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XC6206P212MR-MS

XC6206P212MR-MS

  • 厂商:

    MSKSEMI(美森科)

  • 封装:

    SOT23-3

  • 描述:

    线性稳压器/LDO SOT23-3 1.8V~5V ±3% 500mA 300mW

  • 数据手册
  • 价格&库存
XC6206P212MR-MS 数据手册
www.msksemi.com XC6206 线性稳压器 Compiance GENERAL DESCRIPTION XC6206 系列是高纹波抑制率、低功耗、低压差,具有过流和短路保护的CMOS降压型电压稳压器。这些 器件具有很低的静态偏置电流(8.0μA Typ.),它们能在输入、输出电压差极小的情况下提供250mA的输出 电流,并且仍能保持良好的调整率。由于输入输出间的电压差很小和静态偏置电流很小,这些器件特别适 用于希望延长电池寿命的电池供电类产品,如计算机、消费类产品和工业设备等。 FEATURES ● 高精度输出电压:±2.5% ● 输出电压:1.8V~5.0V(步长 0.1V) ● 极低的静态偏置电流(Typ.=8.0μA) ● 低的温度调整系数 ● 最高输入电压可达 8V ● 带载能力强:当 Vin=4.3V 且 Vout=3.3V 时,Iout=250mA ● 可以作为调整器和参考电压来使用 ● 输入稳定性好:Typ. 0.03%/V ● 封装形式:SOT89-3、SOT-23 Application ● 电池供电系统 ● 无绳电话设备 ● 无线控制系统 ● 便携/手掌式计算机 ● ● ● ● 便携式消费类设备 便携式仪器 汽车电子设备 电压基准源 PIN CONFIGURATION MR 封装 形式 SOT-23 1 2 3 管脚序号 PR 封装 P1 封装 管脚 形式 形式 定义 SOT89-3 SOT89-3 1 2 VSS 3 1 VOUT 2 3 VIN SOT-23 SOT-89-3 功能说明 芯片接地端 芯片输出端 启动输入端 www.msksemi.com XC6206 Semiconductor Compiance P/N Information XC6206P ① XXX XX MS ② ③ ④ MS MSKSEMI 封装 WG Vout 182 212 252 272 282 302 332 362 系列 型号选择 ① 系列 ② 输出电压(V) XC6206P 1.8 、 2.1 、 2.5 2.7 、 2.8 、 3.0 3.3 、 3.6 、 ③ 封装 PR: SOT-89-3 MR:SOT-23 ④ MS MSKSEMI 最高输入电压 (V) 8 容差 +3% www.msksemi.com XC6206 Semiconductor Compiance 功能框图 Vout Vin Vref Current Limit Vss 极限参数 项目 符号 参数 极限值 单位 Vin 输入电压 9 V Vout 输出电压 Vss-0.3 ~Vout+0.3 V 电流 Iout 输出电流 500 mA 功耗 PD 电压 温度 SOT23 SOT89-3 最大允许功耗 300 500 mW Tw 工作温度 -25~+80 ℃ Tc 存储温度 -40~+125 ℃ Th 焊接温度 260 ℃,10s www.msksemi.com XC6206 Semiconductor 电学特性 (Cin=Cout=10uF,Ta=25 C除特别指定) 特性 符号 输出电压 VOUT(E) 最大输出电流 IOUT (max) Compiance O 跌落压差 条件 IOUT=1mA,VIN= VOUT(T)+1V VIN=VOUT(T)+1V Vdrop 静态电流 ISS 负载稳定度 ∆VOUT 输入稳定度 IOUT =50mA 最小值 典型值 最大值 单位 VOUT(T) *0.98 VOUT(T) VOUT(T)* 1.02 V 100 mA 1.5V≤VOUT(T)≤2.5V 200 280 2.6V≤VOUT(T)≤3.3V 160 240 3.4V≤VOUT(T)≤5.5V 120 200 mV VIN= VOUT(T)+1V 7 μA VIN= VOUT(T)+1V,1mA≤IOUT≤80mA 20 mV ∆VOUT/(∆VIN •VOUT) IOUT =1mA, VOUT(T)+0.5V ≤VIN≤5.5V 0.1 输出电压 温度系数 ∆VOUT/(∆Ta •VOUT) VIN= VOUT(T)+1V,IOUT=10mA -40℃≤Ta≤85℃ ±100 输入电压 VIN 纹波抑制比 PSRR VIN= [VOUT(T)+1]V +1Vp-pAC IOUT =10mA,f=1kHz 40 dB 短路电流 Ishort VIN= VOUT(T)+1.5V ,VOUT=Vss 30 mA 过流保护电流 Ilimt VIN= VOUT(T)+1.5V 380 mA 1.8 -- 0.2 %/V ppm/℃ 8.0 V 注 : 1、 VOUT (T):规定的输出电压。 2、VOUT (E) :有效输出电压 ( 即当 IOUT 保持一定数值,VIN = (VOUT (T)+1.0V)时的输出电压)。 3、IOUT (max):VIN=VOUT(T)+1V,缓慢增加输出电流,当输出电压≤VOUT(E)*95%时的电流值。 4、Vdrop= VIN1 –VOUT (E)s :VIN1=逐渐减小输入电压, 当输出电压降为 VOUT (E)1 的 98%时的输入电压。 VOUT (E)s= VOUT (E)*98% VOUT (E)1=当 VIN= VOUT(T)+1V ,Iout=某一数值时的输出电压值。 测试电路 VIN + V A VOUT VSS CL 10uF + VOUT OPEN VSS CL 10uF 图1 VIN V A 图2 www.msksemi.com XC6206 Semiconductor Compiance 应用电路 1、基本电路 Vout Vin VIN VOUT XC6206 + C1 1uF + C2 1uF GND OMMON COMMON Single Point GND 2、大输出电流正电压型电压调整器 Vin VIN R1 + C1 1uF XC6206 Vout VOUT + GND OMMON C2 1uF COMMON Single Point GND 3、提高输出电压值电路(1) Vout Vin VIN VOUT XC6206 + C1 1uF + GND C2 1uF Vxx R1 Iss R2 OMMON Single Point GND COMMON Vout=Vxx(1+R2/R1)+IssR2 www.msksemi.com XC6206 Semiconductor Compiance 4、提高输出电压电路(2) Vout Vin VIN VOUT XC6206 + C1 1uF + C2 1uF Vxx GND R1 Iss D1 OMMON COMMON Single Point GND Vout=Vxx+VD1 5、恒流调整器 Vout Vin VIN + C1 1uF XC6206 + GND C2 1uF Vxx R1 Iss Iout RL OMMON Single Point GND Iout=Vxx/RA+Iss 6、双输出 Vin VIN Vout XC6206 VOUT + GND + OMMON IC2 Vin Vout C1 XC6206 + 10uF GND C2 10uF R1 C3 10uF VOUT COMMON www.msksemi.com XC6206 