TPS65810RTQR

Product Folder Sample & Buy Support & Community Tools & Software Technical Documents TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 TPS6581x Single-Cell Li-Ion Battery and Power Management IC PDAs Smart Phones MP3s Internet Appliances Handheld Devices 3 Description The TPS65810 device provides an easy-to-use, fullyintegrated solution for handheld devices, integrating charge management, multiple regulated power supplies, system management, and display functions in a small, thermally-enhanced 8-mm × 8-mm package. The high level of integration enables space savings of 70% of the typical board area when compared to equivalent discrete solutions, while implementing a high-performance and flexible solution that is portable across multiple platforms. Device Information(1) PART NUMBER PACKAGE TPS65810, TPS65811 BODY SIZE (NOM) QFN (56) 8.00 mm × 8.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. 43 GPIO1 44 SM1 45 PGND1 46 L1 47 VIN_SM1 48 AGND1 49 SM2 50 VIN_SM2 51 L2 52 PGND2 53 GPIO2 54 GPIO3 55 RED QFN Package BLUE 1 42 SM3 SCLK 2 41 FB3 SDAT 3 40 SM3SW RTC_OUT 4 39 L3 SIM 5 38 PGND3 USB 6 AC 7 OUT 8 35 VIN_LDO02 OUT 9 34 PWM LDO_PM 10 33 LDO2 ISET1 11 32 LDO0 37 LDO1 36 LED_PWM Ground Pad LDO3 28 LDO4 27 LDO5 26 AGND2 25 ANLG1 24 29 VIN_LDO35 ANLG2 23 14 ADC_REF 22 30 LDO35_REF DPPM RESPWRON 21 31 SYS_IN 13 TRSTPWON 20 12 INT 19 TS TMR BAT 18 • • • • • • BAT 17 • 2 Applications 56 GREEN • Battery Charger – Complete Charge Management Solution for Single Li-Ion or Li-Pol Cell: – With Thermal Foldback, Dynamic Power Management, and Pack TemperatureSensing – Supports Up to 1.5-A Maximum Charge Current – Programmable Charge Parameters for AC Adapter and USB Port Operation Integrated Power Supplies – Total of 9 integrated LDOs: – 6 Adjustable-Output LDOs (1.25 V to 3.3 V) – 2 Fixed-Voltage LDOs (3.3 V) – 1 RTC Backup Supply With Low Leakage (1.5 V) – 2 0.6-V to 3.4-V Programmable DC–DC Buck Converters (600 mA for TPS65810, 750 mA for TPS65811) – With Enable, Standby Mode Operation, and Automatic Low-Power Mode Setting Display Functions – 2 Open-Drain PWM Outputs With Programmable Frequency and Duty Cycle – Control of Keyboard Backlight, Vibrator, or Other External Peripheral Functions – RGB LED Driver With Programmable Flashing Period and Individual RGB Brightness Control – Constant-Current White LED Driver – With Programmable Current Level, Brightness Control, and Overvoltage Protection – Can Drive up to 6 LEDs in Series Configuration System Management – Dual Input Power Path Function With Input Current-Limiting and OVP Protection – POR Function With Programmable Masking Monitors All Integrated Supplies Outputs – Software and Hardware Reset Functions – 8-Channel Integrated A/D Samples System Parameters – With Single Conversion, Peak Detection, or Averaging Operating Modes Host Interface – Host Can Set System Parameters and Access System Status Using I2C Interface – Interrupt Function With Programmable Masking Signals System Status Modification to Host – 3 GPIO Ports, Programmable as Drivers, Integrated A/D Trigger or Buck Converters Standby Mode Control AGND0 16 • 1 • HOT_RST 15 1 Features 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com Table of Contents 1 2 3 4 5 6 7 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Description (continued)......................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 3 6 7.1 7.2 7.3 7.4 7.5 Absolute Maximum Ratings ...................................... 6 ESD Ratings.............................................................. 6 Recommended Operating Conditions....................... 7 Thermal Information .................................................. 7 Electrical Characteristics – System Sequencing and Operating Modes ....................................................... 8 7.6 Electrical Characteristics – Power Path and Charge Management .............................................................. 9 7.7 Electrical Characteristics – Power Path and Charge Management (Continued) ........................................ 10 7.8 Electrical Characteristics – Power Path and Charge Management (Continued) ........................................ 11 7.9 Electrical Characteristics – Linear Regulators ........ 12 7.10 Electrical Characteristics – Switched-Mode SM1 Step-Down Converter .............................................. 