V, CIN = 1.0 μF, IOUT = 50 mA ↔ 100 mA
16.4
150
16.2
5.0
4.9
2.3
−150
−0.4 0.0 0.4 0.8 1.2 1.6 2.0 2.4 2.8
t [ms]
16.3
5.1
100
IOUT
IOUT [mA]
2. 1 VOUT = 2.5 V
VIN = 13.5 V, CIN = 1.0 μF, IOUT = 50 mA ↔ 100 mA
2.9
150
105°C OPERATION, 36 V INPUT, 250 mA VOLTAGE REGULATOR
S-1212B/D Series
Rev.3.2_00
3. Transient response characteristics of ON / OFF pin (Ta = +25°C)
12
9.0
6
6.0
3.0
0.0
0
V ON / OFF
−6
−3.0
−0.5
0.0
0.5
1.0 1.5
t [ms]
2.0
2.5
3.0
12
9.0
6
6.0
3.0
−12
VOUT
12.0
0.0
−18
0
V ON / OFF
−6
−12
VOUT
−3.0
−0.5
0.0
VON / OFF [V]
12.0
3. 2 VOUT = 5.0 V
VIN = 13.5 V, CL = 10.0 μF, CIN = 1.0 μF,
IOUT = 125 mA, VON / OFF = 0 V → 13.5 V
18
15.0
VON / OFF [V]
3. 1 VOUT = 2.5 V
VIN = 13.5 V, CL = 10.0 μF, CIN = 1.0 μF,
IOUT = 125 mA, VON / OFF = 0 V → 13.5 V
18
15.0
0.5
1.0 1.5
t [ms]
2.0
2.5
3.0
−18
4. Load transient response characteristics dependent on capacitance (Ta = +25°C)
4. 1 VOUT = 5.0 V
VIN = 13.5 V, CIN = 1.0 μF, IOUT = 50 mA → 100 mA
0.20
VIN = 13.5 V, CIN = 1.0 μF, IOUT = 100 mA → 50 mA
0.20
0.15
0.15
0.10
0.10
0.05
0.05
0.00
0.00
0
20
40
60
CL [μF]
80
100
0
20
40
60
CL [μF]
80
100
5. Input transient response characteristics dependent on capacitance (Ta = +25°C)
1.5
1.0
0.5
0.0
VIN = 12.0 V → 7.0 V, tr = 5.0 μs,
CIN = 1.0 μF, IOUT = 40 mA
2.0
Undershoot [V]
Overshoot [V]
5. 1 VOUT = 5.0 V
VIN = 7.0 V → 12.0 V, tr = 5.0 μs,
CIN = 1.0 μF, IOUT = 40 mA
2.0
1.5
1.0
0.5
0.0
0
20
40
60
CL [μF]
80
100
0
20
40
60
CL [μF]
80
100
25
105°C OPERATION, 36 V INPUT, 250 mA VOLTAGE REGULATOR
S-1212B/D Series
Rev.3.2_00
6. Example of equivalent series resistance vs. Output current characteristics (Ta = +25°C)
CIN = CL = 1.0 μF
100
RESR [Ω]
VIN
CIN
Stable
0
S-1212B/D
Series
ON / OFF
0.1
VSS
250
VOUT
CL
*1
RESR
IOUT [mA]
*1. CL: TDK Corporation
Figure 18
26
CGA5L3X8R1H105M (1.0 μF)
Figure 19
105°C OPERATION, 36 V INPUT, 250 mA VOLTAGE REGULATOR
S-1212B/D Series
Rev.3.2_00
Power Dissipation
TO-252-5S(A)
HSOP-8A
Tj = +150°C max.
5
Tj = +150°C max.
5
Power dissipation (PD) [W]
Power dissipation (PD) [W]
E
4 D
3 C
2 B
1 A
0
0
25
50
75
100
125
150
4 E
D
2
B
1
0
175
C
3
A
0
25
Ambient temperature (Ta) [°C]
Board
A
B
C
D
E
Power Dissipation (PD)
1.39 W
2.16 W
3.29 W
4.17 W
4.31 W
100
125
150
175
Board
A
B
C
D
E
Power Dissipation (PD)
1.09 W
1.52 W
2.98 W
2.91 W
3.57 W
SOT-89-5
Tj = +150°C max.
4
3 E
D
2
B
1 A
0
25
50
75
100
125
150
175
Tj = +150°C max.
