BL-HJDGKKC32M-A

BRIGHT LED ELECTRONICS CORP. SINCE 1 9 81 BL-HJDGKKC32M-A ● Features: 1. Emitted Color: Red, Green and Yellow. ●Package Dimensions: 2. Lens Appearance: Water Clear. 3.20 3. 3.5x2.8x1.9mm standard package. 0.80 PIN 1 Mark 1 4 2 3 2.20 2.80 4. Suitable for all SMT assembly methods. 0.70 5. Compatible with infrared and vapor phase reflow solder process. 6. Compatible with automatic placement equipment. 3.50 0.15 7. This product doesn’t contain restriction 4 1.90 Substance, comply ROHS standard. 0.90 1.80 1.70 1.80 1 2 3 R G K Polarity 0.70 ● Applications: 0.90 0.80 1. Automotive lighting. 0.70 2. Backlighting: LCDs, Key padadvertising. 3. Status indicators: Consumer & industrial electronics. 4. General use. NOTES: 1.All dimensions are in millimeters (inches). 2.Tolerance is ±0.10mm (0.004”) unless otherwise specified. 3. Specifications are subject to change without notice. ● Absolute Maximum Ratings(Ta=25℃) Parameter Power Dissipation Symbol PD Color Rating Red 75 Green 120 Yellow 75 Unit mW Forward Current IF 30 mA Peak Forward Current*1 IFP 100 mA Reverse Voltage VR 5 V Operating Temperature Topr -40℃~85℃ - Storage Temperature Tstg -40℃~100℃ - Soldering Temperature Tsol See Page 7 - *1Condition for IFP is pulse of 1/10 duty and 3 msec width. Ver.1.0 Page: 1 of 9 BRIGHT LED ELECTRONICS CORP. SINCE 1 9 81 BL-HJDGKKC32M-A ● Electrical and optical characteristics(Ta=25℃) Parameter Symbol Condition Forward Voltage VF IF=20mA Luminous Intensity Iv IF=20mA Peak Wavelength λp IF=20mA Dominant Wavelength λd IF=20mA Spectral Line Half-width Δλ IF=20mA Reverse Current Viewing Angle IR 2θ1/2 VR=5V IF=20mA Color Min. Typ. Max. Red Green Yellow Red Green Yellow Red Green Yellow Red Green Yellow Red Green Yellow 619 520 586 - 2.0 3.2 2.0 220 1800 300 630 525 590 20 30 30 120 2.5 3.6 2.5 630 530 594 10 - Unit V mcd nm nm nm µA degree ● Typical Electro-Optical Characteristics Curves Fig.1 RELATIVE INTENSITY VS. WAVELENGTH (G) (Y) (R) Fig.2 FORWARD CURRENT VS. AMBIENT TEMPERATURE 1.0 FORWARD CURRENT (mA) 50 0.5 40 30 20 10 0 20 0 400 500 600 40 80 60 100 AMBIENT TEM PERATURE Ta( ⊥ ) 700 W AVELENGTH 竹 (nm) Fig.4 RELATIVE LUMINOUS INTENSITY VS. AMBIENT TEMPERATURE Fig.3 FORWARD CURRENT VS. FORWARD VOLTAGE 50 3.0 (G) 30 20 10 0 1 2 3 4 (NORMALIZED AT 20mA) 2.5 40 RELATIVE LUMINOUS INTENSITY FORWARD CURRENT (mA) (R) (Y) 2.0 1.5 (Y) 0.5 0 -25 5 0 25 50 75 100 A AMBIENT TEM PERATURE Ta( ⊥ ) Fig.6 RADIATION DIAGRAM Fig.5 RELATIVE LUMINOUS INTENSITY VS. FORWARD CURRENT 2.0 (R) (G) 1.0 FORWARD VOLTAGE (V) 0 10 20 (R) 30 (Y) (G) RELATIVE RADIANT INTENSITY RELATIVE LUMINOUS INTENSITY(@20mA) RELATIVE RADIANT INTENSITY 60 1.5 1.0 0.5 40 1.0 0.9 50 0.8 60 70 0.7 80 90 0 10 20 30 40 50 0.5 0.3 0.1 0.2 0.4 0.6 FORW ARD CURRENT (mA) Ver.1.0 Page: 2 of 9 BRIGHT LED ELECTRONICS CORP. SINCE 1 9 81 BL-HJDGKKC32M-A ● Tapping and packaging specifications(Units: mm) 4 1 2 3 R G Y 0.3㊣0.05 ●Package Method:(unit:mm) 12 bag/box 2000 pcs/reel 200 Bar Code Label 245 220 220 Aluminum Foil Bag 185 645 6 box/carton 210 470 Ver.1.0 Page: 3 of 9 BRIGHT LED ELECTRONICS CORP. SINCE 1 9 81 BL-HJDGKKC32M-A ● Bin Limits (At 20mA) I n t e n s i t y B i n L i m i ts (At 20 mA) (JD) COLOR RED ITEM Iv (mcd) λd (nm) Spec 140-475 619-630 BIN MIN MAX R 140 210 S 210 317 T 317 475 MIN MAX 619 630 I n t e n s i t y B i n L i m i ts (At 20 mA) (GK) COLOR ITEM Spec BIN Green Iv (mcd) 715-2400 MIN MAX V5 715 W5 X5 X6 525 525 530 520 525 525 530 520 525 525 530 1600 W6 1600 520 1070 V6 1070 λd (nm) 520-530 MIN MAX 2400 Ver.1.0 Page: 4 of 9 BRIGHT LED ELECTRONICS CORP. SINCE 1 9 81 BL-HJDGKKC32M-A I n t e n s i t y B i n L i m i ts (At 20 mA) (KC) COLOR YELLOW ITEM Iv (mcd) λd (nm) Spec 140-475 586-594 BIN MIN MAX MIN MAX 586 588 588 590 R5 590 592 R6 592 594 S3 586 588 588 590 S5 590 592 S6 592 594 T3 586 588 588 590 T5 590 592 T6 592 594 R3 R4 140 210 S4 210 317 T4 317 ● BIN： x x 475 x YELLOW B I N C O D E GREEN B I N C O D E RED B I N C O D E Notes: 1 . I v ： To l e r a n c e f o r e a c h B i n l i m i t i s ± 1 5 % 2 . λ d ： To l e r a n c e f o r e a c h B i n l i m i t i s ± 1 n m 3 . B i n c a t e g o r i e s a r e e s ta b l i s h e d f o r c l a s s i f i c a t i o n o f p r o d u c ts . P r o d u c ts m a y