WCM7060FASV-701-LM

Form No: T0000X-1-0000-TBM02-190100664 Specification for Approval Date: 2019/01/18 Customer : 深圳臺慶 WCM7060FASV-SERIES-LM TAI-TECH P/N: CUSTOMER P/N: DESCRIPTION: pcs QUANTITY: REMARK: Customer Approval Feedback ■ 西北臺慶科技股份有限公司 TAI-TECH Advanced Electronics Co., Ltd Headquarter: NO.1 YOU 4TH ROAD, YOUTH INDUSTRIAL DISTRICT, YANG-MEI, TAO-YUAN HSIEN, TAIWAN, R.O.C. TEL: +886-3-4641148 FAX: +886-3-4643565 http://www.tai-tech.com.tw E-mail: sales@tai-tech.com.tw Sales Dep. □ Office: 深圳辦公室 APPROVED CHECKED 陳暐治 曾詩涵 11BC,Building B Fortune Plaza,NO.7002, Shennan Avenue, Futian District Shenzhen TEL: +86- 755-23972371 □ FAX: +86-755-23972340 臺慶精密電子(昆山)有限公司 TAI-TECH ADVANCED ELECTRONICS(KUNSHAN) CO., LTD SHINWHA ROAD, KUNJIA HI-TECH INDUSTRIAL PARK, KUN-SHAN, JIANG-SU, CHINA TEL: +86-512-57619396 FAX: +86-512-57619688 E-mail: sales@tai-tech.cn □ 慶邦電子元器件(泗洪)有限公司 TAIPAQ ELECTRONICS (SIHONG) CO., LTD Sihong development zone Suqian City, Jiangsu , CHINA. TEL: +86-527-88601191 FAX: +86-527-88601190 E-mail: sales@taipaq.cn Sable Chen Angela Tseng R&D Center APPROVED CHECKED DRAWN 楊祥忠 羅敏汎 張展耀 Mike Yang Zack Luo Kevin Chang TA834002 P1 TAI-TECH Wire Wound Power Common Mode Filter WCM7060FASV-SERIES-LM ECN HISTORY LIST REV DATE DESCRIPTION APPROVED CHECKED DRAWN 1.0 18/01/18 新 發 行 楊祥忠 羅敏汎 張展耀 備 註 www.tai-tech.com.tw P2 TAI-TECH Wire Wound Power Common Mode Filter WCM7060FASV-SERIES-LM 1. Features 1. High reliability -Reliability tests comply with AEC-Q200 Halogen 2. Operating temperature-40~+125℃ (Including self - temperature rise) Halogen-free C 2. Dimension Series A(mm) B(mm) C(mm) D(mm) E(mm) F(mm) G(mm) WCM7060 7.0±0.5 6.0±0.5 3.8 max. 3.5 typ. 1.5±0.5 1.5±0.5 1.7±0.5 Unit:mm 2. Part Numbering WCM 7060 A B F A S V C D E F - 701 - LM G H A: Series B: Dimension C: Material Ferrite Core D: Process Asembled E: Type S=Shielded , N=Unshielded F: Category Code V=Vehicle G: Impedance 701=700Ω H: Laser Marking 3. Specification TAI-TECH Part Number Impedance (Ω) DC Resistance (mΩ) max. (1 line) Rated Current (A) max. Rated Volt. (Vdc) max. Insulation Resistance (MΩ) min. min. typ. Test Frequency (MHz) WCM7060FASV-400-LM 40 70 100 5 15 80 10 WCM7060FASV-101-LM 100 140 100 10 9 80 10 WCM7060FASV-301-LM 225 300 100 10 5 80 10 WCM7060FASV-501-LM 400 500 100 10 5 80 10 WCM7060FASV-601-LM WCM7060FASV-701-LM 500 500 700 700 100 100 15 15 4 4 80 80 10 10 WCM7060FASV-102-LM 800 1020 100 17 3 80 10 WCM7060FASV-132-LM 910 1300 100 20 3 80 10 Note: Measurement board data Material : FR4 Board dimensions : 100 X 50 X 1.6t mm Pattern dimensions: 45 X 30 mm (Double side board) Pattern thickness : 50 μm www.tai-tech.com.tw P3 TAI-TECH www.tai-tech.com.tw P4 TAI-TECH 4. Schematic Diagram Insulation Resistance DC Resistance Impedance 5. Materials No. Description Specification a. Upper Plate Ferrite core or same type b. Core Ferrite Core c Wire Enameled Copper d Termination Ag/Ni/Sn e Mark Laser Marking 6. Reliability and Test Condition Item Performance Operating temperature -40~+125℃ (Including self - temperature rise) Storage temperature -40~+125℃ (on board) Test Condition Electrical Performance Test Z(common mode) DCR Agilent-4291A+ Agilent -16197A Refer to standard electrical characteristics list. I.R. Temperature Rise Test Agilent-4338B Agilent4339 Rated Current ≧ 1A ∆T 40℃Max www.tai-tech.com.tw 1.Applied the allowed DC current. 