SFH 4641-T2U

www.osram-os.com Produktdatenblatt | Version 1.1 SFH 4641   SFH 4641 MIDLED ® Narrow beam LED in MIDLED package (940 nm) Applications ——Remote Control, Proximity, Ambient Light Sensing ——Electronic Equipment ——Gesture Recognition Features: ——Package: clear silicone ——Qualifications: The product qualification test plan is based on the guidelines of AEC-Q101-REV-C, Stress Test Qualification for Automotive Grade Discrete Semiconductors. ——ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) ——High Power Infrared LED (35 mW) ——Short switching times ——Narrow half angle (± 10°) ——Taping as Toplooker ——Also available as Sidelooker (SFH4646)  Ordering Information  Type Radiant intensity  1) IF = 70 mA; tp = 20 ms Ie Radiant intensity 1) typ. IF = 70 mA; tp = 20 ms Ie Ordering Code 25 ... 125 mW/sr 55 mW/sr Q65111A5899 SFH 4641-Z 25 ... 200 mW/sr 55 mW/sr Q65110A8098  SFH 4641-T1V 1 Version 1.7 | 2019-01-25 SFH 4641   Maximum Ratings TA = 25 °C Parameter Symbol Operating temperature Top min. max. -40 °C 100 °C Storage temperature Tstg min. max. -40 °C 100 °C Forward current IF max. 70 mA Surge current tp ≤ 25 µs; D = 0  IFSM max. 0.7 A Reverse voltage 2) VR max. 12 V Power consumption Ptot max. 140 mW ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2) VESD max. 2 kV   2 Version 1.7 | 2019-01-25 Values SFH 4641   Characteristics IF = 70 mA; tp = 20 ms; TA = 25 °C Parameter Symbol Peak wavelength λpeak typ. 950 nm Centroid wavelength λcentroid typ. 940 nm Spectral bandwidth at 50% Irel,max ∆λ typ. 42 nm Half angle φ typ. 10 ° Dimensions of active chip area LxW typ. 0.2 x 0.2 mm x mm Rise time (10% / 90%) IF = 70 mA; RL = 50 Ω tr typ. 12 ns Fall time (10% / 90%) IF = 70 mA; RL = 50 Ω tf typ. 12 ns Forward voltage VF typ. max. 1.6 V 2V Forward voltage IF = 500 mA; tp = 100 µs VF typ. max. 2.4 V 3V Reverse current 2) VR = 5 V IR max. typ. 10 µA 0.01 µA Radiant intensity 1) IF = 500 mA; tp = 25 µs Ie typ. 275 mW/sr Total radiant flux 3) Φe typ. 35 mW Temperature coefficient of voltage TCV typ. -1.3 mV / K Temperature coefficient of brightness TCI typ. -0.5 % / K Temperature coefficient of wavelength TCλ typ. 0.3 nm / K Thermal resistance junction solder point real 4) RthJS max. 220 K / W Thermal resistance junction ambient real 5) RthJA max. 380 K / W   3 Version 1.7 | 2019-01-25 Values SFH 4641   Brightness Groups  TA = 25 °C Group Radiant intensity IF = 70 mA; tp = 20 ms min. Ie Radiant intensity IF = 70 mA; tp = 20 ms max. Ie T1 25 mW/sr 40 mW/sr T2 32 mW/sr 50 mW/sr U 40 mW/sr 80 mW/sr V 63 mW/sr 125 mW/sr 100 mW/sr 200 mW/sr AW Only one group in one packing unit (variation lower 2:1). Relative Spectral Emission 6), 7) Ie,rel = f (λ); IF = 70 mA; tp = 20 ms OHF04134 100 I rel %  80 60 40 20 0 800 850 900 950 nm 1025  λ 4 Version 1.7 | 2019-01-25 SFH 4641   Radiation Characteristics 6), 7) Ie,rel = f (φ) 40˚ 30˚ 20˚ 10˚ ϕ 0˚ OHF05593 1.0 50˚ 0.8 60˚ 0.6 70˚ 0.4 80˚ 0.2 0 90˚ 100˚ 1.0 0.8 Forward current 0.6 OHF03828 100 A 5 20˚ 40˚ 60˚ 80˚ 100˚ 120˚ 6), 7) Ie/Ie(70mA) = f (IF); single pulse; tp = 25 µs OHF03827 101 Ie I e (70 mA)  10-1 0˚ Relative Radiant Intensity 6), 7) IF = f (VF); single pulse; tp = 100 µs IF 0.4 100 5 10 -2 5 10-1 10-3 5 5 10-4 0 0.5 1 1.5 2 2.5 V 3  VF 5 Version 1.7 | 2019-01-25 10-2 0 10 5 10 1 5 10 2 mA 10 3 IF SFH 4641   Max. Permissible Forward Current Permissible Pulse Handling Capability IF,max = f (TA); RthJA = 380 K / W  IF = f (tp); duty cycle D = parameter; TA = 25°C IF OHF04057 80 mA IF 70 60 0.7 A 0.6 0.5 50 0.4 40 0.3 30 0.2 20 0 20 40 60 80 100 ˚C 120 TA Permissible Pulse Handling Capability IF = f (tp); duty cycle D = parameter; TA = 85°C IF 0.7 A 0.6 0.5 0.4 0.3 0.2 t D = TP IF T D= 0.005 0.01 0.02 0.05 0.1 0.2 0.3 0.5 1 0.1 10 0 OHF04058 tP OHF04059 t D = TP tP IF  T D= 0.005 0.01 0.02 0.05 0.1 0.2 0.3 0.5 1 0.1 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102  tp 6 Version 1.7 | 2019-01-25 0 -5 10 10-4 