14 7.11 Electrical Characteristics – Switched-Mode SM2 Step-Down Converter .............................................. 15 7.12 Electrical Characteristics – GPIOs........................ 15 7.13 Electrical Characteristics – ADC ........................... 16 7.14 Electrical Characteristics – LED and PWM Drivers...................................................................... 17 7.15 Electrical Characteristics – I2C Interface .............. 18 7.16 7.17 7.18 7.19 8 18 19 19 20 Detailed Description ............................................ 23 8.1 8.2 8.3 8.4 8.5 8.6 9 Timing Requirements – I2C Interface.................... Trigger Timing Characteristics .............................. Dissipation Ratings ............................................... Typical Characteristics .......................................... Overview ................................................................. Functional Block Diagram ....................................... Feature Description................................................. Device Functional Modes........................................ Programming........................................................... Register Maps ......................................................... 23 23 24 69 69 73 Application and Implementation ........................ 84 9.1 Application Information............................................ 84 9.2 Typical Applications ................................................ 85 10 Power Supply Recommendations ..................... 91 11 Layout................................................................... 91 11.1 Layout Guidelines ................................................. 91 11.2 Layout Example .................................................... 92 12 Device and Documentation Support ................. 93 12.1 12.2 12.3 12.4 12.5 12.6 12.7 Device Support...................................................... Related Documentation......................................... Related Links ........................................................ Community Resources.......................................... Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ 93 93 93 93 93 93 93 13 Mechanical, Packaging, and Orderable Information ........................................................... 94 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision B (February 2007) to Revision C Page • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .................................................................................................. 1 • Deleted the lead temperature from the Absolute Maximum Ratings table ............................................................................ 6 2 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 5 Description (continued) If required, an external host can control the TPS65810 device through I2C interface with access to all integrated systems. The I2C enables the setting of the output voltages, current thresholds, and operation modes. The internal registers have a complete set of status information, enabling easy diagnostics, and host-controlled handling of fault conditions. The TPS65810 device can operate in standalone mode, with no external host control, if the internal power-up defaults are compatible with the system requirements. 6 Pin Configuration and Functions GREEN RED GPIO3 GPIO2 PGND2 L2 VIN_SM2 SM2 AGND1 VIN_SM1 L1 PGND1 SM1 GPIO1 56 55 54 53 52 51 50 49 48 47 46 45 44 43 RTQ Package 56-Pin QFN With Exposed Thermal Pad Top View BLUE 1 42 SM3 SCLK 2 41 FB3 SDAT 3 40 SM3SW RTC_OUT 4 39 L3 SIM 5 38 PGND3 USB 6 37 LDO1 AC 7 36 LED_PWM 35 VIN_LDO02 34 PWM Thermal Pad OUT 8 OUT 9 26 27 28 LDO5 LDO4 LDO3 25 AGND2 VIN_LDO35 24 29 ANLG1 14 23 DPPM ANLG2 LDO35_REF 22 30 ADC_REF 13 21 TMR RESPWRON SYS_IN TRSTPWON 20 31 19 12 INT TS 18 LDO0 BAT 32 17 11 BAT ISET1 16 LDO2 AGND0 33 15 10 HOT_RST LDO_PM Pin Functions PIN NAME NO. I/O DESCRIPTION EXTERNAL REQUIRED COMPONENTS (See Figure 51) Adapter charge input voltage, connect to AC_DC adapter positive output terminal (DC voltage) 1-μF (minimum) capacitor to AGND1 pin to minimize overvoltage transients during AC power hot-plug events. I/O ADC internal reference filter or ADC external reference input 4.7-μF (minimum) to 10-μF (maximum) capacitor connected to AGND2 