PMEG4030ER-Q
40 V, 3 A low VF Schottky barrier rectifier
16 November 2022
Product data sheet
1. General description
Planar Schottky barrier rectifier with an integrated guard ring for stress protection, encapsulated in
a SOD123W small and flat lead Surface-Mounted Device (SMD) plastic package.
2. Features and benefits
•
•
•
•
•
•
Average forward current: IF(AV) ≤ 3 A
Reverse voltage: VR ≤ 40 V
Low forward voltage
High power capability due to clip-bond technology
Small and flat lead SMD plastic package
Qualified according to AEC-Q101 and recommended for use in automotive applications
3. Applications
•
•
•
•
•
Low voltage rectification
High efficiency DC-to-DC conversion
Switch Mode Power Supply (SMPS)
Reverse polarity protection
Low power consumption applications
4. Quick reference data
Table 1. Quick reference data
Symbol
Parameter
IF(AV)
average forward
current
Conditions
Min
Typ
Max
Unit
δ = 0.5; f = 20 kHz; square wave; Tamb ≤ [1]
40 °C
-
-
3
A
δ = 0.5; f = 20 kHz; square wave; Tsp ≤
130 °C
-
-
3
A
VR
reverse voltage
Tj = 25 °C
-
-
40
V
VF
forward voltage
IF = 3 A; Tj = 25 °C
-
460
540
mV
IR
reverse current
VR = 40 V; Tj = 25 °C
-
25
100
µA
[1]
Device mounted on a ceramic PCB, Al2O3, standard footprint.
PMEG4030ER-Q
Nexperia
40 V, 3 A low VF Schottky barrier rectifier
5. Pinning information
Table 2. Pinning information
Pin
Symbol
Description
1
K
cathode[1]
2
A
anode
[1]
Simplified outline
1
Graphic symbol
K
2
A
sym001
CFP3 (SOD123W)
The marking bar indicates the cathode.
6. Ordering information
Table 3. Ordering information
Type number
Package
PMEG4030ER-Q
Name
Description
Version
CFP3
plastic, surface mounted package; 2 terminals; 2.6 mm x
1.7 mm x 1 mm body
SOD123W
7. Marking
Table 4. Marking codes
Type number
Marking code
PMEG4030ER-Q
BF
8. Limiting values
Table 5. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VR
reverse voltage
Tj = 25 °C
-
40
V
IF(AV)
average forward current
δ = 0.5; f = 20 kHz; square wave; Tamb ≤
40 °C
-
3
A
δ = 0.5; f = 20 kHz; square wave; Tsp ≤
130 °C
-
3
A
-
50
A
[2]
-
0.57
W
[3]
-
0.95
W
[1]
-
1.8
W
IFSM
non-repetitive peak
forward current
tp = 8.3 ms; half-sine wave; Tj(init) = 25 °C
Ptot
total power dissipation
Tamb ≤ 25 °C
[1]
Tj
junction temperature
-
150
°C
Tamb
ambient temperature
-55
150
°C
Tstg
storage temperature
-65
150
°C
[1]
[2]
[3]
Device mounted on a ceramic PCB, Al2O3, standard footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
2
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm .
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40 V, 3 A low VF Schottky barrier rectifier
9. Thermal characteristics
Table 6. Thermal characteristics
Symbol
Parameter
Rth(j-a)
thermal resistance from in free air
junction to ambient
Rth(j-sp)
[1]
[2]
[3]
[4]
[5]
Conditions
thermal resistance from
junction to solder point
Min
Typ
Max
Unit
[1] [2]
-
-
220
K/W
[1] [3]
-
-
130
K/W
[1] [4]
-
-
70
K/W
[5]
-
-
18
K/W
For Schottky barrier diodes thermal runaway has to be considered, as in some applications the reverse power losses PR are a
significant part of the total power losses.
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
2
Device mountted on an FR4 PCB, single-sided copper, tin-plated, mouting pad for cathode 1 cm .
Device mounted on a ceramic PCB, Al2O3, standard footprint.
Soldering point of cathode tab.
006aab649
103
duty cycle =
Zth(j-a)
(K/W)
1
102
0.5
0.25
0.1
10
0.02
1
0.75
0.33
0.2
0.05
0.01
0
10- 1
10- 3
10- 2
10- 1
1
10
102
tp (s)
103
FR4 PCB, standard footprint
Fig. 1.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
006aab650
103
Zth(j-a)
(K/W)
duty cycle =
102
1
0.5
0.25
10
0.1
0.02
1
0.75
0.33
0.2
0.05
0.01
0
10- 1
10- 3
10- 2
10- 1
FR4 PCB, mounting pad for cathode 1 cm
Fig. 2.
