SFP101J68K0TKRTR2K0

SFP - Stabilized Film Power MELF Resistor y iabilit tion • Rel y t Innova i l a a n vi w Qu o t-D Cos Specifications Per D2 • IEC 60115-1 Features SFP • Excellent in heat dissipation than chip resistor • Stronger mechanical structure to endure vibration and thermal shock B D1 L • Low temperature coefficient and tolerances • Excellent stability • Superior power handling • Products meet RoHS requirements and do not contain substances of very high concern identified by European Chemicals Agency DIMENSIONS Body Length (L, mm) Type Cap Diameter (D1, mm) Body Diameter (D2, mm) Soldering Spot (B, mm) Net Weight Per 1000 pcs SFP204 3.52 ± 0.15 1.35 ± 0.1 D1+0.02/ -0.15 0.6 Min. 17 grams SFP101 5.90 ± 0.20 2.20 ± 0.1 D1+0.02/ -0.15 1.0 Min. 66 grams SFP201 8.50 ± 0.50 3.00 ± 0.2 D1+0.02/ -0.15 1.3 Min. 186 grams SFP301 10.5 ± 0.50 4.00 ± 0.5 D1+0.02/ -0.15 1.6 Min. 446 grams GENERAL SPECIFICATIONS Type Power Rating* Maximum Working Voltage Maximum Overload Voltage Minimum Resistance Maximum Resistance Resistance Tolerance Available Resistance Values SFP204 0.4W 200V 400V 0, 0.5Ω 10MΩ ±0.5%~5% E-192/E-24 SFP101 1W 350V 700V 0, 0.5Ω 10MΩ ±0.5%~5% E-192/E-24 SFP201 2W 400V 800V 0, 0.5Ω 1MΩ ±0.5%~5% E-192/E-24 SFP301 3W 400V 800V 0, 0.5Ω 1MΩ ±0.5%~5% E-192/E-24 * At 70°C, with the exception of SFP201 and SFP301, derating of which starts at 40°C. Please refer to the Power Derating Curve. * Special sizes, values, and specifications not listed available on special order. POWER DERATING CURVE 100% 90% SFP204, SFP101 80% SFP201 SFP301 RATED LOAD 70% 60% 50% 40% 30% 20% 10% 0% 30 40 50 60 70 80 90 100 110 120 130 140 150 160 o AMBIENT TEMPERATURE ( C) 151 www.firstohm.com.tw qrc@firstohm.com.tw Revision: 25-APRIL-2023 SFP - Stabilized Film Power MELF Resistor y iabilit tion • Rel y t Innova i l a a n vi w Qu o t-D Cos SFP SUGGESTED PAD LAYOUT Type SFP204 SFP101 SFP201 SFP301 Soldering Mode Pad Length (L, mm, Min.) Pad Spacing (P, mm) Pad Width (W, mm, Min.) Reflow 1.3 1.6 ± 0.1 1.6 Wave 1.5 1.5 ± 0.1 1.8 Reflow 2.0 3.0 ± 0.1 3.0 Wave 2.5 3.0 ± 0.1 3.0 Reflow 3.0 4.9 ± 0.3 3.7 Wave 3.5 4.8 ± 0.3 4.0 Reflow 4.0 6.2 ± 0.4 5.0 Wave 4.5 6.0 ± 0.4 5.0 For better heat dissipation / lower heat resistance, increase W & L. COVER TAPE PEELING SPECIFICATION Recommended peeling force: SFP204, SFP101: 50±5gf Revision: 25-APRIL-2023 SFP201, SFP301: 70±10gf www.firstohm.com.tw qrc@firstohm.com.tw 152 SFP - Stabilized Film Power MELF Resistor y iabilit tion • Rel y t Innova i l a a n vi w Qu o t-D Cos PART NUMBER SFP Example: SFP101F46R4TKSTR2K0 SFP101 F 46R4 TKS TR2K0 Type Tolerance* Resistance TCR* Packaging Z (Jumper) D (0.5%) F (1%) G (2%) J (5%) 46.4Ω 4-character code containing 3 significant digits 1 letter multiplier 100ppm 3-character code 5-character code OHM MULTIPLIER R=1 K = 103 M = 106 G = 109 TKQ = ± 25 ppm TKR = ± 50 ppm TKS = ± 100 ppm TK2 = ± 200 ppm TR = Tape Reel (pieces per reel) SFP204 3K0 = 3,000 6K0 = 6,000** 10K = 10,000** SFP101 2K0 = 2,000 6K0 = 6,000** 10K = 10,000** SFP201 2K5 = 2,500 SFP301 2K0 = 2,000 * Listed values may not be applicable across product types or to all resistance values. Please check with us before placing order. ** upon request TECHNICAL SUMMARY Characteristics Limits Dielectric Withstanding Voltage, VAC or DC SFP204: 200 SFP101: 500 SFP201: 700 SFP301: 1000 Temperature Coefficient, PPM / °C* ±25, ±50, ±100, ±200 Operating Temperature Range, °C -55 ~ +155 Insulation Resistance, MΩ >104 Failure Rate in Time, pcs / 109 device hours