2.Temperature measured by digital surface thermometer P5 TAI-TECH Reliability Test Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Temperature：125±2℃ High Temperature Exposure(Storage) AEC-Q200 Duration ：1000hrs Min. Measured at room temperature after placing for 24±2 hrs Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Condition for 1 cycle Step1：-40±2℃ 30min Min. Temperature Cycling Step2：125±2℃ transition time 1min MAX. Step3：125±2℃ 30min Min. AEC-Q200 Step4：Low temp. transition time 1min MAX. Moisture Resistance Appearance：No damage. Impedance：within±15% of initial value Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Biased Humidity (AEC-Q200) Temperature：85℃±2℃ Duration : 1000hrs Min. Measured at room temperature after placing for24±2hrs Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Temperature：125±2℃ High Temperature Operational Life (AEC-Q200) External Visual Physical Dimension Resistance to Solvents Mechanical Shock Number of cycles： 1000 Measured at room temperature after placing for 24±2 hrs Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles 1.Baked at50℃ for 25hrs, measured at room temperature after placing for 4 hrs. 2.Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25℃ in 2.5hrs. 3.Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25℃ in 2.5hrs,keep at 25℃ for 2hrs then keep at -10℃ for 3hrs 4.Keep at 25℃ 80-100%RH for 15min and vibrate at the frequency of 10 to 55 Hz to 10 Hz, measure at room temperature after placing for 1~2 hrs. Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Humidity ：85±3﹪R.H, Duration ：1000hrs Min. with 100% rated current. Measured at room temperature after placing for24±2hrs Appearance：No damage. Inspect device construction, marking and workmanship. Electrical Test not required. According to the product specification size measurement According to the product specification size measurement Appearance：No damage. Add aqueous wash chemical - OKEM clean or equivalent. Appearance：No damage. Impedance：within±15% of initial value Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Type Peak value Normal (g’s) duration (D) (ms) Wave form Velocity change (Vi)ft/sec SMD 100 6 Half-sine 12.3 Lead 100 6 Half-sine 12.3 shocks in each direction along 3 perpendicular axes. www.tai-tech.com.tw P6 TAI-TECH Item Performance Test Condition IPC/JEDEC J-STD-020DClassification Reflow Profiles Oscillation Frequency: 10～2K～10Hz for 20 minute Equipment： Vibration checker Total Amplitude:1.52mm±10% Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations)。 Test condition ： Vibration Temperature(℃) Time(s) Resistance to Soldering Heat Thermal shock 260±5(soldertemp) 10±1 25mm/s ±6 mm/s 1 Appearance：No damage. Impedance：within±15% of initial value Inductance：within±10% of initial value Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC Q：Shall not exceed the specification value. J-STD-020DClassification Reflow Profiles RDC：within ±15% of initial value and shall not exceed the Condition for 1 cycle specification value Step1：-40±2℃ 15±1min Step2：125±2℃ within 20Sec. (AEC-Q200) ESD Solderability Electrical Characterization Flammability Temperature Number of ramp/immersion heat cycles and emersion rate Step3：125±2℃ 15±1min Number of cycles： 300 Measured at room fempraturc after placing fo24±2hrs Appearance：No damage. a. Method B, 4 hrs @155°C dry heat @235°C±5°C b. Method B @ 215°C±5°C category 3.