5
Power dissipation (PD) [W]
5
Power dissipation (PD) [W]
75
Ambient temperature (Ta) [°C]
HSOP-6
0
50
4
E
3
D
2
B
1
0
A
0
25
Ambient temperature (Ta) [°C]
Board
A
B
C
D
E
Power Dissipation (PD)
1.18 W
1.52 W
−
2.45 W
2.60 W
50
75
100
125
150
175
Ambient temperature (Ta) [°C]
Board
A
B
C
D
E
Power Dissipation (PD)
1.02 W
1.39 W
−
2.36 W
3.05 W
27
105°C OPERATION, 36 V INPUT, 250 mA VOLTAGE REGULATOR
S-1212B/D Series
HTMSOP-8
SOT-23-5
Tj = +150°C max.
E
D
3
C
2
B
1
Tj = +150°C max.
5
Power dissipation (PD) [W]
Power dissipation (PD) [W]
5
4
4
3
2
1 B
A
0
0
A
25
50
75
100
125
150
175
0
0
25
Ambient temperature (Ta) [°C]
28
Rev.3.2_00
Board
Power Dissipation (PD)
A
B
C
D
E
0.78 W
1.08 W
2.84 W
2.84 W
3.57 W
50
75
100
125
150
Ambient temperature (Ta) [°C]
Board
A
B
C
D
E
Power Dissipation (PD)
0.69 W
0.87 W
−
−
−
175
TO-252-5S Test Board
(1) Board A
IC Mount Area
Item
Size [mm]
Material
Number of copper foil layer
Copper foil layer [mm]
1
2
3
4
Thermal via
Specification
114.3 x 76.2 x t1.6
FR-4
2
Land pattern and wiring for testing: t0.070
74.2 x 74.2 x t0.070
-
(2) Board B
Item
Size [mm]
Material
Number of copper foil layer
Copper foil layer [mm]
1
2
3
4
Thermal via
Specification
114.3 x 76.2 x t1.6
FR-4
4
Land pattern and wiring for testing: t0.070
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.070
-
(3) Board C
Item
Size [mm]
Material
Number of copper foil layer
Copper foil layer [mm]
Thermal via
1
2
3
4
Specification
114.3 x 76.2 x t1.6
FR-4
4
Land pattern and wiring for testing: t0.070
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.070
Number: 4
Diameter: 0.3 mm
No. TO252-5S-A-Board-SD-1.0
enlarged view
ABLIC Inc.
TO-252-5S Test Board
(4) Board D
IC Mount Area
Item
Size [mm]
Material
Number of copper foil layer
Specification
114.3 x 76.2 x t1.6
FR-4
4
Thermal via
2
Pattern for heat radiation: 2000mm t0.070
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.070
-
Item
Size [mm]
Material
Number of copper foil layer
Specification
114.3 x 76.2 x t1.6
FR-4
4
Copper foil layer [mm]
1
2
3
4
(5) Board E
Copper foil layer [mm]
Thermal via
1
2
3
4
2
Pattern for heat radiation: 2000mm t0.070
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.070
Number: 4
Diameter: 0.3 mm
enlarged view
No. TO252-5S-A-Board-SD-1.0
ABLIC Inc.
HSOP-8A Test Board
(1) Board A
IC Mount Area
Item
Size [mm]
Material
Number of copper foil layer
Copper foil layer [mm]
1
2
3
4
Thermal via
Specification
114.3 x 76.2 x t1.6
FR-4
2
Land pattern and wiring for testing: t0.070
74.2 x 74.2 x t0.070
-
(2) Board B
Item
Size [mm]
Material
Number of copper foil layer
Copper foil layer [mm]
1
2
3
4
Thermal via
Specification
114.3 x 76.2 x t1.6
FR-4
4
Land pattern and wiring for testing: t0.070
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.070
-
(3) Board C
Item
Size [mm]
Material
Number of copper foil layer
Copper foil layer [mm]
Thermal via
1
2
3
4
Specification
114.3 x 76.2 x t1.6
FR-4
4
Land pattern and wiring for testing: t0.070
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.070
Number: 4
Diameter: 0.3 mm
enlarged view
No. HSOP8A-A-Board-SD-1.0
ABLIC Inc.
