1N5824

1N5823 THRU 1N5825 5.0A Axial Leaded Schottky Barrier Rectifiers - 20V-40V Features • Axial lead type devices for through hole design • Low power loss, high efficiency. • High current capability, low forward voltage drop. • High surge capability. • Guardring for overvoltage protection. • Ultra high-speed switching. • Silicon epitaxial planar chip, metal silicon junction. • Lead-free parts meet environmental standards of Package outline DO-201AD 0.94(24.0) MIN. MIL-STD-19500 /228 .220(5.6) .197(5.0) DIA. Mechanical data .375(9.5) .285(7.2) • Epoxy : UL94-V0 rated flame retardant • Case : Molded plastic, DO-201AD/DO-27 • Lead : Axial leads, solderable per MIL-STD-202, 0.94(24.0) MIN. .051(1.30) Method 208 guranteed .043(1.10) DIA. • Polarity: Color band denotes cathode end • Mounting Position : Any Dimensions in inches and (millimeters) Maximum ratings and Electrical Characteristics (AT Maximum repetitive peak reverse voltage Maximum RMS voltage Maximum DC blocking voltage Maximum average forward rectified current 0.375”(9.5mm) lead length(see fig.1) Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) Maximum instantaneous forward voltage at 5.0A Maximum DC reverse current TA=25 C at rated DC blocking voltage TA=100 C Typical junction capacitance (NOTE 1) Typical thermal resistance (NOTE 2) Operating junction temperature range Storage temperature range T A=25 oC unless otherwise noted) SYMBOLS 1N5823 1N5824 1N5825 VRRM VRMS VDC 20 14 20 30 21 30 40 28 40 UNITS V V V I(AV) 5.0 A IFSM 150.0 A VF 0.55 V IR 0.5 20.0 mA CJ RθJA TJ, TSTG 380 25.0 -55 to +150 -55 to +150 pF C/W C C Note:1.Measured at 1MHz and applied reverse voltage of 4.0V D.C. 2.Thermal resistance from junction to ambient at 0.375”(9.5mm)lead length,P.C.B. mounted www.fuxinsemi.com Page 1 Ver2.1 1N5823 THRU 1N5825 5.0A Axial Leaded Schottky Barrier Rectifiers - 20V-40V Rating and characteristic curves FIG.1-TYPICAL FORWARD CURRENT DERATING CURVE FIG.2-TYPICAL FORWARD 50 5.0 4.0 3.0 2.0 1.0 0 0 20 40 60 80 100 120 140 160 180 200 LEAD TEMPERATURE,(°C) FIG.3-MAXIMUM NON-REPETITIVE FORWARD SURGE CURRENT INSTANTANEOUS FORWARD CURRENT,(A) AVERAGE FORWARD CURRENT,(A) CHARACTERISTICS 6.0 10 1.0 TJ=25 C Pulse Width 300us 1% Duty Cycle 0.1 PEAK FORWARD SURGE CURRENT,(A) 150 .01 120 .1 .3 .5 .7 .9 1.1 1.3 1.5 FORWARD VOLTAGE,(V) 90 8.3ms Single Half TJ=25 C Sine Wave JEDEC method 60 30 FIG.5 - TYPICAL REVERSE 0 1 5 50 10 CHARACTERISTICS 100 10 NUMBER OF CYCLES AT 60Hz TJ=100°C REVERSE LEAKAGE CURRENT, (mA) FIG.4-TYPICAL JUNCTION CAPACITANCE JUNCTION CAPACITANCE,(pF) 1400 1200 1000 800 600 400 1 TJ=75°C 0.1 0.01 TJ=25°C 200 0 0.001 .01 .05 .1 .5 1 5 10 50 100 REVERSE VOLTAGE,(V) www.fuxinsemi.com 0 20 40 60 80 100 PERCENT OF RATED PEAK REVERSE VOLTAGE,(%) Page 2 Ver2.1 1N5823 THRU 1N5825 5.0A Axial Leaded Schottky Barrier Rectifiers - 20V-40V Pinning information Pin Pin1 Pin2 cathode anode Simplified outline 1 Symbol 2 1 2 Marking Type number 1N5823 1N5824 1N5825 Marking code 1N5823 1N5824 1N5825 Example LOGO 1N5824 Marking code www.fuxinsemi.com Page 3 Ver2.1 1N5823 THRU 1N5825 5.0A Axial Leaded Schottky Barrier Rectifiers - 20V-40V Suggested thermal profiles for soldering processes 1.Lead free temperature profile wave-soldering 280 Peak soldering temperature not to exceed 260ºC 260 240 220 Temperature(°C) 200 180 160 140 120 Peak Max well time 5 Max 100 80 Cool Down Max gradient-4ºC/s Suggested gradient - 2ºC/s or less 60 40 20 0 0 Preheat Max gradient 2ºC/s 20 40 60 80 100 120 140 160 180 200 220 240 Time(Sec) www.fuxinsemi.com Page 4 Ver2.1