TAI-TECH
P1
SMD Power Inductor
TMPC0302H-Serise(G)
ECN HISTORY LIST
REV
DATE
DESCRIPTION
APPROVED
CHECKED
DRAWN
1.0
14/05/19
新發行
楊祥忠
詹偉特
徐允珮
備
註
TAI-TECH
P2
SMD Power Inductor
TMPC0302H-Serise(G)
1. Features
1. Carbonyl Powder.
2. Compact design.
3. High current,low DCR,high efficiency.
Halogen
Pb
Halogen-free
Pb-free
4. Very low acoustic noise and very low leakage flux noise.
5. High reliability.
6. 100% Lead(Pb)-Free and RoHS compliant.
2. Applications
Note PC power system,incl. IMVP-6
DC/DC converter .
3. Dimensions
Dr. MOS application
C
A
D
Recommend PC Board Pattern
E
1.0
H
B
L
G
Series
TMPC0302H
A(mm)
3.5±0.2
B(mm)
C(mm)
3.2±0.2
1.8±0.2
D(mm)
0.7±0.2
E(mm)
L(mm)
G(mm)
H(mm)
1.2±0.2
4.1
1.9
1.45
4. Part Numbering
TMPC
0302
H
A
B
C
-
A: Series
B: Dimension
C: Type
D: Inductance
E: Inductance Tolerance
1R0
MG
D
E
BxC
Carbonyl Powder.
1R0=1.00uH
M=±20%,Y=±30%,
印字:黑色,單向印字,1.0 中間打點.
.
5. Specification
Part Number
Inductance
L0 (uH)±20% @ 0 A
I rms (A)
Typ.
I sat (A)
Typ.
DCR(mΩ)
Typ.@25℃
DCR(mΩ)
Max.@25℃
TMPC0302H-R47MG
0.47
7.0
9.0
19.7
23
TMPC0302H-R68MG
0.68
5.5
7.0
25.5
29
TMPC0302H-1R0MG
1.00
4.0
5.0
32
38
TMPC0302H-1R5MG
1.50
3.8
4.0
42
50
TMPC0302H-2R2MG
2.20
3.5
3.7
65
75
TMPC0302H-3R3MG
3.30
3.0
3.5
125
145
TMPC0302H-4R7MG
4.70
2.6
3.0
172
200
TMPC0302H-5R6MG
5.60
2.2
2.6
205
238
TMPC0302H-6R8MG
6.80
1.9
2.2
260
300
TMPC0302H-8R2MG
8.20
1.6
1.9
340
390
TMPC0302H-100MG
10.0
1.4
1.6
366
422
Note:
1. Test frequency : L : 100KHz /1.0V.
2. All test data referenced to 25℃ ambient.
3. Testing Instrument : L/Q: HP4284A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER.
4. Heat Rated Current (Irms) will cause the coil temperature rise approximately Δt of 40℃ (keep 1min.).
5. Saturation Current (Isat) will cause L0
to drop
30% typical. (keep quickly).
6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
7. Special inquiries besides the above common used types can be met on your requirement.
TAI-TECH
P3
6. Material List
NO
Items
1
Core
2
Wire
3
Solder Plating
Materials
Carbonyl Powder.
Polyester Wire or equivalent.
100% Pb free solder
7. Reliability and Test Condition
Item
Performance
Operating temperature
-40~+125℃
Storage temperature and
Humidity range
-40~+125℃(For products in unopened tape package, less than 40℃)
50~60%RH (Product without taping)
Test Condition
Electrical Performance Test
Inductance
Refer to standard electrical characteristics list.
DCR
HP4284A,CH11025,CH3302,CH1320,CH1320S
LCR Meter.
CH16502,Agilent33420A Micro-Ohm Meter.
Saturation Current (Isat)
△L30% typical.
Saturation DC Current (Isat) will cause L0
to drop △L(%)(keep quickly).
Heat Rated Current (Irms)
Approximately △T≦40℃
Heat Rated Current (Irms) will cause the coil temperature
rise △T(℃) without core loss.
1.Applied the allowed DC current(keep 1 min.).
2.Temperature measured by digital surface thermometer
Reliability Test
Temperature:125±2℃.
Duration:500±8hrs.
Measured at room temperature after placing for 2 to 3hrs.
(MIL-STD-202 Method 108)
Temperature:-40±2℃.
Duration:500±8hrs.
Measured at room temperature after placing for 2 to 3hrs.
(JESD22-A119)
Humidity:90~95%.
Temperature:40±2℃.
Duration:500±8hrs.
Measured at room temperature after placing for 2 to 3hrs
(AEC-Q200-REV C)
High Temperature Exposure Test
Low Temperature Life Test
Biased Humidity Test
Thermal shock test
Electric specifications should be satisfied
Condition for 1 cycle
Step1:-40+0 / -2℃
15±1 min.
Step2:Room temperature within ≦0.2 min.
Step3:+125+2 / -0℃ 15±1min.
Number of cycles:300
Measured at room temperature after placing for 2 to 3 hrs.
(AEC-Q200)
Vibration test
Frequency: 10-2000-10Hz for 20 min.
Amplitude: Parts mounted within 2" from any secure point.
Directions and times: X, Y, Z directions for 20 min.
This cycle shall be performed 12 times in each of three
mutually perpendicular directions
(Total 12hours).
(MIL-STD-202 Method 204 D Test condition B)
Reflow test
Pre-heat:150±5℃
Duration:5 minutes
Temperature:260±5℃,20~40 seconds
(IPC/JEDEC J-STD-020C)
Solder test
Terminals should be covered by over 95% solder on visual inspection
After dip into flux,dip into solder
235±5℃,4±1seconds
Flux 、solder for lead free
(ANSI /J-STD-002C Method B)
TAI-TECH
P4
8. Soldering and Mounting
(1) Soldering
Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused
by the difference in coefficients of expansion between solder, chip and substrate. TAIPAQ terminations are suitable for
re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air
soldering tools.