HSOP-8A Test Board
(4) Board D
IC Mount Area
Item
Size [mm]
Material
Number of copper foil layer
1
2
Copper foil layer [mm]
3
4
Thermal via
Specification
114.3 x 76.2 x t1.6
FR-4
4
Pattern for heat radiation: 2000mm2 t0.070
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.070
-
Item
Size [mm]
Material
Number of copper foil layer
1
2
Copper foil layer [mm]
3
4
Specification
114.3 x 76.2 x t1.6
FR-4
4
Pattern for heat radiation: 2000mm2 t0.070
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.070
Number: 4
Diameter: 0.3 mm
(5) Board E
Thermal via
enlarged view
No. HSOP8A-A-Board-SD-1.0
ABLIC Inc.
HSOP-6 Test Board
IC Mount Area
(1) Board A
Item
Specification
Size [mm]
114.3 x 76.2 x t1.6
Material
FR-4
Number of copper foil layer
2
Copper foil layer [mm]
1
Land pattern and wiring for testing: t0.070
2
3
4
74.2 x 74.2 x t0.070
Thermal via
-
(2) Board B
Item
Specification
Size [mm]
114.3 x 76.2 x t1.6
Material
FR-4
Number of copper foil layer
4
Land pattern and wiring for testing: t0.070
1
74.2 x 74.2 x t0.035
2
Copper foil layer [mm]
74.2 x 74.2 x t0.035
3
74.2 x 74.2 x t0.070
4
Thermal via
-
(3) Board D
Item
Specification
Size [mm]
114.3 x 76.2 x t1.6
Material
FR-4
Number of copper foil layer
4
Copper foil layer [mm]
1
2
3
4
Thermal via
Pattern for heat radiation: 2000mm2 t0.070
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.070
-
(4) Board E
Item
Size [mm]
Material
Number of copper foil layer
1
2
Copper foil layer [mm]
3
4
Thermal via
Specification
114.3 x 76.2 x t1.6
FR-4
4
Pattern for heat radiation: 2000mm2 t0.070
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.070
Number: 4
Diameter: 0.3 mm
No. HSOP6-A-Board-SD-1.0
enlarged view
ABLIC Inc.
SOT-89-5 Test Board
IC Mount Area
(1) Board A
Item
Specification
Size [mm]
114.3 x 76.2 x t1.6
Material
FR-4
Number of copper foil layer
Copper foil layer [mm]
2
1
Land pattern and wiring for testing: t0.070
2
-
3
4
74.2 x 74.2 x t0.070
Thermal via
-
(2) Board B
Item
Specification
Size [mm]
114.3 x 76.2 x t1.6
Material
FR-4
Number of copper foil layer
4
Copper foil layer [mm]
1
Land pattern and wiring for testing: t0.070
2
74.2 x 74.2 x t0.035
3
74.2 x 74.2 x t0.035
4
74.2 x 74.2 x t0.070
Thermal via
-
(3) Board D
Item
Specification
Size [mm]
114.3 x 76.2 x t1.6
Material
FR-4
Number of copper foil layer
Copper foil layer [mm]
4
2
Pattern for heat radiation: 2000mm2 t0.070
74.2 x 74.2 x t0.035
3
74.2 x 74.2 x t0.035
4
74.2 x 74.2 x t0.070
1
Thermal via
-
(4) Board E
Item
Specification
Size [mm]
114.3 x 76.2 x t1.6
Material
FR-4
Number of copper foil layer
Copper foil layer [mm]
Thermal via
4
1
Pattern for heat radiation: 2000mm2 t0.070
2
74.2 x 74.2 x t0.035
3
74.2 x 74.2 x t0.035
4
74.2 x 74.2 x t0.070
Number: 4
Diameter: 0.3 mm
No. SOT895-A-Board-SD-1.0
enlarged view
ABLIC Inc.
HTMSOP-8 Test Board
IC Mount Area
(1) Board A
Item
Size [mm]
Material
Number of copper foil layer
Copper foil layer [mm]
1
2
3
4
Thermal via
Specification
114.3 x 76.2 x t1.6
FR-4
2
Land pattern and wiring for testing: t0.070
74.2 x 74.2 x t0.070
-
(2) Board B
Item
Size [mm]
Material
Number of copper foil layer
Copper foil layer [mm]
1
2
3
4
Thermal via
Specification
114.3 x 76.2 x t1.6
FR-4
4
Land pattern and wiring for testing: t0.070
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.070
-
(3) Board C
Item
Size [mm]
Material
Number of copper foil layer
Copper foil layer [mm]
Thermal via
1
2
3
4
Specification
114.3 x 76.2 x t1.6
FR-4
4
Land pattern and wiring for testing: t0.070
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.070
Number: 4
Diameter: 0.3 mm
No. HTMSOP8-A-Board-SD-1.0
enlarged view
ABLIC Inc.