(8hours ± 15 min) c. Method D category 3. (8hours ± 15 min)@ 260°C±°C More than 95% of the terminal electrode should be covered Preheat: 150℃,60sec. Solder: Sn96.5% Ag3% Cu0. 5% Temperature: 245±5℃。 with solder。 Flux for lead free: Rosin. 9.5%。 Dip time: 4±1sec. Depth: completely cover the termination Refer Specification for Approval Summary to show Min, Max, Mean and Standard deviation . Electrical Test not required. V-0 or V-1 are acceptable. Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Place the 100mm X 40mm board into a fixture similar to the one shown in below Figure with the component facing down. The apparatus shall consist of mechanical means to apply a force which will bend the board (D) x = 2 mm minimum. The duration of the applied forces shall be 60 (+ 5) sec. The force is to be applied only once to the board. Board Flex Appearance：No damage Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020D Classification Reflow Profiles With the component mounted on a PCB with the device to be tested, apply a 17.7 N (1.8 Kg) force to the side of a device being tested. This force shall be applied for 60 +1 seconds. Also the force shall be applied gradually as not to apply a shock to the component being tested. Terminal Strength(SMD) Appearance：No damage www.tai-tech.com.tw P7 TAI-TECH 7. Soldering and Mounting 7-1. Recommended PC Board Pattern WCM7060 L(mm) 8.0 H(mm) 4.5 G1(mm) 3.5 G1 G2(mm) 1.5 L G2 H 7-2. Soldering Mildly activated rosin fluxes are preferred. TAI-TECH terminations are suitable for all wave and re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. 7-2.1 Lead Free Solder re-flow: Recommended temperature profiles for re-flow soldering in Figure 1. 7-2.2 Soldering Iron(Figure 3): Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150℃ ‧350℃ tip temperature (max) ‧Never contact the ceramic with the iron tip ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧1.0mm tip diameter (max) ‧Limit soldering time to 4~5 sec. Reflow Soldering Iron Soldering PRE-HEATING SOLDERING NATURAL COOLING PRE-HEATING 217 60~150s 200 150 60~180s TEMPERATURE(°C) TEMPERATURE(°C) tp(245° C / 20~40s.) SOLDERING within 4~5s TP(260 ℃ / 10s max.) 350 150 Gradual cooling Over 60s 480s max. NATURAL COOLING 25 TIME(sec.) TIME( sec.) Reflow times: 3 times max. Iron Soldering times: 1 times max. Fig.2 Fig.1 www.tai-tech.com.tw P8 TAI-TECH 8. Packaging Information 8-1. Reel Dimension 8-2. Tape Dimension Series W(mm) WCM7060 16.00+0.3/-0.1 Bo(mm) Ao(mm) Ko(mm) P0(mm) P2(mm) F(mm) E(mm) P(mm) 7.50±0.1 6.3±0.1 3.8±0.1 4.0±0.1 2.0±0.1 7.5±0.1 t(mm) 1.75±0.1 12.0±0.1 0.35±0.05 8-3. Packaging Quantity Size Reel WCM7060 1500 8-4. Tearing Off Force F Top cover tape The force for tearing off cover tape is 15 to 80 grams in the arrow direction under the following conditions. 165° to180° Base tape Room Temp. Room Humidity Room atm Tearing Speed (℃) (%) (hPa) mm/min 5~35 45~85 860~1060 300 Application Notice ‧Storage Conditions(component level) To maintain the solderability of terminal electrodes: 1. TAI-TECH products meet IPC/JEDEC J-STD-020D standard-MSL, level 1. 2. Temperature and humidity conditions: Less than 40℃ and 60% RH. 3. Recommended products should be used within 12 months form the time of delivery. 4. The packaging material should be kept where no chlorine or sulfur exists in the air. ‧Transportation 1.Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and mechanical shock are minimized. www.tai-tech.com.tw