GMA3730H11-B38

規 格 承 認 書 PECIFICATION FOR APPROVAL 客 戶 CUSTOMER ： 項 目 ITEM ： 型 號 TYPE ： 描述 DESCRIPTION ： 客戶料號 CUSTOMER NO. ： 規 格 書 號 立创 后进声硅微麦克风（MEMS MIC） GMA3730H11-B38 L3.76 x W3.0xH1.1 mm -38 dB S/N: ≥58 dBA SPECIFICATION NO.： 版 本 EDITION NO. 日 期 DATE ： V1.0 ： 2020-2-26 客戶承認 CUSTOMER CONFIRM AND SIGN 檢查 TESTED BY 審核 CHECKED BY 承認 APPROVED BY 東莞市赢海電子有限公司 DONGUAN INGHAI ELECTRONICS CO.,LTD 製作 ISSUED BY 審查 CHECKED BY 周明 刘承成 確認 APPROVED BY 地址：广东省东莞市长安镇上沙第五工业区新春路 1 号新春科技园 電話 / TEL：0769-83060958 傳真 / FAX： 0769-81608993 網址：HTTP://WWW.INGHAI.COM 1/9 A. GENERAL DESCRIPTION GMA3730H11-B42 is a Silicon Microphone with analog output and bottom inlet for sound input. It is a cost-effective alternative to traditional electret condenser microphone(ECM). Provided on tap-and-reel, it is ideally suited for high volume applications. And it can be processed directly to customer’s PCB using standard automatic pick-and-place equipment and surface mounted via standard solder reflow equipment.. B. ABSOLUTE MAXIMUM RATINGS Supply voltage :VDD to GND…………-0.3V～5V ESD Tolerance The Lid Mode…………………………8kV The I/O Pin Mode…………………….4kV TEMPERATURE CHARACTERISTICS Parameter Conditions Max Unit -40 +85 ℃ Solder on PC board -40 +105 ℃ In Tape and Reel -10 +50 ℃ Operating Temperature Storage Temperature Min Typ C. ACOUSTIC & ELECTRICAL SPECIFICATIONS Unless otherwise specified, test conditions are: Supply voltage VDD = 2.2V Input sound pressure PIN = 94dB SPL@1kHZ Test room temperature Ta = 25℃,Room Humidity = 50% A-weighting filter applied for noise floor measurement PERFORMANCE Parameter Conditions Directivity Min Typ Max Unit Omni-Directional Sensitivity @1KHz (0 dB = 1V/Pa) -41 -38 -35 dB Signal-to-Noise Ratio @1KHz (0 dB = 1V/Pa) 62 Total Harmonic Distortion (THD) @ 100dB SPL @1KHz 0.2 0.5 % Total Harmonic Distortion (THD) @ 115dB SPL @1KHz 0.5 1 % Max Input Sound Pressure @1KHz, THD < 10% 130 Power Supply Rejection (PSR) 217Hz,100m Vpp square wave -84 dB dB SPL -79 dB 2/9 INPUT CHARACTERISTICS Power supply Voltage 1.6 Sensitivity Loss Across Power Supply Voltage Change in sensitivity from 1.6V to 3.6V power supply voltage Total Operation Current 1.6V-3.6V power supply voltage Standby Current 1.6V-3.6V power supply voltage 3.6 No change 160 V dB 200 uA 2 uA 100 pF 200 Ω OUTPUT CHARACTERISTICS LOAD Capacitance Output Impedance @1KHz (0 dB = 1 V/Pa) D. FREQUENCY RESPONSE CURVE . Typical free field frequency response (Normalized to 1 KHz) E.MECHANICAL SPECIFIONS 3/9 ITEM DIMENSION TOLERANCE UNITS LENGTH(L) 3.76 WIDTH(W) 3.00 ±0.10 mm HEIGHT(H) 1.10 ±0.10 mm ACOUSTIC PORT(AP) Φ0.25 ±0.05 mm ±0.10 mm PIN OUTPUT PIN# FUNCTION 1 OUTPUT 2 GROUND 3 GROUND 4 POWER(Vdd) 5 GROUND 6 GROUND Dimensions are in millimetre unless otherwise specified. Tolerance ±0.15mm unless otherwise specified Figure 2. Detailed mechanical drawings F.RECOMMENDED CUSTOMER LANDING PATTERN