HTMSOP-8 Test Board
IC Mount Area
(4) Board D
Item
Size [mm]
Material
Number of copper foil layer
Specification
114.3 x 76.2 x t1.6
FR-4
4
Thermal via
2
Pattern for heat radiation: 2000mm t0.070
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.070
-
Item
Size [mm]
Material
Number of copper foil layer
Specification
114.3 x 76.2 x t1.6
FR-4
4
Copper foil layer [mm]
1
2
3
4
enlarged view
(5) Board E
Copper foil layer [mm]
Thermal via
1
2
3
4
2
Pattern for heat radiation: 2000mm t0.070
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.070
Number: 4
Diameter: 0.3 mm
enlarged view
No. HTMSOP8-A-Board-SD-1.0
ABLIC Inc.
SOT-23-3/3S/5/6 Test Board
IC Mount Area
(1) Board A
Item
Size [mm]
Material
Number of copper foil layer
Copper foil layer [mm]
1
2
3
4
Thermal via
Specification
114.3 x 76.2 x t1.6
FR-4
2
Land pattern and wiring for testing: t0.070
74.2 x 74.2 x t0.070
-
(2) Board B
Item
Size [mm]
Material
Number of copper foil layer
Copper foil layer [mm]
Thermal via
1
2
3
4
Specification
114.3 x 76.2 x t1.6
FR-4
4
Land pattern and wiring for testing: t0.070
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.035
74.2 x 74.2 x t0.070
-
No. SOT23x-A-Board-SD-2.0
ABLIC Inc.
6.5±0.2
5.8
1.2±0.1
(5.2)
0.80
0.6±0.1
0.22±0.05
1.27
No. VA005-A-P-SD-2.0
TITLE
TO-252-5S-A-PKG Dimensions
VA005-A-P-SD-2.0
No.
ANGLE
UNIT
mm
ABLIC Inc.
4.0±0.1(10 pitches:40.0±0.2)
2.0±0.05
ø1.5
+0.1
-0.0
0.2±0.05
ø1.7±0.1
8.0±0.1
1.5±0.1
6.9±0.1
5
1
Feed direction
No. VA005-A-C-SD-1.0
TITLE
TO-252-5S-A-C a r r i e r T a p e
No.
VA005-A-C-SD-1.0
ANGLE
UNIT
mm
ABLIC Inc.
60°
13.4±1.0
17.4±1.0
Enlarged drawing in the central part
2±0.5
ø21±0.8
ø13±0.2
No. VA005-A-R-SD-1.1
TO-252-5S-A-Reel
TITLE
VA005-A-R-SD-1.1
No.
ANGLE
UNIT
QTY.
mm
ABLIC Inc.
4,000
6.0
0.8
2.54
1.27
No. VA005-A-L-SD-1.0
TITLE
TO-252-5S-A
-Land Recommendation
No.
VA005-A-L-SD-1.0
ANGLE
UNIT
mm
ABLIC Inc.
5.02±0.2
3.0
8
5
1
4
1.27
0.20±0.05
5
8
4
1
0.4±0.05
No. FH008-A-P-SD-2.0
TITLE
HSOP8A-A-PKG Dimensions
No.
FH008-A-P-SD-2.0
ANGLE
UNIT
mm
ABLIC Inc.
4.0±0.1(10 pitches:40.0±0.2)
2.0±0.05
ø1.5
+0.1
-0.0
0.3±0.05
ø2.0±0.05
8.0±0.1
2.1±0.1
6.7±0.1
1
8
4
5
Feed direction
No. FH008-A-C-SD-1.0
TITLE
HSOP8A-A-Carrier Tape
FH008-A-C-SD-1.0
No.
ANGLE
UNIT
mm
ABLIC Inc.
13.4±1.0
17.4±1.0
Enlarged drawing in the central part
2±0.5
ø21±0.8
ø13±0.2
No. FH008-A-R-SD-1.1
TITLE
HSOP8A-A-Reel
No.
FH008-A-R-SD-1.1
QTY.
ANGLE
UNIT
mm
ABLIC Inc.
4,000
0.76
3.2
1.27
1.27
1.27
No. FH008-A-L-SD-1.0
TITLE
HSOP8A-A
-Land Recommendation
No.
