SE03-LP2835S-14100-940

SE03-LP2835S-14100-940 ■ 特点 Features： • 白色 PLCC 封装 White PLCC Package • 适用于 SMT 组装 Suitable for SMT assembly • 峰值波长 940nm Peak wavelength 940 nm • 高效红外光源 IR lightsource with high efficiency ■ 应用 Applications： • 监控摄像机辅助光源 Auxiliary light source for surveillance camera • 红外数据传输 Infrared data transmission • 红外传感器 Infrared sensor ■ 外观及推荐焊盘尺寸 Appearance and Recommended pad size： 2.8 3.5 1 1.9 0.25 Anode(+) 1.86 0.45 Cathode(-) 1.37 2.38 2.98 2.4 1.84 0.91 1.94 1.19 Anode(+) 2.14 推荐焊盘尺寸 Recommended pad size 备注 Note： 1. 所有标注尺寸单位为毫米 All dimensioning units are millimeters。 2. 除特别标注外，所有尺寸允许公差±0.15mm。 All dimensions tolerances are ±0.15mm unless otherwise noted。 1 DATASHEET SE03-LP2835S-14100-940 ■ 极限参数 Absolute maximum rating： 参数名称 Parameter 符号 Symbol 最大额定值 Maximum Rating 单位 Unit 环境温度 Ambient temperature 功耗 Power Dissipation Pd 0.17 W Ta=25°C 正向电流 Forward Current IF ≤100 mA Ta=25°C 反向电压 Reverse voltage VR 5.0 V Ta=25°C 工作温度 Operating Temperature TOPR -30°C~+85°C °C 存储温度 Storage Temperature TSTG -40°C~+100°C °C 回流焊温度 Soldering Temperature TSOL 260°C for 5sec °C ■ 光电特性 Electrical-optical characteristics： 参数名称 Parameter 符号 Symbol 条件 Condition 最小 Min 典型 Typ 最大 Max 单位 Unit 辐射通量 Radiant Flux Φe IF=100mA 33 - 43 mW 视角 Half-value Angle 2θ1/2 - 100 - Deg 光线光谱 Peak Wavelength λp IF=100mA 930 945 960 nm 光谱线半波宽 Half-wave Width Δλ IF=100mA - 35 - nm 正向电压 Forward Voltage VF IF=100mA - 1.45 1.8 V 反向电流 Reverse Current IR VR=5.0V - - 10 μA REV: A 2 Copyright © 2020.09 www.xs-ir.com 2 DATASHEET SE03-LP2835S-14100-940 ■ 电压的分档 Voltage classification： 档位 Stall IF=70mA 最小 MIN 最大 MAX I 1.3V 1.4V II 1.4V 1.5V III 1.5V 1.6V IV 1.6V 1.7V 备注 Note： 1. 以上所示电压测量误差±0.1V。 The above forward voltage measurement allowance tolerance is ±0.1V. 2. 以上所示辐射通量测试误差±10% Tolerance of measurement of total radiant flux:±10%. 3. 以上所示波长测量误差±1nm。 Tolerance of measurement of wavelength:±1nm. 4. θ1/2 是半值角，指发光强度值为轴向强度值一半的方向与发光轴向（法向）的夹角。 θ1/2 is the half angle, which refers to the angle of the luminous intensity value in the direction of half of the axial intensity and the axial (normal) direction of the light emitting. ■ 光学特性曲线 Optical property curve： 配光曲线 Light distribution curve -105° 1.0 0.8 0.6 -120° 120° 105° -90° 0 90° -75° 0.2 75° 0.4 -60° 0.4 60° 0.6 0.8 0.2 -45° 0 -90 -70 REV: A 2 -50 -30 -10 10 30 Copyright © 2020.09 50 70 90 www.xs-ir.com 1.0 -30° -15° 0° 45° 15° 30° 3 DATASHEET SE03-LP2835S-14100-940 ■ 光电特性曲线 Photoelectric characteristic curve： Fig.1-Relative Radiant Flus vs. Forward Current Fig.2-Forward Current vs. Forward Voltage 正向电流 & 正向电压 相对辐射通量 & 正向电流 Fig.3-Relative Intensity (@100mA) vs. Ambient Temperature Fig.4-Forward Voltage (@100mA) vs. Temperature 正向电压 & 环境温度 辐射强度 & 环境温度 Fig.5- Peak Wavelength (@100mA) vs. Ambient Temperature. 