6223E-UUD

PRODUCT SPECIFICATION 6223E-UUD Wi-Fi Single-band 1x1 + Bluetooth 2.1+ EDR / Bluetooth3.0/3.0+HS/4.2 Combo Module Version:v3.5 FN-LINK TECHNOLOGY LIMITED 1 6223E-UUD Module Datasheet Part NO. FG6223EUUD-W4 Ordering Information FG6223EUUD-W5 FG6223EUUD-L4 Description RTL8723DU, b/g/n, Wi-Fi+BLE4.2, 1T1R, 12.2X13mm, USB Single antenna, PCB version V3.0 RTL8723DU, b/g/n, Wi-Fi+BLE4.2, 1T1R, 12.2X13mm, USB, Dual antenna, PCB version V3.0 RTL8723DU b/g/n,Wi-Fi+BLE4.2,1T1R,12.2X13mm, USB+PCM, (无 USB 落地电容),Single antenna Customer: Customer P/N: Signature: Date: Office: 14th floor, Block B, phoenix zhigu, Xixiang Street, Baoan District, Shenzhen Factory: NO.8, Litong RD., Liuyang Economic & Technical Development Zone, Changsha, CHINA TEL:+86-755-2955-8186 FN-LINK TECHNOLOGY LIMITED Website:www.fn-link.com 2 6223E-UUD CONTENTS 1. General Description .................................................................................................. 5 1.1 Introduction ............................................................................................................ 5 1.2 Description .............................................................................................................5 2. Features ..................................................................................................................... 6 3. Block Diagram ........................................................................................................... 6 4. General Specification ................................................................................................7 4.1 WI-FI Specification .................................................................................................7 4.2 Bluetooth Specification .......................................................................................... 8 5. ID setting information ............................................................................................... 9 6. Pin Definition ............................................................................................................. 9 6.1 Pin Outline ............................................................................................................. 9 6.2 Pin Definition details ............................................................................................ 10 7. Electrical Specifications ......................................................................................... 11 7.1 Power Supply DC Characteristics ........................................................................ 11 7.2 Power Consumption .............................................................................................11 7.3 Interface Circuit time series ................................................................................. 12 7.3.1 module power-on&off time sequence ......................................................................12 7.3.2 Timing information .................................................................................................. 13 8. Size reference .......................................................................................................... 14 8.1 Module Picture .....................................................................................................14 8.2 Physical Dimensions ............................................................................................15 8.3 Layout Recommendation ..................................................................................... 16 9. The Key Material List ...............................................................................................16 10. Reference Design .................................................................................................. 17 11. Recommended Reflow Profile ..............................................................................18 12. RoHS compliance .................................................................................................. 18 13. Package ..................................................................................................................19 13.1 Reel ................................................................................................................... 