FH008-A-L-SD-1.0
ANGLE
UNIT
mm
ABLIC Inc.
5.02±0.2
6
1
0.4±0.05
5
4
2
3
0.20±0.05
1.67±0.05
1.91
1.91
No. FH006-A-P-SD-2.1
TITLE
HSOP6-A-PKG Dimensions
No.
FH006-A-P-SD-2.1
ANGLE
UNIT
mm
ABLIC Inc.
4.0±0.1(10 pitches:40.0±0.2)
2.0±0.05
ø1.55±0.05
0.3±0.05
ø2.0±0.05
8.0±0.1
2.1±0.1
6.7±0.1
1
6
3
4
Feed direction
No. FH006-A-C-SD-2.0
TITLE
HSOP6-A-Carrier Tape
No.
FH006-A-C-SD-2.0
ANGLE
UNIT
mm
ABLIC Inc.
60°
13.4±1.0
17.4±1.0
Enlarged drawing in the central part
2±0.5
ø21±0.8
ø13±0.2
No. FH006-A-R-S1-2.0
TITLE
HSOP6-A-Reel
No.
FH006-A-R-S1-2.0
ANGLE
UNIT
QTY.
mm
ABLIC Inc.
4,000
2.03
0.76
1.91
1.91
No. FH006-A-L-SD-2.0
TITLE
HSOP6-A
-Land Recommendation
No.
FH006-A-L-SD-2.0
ANGLE
UNIT
mm
ABLIC Inc.
4.5±0.1
1.5±0.1
1.6±0.2
5
4
0.3
45°
1
2
3
1.5±0.1 1.5±0.1
0.4±0.05
0.4±0.1
0.4±0.1
0.45±0.1
No. UP005-A-P-SD-2.0
TITLE
SOT895-A-PKG Dimensions
No.
UP005-A-P-SD-2.0
ANGLE
UNIT
mm
ABLIC Inc.
4.0±0.1(10 pitches : 40.0±0.2)
ø1.5
+0.1
-0
2.0±0.05
ø1.5
+0.1
-0
0.3±0.05
8.0±0.1
2.0±0.1
4.75±0.1
3 2 1
4
5
Feed direction
No. UP005-A-C-SD-2.0
TITLE
SOT895-A-Carrier Tape
UP005-A-C-SD-2.0
No.
ANGLE
UNIT
mm
ABLIC Inc.
13.0
+1.0
- 0.0
15.4±1.0
Enlarged drawing in the central part
ø13±0.2
(60°)
(60°)
No. UP005-A-R-SD-2.0
TITLE
SOT895-A-Reel
No.
UP005-A-R-SD-2.0
ANGLE
UNIT
QTY.
mm
ABLIC Inc.
1,000
2.90±0.2
1.85
8
5
1
4
0.13±0.1
0.2±0.1
0.65±0.1
No. FP008-A-P-SD-2.0
TITLE
HTMSOP8-A-PKG Dimensions
No.
FP008-A-P-SD-2.0
ANGLE
UNIT
mm
ABLIC Inc.
2.00±0.05
4.00±0.1
4.00±0.1
1.5
1.00±0.1
+0.1
-0
1.05±0.05
0.30±0.05
3.25±0.05
4
1
5
8
Feed direction
No. FP008-A-C-SD-1.0
TITLE
HTMSOP8-A-Carrier Tape
No.
FP008-A-C-SD-1.0
ANGLE
UNIT
mm
ABLIC Inc.
13.0
+1.0
- 0.0
15.4±1.0
Enlarged drawing in the central part
ø13±0.2
(60°)
(60°)
No. FP008-A-R-SD-2.0
TITLE
HTMSOP8-A-Reel
No.
FP008-A-R-SD-2.0
ANGLE
QTY.
UNIT
mm
ABLIC Inc.
4,000
0.35
1.90
0.65
0.65
0.65
No. FP008-A-L-SD-2.0
TITLE
No.
HTMSOP8-A
-Land Recommendation
FP008-A-L-SD-2.0
ANGLE
UNIT
mm
ABLIC Inc.
2.9±0.2
1.9±0.2
4
5
1
2
0.16
3
+0.1
-0.06
0.95±0.1
0.4±0.1
No. MP005-A-P-SD-1.3
TITLE
SOT235-A-PKG Dimensions
No.
MP005-A-P-SD-1.3
ANGLE
UNIT
mm
ABLIC Inc.