(2) Solder re-flow:
Recommended temperature profiles for re-flow soldering in Figure 1.
(3) Soldering Iron:
Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that
a soldering iron must be employed the following precautions are recommended.
‧Preheat circuit and products to 150℃
‧355℃ tip temperature (max)
‧Never contact the ceramic with the iron tip
‧1.0mm tip diameter (max)
Iron Soldering
Reflow Soldering
SOLDERING
20~40s
TEMPERATURE(°C)
TP(260° C / 40s max.)
217
60~150s
200
150
PRE-HEATING
NATURAL
COOLING
60~180s
SOLDERING
within 4~5s
TEMPERATURE(°C)
PRE-HEATING
‧Use a 20 watt soldering iron with tip diameter of 1.0mm
‧Limit soldering time to 4~5sec.
350
150
Gradual cooling
Over 60s
480s max.
NATURAL
COOLING
25
TIME( sec.)
Reflow times: 3 times max.
Fig.1
TIME(sec.)
Iron Soldering times: 1 times max.
Fig.2
TAI-TECH
P5
9. Packaging Information
(1) Reel Dimension
COVER TAPE
Type
A(mm)
B(mm)
C(mm)
D(mm)
13”x12mm
12.0±0.5
100±2
13.5±0.5
330
C
B
D
2.0±0.5
A
EMBOSSED CARRIER
(2) Tape Dimension
Series Size Bo(mm) Ao(mm) Ko(mm) P(mm) W(mm) F(mm)
TMPC
0302
3.9±0.1
3.6±0.1
2.3±0.1
8.0±0.1
12±0.3
5.5±0.1
t(mm)
0.35±0.05
(3) Packaging Quantity
TMPC
0302
Chip / Reel
3000
Inner box
6000
Carton
24000
(4) Tearing Off Force
F
Top cover tape
The force for tearing off cover tape is 10 to 130 grams in the arrow
direction under the following conditions(referenced
ANSI/EIA-481-C-2003 of 4.11 stadnard).
165° to180°
Base tape
Room Temp.
(℃)
Room Humidity
(%)
Room atm
(hPa)
Tearing Speed
mm/min
5~35
45~85
860~1060
300
Application Notice
‧Storage Conditions
To maintain the solderability of terminal electrodes:
1. TAIPAQ products meet IPC/JEDEC J-STD-020D standard-MSL, level 1.
2. Temperature and humidity conditions: Less than 40℃ and 60% RH.
3. Recommended products should be used within 12 months form the time of delivery.
4. The packaging material should be kept where no chlorine or sulfur exists in the air.
‧Transportation
1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils.
2. The use of tweezers or vacuum pick up is strongly recommended for individual components.
3. Bulk handling should ensure that abrasion and mechanical shock are minimized.
TAI-TECH
P6
10. Typical Performance Curves
1.6
29.6
0.6
30
1.2
22.2
0.4
20
0.8
14.8
0.2
10
0.4
7.4
0.32
20
0.16
10
0
7.2
0
9
1.4
2.4
72
1.6
48
24
0.5
3
0.8
0
0
0
3.2
TMPC0302H-2R2
96
6
4
1.4
10
6.4
20
4.8
15
3.2
10
1.6
0
1.2
1.8
2.4
30
0
0
0.7
2.1
2.8
3.5
TMPC0302H-6R8
6
30
6
30
4
20
4
20
5
2
10
2
10
0
0
0
0
3
0
0.52
1.04
1.56
2.08
2.6
TMPC0302H-100
24
12
12
4.8
16
8
8
2.4
8
4
4
0
0
1.9
20
0
0
0.32
0.64
0.96
DC CURRENT(A)
1.28
1.6
50
0
0
0.44
0.88
1.32
DC CURRENT(A)
7.2
1.52
1.4
40
16
1.14
1.2
8
16
0.76
60
40
32
DC CURRENT(A)
2.4
8
9.6
0.38
90
DC CURRENT(A)
20
0
3.6
0
40
0
150
120
7
DC CURRENT(A)
TMPC0302H-8R2
4.5
10
TEMP. RISE(oC)
INDUCTANCE (uH)
INDUCTANCE (uH)
5.6
TMPC0302H-5R6
DC CURRENT(A)
12
3.6
50
TEMP. RISE(oC)
INDUCTANCE (uH)
INDUCTANCE (uH)
25
0.6
4.2
2.7
4.8
DC CURRENT(A)
TMPC0302H-4R7
0
2.8
1.8
TMPC0302H-3R3
6
120
0
0
DC CURRENT(A)
8
0.9
DC CURRENT(A)
3.2
1
2.4
0
0
7
12
9
1.6
5.6
4
1.5
0.8
4.2
15
TEMP. RISE(oC)
INDUCTANCE (uH)
INDUCTANCE (uH)
2
0
2.8
DC CURRENT(A)
TMPC0302H-1R5
2.5
0
0
0
TEMP. RISE(oC)
INDUCTANCE (uH)
5.4
TEMP. RISE(oC)
INDUCTANCE (uH)
3.6
DC CURRENT(A)
TEMP. RISE(oC)
1.8
TEMP. RISE(oC)
30
1.76
2.2
TEMP. RISE(oC)
0.48
37
TEMP. RISE(oC)
40
40
TEMP. RISE(oC)
INDUCTANCE (uH)
INDUCTANCE (uH)
0.8
0.64
0
TMPC0302H-1R0
2
1
0
TMPC0302H-R68
50
50
TEMP. RISE(oC)
INDUCTANCE (uH)
TMPC0302H-R47
0.8
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