pin 16 — Analog ground connection Connect to analog ground plane AGND1 48 — Analog ground pin Connect to analog ground plane AGND2 25 — Analog ground pin Connect to analog ground plane Can be used to monitor additional system or pack parameters Can be used to monitor additional system or pack parameters AC 7 I ADC_REF 22 AGND0 ANLG1 24 I Analog input to ADC, programmable current source output ANLG2 23 I Analog input to ADC, programmable current source output Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 Submit Documentation Feedback 3 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com Pin Functions (continued) PIN NAME NO. 17 BAT 18 I/O DESCRIPTION EXTERNAL REQUIRED COMPONENTS (See Figure 51) I/O Battery power Connect to battery positive terminal. Connect a 10-μF capacitor (minimum) from BAT pin to AGND1 pin. BLUE 1 O Programmable blue driver, open-drain output, current sink output when active. Connect to BLUE input of RGB LED DPPM 14 I Dynamic power path management set-point External resistor from DPPM pin to AGND1 pin sets the DPPM regulation threshold. 1-nF (minimum) capacitor to from DPPM to AGND1 sets BAT to OUT short circuit blanking delay when battery is hot-plugged into system Exposed thermal pad 57 — An internal electrical connection exists between the exposed thermal pad and AGNDn pins of the device. The exposed thermal pad must be connected to the same potential as the AGND1 pin on the printedcircuit-board. Do not use the thermal pad as the primary ground input for the device. AGNDn pins must be connected to a clean ground plane at all times. FB3 41 I/O White LED duty cycle switch output, LED current setting External resistor from FB3 pin to PGND3 pin sets LED peak current. Connect a 100-pF (minimum) filter capacitor to PGND3 pin. GPIO1 43 I/O General-purpose programmable I/O Power-up default: SM1 enable control, SM1 ON at GPIO1 = HI. GPIO2 53 I/O General-purpose programmable I/O Power-up default: SM2 enable control, SM2 ON at GPIO2 = HI. GPIO3 54 I/O General-purpose programmable I/O. Example: ADC conversion start trigger. GREEN 56 O Programmable LED driver, open-drain output, current sink output when active. Connect to GREEN input of RGB LED HOT_RST 15 I/O Hardware reset input, reset generated when connected to ground Connect to an external push-button switch. Connect to external pullup resistor. INT 19 O Interruption pin, open-drain output Connect 100-kΩ external pullup resistor between INT and OUT INT pin is LO when interrupt is requested by the TPS65810 device. ISET1 11 I Current set point when charging in auto mode with AC selected. Precharge and charge termination set point for all charge modes External resistor from ISET1 pin to AGND1 pin sets charge current value L1 46 O SM1 synchronous buck converter power-stage output 3.3-μH inductor to SM1 pin L2 51 O SM2 synchronous buck converter power-stage output 3.3-μH inductor to SM2 pin L3 39 O Drain of the integrated boost power-stage switch 4.7-μH inductor to OUT pin, external Schottky diode to SM3 pin LDO0 32 O LDO0 output, fixed voltage 1-μF (minimum) capacitor to AGND1 LDO1 37 O LDO1 output 1-μF (minimum) capacitor to AGND1 LDO2 33 O LDO2 output 1-μF (minimum) capacitor to AGND1 LDO3 28 O LDO3 output 2.2-μF (minimum) capacitor to AGND2 LDO35_REF 30 I Linear regulators LDO3-5 reference filter 100-nF capacitor to AGND2 LDO4 27 O LDO4 output 2.2-μF (minimum) capacitor to AGND2 LDO5 26 O LDO5 output 2.2-μF (minimum) capacitor to AGND2 LDO_PM 10 O General-purpose LDO output 1-μF (minimum) capacitor to AGND1 pin LED_PWM 36 O PWM driver output, open-drain Can be used to drive a keyboard backlight LED O Power-path output. Connect to system main power rail (system power bus) 10-μF capacitor to AGND1 pin — SM1 synchronous buck converter power ground Connect to power ground plane 8 OUT 9 PGND1 45 PGND2 52 PGND3 38 — White LED driver power ground input. Connect to a power ground plane PWM 34 O PWM driver output, open-drain Can be used to drive a vibrator or other external functions O Programmable LED driver, open-drain output, current sink output when active Connect to RED input of RGB LED RED 4 55 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 Pin Functions (continued) PIN NAME RESPWRON NO. 21 I/O DESCRIPTION EXTERNAL REQUIRED COMPONENTS (See Figure 51) O System reset, open-drain output 100-kΩ external pullup resistor to OUT. RESPWRON pin is LO when the TPS65810 device is resetting the system. 