4.0±0.1(10 pitches:40.0±0.2)
ø1.5
ø1.0
+0.1
-0
+0.2
-0
2.0±0.05
0.25±0.1
4.0±0.1
1.4±0.2
3.2±0.2
3 2 1
4
5
Feed direction
No. MP005-A-C-SD-2.1
TITLE
SOT235-A-Carrier Tape
No.
MP005-A-C-SD-2.1
ANGLE
UNIT
mm
ABLIC Inc.
+1.0
- 0.0
9.0
11.4±1.0
Enlarged drawing in the central part
ø13±0.2
(60°)
(60°)
No. MP005-A-R-SD-2.0
TITLE
SOT235-A-Reel
No.
MP005-A-R-SD-2.0
ANGLE
QTY.
UNIT
mm
ABLIC Inc.
3,000
Disclaimers (Handling Precautions)
1.
All the information described herein (product data, specifications, figures, tables, programs, algorithms and
application circuit examples, etc.) is current as of publishing date of this document and is subject to change without
notice.
2.
The circuit examples and the usages described herein are for reference only, and do not guarantee the success of
any specific mass-production design.
ABLIC Inc. is not liable for any losses, damages, claims or demands caused by the reasons other than the products
described herein (hereinafter "the products") or infringement of third-party intellectual property right and any other
right due to the use of the information described herein.
3.
ABLIC Inc. is not liable for any losses, damages, claims or demands caused by the incorrect information described
herein.
4.
Be careful to use the products within their ranges described herein. Pay special attention for use to the absolute
maximum ratings, operation voltage range and electrical characteristics, etc.
ABLIC Inc. is not liable for any losses, damages, claims or demands caused by failures and / or accidents, etc. due to
the use of the products outside their specified ranges.
5.
Before using the products, confirm their applications, and the laws and regulations of the region or country where they
are used and verify suitability, safety and other factors for the intended use.
6.
When exporting the products, comply with the Foreign Exchange and Foreign Trade Act and all other export-related
laws, and follow the required procedures.
7.
The products are strictly prohibited from using, providing or exporting for the purposes of the development of
weapons of mass destruction or military use. ABLIC Inc. is not liable for any losses, damages, claims or demands
caused by any provision or export to the person or entity who intends to develop, manufacture, use or store nuclear,
biological or chemical weapons or missiles, or use any other military purposes.
8.
The products are not designed to be used as part of any device or equipment that may affect the human body, human
life, or assets (such as medical equipment, disaster prevention systems, security systems, combustion control
systems, infrastructure control systems, vehicle equipment, traffic systems, in-vehicle equipment, aviation equipment,
aerospace equipment, and nuclear-related equipment), excluding when specified for in-vehicle use or other uses by
ABLIC, Inc. Do not apply the products to the above listed devices and equipments.
ABLIC Inc. is not liable for any losses, damages, claims or demands caused by unauthorized or unspecified use of
the products.
9.
In general, semiconductor products may fail or malfunction with some probability. The user of the products should
therefore take responsibility to give thorough consideration to safety design including redundancy, fire spread
prevention measures, and malfunction prevention to prevent accidents causing injury or death, fires and social
damage, etc. that may ensue from the products' failure or malfunction.
The entire system in which the products are used must be sufficiently evaluated and judged whether the products are
allowed to apply for the system on customer's own responsibility.
10. The products are not designed to be radiation-proof. The necessary radiation measures should be taken in the
product design by the customer depending on the intended use.
11. The products do not affect human health under normal use. However, they contain chemical substances and heavy
metals and should therefore not be put in the mouth. The fracture surfaces of wafers and chips may be sharp. Be
careful when handling these with the bare hands to prevent injuries, etc.
12. When disposing of the products, comply with the laws and ordinances of the country or region where they are used.
13. The information described herein contains copyright information and know-how of ABLIC Inc. The information
described herein does not convey any license under any intellectual property rights or any other rights belonging to
ABLIC Inc. or a third party. Reproduction or copying of the information from this document or any part of this
document described herein for the purpose of disclosing it to a third-party is strictly prohibited without the express
permission of ABLIC Inc.
14. For more details on the information described herein or any other questions, please contact ABLIC Inc.'s sales
representative.
15. This Disclaimers have been delivered in a text using the Japanese language, which text, despite any translations into
the English language and the Chinese language, shall be controlling.
2.4-2019.07
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