峰值波长 & 环境温度 Fig.6- Maximum Driving Forward DC Current vs.Ambient Temperature (Derating based on Tj max=115℃) 最大正向直流电流 & 环境温度 REV: A 2 Copyright © 2020.09 www.xs-ir.com 4 DATASHEET SE03-LP2835S-14100-940 ■ 可靠性试验 Reliability Test Items Conditions 参考标准 测试项目 Reference Test item standard 回流焊 Reflow soldering JESD22-B106 测试条件 时间 数量 接受/拒收 Test condition Time Number Accept / Reject 3 times 22Pcs 0/1 100 Cycles 22Pcs 0/1 Temp:260°C max T=5sec 100°C±5°C 30min. 冷热冲击 JESD22-A104 Thermal Shock ↑↓5min -40°C±5°C 30min. 高温保存 High temperature JESD22-A103 Temp:100°C±5°C 1000Hrs 22Pcs 0/1 JESD22-A119 Temp:-40°C±5°C 1000Hrs 22Pcs 0/1 1000Hrs 22Pcs 0/1 1000Hrs 22Pcs 0/1 1000Hrs 22Pcs 0/1 storage 低温保存 Low temperature storage 常温通电 Ambient JESD22-A108 temperature Ta=25°C±5°C IF=70mA energization 常温加速通电 Ambient temperature JESD22-A108 accelerated Ta=25°C±5°C IF=100mA energization 高温高湿通电 High temperature and high humidity JESD22-A101 85°C±5°C /85％RH IF=70mA energization REV: A 2 Copyright © 2020.09 www.xs-ir.com 5 DATASHEET SE03-LP2835S-14100-940 ■ 失效判定标准 Criteria for Judgment 项目 符号 测试条件 Item Symbol Test condition VF 正向电压 Forward Voltage 反向电流 Reverse Current 辐射通量 Radiant Flux 判定标准 Criterion 最小 MIN 最大 MAX IF=100mA -- U.S.L*）×1.2 IR VR=5V -- U.S.L*）×2.0 Φe IF=100mA L.S.L*）×0.7 -- 备注 Note： 1、USL：标准值上限值，LSL：标准值下限值 USL：Upper Standard Level, LSL: Lower Standard Level 2、数据工作表中所示的技术信息仅限于典型特征和电路实例引用的产品.它既不构成工业特性的保证,也不构成任何许可 的授权。 The technical information shown in the data sheets are limited to the typical characteristics and circuit examples of the referenced products. It does not constitute the warranting of industrial property nor the granting of any license. ■ 焊接指导 Guideline for solidering： 1、使用烙铁焊接 Hand solidering  推荐使用功率低于 20W 的烙铁，焊接时烙铁的温度必须保持在 300℃以下，且每个电极只能进行一 次焊接，每次焊接的持续时间不得超过 3 秒. A soldering iron of less than 20W is recommended to be used in Hand Soldering. Please keep the temperature of the soldering iron under 300℃ while soldering. Each terminal of the LED is to go for less than 3 second and for one time only.  人手焊接过程中的不慎操作易引起 LED 产品的损坏，应当小心谨慎。 Be careful because the damage of the product is often started at the time of the hand soldering. REV: A 2 Copyright © 2020.09 www.xs-ir.com 6 DATASHEET SE03-LP2835S-14100-940 2、回流焊接：Reflow soldering  推荐使用以下无铅回流焊接温度图进行 Use the conditions shown in the under Figure of Pb-Free Reflow Soldering. 