1-μF (minimum) capacitor to AGND1 pin or supercapacitor 2-kΩ pullup resistor to OUT pin RTC_OUT 4 O Low leakage LDO output. Can be connected to a super-capacitor or secondary cell, if used as a RTC backup output. SCLK 2 I I2C interface clock line 2 SDAT 3 I/O I C interface data line 2-kΩ pullup resistor to OUT pin SIM 5 O General-purpose LDO output 1-μF (minimum) capacitor to AGND1 pin LC filter: 10-μF capacitor to PGND1 pin SM1 44 I SM1 synchronous buck converter output voltage sense SM2 49 I SM2 synchronous buck converter output voltage sense LC filter: 10-μF capacitor to PGND2 pin SM3 42 I White LED driver output overvoltage detection Connect 1-μF capacitor to PGND3 pin. Connect SM3 pin to the positive side of white LED ladder. SM3SW 40 I Integrated white LED duty cycle switch input Connect to negative side of external LED ladder SYS_IN 31 I System power bus low-voltage detection External resistive divider sets minimum system operational voltage. The TPS65810 device enters sleep mode when voltage below minimum system voltage threshold is detected. 1-nF filter capacitor to AGND1 recommended. TMR 13 I Charge safety timer program input External resistor from TMR pin to AGND1 pin sets the charge safety timer time-out value TRSTPWON 20 I System reset pulse-duration setting 100-nF (minimum) capacitor to AGND. External capacitor from TRSTPWON pin to AGND1 pin sets RESPWRON pulse duration. TS 12 I/O Temperature sense input, current source output Connect to battery pack thermistor to sense battery pack temperature. Connect to external pullup resistor. USB 6 I USB charge input voltage, connect to USB port positive power output 1-μF (minimum) capacitor to AGND1 pin, to minimize overvoltage transients during USB power hot-plug events. VIN_LDO35 29 — Input to LDOs 3 to 5 1-μF (minimum) decoupling capacitor to AGND2 1-μF (minimum) decoupling capacitor to AGND1 VIN_LDO02 35 — Positive supply input for LDO0, LDO1, LDO2 VIN_SM1 47 — SM1 synchronous buck converter positive 10-μF capacitor to PGND1 pin supply input VIN_SM2 50 — SM2 synchronous buck converter positive 10-μF capacitor to PGND2 pin supply input Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 Submit Documentation Feedback 5 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings over operating free-air temperature range (unless otherwise noted) (1) MIN MAX UNIT AC and USB with respect to AGND1 –0.3 18 V ANLG1, ANLG2 with respect to AGND2 –0.3 V(OUT) V 5 V V(OUT) with respect to AGND1 VIN_LDO12, VIN_LDO35, LDO3, LDO4, LDO5 with respect to AGND2 –0.3 V(OUT) V LDO35_REF, ADC_REF with respect to AGND2 –0.3 Smaller of: 3.6 or V(OUT) V SIM, RTC_OUT with respect to AGND1 –0.3 Smaller of: 3.6 or V(OUT) V SM1, L1, VIN_SM1 with respect to PGND1 –0.3 V(OUT) V SM2, L2, VIN_SM2 with respect to PGND2 –0.3 V(OUT) V SM3, L3 with respect to PGND3 –0.3 29 V SM3SW with respect to PGND3 –0.3 V(OUT) V FB3 with respect to PGND3 –0.3 0.5 V All other pins (except AGND and PGND), with respect to AGND1 –0.3 V(OUT) V AGND2, AGND0, PGND1, PGND2, PGND3 with respect to AGND1 –0.3 0.3 V 2750 mA Input Current, USB pin 600 mA Output continuous current, OUT pin 3000 mA Output continuous current, BAT pin –3000 mA Continuous Current at L1, PGND1, L2, PGND2 1800 mA 85 °C 125 °C 150 °C Input Current, AC pin TA Operating free-air temperature TJ Maximum junction temperature –40 Tstg Storage temperature (1) –65 Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. 7.2 ESD Ratings V(ESD) (1) 6 Electrostatic discharge Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) VALUE UNIT 1500 V JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process. Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 7.3 Recommended Operating Conditions MIN MAX 4.35 16.5 (1) V 0 2.6 V See (2) 4.7 V VIN_LDO12 with respect to AGND1 See (2) 4.7 V VIN_SM1 with respect to PGND1 See (2) 4.7 V VIN_SM2 with respect to PGND2 See (2) 4.7 V AC and USB with respect to AGND1 ANLG1,ANLG2 with respect to AGND2 VIN_LDO35 with respect to AGND2 SM3 with respect to PGND3 UNIT 28 V TA Operating free-air temperature –40 85 °C TJ(op) Junction temperature, functional operation ensured –40 125 °C TJ Junction temperature, electrical characteristics ensured 0 125 °C (1) (2) Thermal operating restrictions are reduced or avoided if input voltage does not exceed 5 V. Greater of: 3.6 V OR minimum input voltage required for LDO/converter operation outside dropout region. 