EL304YGD

3.0mm Round Through Hole LED EL304YGD LIGHT EMITTING DIODE SPECIFICATION CUSTOMER NAME: DESCRIPTION: EL304YGD REVISION： V2.2 ISSUE DATE： 2018-07-25 Contains trade secret information which is the property of Ekinglux and shall not be made available to, or copied or used by anyone outside Ekinglux without its written authorization. Copyright © 2017 Ekinglux Optoelectronics Technology Co., Ltd. All rights reserved www.ekingluxs.com Sales@ekingluxs.com 1 3.0mm Round Through Hole LED EL304YGD Features: ●Long operating life ●Low Power Consumption ●Low voltage DC operated ●RoHS Compliant Application: ●Status indicator ●Industrial control panel ●Sensor status indication ●Wearable and portable devices Part Number EL304YGD Dice Material AlGaInP Emitted Color Yellow Green Lens Color Green Diffused Electro-Optical Characteristics(Ta=25℃, @20mA) Parameter Luminous Intensity Radiation Bandwidth Forward Voltage Luminous Flux Dominant Wavelength CIE Coordinates CIE Color Temperature Viewing Angle Reverse Current Symbol IV △λ VF Φ λd x,y Tc 2θ1/2 IR Min. 50 1.90 567 - Typ. 30 2.00 570 60 - Max. 100 2.40 575 10 Unit mcd nm v Lm nm k deg uA Absolute Maximum Ratings(Ta=25℃) Parameter Peak Forward Current(1/10 Duty Cycle, 0.1ms Pulse Width) Forward Current Reverse Voltage Electrostatic Discharge Operating Temperature Range Storage Temperature Range Wave soldering www.ekingluxs.com Symbol IFP IF VR ESD Topr Tstg Tsld Max. Unit 100 mA 30 mA 5 v 2000 v o -30to+85 C o -40to+90 C 260℃for 5secs Sales@ekingluxs.com 2 3.0mm Round Through Hole LED EL304YGD Optical & Electrical Characteristics Relative Intensity vs.Wavelength 100% Relative lntensity(%) Ta=25°c 80% 60% 40% 20% 0% 350 400 450 500 550 600 650 Wavelength (nm) Permissible Forward Current(mA) 50 Forward Current(mA) Ta=25°c 40 30 20 10 1.6 2.0 2.4 2.8 3.2 Forward Voltage(V) 3.6 Relative lntensity vs.Forward Currenr 50 40 30 20 10 0 0 20 40 60 80 100 Ambient Temperature(°c) 1.0 Relative lntensity Relative lntensity 60 1.2 Ta=25°c 1.0 0.8 0.6 0.4 0.2 0 800 Relative lntensity vs.Ambient Temperature 1.2 0 750 Forward Current vs.Ambient Temperature Forward Current vs.Forward Voltage 0 700 0.8 0.6 0.4 0.2 20 40 60 80 Forward Currenr(mA) 0 100 -20° -30° -40° Radiation Pattern -10° 0° 10° Ta=25°c 20 40 60 80 100 Ambient Temperature(°c) 20° 30° 40° 50° -50° -60° 60° -70° 70° 80° -80° -90° 1.0 0 0.5 0 www.ekingluxs.com 0.5 90° 1.0 Sales@ekingluxs.com 3 3.0mm Round Through Hole LED EL304YGD Bin Limits Bin Range Of Luminous Intensity (Unit:mcd) Bin Code L1 L2 L3 Min 50 - Max 100 - Condition IF=20mA Bin Range Of Forward Voltage (Unit:V) Bin Code V1 V2 V3 V4 V5 Min 1.9 2.0 2.1 2.2 2.3 Max 2.0 2.1 2.2 2.3 2.4 Condition IF=20mA Bin Range Of Wavelength (Unit:nm) Bin Code YG1 YG2 YG3 YG4 YG5 Min 567 569 571 573 - Max 569 571 573 575 - Condition IF=20mA Notes: 1.Tolerance of Luminous Intensity ±10% 2.Tolerance of Forward Voltage ±0.1V www.ekingluxs.com Sales@ekingluxs.com 4 3.0mm Round Through Hole LED EL304YGD Reliability Test Items And Conditions Test Items Reference Thermal Shock Test Conditions Time -40℃（30min） 100 -100℃（30min） Cycles -10℃~65℃； 10cycles 0%~90%RH MIL-STD-202G Temperature And Humidity Cyclic High Temperature Storage Low Temperature Storage High Temperature High Humidity Storage High Temperature Life Test JEITA ED-4701 200 203 JEITA ED -4071 200 201 JEITA ED -4071 200 202 JEITA ED -4071 100 103 JESD22-A108D Life Test Resistance to Sodering Heat GB/T 4937,Ⅱ， 2.2&2.3 Criterion 22 0/22 22 0/22 Ta=100℃ 1000H 22 0/22 Ta=-40℃ 1000H 22 0/22 1000H 22 0/22 1000H 22 0/22 1000H 22 0/22 2 times 22 0/22 