10-3 10-2 10-1 100 101 s 102 tp SFH 4641   Dimensional Drawing 8) Further Information 23.0 mg Approximate Weight: Pin Description 1 Anode 2 Cathode   7 Version 1.7 | 2019-01-25 SFH 4641   Recommended Solder Pad 8) Reflow Soldering Profile Product complies to MSL Level 2 acc. to JEDEC J-STD-020E OHA04525 300 ˚C T 250  Tp 245 ˚C 240 ˚C tP 217 ˚C 200 tL 150 tS 100 50 25 ˚C 0 0 50 100 150 200 250 s 300  t 8 Version 1.7 | 2019-01-25 SFH 4641   Profile Feature Symbol Pb-Free (SnAgCu) Assembly Minimum Recommendation Maximum Ramp-up rate to preheat*) 25 °C to 150 °C tS Time tS TSmin to TSmax 60 Ramp-up rate to peak*) TSmax to TP 2 3 100 120 2 3 Unit K/s s K/s Liquidus temperature TL 217 Time above liquidus temperature tL 80 100 s Peak temperature TP 245 260 °C Time within 5 °C of the specified peak temperature TP - 5 K tP 20 30 3 6 Ramp-down rate* TP to 100 °C 10 480 Time 25 °C to TP All temperatures refer to the center of the package, measured on the top of the component * slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range Taping °C 8)   9 Version 1.7 | 2019-01-25 s K/s s SFH 4641   Tape and Reel 9) W1 D0 P0 A N F W E 13.0 ±0.25 P2 Label P1 Direction of unreeling Direction of unreeling W2 Leader: min. 400 mm * Trailer: min. 160 mm * *) Dimensions acc. to IEC 60286-3; EIA 481-D OHAY0324 Reel Dimensions A 180 mm W Nmin 8 + 0.3 / - 0.1   10 Version 1.7 | 2019-01-25 W1 60 W2 max 8.4 + 2 14.4 Pieces per PU 2000 SFH 4641   Barcode-Product-Label (BPL) Dry Packing Process and Materials 8) Moisture-sensitive label or print L E E V l e be sela ). k, H de L If an bl r co ba (R id m ity . H R hu 0% e e /6 tiv ˚C la ared ag ck re fr 30 _ < in pa % k of to 90 rs ea s d ). rs ou or te (p on rs H de , ou iti H an bjec ng ou rs co ˚C 72 si nd H ou 5 te 48 ˚C su es e H co ± 24 6 da e y 40 be oc tim ˚C e or < ith tim ill pr). or ct w O w nt 23 tim e at lo or fa M TO F s al tim at le ˚C at lo at or e. P th F l tic th va lo or ur O F lo s ui on be if: read en w ed l 4 5 F m la ce eq id lo g, n oc l ve vi 5a is in or be 24 de pr ve l 6 Le de , nt whe e te co g: , w e Le ve l ke r ou se da ba ed flo ur e Le ve m % ba e ba al st ur e Le r en re ed e re> 10 oi st e e fo tim ur se al op fo M se oi st ur as k, is or . 33 se is M oi st bed k, lo H an , g ph -0 M oi in an in F R ng ar rbl D M e ba T r po If bl ith % lif ki r C. (if S is p. w ea r ks lf J10 ba to et th va Y ea m rs m _ r w, < he ed 1 ee te Y d, EC iredicat S fte at nt > 1 W Hou D A flody qu In no ire 1. d e ou 4 8 re reity is qu/JE re 2. bo e M tim to es id 2b re C 16 : e a) S tim is IP ic ed loor tim e b) ev Humor or e en F tim lo or D 2a king nc te F op a) lo or 3. b) ba re F lo da e fe l 1 2 F If al re tim ve l 4. se d l 2a ve Le 3 an ve l ag e Le e B ve ur e Le at st ur e Le D oi st ur e M oi st ur M oi st M oi M N E RS s in IV O IT T S C nta N U TIO U coSEND Ais bUagRMEICO T E CThIS S d Barcode label < M RA OS  Humidity indicator Barcode label Please check the HIC immidiately after bag opening. Discard if circles overrun. Avoid metal contact. Do not eat. Comparator check dot WET If wet, examine units, if necessary bake units 15% If wet, examine units, if necessary bake units 10% 5% If wet, parts still adequately dry. change desiccant Humidity Indicator MIL-I-8835 Desiccant AM OSR OHA00539  Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033. 11 Version 1.7 | 2019-01-25 SFH 4641   Schematic Transportation Box 8) Barcode label N O : (Q )Q TY :2 00 0 (9 D ) D /C :0 (X ) Packing Sealing label Length 200 ± 5 mm 195 ± 5 mm   12 Version 1.7 | 2019-01-25 M Y DE -1 +Q -1 R 18 P OHA02044 Dimensions of Transportation Box Width RO UP : M RA OS PR O D 5 14 2 110 0 G 4 01 4 C: D/ (9 D) 20 00 (Q )Q TY : O TC P) (6 T LO (1 T) O D PR D EM Y 18 R -1 : Q + P -1 G R O U P: u L lt S iT Y O T6 P 7 L 6 M 14 4 (G ) E Bi D Bi n1 Bi n2 : Pn3 : Q 1: -1 20 M -2 2 L 0 Te 2a 22 m 3 24 0 p ST Ad 26 0 C R C R ditio 0 C R 07 PA 7 na RT l TE C KV XT AR Muster A o M n O d u p cto to rs R 34 ic N O : O S H 12 G BA TC H (1 T) LO T N O :1 (6 P) 23 em 8 2199 2100 5 14 2 110 0 (X ) O M O PT O M 998 NO : CThISTU SE S 21 2100 BA _ < s ur s ). Ho ururs s de Ho co 72 Ho ur te 48 e Ho 24 6 da 40 be tim e e ˚C or th r pr < ll tim ct ). 