1
10
102
tp (s)
2
103
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
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PMEG4030ER-Q
Nexperia
40 V, 3 A low VF Schottky barrier rectifier
102
006aab651
duty cycle =
1
Zth(j-a)
(K/W)
0.75
0.5
0.33
0.25
0.2
10
0.1
0.05
0.02
0.01
1
0
10- 1
10- 3
10- 2
10- 1
1
102
10
103
tp (s)
Ceramic PCB, Al2O3, standard footprint
Fig. 3.
Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
10. Characteristics
Table 7. Characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VF
IF = 0.1 A; Tj = 25 °C
-
295
330
mV
IF = 1 A; Tj = 25 °C
-
380
440
mV
IF = 3 A; Tj = 25 °C
-
460
540
mV
VR = 10 V; Tj = 25 °C
-
5
-
µA
VR = 40 V; Tj = 25 °C
-
25
100
µA
VR = 1 V; f = 1 MHz; Tj = 25 °C
-
250
-
pF
VR = 10 V; f = 1 MHz; Tj = 25 °C
-
95
-
pF
forward voltage
IR
reverse current
Cd
diode capacitance
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Nexperia
40 V, 3 A low VF Schottky barrier rectifier
006aab652
10
IF
(A)
(1)
1
006aab653
10- 2
IR
(A)
10- 3
(2)
(1)
(2)
10- 4
(3)
10- 1
(4)
(5)
10- 5
(3)
10- 6
10- 2
10- 7
10- 3
10- 4
0.0
0.1
0.2
0.3
0.4
0.5
10- 9
0.6
0.7
VF (V)
(1) Tj = 150 °C
(2) Tj = 125 °C
(3) Tj = 85 °C
(4) Tj = 25 °C
(5) Tj = -40 °C
Fig. 4.
(4)
10- 8
0
10
20
30
VR (V)
40
(1) Tj = 125 °C
(2) Tj = 85 °C
(3) Tj = 25 °C
(4) Tj = -40 °C
Fig. 5.
Forward current as a function of forward
voltage; typical values
006aab654
600
Reverse current as a function of reverse
voltage; typical values
006aab661
2.0
(4)
PF(AV)
(W)
Cd
(pF)
(3)
1.5
400
(2)
(1)
1.0
200
0.5
0
0
10
20
30
VR (V)
0.0
0.0
40
f = 1 MHz; Tamb = 25 °C
Fig. 6.
Fig. 7.
Product data sheet
2.0
3.0
4.0
5.0
IF(AV) (A)
Tj = 150 °C
(1) δ = 0.1
(2) δ = 0.2
(3) δ = 0.5
(4) δ = 1
Diode capacitance as a function of reverse
voltage; typical values
PMEG4030ER-Q
1.0
Average forward power dissipation as a
function of average forward current; typical
values
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PMEG4030ER-Q
Nexperia
40 V, 3 A low VF Schottky barrier rectifier
006aab656
0.7
PR(AV)
(W)
0.6
006aab662
4.5
IF(AV)
(A)
0.5
3.0
0.4
(1)
(1)
(2)
0.3
(3)
1.5
0.2
(2)
(3)
(4)
(4)
0.1
0.0
0
10
20
30
VR (V)
0.0
40
Tj = 125 °C
(1) δ = 1
(2) δ = 0.9
(3) δ = 0.8
(4) δ = 0.5
Fig. 8.
Average reverse power dissipation as a
function of reverse voltage; typical values
006aab663
4.5
IF(AV)
(A)
0
25
75
100
125
150
175
Tamb (°C)
FR4 PCB, standard footprint
Tj = 150 °C
(1) δ = 1; DC
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
Fig. 9.