Recommended landing pattern on customer ‘s PCB 4/9 G. RECOMMENDED INTERFACE CIRCUIT . Recommended interface circuit for customers’ applications H. PACKAGING SPECIFICATIONS D0 1.5±0.1 W 12.0±0.30 D1 1.5±0.1 E 1.75±0.10 A0 4.06±0.10 F 5.50±0.10 P0 4.00±0.10 P1 8.00±0.10 P2 2.00±0.10 B0 K0 T 3.30±0.10 1.35±0.10 0.3±0.05 Notes: (1) Tape & Reel Per EIA-481 standard; (2) Label applied to external package and direct to reel Order Part Number GMA3730H11-B42 Reel Diameter 13” Qty per Reel 5,000 5/9 5,000PCS PRODUCTS/1 reel Figure 6. Reel Specification5,000PCS PRODUCTS/1 reel 6/9 50,000 Pieces of Products per Carton 7/9 I. RECOMMENDED REFLOW PROFILE Profile Feafure Average Ramp-up rate (TSMAX to TP) Preheat Temperature Min (TSMIN) Temperature Max (TSMAX) Time (TSMIN to TSMAX) (tS) Time maintained above: Temperature (TL) Time (tL) Peak Temperature (TP) Time within 5℃ of actual Peak Temperature (tP) Pb-Free 3℃/second max. 150℃ 200℃ 60-180 seconds 217℃ 60-150 seconds 260℃ 20-40 seconds Ramp-down rate(TP to TSMAX) 6℃/second max Time 25℃ to Peak Temperature 8 minutes max Notes: 1. Vacuuming over acoustical hole of the microphone is not allowed, because the device can be damaged by vacuum. 2. To wash the board after reflow process is not allowed, because board washing and Cleaning agents can damage the device. A device should not be exposed to ultrasonic processing or cleaning. 3. Recommended number of reflow is no more than 5 Times. 8/9 N. RELIABILITY SPECIFICATIONS Test item Detail standard Reflow Simulation Refer to Sec.9 for solder reflow profile, total 5 times / Low Temperature Bias Conditions:-40℃ Duration:168 hours while under bias IEC 60068-2-2 Test Aa High Temperature Bias Conditions: 105℃ Duration:168 hours while under bias IEC 60068-2-2 Test Ba Thermal Shock Conditions: 100 cycles of air-air thermal shock from -40 ℃ to 125 ℃ with 15-minute soaks IEC 60068-2-4 Temperature/Humidity Bias Conditions: 85 ℃ /85%RH environment while under bias for 168 hours JESD 22-A101A-B Mechanical Shock Conditions:3 pulses of 10,000g in the X,Y and Z direction JEC 60068-2-27 Test Ea Vibration Test Test axis: X,Y,Z Conditions:2~400Hz 1 oct/min Test time:15mins per axis Use fixture during the testing IEC 60068-2-6 Drop Test Conditions: 1.8-meter height onto a concrete surface each time at three directions in state of packaging IEC 60068-2-32 ESD Conditions： ±8KV direct contact to the lid when unit is grounded，±4KV direct contact to the I/O pins. 10 times IEC 61000-4-2 Note: Immediately after reliability test, the samples shall be stored under climatic conditions such as that normally exists in ordinary rooms or laboratories. Unless otherwise noted , the recovery period shall be 2 hours at least before performance testing. After test condition is performed, the sensitivity of the microphone shall not deviate more than 3dB from its initial value. 9/9