23 oo r wi nt tim e at l wi fa r Fl oo tim s at at le ˚C at e. ica l Fl th oo r th va ur nt Fl oo s ui be on if: read w ed l 4 5 Fl la m ide ce eq lo g, oc ve l vi is in en de be 24 de or l 5a6 pr Le ve nt wh e te co , w, g: ve l Le ke r re ou se da ba ed flo ba Le ve tu re m % ba e al e Le r en re e ed re 10 ois stu ur e tim se fo al op se fo > , M oi r se st ur 3 is is ha se M oi st nk be k, oo . 03 rd g M oi in an in Fl RH g, r-p bla DM ba Ca po If bl th % kinr life is (if . ar ST f p. wi 10 ba to et Jel r th va Ye ar ks s m _ < cat m d, C ed 1 Ye ee ur ire Sh te w, te di at nt > 1 W Ho Af flody qu In no ire DE 1. e ou 4 8 re ed re qu JE 2. bo ity is M or tim e e 16 re C/ : es id 2b r a) St tim mor is IP ed oo r tim e vic b) g e r Hu Fl oo en tim De 2a kin nc te Fl oo r a) op 3. b) ba re Fl oo da e fe l 1 Fl If al re tim ve l 2 4. se d l 2a3 Le ve g an ve l e Le Ba te ur e Le ve Le Da oist stur e ur e M oi st ur M oi st M oi H 12 34 . RH 0% /6 ˚C : L e el selab . , H) nk de co (R bla r S S em R ic AM o n O d u p ct to o H rs NO If 23 G E V E ba ity id m hu e e d tiv re ag NO :1 L la re fra ck 30 Nns IVE RS in pa % k of ai IT TO to 90 ea d ntNS < ns UC or TIO te (p d , g itio ND U g coSE an bjec ˚C sin nd O 5 ˚C su es Ais baRE co IC ± y M oc (G ) M u L lt S iT Y O T6 P 7 L 6 E D Muster Bi Bi n1 Bi n2 : P- n3 : Q 1: -1 20 M -2 2 L 0 Te 2a 22 m 3 24 0 p ST Ad 26 0 C R C R0 ditio 0 C R PA 77 na RT l TE CK VA XT R: Barcode label Height 30 ± 5 mm SFH 4641   Notes The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for exposure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoyance, visual impairment, and even accidents, depending on the situation. Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. Therefore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810. For further application related informations please visit www.osram-os.com/appnotes   13 Version 1.7 | 2019-01-25 SFH 4641   Disclaimer Attention please! The information describes the type of component and shall not be considered as assured characteristics. Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances. For information on the types in question please contact our Sales Organization. If printed or downloaded, please find the latest version on the OSRAM OS webside. Packing Please use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred. Product safety devices/applications or medical devices/applications OSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices. In case Buyer – or Customer supplied by Buyer– considers using OSRAM OS components in product safety devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordinate the customer-specific request between OSRAM OS and Buyer and/or Customer.   14 Version 1.7 | 2019-01-25 SFH 4641   Glossary 1) Radiant intensity: Measured at a solid angle of Ω = 0.01 sr 2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse operation is not allowed. 3) Total radiant flux: Measured with integrating sphere. 4) Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g. metal block) 5) Thermal resistance: junction ‐ ambient, mounted on PC‐board (FR4), padsize 16 mm² each 6) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devices, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice. 7) Testing temperature: TA = 25°C 8) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm. 9) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.   15 Version 1.7 | 2019-01-25 SFH 4641   Revision History Version Date Change 1.7 2019-01-25 Applications   16 Version 1.7 | 2019-01-25 SFH 4641     Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved. 17 Version 1.7 | 2019-01-25