Ta=60℃； RH=90% Ta=80℃ Ta=25℃ IF=20mA Tsol*=(240±5) ℃10secs JESD22-A108D Quantity Criteria For Judging Damage Test Items Forward Voltage Recerse Current Symbol VF IR Test Conditions IF=IFT VR=5V Luminous Intensity IV IF=IFT Resistance to Soldering Heat - - Criteria For Judging Damage Initial Data±10% IR≤10uA Average IV degradation≤30%；Single LED IV degradation≤50% Meterial without internal cracks,no meterial between stripped,no deaded light www.ekingluxs.com Sales@ekingluxs.com 5 3.0mm Round Through Hole LED EL304YGD Product size (Unit:mm) Notes: 1. All dimensions are in millimeters (inches). 2. Tolerance is ±0.25(0.01") unless otherwise noted. 3. Lead spacing is measured where the leads emerge from the package. www.ekingluxs.com Sales@ekingluxs.com 6 3.0mm Round Through Hole LED EL304YGD LabelStyle Packaging www.ekingluxs.com Sales@ekingluxs.com 7 3.0mm Round Through Hole LED EL304YGD Precautions 1. Lead Forming 1.1 During lead formation, the leads should be bent at a point at least 3mm from the base of the epoxy bulb. 1.2 Lead forming should be done before soldering. 1.3 Avoid stressing the LED package during leads forming. The stress to the base may damage the LED’s characteristics or it may break the LEDs. 1.4 Cut the LED lead frames at room temperature. Cutting the lead frames at high temperatures may cause failure of the LEDs. 1.5 When mounting the LEDs onto a PCB, the PCB holes must be aligned exactly with the lead position of the LED. If the LEDs are mounted with stress at the leads, it causes deterioration of the epoxy resin and this will degrade the LEDs. 2. Storage 2.1 The LEDs should be stored at 30°C or less and 70%RH or less after being shipped from Everlight and the storage life limits are 3 months. If the LEDs are stored for 3 months or more, they can be stored for a year in a sealed container with a nitrogen atmosphere and moisture absorbent material. 2.2 Please avoid rapid transitions in ambient temperature, especially, in high humidity environments where condensation can occur. 3. Soldering 3.1 Careful attention should be paid during soldering. When soldering, leave more then 3mm from solder joint to epoxy bulb, and soldering beyond the base of the tie bar is recommended. 3.2 Recommended soldering conditions: 3.3 Recommended soldering profile www.ekingluxs.com Sales@ekingluxs.com 8 3.0mm Round Through Hole LED EL304YGD 3.4 Avoiding applying any stress to the lead frame while the LEDs are at high temperature particularly when soldering. 3.5 Dip and hand soldering should not be done more than one time 3.6 After soldering the LEDs, the epoxy bulb should be protected from mechanical shock or vibration until the LEDs return to room temperature. 3.7 A rapid-rate process is not recommended for cooling the LEDs down from the peak temperature. 3.8 Although the recommended soldering conditions are specified in the above table, dip or hand soldering at the lowest possible temperature is desirable for the LEDs. 3.9 Wave soldering parameter must be set and maintain according to recommended temperature and dwell time in the solder wave. 4. Cleaning 4.1 When necessary, cleaning should occur only with isopropyl alcohol at room temperature for a duration of no more than one minute. Dry at room temperature before use. 4.2 Do not clean the LEDs by the ultrasonic. When it is absolutely necessary, the influence of ultrasonic cleaning on the LEDs depends on factors such as ultrasonic power and the assembled condition. Ultrasonic cleaning shall be pre-qualified to ensure this will not cause damage to the LED www.ekingluxs.com Sales@ekingluxs.com 9