Average forward current as a function of
ambient temperature; typical values
006aab664
4.5
(1)
IF(AV)
(A)
(1)
50
(2)
3.0
3.0
(2)
(3)
(4)
1.5
0.0
(3)
0
(4)
1.5
25
50
75
100
125
150
175
Tamb (°C)
2
0.0
FR4 PCB, mounting pad for cathode 1 cm
Tj = 150 °C
(1) δ = 1; DC
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
Fig. 10. Average forward current as a function of
ambient temperature; typical values
PMEG4030ER-Q
Product data sheet
0
25
50
75
100
125
150
175
Tamb (°C)
Ceramic PCB, Al2O3, standard footprint
Tj = 150 °C
(1) δ = 1; DC
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
Fig. 11. Average forward current as a function of
ambient temperature; typical values
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40 V, 3 A low VF Schottky barrier rectifier
006aab665
4.5
(1)
IF(AV)
(A)
(2)
3.0
(3)
(4)
1.5
0.0
0
25
50
75
100
125
150
175
Tsp (°C)
Tj = 150 °C
(1) δ = 1; DC
(2) δ = 0.5; f = 20 kHz
(3) δ = 0.2; f = 20 kHz
(4) δ = 0.1; f = 20 kHz
Fig. 12. Average forward current as a function of solder point temperature; typical values
11. Test information
P
tcy
duty cycle δ =
tp
tcy
tp
t
006aac658
Fig. 13. Duty cycle definition
The current ratings for the typical waveforms are calculated according to the equations:
IF(AV) = IM × δ with IM defined as peak current
IRMS = IF(AV) at DC
IRMS = IM × √δ with IRMS defined as RMS current
Quality information
This product has been qualified in accordance with the Automotive Electronics Council (AEC)
standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in
automotive applications.
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Product data sheet
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40 V, 3 A low VF Schottky barrier rectifier
12. Package outline
1.9
1.5
1.1
0.9
1
0.6
0.3
3.7
3.3
2.8
2.4
2
1.05
0.75
0.22
0.10
Dimensions in mm
08-11-06
Fig. 14. Package outline CFP3 (SOD123W)
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Product data sheet
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40 V, 3 A low VF Schottky barrier rectifier
13. Soldering
Footprint information for reflow soldering of CFP3 package
SOD123W
4.4
2.9
2.8
2.1
1.6
1.1
1.2
1.4
1.1
1.2
1.4
recommended stencil thickness: 0.1 mm
occupied area
solder resist
solder land
solder paste
Dimensions in mm
Issue date
17-06-09
20-02-28
sod123w_fr
Fig. 15. Reflow soldering footprint for CFP3 (SOD123W)
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40 V, 3 A low VF Schottky barrier rectifier
Wave soldering footprint information
SOD123W
8.3
4.8
1.8
3.5
2.4
(2×)
2.55
(2×)
3.0 (2×)
3.15 (2×)
occupied area
solder resist
solder lands
dummy track (solder resist and Cu free)
Dimensions in mm
Issue date
17-06-06
17-06-07
sod123w_fw
Fig. 16. Wave soldering footprint for CFP3 (SOD123W)
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40 V, 3 A low VF Schottky barrier rectifier
14. Revision history
Table 8. Revision history
Data sheet ID
Release date
Data sheet status
Change notice
Supersedes
PMEG4030ER-Q v.2
20221116
Product data sheet
-
PMEG4030ER-Q v.1
Modifications:
•
PMEG4030ER-Q v.1
20210719
PMEG4030ER-Q
Product data sheet
Limiting values: Measurement conditions for IFSM changed from square wave to half-sine
wave.
Product data sheet
-
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40 V, 3 A low VF Schottky barrier rectifier
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applications and therefore such inclusion and/or use is at the customer's own
risk.
15. Legal information
Data sheet status
Document status
[1][2]
Product
status [3]
Definition
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Objective [short]
data sheet
Development
This document contains data from
the objective specification for
product development.
Preliminary [short]
data sheet
Qualification
This document contains data from
the preliminary specification.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. Nexperia makes no representation
or warranty that such applications will be suitable for the specified use
without further testing or modification.
Product [short]
data sheet
Production
This document contains the product
specification.
[1]
[2]
[3]
Please consult the most recently issued document before initiating or
completing a design.
The term 'short data sheet' is explained in section "Definitions".
The product status of device(s) described in this document may have
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the internet at https://www.nexperia.com.
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Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
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40 V, 3 A low VF Schottky barrier rectifier
Contents
1. General description...................................................... 1
2. Features and benefits.................................................. 1
3. Applications.................................................................. 1
4. Quick reference data....................................................1
5. Pinning information......................................................2
6. Ordering information....................................................2
7. Marking.......................................................................... 2
8. Limiting values............................................................. 2
9. Thermal characteristics............................................... 3
10. Characteristics............................................................ 4
11. Test information.......................................................... 7
12. Package outline.......................................................... 8
13. Soldering..................................................................... 9
14. Revision history........................................................11
15. Legal information......................................................12
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Nexperia B.V. 2022. All rights reserved
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Date of release: 16 November 2022
PMEG4030ER-Q
Product data sheet
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