19 13.2 Carrier Tape Detail .............................................................................................19 13.3 Packaging Detail ................................................................................................ 20 14. Moisture sensitivity ............................................................................................... 21 FN-LINK TECHNOLOGY LIMITED 3 6223E-UUD Revision History Version Date Contents of Revision Change Draft Checked Approved V1.0 2019/11/01 New version LXY LXY SZS V1.1 2020/02/14 Add description for pin9 Lxy Lxy Szs V1.2 2020/04/08 Refine Section 5.1, 7 and 8 for PCB V3.0. Lsp Lsp Szs V1.3 2020/05/13 Refine section 2 OS support part. Lsp Lsp Szs Lgp Lgp Szs Update reference design V2.0 2020/12/02 Update package information Update key material list V3.0 2021/03/06 Update package information Lgp Lgp Szs V3.1 2021/07/28 Update PCB Au information LXY LXY QJP V3.2 2021/08/31 Update package quanlity to 1500 LXY LXY QJP FC LXY QJP 1.Update the specification format 2.Up and down electricity time series supplement V3.3 2022/02/07 3.The RF index was changed to ±2dbm 4.W4&W5 merge into a module datasheet 5.Update power supply DC Characteristics and power consumption V3.4 2022/05/17 Update packaging information FC LXY QJP V3.5 2022/06/02 Add -L4 version and module diagram FC LXY QJP FN-LINK TECHNOLOGY LIMITED 4 6223E-UUD 1. General Description 1.1 Introduction 6223E-UUD is a small size and low profile of Wi-Fi + BT Combo module, board size is 12.2mm*13mm . It can be easily manufactured on SMT process and highly suitable for tablet PC, ultra book, mobile device and consumer products. It provides USB interface for Wi-Fi and Bluetooth. The module provides simple legacy and 20MHz/40MHz co-existence mechanisms to ensure backward and network compatibility and Bluetooth can support BT2.1+EDR/BT3.0 and BT4.2. 6223E-UUD uses highly integrated Wi-Fi/BT single chip based on advanced COMS process. 6223E-UUD integrates whole Wi-Fi/BT function blocks into a chip, such as USB, MAC, BB, AFE, RFE, PA, EEPROM and LDO/SWR, except fewer passive components remained on PCB. This compact module is a total solution for a combination of Wi-Fi + BT technologies. The module is specifically developed for Smart phones and Portable devices. 1.2 Description Model Name 6223E-UUD Product Description Support Wi-Fi/Bluetooth functionalities Dimension L x W x H: 12.2 x 13 x1.8 (typical) mm Wi-Fi Interface Support USB2.0 BT Interface Support USB2.0 OS supported Android /Linux/ Win CE /iOS /XP/WIN7/WIN10 Operating temperature 0°C to 70°C Storage temperature -55°C to 85°C FN-LINK TECHNOLOGY LIMITED 5 6223E-UUD 2. Features General Features Operate at ISM frequency bands (2.4GHz) IEEE standards support: IEEE 802.11b, IEEE 802.11g, IEEE 802.11n, IEEE 802.11d, IEEE 802.11e, IEEE 802.11h, IEEE 802.11i  Enterprise level security which can apply WPA/WPA2 certification for Wi-Fi Wi-Fi 1 transmitter and 1 receiver allow data rates supporting up to 150 Mbps downstream and 150 Mbps upstream PHY rates WLAN Interface USB for Wi-Fi and Bluetooth Bluetooth Features Fully Qualified for Bluetooth 2.1+EDR specification including both 2Mbps and 3Mbps modulation mode Fully qualified for Bluetooth 3.0 Fully qualified for Bluetooth 4.2 Dual mode Full–speed Bluetooth operation with Piconet and Scatternet support 3. Block Diagram Single antenna: FN-LINK TECHNOLOGY LIMITED 6 6223E-UUD Dual antenna: 4. General Specification 4.1 WI-FI Specification Feature Description WLAN Standard IEEE 802.11 b/g/n Wi-Fi compliant Frequency Range 2.400 GHz ~ 2.4835 GHz (2.4 GHz ISM Band) Number of Channels 2.4GHz：Ch1 ~ Ch14 Test Items Typical Value EVM 802.11b /11Mbps : 16dBm ± 2 dB EVM  -10dB 802.11g /54Mbps : 14dBm ± 2 dB EVM  -25dB 802.11n /MCS7 EVM  -28dB Output Power : 13dBm ± 2 dB Spectrum Mask Meet with IEEE standard Freq. Tolerance ±20ppm Test Items TYP Test Value SISO Receive Sensitivity (11b,20MHz) @8% PER SISO Receive Sensitivity (11g,20MHz) @10% PER Standard Value - 1Mbps PER @ -91 dBm ≤-83 - 2Mbps PER @ -89 dBm ≤-80 - 5.5Mbps PER @ -87 dBm ≤-79 - 11Mbps PER @ -85 dBm ≤-76 - 6Mbps PER @ -87 dBm ≤-85 - 9Mbps PER @ -86 dBm ≤-84 FN-LINK TECHNOLOGY LIMITED 7 