Semiconductor Compiance 特性曲线图 1、输出电压--输出电流(负载电流增加时) 2、输出电压和输入电压 3、Dropout 电压和输出电流 4、Dropout 电压和输出电压 5、输出电压和温度 6、纹波抑制 7、瞬态响应 输入过渡响应特性 负载过渡输入响应特性 www.msksemi.com XC6206 Semiconductor Compiance PACKAGE MECHANICAL DATA Symbol A b b1 c D D1 E E1 e e1 L Dimensions In Millimeters Max Min 1.400 1.600 0.320 0.520 0.400 0.580 0.350 0.440 4.400 4.600 1.550 REF. 2.300 2.600 3.940 4.250 1.500 TYP. 3.000 TYP. 0.900 1.200 Dimensions In Inches Min Max 0.055 0.063 0.013 0.020 0.016 0.023 0.014 0.017 0.173 0.181 0.061 REF. 0.091 0.102 0.155 0.167 0.060 TYP. 0.118 TYP. 0.035 0.047 REEL SPECIFICATION P/N PKG QTY XC6206 SOT-89-3 1000 www.msksemi.com XC6206 Semiconductor Compiance PACKAGE MECHANICAL DATA Symbol A A1 A2 b c D E E1 e e1 L L1 θ Dimensions In Millimeters Min Max 0.900 1.150 0.000 0.100 0.900 1.050 0.300 0.500 0.080 0.150 2.800 3.000 1.200 1.400 2.250 2.550 0.950 TYP 1.800 2.000 0.550 REF 0.300 0.500 0° 8° Dimensions In Inches Min Max 0.035 0.045 0.000 0.004 0.035 0.041 0.012 0.020 0.003 0.006 0.110 0.118 0.047 0.055 0.089 0.100 0.037 TYP 0.071 0.079 0.022 REF 0.012 0.020 0° 8° REEL SPECIFICATION P/N PKG QTY XC6206 SOT-23 3000 www.msksemi.com XC6206 Semiconductor Compiance Attention ■ Any and all MSKSEMI Semiconductor products described or contained herein do not have specifications that can handle applications that require extremely high levels of reliability, such as life-support systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your MSKSEMI Semiconductor representative nearest you before using any MSKSEMI Semiconductor products described or contained herein in such applications. ■ MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specificationsof any andall MSKSEMI Semiconductor products described orcontained herein. ■ Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer’sproducts orequipment. ■ MSKSEMI Semiconductor. strives to supply high-quality high-reliability products. However, any and all semiconductor products fail with someprobability. It is possiblethat these probabilistic failures could give rise to accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits anderror prevention circuitsfor safedesign, redundant design, and structural design. ■ In the event that any or all MSKSEMI Semiconductor products(including technical data, services) described or contained herein are controlled under any of applicable local export control laws and regulations, such products must not be exported without obtaining the export license from theauthorities concerned in accordance with the above law. ■ No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written permission of MSKSEMI Semiconductor. ■ Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not guaranteed for volume production. MSKSEMI Semiconductor believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringementsof intellectual property rights or other rightsof third parties. ■ Any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. Whendesigning equipment, referto the "Delivery Specification" for the MSKSEMI Semiconductor productthat you intend to use. www.msksemi.com
XC6206P212MR-MS 价格&库存

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XC6206P212MR-MS
    •  国内价格
    • 20+0.14493
    • 200+0.11645
    • 600+0.10070
    • 3000+0.08739
    • 9000+0.07922
    • 21000+0.07475

    库存:5371