300 Above 255℃ 30sec MAX 3℃/sec MAX 255℃ 240℃ 250 tp tL 217℃ 温度（Temperature） 200 Tp(260℃ MAX 5sec MAX) Above 240℃ 60-150sec 150 ts 120sec MAX 6℃/sec MAX 100 5℃/sec MAX 50 25℃ 0 0 50 100 150 200 250 300 时间（Time） 特征 符号 Profile Feature Symbol 平均升温速度（Tsmax 至 Tp） Ramp-up rate to preheat (25℃ to 150℃) 预热：时间（tsmin 至 tsmax） Time ts (Tsmin to Tsmax) Tsmax 升至峰值温度的速度 Ramp-up rate to peak (Tsmax to Tp) 限时维持高温：温度 (TL) Liquidus temperature 限时维持高温：时间 (tL) Time above liquidus temperature 峰值温度 (Tp) Peak temperature 无铅锡膏 Pb-Free(SnAgCu)Assembly Min / ts 60 / TL 单位 Unit Tpy MAX 2 5 ℃/s 100 120 s 2 ℃/s 217 ℃ tL 80 100 s Tp 245 260 ℃/s 20 30 s 3 6 ℃/s 480 s 与实际峰值温度 (Tp) 相差 5℃ 以内的保持时间 Time within 5℃ of the specified peak tP 10 temperature Tp-5℃ 降温速度 Ramp-down rate（Tp to 100℃） 降温时间 Time（25℃ toTp） REV: A 2 Copyright © 2020.09 / / www.xs-ir.com 7 DATASHEET SE03-LP2835S-14100-940 备注 Note： 1、回流焊最多只能进行一次。 Reflow soldering should not be done more than one times. 2、在回流焊接升温过程中，请不要对 LED 施加任何压力。 Stress on the LEDs should be avoided during heating in soldering process。 3、在焊接完成后，待产品温度下降到室温之后，再进行其他处理。 After soldering, do not deal with the product before its temperature drop down to room temperature。 3、清洗：Cleaning  在焊接后推荐使用酒精进行清洗，在温度不高于 30℃的条件下持续 3 分钟，不高于 50℃的条件下持 续 30 秒。使用其他类似溶剂清洗前，请先确认使用的溶剂不会对 LED 的封装和环氧树脂部分造成损 伤。 It is recommended that alcohol be used as a solvent for cleaning after soldering. Cleaning is to go under 30℃ for 3 minutes or 50℃ for 30 seconds. When using other solvents, it should be confirmed beforehand whether the solvents will dissolve the package and the resin or not.  超声波清洗也是有效的方法，一般最大功率不应超过 300W，否则可能对 LED 造成损伤。请根据具体 的情况预先测试清洗条件是否会对 LED 造成损伤。 Ultrasonic cleaning is also an effective way for cleaning. But the influence of Ultrasonic cleaning on LED depends on factors such as ultrasonic power. Generally, the ultrasonic power should not be higher than 300W. Before cleaning, a pre-test should be done to confirm whether any damage to LEDs will occur.  注意：Note 此一般指导原则并不适用于所有 PCB 设计和焊接设备的配置。具体工艺受到诸多因素的影响，请根 据特定的 PCB 设计和焊接设备来确定焊接方案。 This general guideline may not apply to all PCB designs and configurations of all soldering equipment.The technique in practice is influenced by many factors it should be specialized base on the PCB designs and configurations of the soldering equipment. REV: A 2 Copyright © 2020.09 www.xs-ir.com 8 DATASHEET SE03-LP2835S-14100-940 ■ 使用注意事项 Using Guide 1、存储 Storage  本产使用密封防潮抗静电袋包装,并附有干燥剂,未开封的产品保存时间 6 个月。 Moisture proof and anti-electrostatic package with moisture absorbent material is used, Packaged products have six months to save time。  开封前,产品须存放在温度不高于 30℃,湿度不高于 60%RH 的环境中。 Before opening the package, the product should be kept at 30℃ or less and humidity less the60%RH。  密封防静电袋内的湿度卡应在打开袋子后立即查看袋内的湿度指示卡来确定,湿度显示小于或等于 10%时,使用前须进行烘烤.。 Seal anti-electrostatic bag humidity card should immediately check bag humidity indicator card in the open the bag after, Humidity is less than or equal to 10%, Must be baked before use。  开封后,产品必须 12 小时内使用完(建议工作环境温度不高于 30℃,湿度不高于 60%),如未使用完,余料 须存放在温度不高于 30℃,湿度不高于 10%的环境中。 