6223E-UUD SISO Receive Sensitivity (11n,20MHz) @10% PER SISO Receive Sensitivity (11n,40MHz) @10% PER Maximum Input Level - 12Mbps PER @ -84 dBm ≤-82 - 18Mbps PER @ -82 dBm ≤-80 - 24Mbps PER @ -79 dBm ≤-77 - 36Mbps PER @ -75 dBm ≤-73 - 48Mbps PER @ -71 dBm ≤-69 - 54Mbps PER @ -70 dBm ≤-68 - MCS=0 PER @ -87 dBm ≤-85 - MCS=1 PER @ -84 dBm ≤-82 - MCS=2 PER @ -82 dBm ≤-80 - MCS=3 PER @ -79 dBm ≤-77 - MCS=4 PER @ -75 dBm ≤-73 - MCS=5 PER @ -71 dBm ≤-69 - MCS=6 PER @ -70 dBm ≤-68 - MCS=7 PER @ -69 dBm ≤-67 - MCS=0, PER @ -84 dBm ≤-82 - MCS=1, PER @ -81 dBm ≤-79 - MCS=2, PER @ -79 dBm ≤-77 - MCS=3, PER @ -76 dBm ≤-74 - MCS=4, PER @ -72 dBm ≤-70 - MCS=5, PER @ -68 dBm ≤-66 - MCS=6, PER @ -67 dBm ≤-65 - MCS=7, PER @ -66 dBm ≤-64 802.11b : ≥ -8 dBm 802.11g/n : ≥-20 dBm 4.2 Bluetooth Specification Feature Description General Specification Bluetooth Standard Bluetooth V2.1+EDR/BT v3.0/BT v3.0+HS/BT v4.2 Host Interface USB Frequency Band 2402 MHz ~ 2480 MHz Number of Channels 79 channels Modulation GFSK, π/4-DQPSK, 8-DPSK FN-LINK TECHNOLOGY LIMITED 8 6223E-UUD RF Specification Output Power (Class 1) Min(dBm) Typical(dBm) Max(dBm) 2 5 8 Sensitivity @ BER=0.1% -89 for GFSK (1Mbps) Sensitivity @ BER=0.01% -86 for π/4-DQPSK (2Mbps) Sensitivity @ BER=0.01% -83 for 8DPSK (3Mbps) 5. ID setting information WI-FI Vendor ID 0BDAh Product ID D723h 6. Pin Definition 6.1 Pin Outline < TOP VIEW > Single antenna: FN-LINK TECHNOLOGY LIMITED 9 6223E-UUD Dual antenna: 6.2 Pin Definition details NO. Name Type Description 1 GND － Ground connections 2 ANT 0 I/O RF I/O 3 ANT1/NC I/O 4 GND － 5 BT_PCM_IN I/O 6 BT_PCM_OUT I/O 7 BT_PCM_SYNC I/O 8 BT_PCM_CLK I/O Voltage Dual antenna:RF I/O Single antenna:Floating (NC) Ground connections BT_PCM_IN. If not used please NC, Don’t connected to ground. BT_PCM_OUT. If not used please NC, Don’t connected to ground. BT_PCM_SYNC. If not used please NC, Don’t connected to ground. BT_PCM_CLK. If not used please NC, Don’t connected to ground. 3.3V 3.3V 3.3V 3.3V Bluetooth device wake up host 9 BT_WAKE_HOST O IC pin GPIO14, pull high boot to test mode. pull low 3.3V boot to normal mode. be careful to using this pin. 10 HOST_WAKE_BT FN-LINK TECHNOLOGY LIMITED I Host wake up Bluetooth device IC pin GPIO13 10 3.3V 6223E-UUD 11 VDD33 － Main power voltage source input 3.3V 12 USB_DM I/O USB2.0 differential pair for WLAN And Bluetooth 13 USB_DP I/O USB2.0 differential pair for WLAN And Bluetooth 14 GND － Ground connections P:POWER I:INPUT 3.3V O:OUTPUT 7. Electrical Specifications 7.1 Power Supply DC Characteristics MIN TYP MAX 0 25 70 VCC33 3.0 3.3 3.6 V VDDIO 1.62 1.8 or 3.3 3.6 V Operating Temperature Unit deg.C 7.2 Power Consumption VCC33 = 3.3V(Unit:mA) Wi-Fi on Mode TX Power Consumption (2.4G HT40) RX (2.4G HT40) BT on FN-LINK TECHNOLOGY LIMITED 11 68 110 107 8.5 6223E-UUD 7.3 Interface Circuit time series 7.3.1 module power-on&off time sequence 1.上下电时序请满足表格要求； The power up ramp and power down ramp must meet the following table. 2.上下电过程如有较长时间中间电压停留都会有几率导致 efuse 被窜写； If climbing process for a long time during power-on and power-off , It may cause efuse to be overwritten. 3.建议主芯片上电完成后，再给模组上电； it is recommended to power on the module after platform side. 4.如有下图所示异常上下电时序，务必做相应调整符合时序规格； If power on/off timing as below shown, must modify to meet the timing specification. FN-LINK TECHNOLOGY LIMITED 12 6223E-UUD 7.3.2 Timing information FN-LINK TECHNOLOGY LIMITED 13 6223E-UUD 8. Size reference 8.1 Module Picture L x W : 13 x 12.2 (+0.3/-0.1) mm FG6223EUUD-L4: H: 1.8 (±0.2) mm Weight FN-LINK TECHNOLOGY LIMITED 0.51g 14 6223E-UUD 8.2 Physical Dimensions FN-LINK TECHNOLOGY LIMITED 15 6223E-UUD 8.3 Layout Recommendation 9. The Key Material List Item Part Name Description 1 Crystal 2520 40MHz 15pF 10ppm ECEC, TKD, Hosonic, JWT, TXC 2 Chipset RTL8723DU-CG Realtek 3 PCB 6223E-UUD-V3.0 XY-PCB, GDKX, Sunlord, SLPCB FN-LINK TECHNOLOGY LIMITED 16 Manufacturer 6223E-UUD 10. Reference Design Single antenna: Dual antenna: Note: 1. Please add 22uF cap for VCC_3V3. 2. For USB 2.0 differential signal, requires 90 ohm impedance. 3. For PIN2 and PIN3 RF IO trace, keep 50 ohm impedance. FN-LINK TECHNOLOGY LIMITED 17 6223E-UUD 11. Recommended Reflow Profile Referred to IPC/JEDEC standard. Peak Temperature :