www.osram-os.com
Produktdatenblatt | Version 1.1
SFH 4736
SFH 4736
OSLON ® Black
OSLON Black (IR broad band emitter) - 80°
Applications
——Infrared Spectroscopy
Features:
——Package: clear silicone
——Corrosion Robustness Class: 3B
——ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
——Spectral range of emission: (typ) 650 ... 1050 nm
——Radiant intensity (λ = 600 - 1050 nm): typ. 11 mW/sr
——Viewing angle of 80°
——Low thermal resistance (Max. 9 K/W)
Ordering Information
Type
23 mW
Q65112A0833
Preliminary datasheet version
SFH 4736
Ordering Code
Total radiant flux 1)
typ.
IF = 350 mA; λ = 600 nm - 1050 nm; tp = 20 ms
Φe
1 Version 0.0 | 2018-08-27
SFH 4736
Maximum Ratings
TA = 25 °C
Parameter
Symbol
Operating temperature
Top
min.
max.
-40 °C
85 °C
Storage temperature
Tstg
min.
max.
-40 °C
85 °C
Junction temperature
Tj
max.
125 °C
Forward current
IF
max.
500 mA
Surge current
tp ≤ 1 ms; D = 0
IFSM
max.
1A
Reverse current 2)
IR
max.
200 mA
Power consumption
Ptot
max.
1900 mW
ESD withstand voltage
acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
VESD
max.
2 kV
For the forward current and power consumption please see “maximum
permissible forward current” diagram
Preliminary datasheet version
2 Version 0.0 | 2018-08-27
Values
SFH 4736
Characteristics
Preliminary datasheet version
IF = 350 mA; tp = 25 ms; TA = 25 °C
Parameter
Symbol
Half angle
φ
typ.
Forward voltage
VF
typ.
max.
2.95 V
3.5 V
Forward voltage
IF = 500 mA; tp = 100 µs
VF
typ.
max.
3V
3.8 V
Reverse voltage 2)
IR = 20 mA
VR
max.
1.2 V
Reverse voltage (ESD device) 2)
VR ESD
min.
45 V
Radiant intensity
λ = 350 - 600 nm
Ie
typ.
60 mW/sr
Radiant intensity
λ = 600 - 1050 nm
Ie
typ.
11 mW/sr
Radiant intensity
IF = 500 mA; tp = 10 ms; λ = 350 - 600 nm
Ie
typ.
85 mW/sr
Radiant intensity
IF = 500 mA; tp = 10 ms; λ = 600 - 1050 nm
Ie
typ.
14 mW/sr
Total radiant flux 1)
λ = 350 - 600 nm
Φe
typ.
120 mW
Total radiant flux 1)
λ = 600 - 1050 nm
Φe
typ.
23 mW
Total radiant flux 1)
IF = 500 mA; tp = 10 ms; λ = 350 - 600 nm
Φe
typ.
160 mW
Total radiant flux 1)
IF = 500 mA; tp = 10 ms; λ = 600 - 1050 nm
Φe
typ.
29 mW
Spectral flux
λ = 750 nm
Φe,λ
typ.
65 µW/nm
Spectral flux
λ = 850 nm
Φe,λ
typ.
63 µW/nm
Spectral flux
λ = 950 nm
Φe,λ
typ.
60 µW/nm
Thermal resistance junction solder point real 3)
RthJS
max.