After opening the package, the product should be soldered within 12 hours. If not, please store at 30℃ or less and humidity less than 10%RH. It is recommended that the product be operated at the workshop condition of 30℃ or less and humidity less than 60%RH.  对于尚未焊接的 LED,如果吸湿剂或包装失效,或者产品没有符合以上有效存储条件,烘烤可以起到一定 的性能恢复效果.烘烤条件:75±5℃,持续时间 12H。 If the moisture absorbent material has fade away or the LEDs have exceeded the storage time, baking treatment should be performed based on the following condition : 75±5℃ for 12 hours. REV: A 2 Copyright © 2020.09 www.xs-ir.com 9 DATASHEET SE03-LP2835S-14100-940 2、静电防护 Electrostatic protection 以下操作可降低静电破坏的可能性 The following procedures may decrease the possibility of ESD damage.  将产品和外界之间的摩擦减到最低以避免静电产生. Minimize friction between the product and surroundings to avoid static buildup.  所有的产品设备和测试仪器必须接地. All production machinery and test instruments must be electrically grounded.  操作人员必须配戴静电环. Operators must wear anti-static bracelets.  进入带电设备工作区域时需穿防静电服. Wear anti-static suit when entering work areas with conductive machinery.  所有操作 IC 和 ESD 敏感器件元器件的工作台必须保持低于 150V 的静电保护. All workstations that handle IC and ESD-sensitive components must maintain an electrostatic potential of 150V or less. 3、温度保护 The safe temperature for LEDs working LED 在高温条件下, 衰减会加速,本身应力也会增大, 若长期处于高温环境下, 极容易出现失效. 对于 高密度排列使用的情况,建议在使用过程中灯面温度不超过 55℃, 支架温度不超过 75℃. The high temperature will make the LED ’ s Luminous Intensity deceased radically, if LEDs worked in hot environment for a long time, they will be disabled easily. When LEDs are working in a closed array, we suggest that the LED’s surface temperature should be lower than 55℃ and the leg’s temperature should be lower than 75℃. REV: A 2 Copyright © 2020.09 www.xs-ir.com 10 DATASHEET SE03-LP2835S-14100-940 4、其他事项 Others  直接用手拿取产品不但会污染封装树脂表面，也可能由于静电等因素导致产品性能的改变，过度的压 力也可能直接影响封装内部的管芯和金线，因此请勿对产品施加过度压力，特别当产品处于高温状态 下，例如在回流焊接过程中。 When handling the product, touching the encapsulant with bare hands will not only contaminate its surface, but also affect on its optical characteristics. Excessive force to the encapsulant might result in catastrophic failure of the LEDs due to die breakage or wire deformation. For this reason, please do not put excessive stress on LEDs, especially when the LEDs are heated such as during Reflow Soldering.  LED 的环氧树脂封装部分相当脆弱，请勿用坚硬、尖锐的物体刮、擦封装树脂部分。在用镊子夹取的 时候也应当小心注意。 The epoxy resin of encapsulant is fragile, so please avoid scratch or friction over the epoxy resin surface. While handling the product with tweezers, do not hold by the epoxy resin, be careful.  不可将模组材料堆积在一起，它可能会损坏内部电路。 Do not pile up the module material and it may damage inner circuit.  LED 工作环境及 LED 适配的材料中硫元素及化合物成分不可超过 100PPM，不可用在 PH