n o t b e a v a i l a b l e i n a l l b i n c a t e g o r i e s . Ver.1.0 Page: 5 of 9 BRIGHT LED ELECTRONICS CORP. SINCE 1 9 81 BL-HJDGKKC32M-A ● Reliability Test Classification Test Item Reference Standard Operation Life MIL-STD-750:1026 MIL-STD-883:1005 JIS-C-7021 :B-1 High Temperature MIL-STD-202:103B High Humidity JIS-C-7021 :B-11 Endurance Storage Test High MIL-STD-883:1008 Temperature JIS-C-7021 :B-10 Storage Low Temperature JIS-C-7021 :B-12 Storage Temperature MIL-STD-202:107D Cycling MIL-STD-750:1051 MIL-STD-883:1010 JIS-C-7021 :A-4 Thermal Shock MIL-STD-202:107D Environmental MIL-STD-750:1051 Test MIL-STD-883:1011 Solder MIL-STD-202:201A Resistance MIL-STD-750:2031 JIS-C-7021 :A-1 Test Conditions IF=20mA Ta=Under room temperature Test time=1,000hrs Ta=+65℃±5℃ RH=90%-95% Test time=240hrs Result 0/20 0/20 High Ta=+85℃±5℃ Test time=1,000hrs 0/20 Low Ta=-35℃±5℃ Test time=1,000hrs 0/20 -35℃ ~ +25℃ ~ +85℃ ~ +25℃ 60min 20min 60min 20min Test Time=5cycle -35℃±5℃ ~+85℃±5℃ 20min 20min Test Time=10cycle Preheating： 140℃-160℃,within 2 minutes. Operation heating： 260℃(Max.), within 10seconds. (Max.) 0/20 0/20 0/20 ● Judgment criteria of failure for the reliability Measuring items Forward voltage Reverse current Luminous intensity Note: Symbol VF (V) IR (uA) Iv ( mcd ) Measuring conditions IF=20mA VR=5V IF=20mA 1. U means the upper limit of specified characteristics. Judgment criteria for failure Over U1x1.2 Over U1x2 Below S1X0.5 S means initial value. 2. After each test, remove test pieces, wait for 2 hours and test pieces have returned to ambient temperature, then take next measurement. Ver.1.0 Page: 6 of 9 BRIGHT LED ELECTRONICS CORP. SINCE 1 9 81 BL-HJDGKKC32M-A ●IR-Reflow RAMP-UP 3°c/s max Max260°C MAX10S 255°C 245°C TEMPERATURE(°c) 240°C 217°C 200°C 30 sec Max 150°C RAMP-UP 3°c/s max RAMP-DOWN 6°c/s max 60-120S 60-120S TIME(sec) 1、Avoid any external stress applied to the resin while the LEDs are at high temperature, especially during soldering. 2、Avoid rapid cooling or any excess vibration during temperature ramp-down process 3、Although the soldering condition is recommended above, soldering at the lowest possible temperature is feasible for the LEDs ●IRON Soldering 350℃ Within 3 sec, one time only. Ver.1.0 Page: 7 of 9 BRIGHT LED ELECTRONICS CORP. SINCE 1 9 81 BL-HJDGKKC32M-A Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools.(pic.1) 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. (pic.2,pic.3) 3. Do not stack together assembled PCBs, containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. (pic.4) 4. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diameter of the nozzle should be as large as possible. (pic.5) 5. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. (pic.5) 6. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. (pic.5) Pic.1 Pic.2 Pic.3 Pic.4 Pic.5 Ver.1.0 Page: 8 of 9 BRIGHT LED ELECTRONICS CORP. SINCE 1 9 81 BL-HJDGKKC32M-A ● Notes for designing: Care must be taken to provide the current limiting resistor in the circuit so as to drive the LEDs within the rated figures. Also, caution should be taken not to overload LEDs with instantaneous voltage at the turning ON and OFF of the circuit. When using the pulse drive care must be taken to keep the average current within the rated figures. Also, the circuit should be designed so as be subjected to reverse voltage when turning off the LEDs. ● Storage: In order to avoid the absorption of moisture, it is recommended to solder LEDs as soon as possible after unpacking the sealed envelope. If the envelope is still packed, to store it in the environment as following: (1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪ Max. (2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be: a. Completed within 168 hours. b. Stored at less than 30% RH. (3) Devices require baking before mounting, if: 2a or 2b is not met. (4) If baking is required, devices must be baked under below conditions: 48 hours at 60℃±3℃. ● Package and Label of Products: (1) Package: Products are packed in one bag of 2000 pcs (one taping reel) and a label is attached to each bag. (2) Label: BRIGHT LED LOGO Part No. Quantity BIN. Sealing Date XXXXX x xx xx Year Month xx Day Manufacture Location Ver.1.0 Page: 9 of 9