9.0 K / W
3 Version 0.0 | 2018-08-27
Values
40 °
SFH 4736
Relative Spectral Emission
4), 5)
Irel = f (λ); IF = 350 mA; tp = 25 ms
Radiation Characteristics
4), 5)
Irel = f (φ)
φ[ ]
-20°
: 90°
-40°
-50°
-60°
-70°
-30°
-10°
0° 10° 20° 30° 40° 50° 60° 70° 80° 90°
1.0
0.9
0.8
0.7
0.6
0.5
0.4
Preliminary datasheet version
0.3
-80°
0.2
0.1
-90°
4 Version 0.0 | 2018-08-27
0.0
SFH 4736
Forward current
Relative Total Radiant Flux
4), 5)
IF = f (VF); single pulse; tp = 100 µs
Φe/Φe(350mA) = f (IF); single pulse; tp = 100 µs
Max. Permissible Forward Current
Permissible Pulse Handling Capability
IF,max = f (TS); RthJS = 9.0 K / W
IF = f (tp); duty cycle D = parameter; TS = 85°C
[ ]
[ ] 0.5
0.4
1.0
0.8
0.3
0.6
0.2
Preliminary datasheet version
4), 5)
0.4
0.1
0.2
0.0
0
20
5 Version 0.0 | 2018-08-27
40
60
80
[ ]
0.0 -5
10 10-4 10-3 0.01 0.1
:D=1
: D = 0,5
: D = 0,2
: D = 0,1
: D = 0,05
: D = 0,02
: D = 0,005
1
10 100
[ ]
SFH 4736
Dimensional Drawing
6)
Approximate Weight:
32.0 mg
Package marking:
Anode
Corrosion test:
Class: 3B
Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter then IEC
60068-2-43)
Preliminary datasheet version
ESD advice:
6 Version 0.0 | 2018-08-27
The device is protected by ESD device which is connected in parallel to the
Chip.
SFH 4736
Recommended Solder Pad
6)
For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere.
Reflow Soldering Profile
Product complies to MSL Level 2 acc. to JEDEC J-STD-020E
OHA04525
300
˚C
T 250
Tp 245 ˚C
240 ˚C
tP
217 ˚C
200
150
tL
tS
Preliminary datasheet version
100
50
25 ˚C
0
0
50
100
150
200
250
s 300
t
7 Version 0.0 | 2018-08-27
SFH 4736
Profile Feature
Symbol
Pb-Free (SnAgCu) Assembly
Minimum
Recommendation Maximum
Ramp-up rate to preheat*)
25 °C to 150 °C
tS
Time tS
TSmin to TSmax
60
Ramp-up rate to peak*)
TSmax to TP
2
3
100
120
2
3
Unit
K/s
s
K/s
Liquidus temperature
TL
217
Time above liquidus temperature
tL
80
100
s
Peak temperature
TP
245
260
°C
Time within 5 °C of the specified peak
temperature TP - 5 K
tP
20
30
3
6
Ramp-down rate*
TP to 100 °C
10
480
Time
25 °C to TP
All temperatures refer to the center of the package, measured on the top of the component
* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range
Taping
°C
6)
Preliminary datasheet version
8 Version 0.0 | 2018-08-27
s
K/s
s
SFH 4736
Tape and Reel
7)
W1
D0
P0
A
N
F
W
E
13.0 ±0.25
P2
Label
P1
Direction of unreeling
Direction of unreeling
W2
Leader: min. 400 mm *
Trailer: min. 160 mm *
*) Dimensions acc. to IEC 60286-3; EIA 481-D
OHAY0324
Reel dimensions [mm]
A
W
Nmin
W1
W2 max
Pieces per PU
180 mm
8 + 0.3 / - 0.1
60
8.4 + 2
14.4
600
Preliminary datasheet version
9 Version 0.0 | 2018-08-27
SFH 4736
Barcode-Product-Label (BPL)
Dry Packing Process and Materials
6)
Moisture-sensitive label or print
Barcode label
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Humidity indicator
Barcode label
Please check the HIC immidiately after
bag opening.
Discard if circles overrun.
Avoid metal contact.
Do not eat.
Comparator
check dot
WET
If wet,
examine units, if necessary
bake units
15%
If wet,
examine units, if necessary
bake units
10%
5%
If wet,
parts still adequately dry.
change desiccant
Humidity Indicator
MIL-I-8835
Desiccant
AM
OSR
Preliminary datasheet version
OHA00539
Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.
