S8MCH

S8GCH – S8MCH Taiwan Semiconductor 8A, 400V - 1000V Surface Mount Rectifier FEATURES ● ● ● ● ● ● ● ● KEY PARAMETERS AEC-Q101 qualified Glass passivated chip junction Low forward voltage drop Ideal for automated placement High surge current capability Moisture sensitivity level: level 1, per J-STD-020 RoHS Compliant Halogen-free according to IEC 61249-2-21 PARAMETER VALUE UNIT IF 8 A VRRM 400 - 1000 V IFSM 200 A TJ MAX 150 °C Package DO-214AB (SMC) Configuration Single die APPLICATIONS ● ● ● ● ● DC to DC converter Automotive application Car lighting Snubber General purpose MECHANICAL DATA ● ● ● ● ● ● Case: DO-214AB (SMC) Molding compound meets UL 94V-0 flammability rating Terminal: Matte tin plated leads, solderable per J-STD-002 Meet JESD 201 class 2 whisker test Polarity: Indicated by cathode band Weight: 0.270g (approximately) DO-214AB (SMC) ABSOLUTE MAXIMUM RATINGS (TA = 25°C unless otherwise noted) PARAMETER SYMBOL S8GCH S8JCH S8KCH S8MCH UNIT Marking code on the device S8GC S8JC S8KC S8MC Repetitive peak reverse voltage VRRM 400 600 800 1000 V Reverse voltage, total rms value VR(RMS) 280 420 560 700 V Forward current Surge peak forward current, 8.3ms single half sine-wave superimposed on rated load Surge peak forward current, 1.0ms single half sine-wave superimposed on rated load Junction temperature Storage temperature IF TJ = 25°C TJ = 125°C TJ = 25°C TJ = 125°C 8 A 200 A 170 A 600 A 338 A TJ - 55 to +150 °C TSTG - 55 to +150 °C IFSM IFSM 1 Version: B2210 S8GCH – S8MCH Taiwan Semiconductor THERMAL PERFORMANCE PARAMETER SYMBOL TYP UNIT Junction-to-lead thermal resistance RӨJL 12.5 °C/W Junction-to-ambient thermal resistance RӨJA 44.0 °C/W ELECTRICAL SPECIFICATIONS (TA = 25°C unless otherwise noted) PARAMETER Forward voltage CONDITIONS (1) Reverse current @ rated VR IF = 8A, TJ = 25°C (2) Junction capacitance TJ = 25°C SYMBOL TYP MAX UNIT VF - 0.985 V - 10 µA - 250 µA 48 - pF IR TJ = 125°C 1MHz, VR = 4.0V CJ Notes: 1. Pulse test with PW = 0.3ms 2. Pulse test with PW = 30ms ORDERING INFORMATION ORDERING CODE(1) PACKAGE PACKING S8xCH DO-214AB (SMC) 3,000 / Tape & Reel Notes: 1. “x” defines voltage from 400V(S8GCH) to 1000V(S8MCH) 2 Version: B2210 S8GCH – S8MCH Taiwan Semiconductor CHARACTERISTICS CURVES (TA = 25°C unless otherwise noted) Fig.1 Forward Current Derating Curve Fig.2 Maximum Non-repetitive Forward Surge Current 250 PEAK FORWARD SURGE CURRENT (A) AVERAGE FORWARD CURRENT (A) 10 8 6 4 2 0 0 25 50 75 100 125 8.3ms single half sine wave 200 150 100 50 0 150 1 10 LEAD TEMPERATURE (°C) Fig.4 Typical Forward Characteristics TJ=125°C 1 0.1 TJ=25°C 0.01 10 20 30 40 50 60 70 80 90 10 10 1 PERCENT OF RATED PEAK REVERSE VOLTAGE (%) TJ=125°C TJ=125°C 0.1 TJ=25°C 0.01 TJ=25°C Pulse width 0.001 0.3 0.1 0.3 100 UF1DLW 1 (A) 100 INSTANTANEOUS FORWARD CURRENT (A) INSTANTANEOUS REVERSE CURRENT (μA) Fig.3 Typical Reverse Characteristics 10 100 NUMBER OF CYCLES AT 60 HZ 0.4 0.4 0.5 0.5 0.6 0.6 0.7 0.7 0.8 0.8 0.9 0.9 1 1 1.1 1.1 1.2 FORWARD VOLTAGE (V) 3 Version: B2210 1.2 S8GCH – S8MCH Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS DO-214AB (SMC) 0.13 C A B C H 4 5 7.15 6.60 8.15 7.75 3.20 2.90 0.13 B C A B 6.25 5.55 A 4 5 2.65 1.95 H 2.45 1.90 0.31 0.15 1.60 0.75 6.80 0.20 0.05 C SEATING PLANE 2.00 DETAIL A, ROTATED -90° (SCALE 3:1) 3.60 SUGGESTED PAD LAYOUT CATHODE INDICATOR P/N GYWF NOTES: UNLESS OTHERWISE SPECIFIED 1. ALL DIMENSIONS ARE IN MILLIMETERS. 2. DIMENSIONING AND TOLERANCING PER ASME Y14.5M-1994. MARKING DIAGRAM P/N G YW F = MARKING CODE = GREEN COMPOUND 3. PACKAGE OUTLINE REFERENCE: JEDEC DO-214, VARIATION AB, ISSUE D. 4 MOLDED PLASTIC BODY DIMENSIONS DO NOT INCLUDE MOLD FLASH. 5 MOLDED PLASTIC BODY LATERAL DIMENSIONS TO BE DETERMINED AT DATUM PLANE H. = DATE CODE = FACTORY CODE 6. DWG NO. REF: HQ2SD07-DO214SMC-036 REV A. 4 Version: B2210 S8GCH – S8MCH Taiwan Semiconductor Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Purchasers are solely responsible for the choice, selection, and use of TSC products and TSC assumes no liability for application assistance or the design of Purchasers’ products. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC’s terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. 5 Version: B2210