10 Version 0.0 | 2018-08-27
SFH 4736
Transportation Packing and Materials
6)
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Barcode label
Packing
Sealing label
Dimensions of transportation box in mm
Width
Length
Height
200 ± 5 mm
195 ± 5 mm
30 ± 5 mm
Preliminary datasheet version
11 Version 0.0 | 2018-08-27
OHA02044
SFH 4736
Notes
The evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of
lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this
data sheet falls into the class moderate risk (exposure time 0.25 s). Under real circumstances (for exposure
time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources
have a high secondary exposure potential due to their blinding effect. When looking at bright light sources
(e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irritation, annoyance, visual impairment, and even accidents, depending on the situation.
Subcomponents of this device contain, in addition to other substances, metal filled materials including silver.
Metal filled materials can be affected by environments that contain traces of aggressive substances. Therefore, we recommend that customers minimize device exposure to aggressive substances during storage,
production, and use. Devices that showed visible discoloration when tested using the described tests above
did show no performance deviations within failure limits during the stated test duration. Respective failure
limits are described in the IEC60810.Subcomponents of this device contain, in addition to other substances,
metal filled materials including silver. Metal filled materials can be affected by environments that contain
traces of aggressive substances. Therefore, we recommend that customers minimize device exposure to
aggressive substances during storage, production, and use. Devices that showed visible discoloration when
tested using the described tests above did show no performance deviations within failure limits during the
stated test duration. Respective failure limits are described in the IEC60810.
For further application related informations please visit www.osram-os.com/appnotes
Preliminary datasheet version
12 Version 0.0 | 2018-08-27
SFH 4736
Disclaimer
OSRAM OS assumes no liability whatsoever for any use of this document or its content by recipient including, but not limited to, for any design in activities based on this preliminary draft version. OSRAM OS may
e.g. decide at its sole discretion to stop developing and/or finalising the underlying design at any time.
Disclaimer
Language english will prevail in case of any discrepancies or deviations between the two language wordings.
Attention please!
The information describes the type of component and shall not be considered as assured characteristics.
Terms of delivery and rights to change design reserved. Due to technical requirements components may
contain dangerous substances.
For information on the types in question please contact our Sales Organization.
If printed or downloaded, please find the latest version in the OSRAM OS Webside.
Packing
Please use the recycling operators known to you. We can also help you – get in touch with your nearest
sales office.
By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For
packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to
invoice you for any costs incurred.
Product safety devices/applications or medical devices/applications
OSRAM OS components are not developed, constructed or tested for the application as safety relevant
component or for the application in medical devices.
In case Buyer – or Customer supplied by Buyer– considers using OSRAM OS components in product safety
devices/applications or medical devices/applications, Buyer and/or Customer has to inform the local sales
partner of OSRAM OS immediately and OSRAM OS and Buyer and /or Customer will analyze and coordinate the customer-specific request between OSRAM OS and Buyer and/or Customer.
Preliminary datasheet version
13 Version 0.0 | 2018-08-27
SFH 4736
Glossary
1)
Total radiant flux: Measured with integrating sphere.
2)
Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse operation is not allowed.
3)
Thermal resistance: junction - soldering point, of the device only, mounted on an ideal heatsink (e.g.
metal block)
4)
Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devices, the typical data or calculated correlations of technical parameters can only reflect statistical figures.
These do not necessarily correspond to the actual parameters of each single product, which could differ from the typical data and calculated correlations or the typical characteristic line. If requested, e.g.
because of technical improvements, these typ. data will be changed without any further notice.
5)
Testing temperature: TA = 25°C
6)
Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and
dimensions are specified in mm.
7)
Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.
Preliminary datasheet version
14 Version 0.0 | 2018-08-27
SFH 4736
Preliminary datasheet version
Published by OSRAM Opto Semiconductors GmbH
Leibnizstraße 4, D-93055 Regensburg
www.osram-os.com © All Rights Reserved.
15 Version 0.0 | 2018-08-27