7.4 Thermal Information TPS6581x THERMAL METRIC (1) RTQ (QFN) UNIT 56 PINS RθJA Junction-to-ambient thermal resistance 26.9 °C/W RθJC(top) Junction-to-case (top) thermal resistance 10.9 °C/W RθJB Junction-to-board thermal resistance 4.9 °C/W ψJT Junction-to-top characterization parameter 0.2 °C/W ψJB Junction-to-board characterization parameter 4.8 °C/W RθJC(bot) Junction-to-case (bottom) thermal resistance 0.7 °C/W (1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application report, SPRA953. Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 Submit Documentation Feedback 7 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com 7.5 Electrical Characteristics – System Sequencing and Operating Modes over recommended operating conditions (typical values at TJ = 25°C), application circuit as in Figure 51 (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT QUIESCENT CURRENT IBAT(SLEEP) BAT pin current, sleep mode set Input power not detected, V(BAT) = 4.2 V, Sleep mode set 400 μA 2 IBAT(DONE) BAT pin current, charge terminated Charger function enabled by I C, termination detected, input power detected and selected 3 μA IBAT(CHGOFF) BAT pin current, charge function OFF Charger function disabled by I2C, termination not detected, input power detected and selected 3 μA 2 IINP(CHGOFF) AC or USB pin current, charge function OFF Charger function disabled by I C, termination not detected, input power detected and selected. All integrated supplies and drivers OFF, no load at OUT pin. 200 μA 3% V UNDERVOLTAGE LOCKOUT VUVLO Internal UVLO detection threshold NO POWER mode set at V(OUT) < VUVLO, V(OUT) decreasing VUVLO_HYS UVLO detection hysteresis V(OUT) increasing tDGL(UVLO) UVLO detection deglitch time Falling voltage only –3% 2.5 120 mV 5 ms SYSTEM LOW VOLTAGE THRESHOLD VLOW_SYS Minimum system voltage System voltage V(SYS_IN) decreasing, SLEEP mode set if detection threshold V(SYS_IN) < VLOW_SYS VHYS(LOWSYS) Minimum system voltage V(SYS_IN) increasing detection hysteresis 50 mV tDGL(LOWSYS) Minimum system voltage V(SYS_IN) decreasing detection deglitch time 5 ms 0.97 1 1.03 V THERMAL FAULT TSHUT Thermal shutdown Increasing junction temperature 165 °C THYS(SHUT) Thermal shutdown hysteresis Decreasing junction temperature 30 °C INTEGRATED SUPPLY POWER FAULT DETECTION VPGOOD Power-good fault detection threshold Falling output voltage, applies to all integrated supply outputs. Referenced to the programmed output voltage value 84% 90% 96% VHYS(PGOOD) Power-good fault detection hysteresis Rising output voltage, applies to all integrated supply outputs. Referenced to VPGOOD threshold 3% 5% 7% HOT RESET FUNCTION VHRSTON Low level input voltage RESET mode set at V(HOT_RESET) < VHRSTON VHRSTOFF High level input voltage HOT reset not active at V(HOT_RESET) > VHRSTOFF tDGL(HOTRST) Hot reset input deglitch 0.4 1.3 V V 5 ms SYSTEM RESET – OPEN-DRAIN OUTPUT RESPWRON VRSTLO Low level output voltage IIL = 10 mA, V(RESPWRON ) < VRSTLO ITRSTPWON Pullup current source Internally connected to TRSTPWRON pin KRESET Reset timer constant TRESET = KRESET × CTRSTPWON 8 Submit Documentation Feedback 0 0.9 1 1 0.3 V 1.2 μA ms/nF Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 7.6 Electrical Characteristics – Power Path and Charge Management over recommended operating conditions (typical values at TJ = 25°C), circuit as in Figure 51 (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT VOLTAGE DETECTION THRESHOLDS VIN(DT) Input Voltage detection threshold AC detected at V(AC)– V(BAT) > VIN(DT) USB detected at V(USB)– V(BAT) > VIN(DT) VIN(NDT) Input Voltage removal threshold AC not detected at V(AC)– V(BAT) < VIN(NDT) USB not detected at V(USB)– V(BAT) < VIN(NDT) tDGL(NDT) Power not detected deglitch VSUP(DT) Supplement detection threshold VSUP(NDT) Supplement not detected threshold 190 mV 125 mV 22.5 ms Battery switch ON at V(BAT) – V(OUT) > VSUP(DT) 60 mV Battery switch OFF at V(BAT)– V(OUT) < VSUP(NDT) 20 mV POWER PATH INTEGRATED MOSFETS CHARACTERISTICS VACDO AC switch dropout voltage VACDO = V(AC)– V(OUT); V(AC) = 4.75 V AC input current limit set to 2.75 A (typical), IO(OUT) = 1 A VUSBDO USB switch dropout voltage VUSBDO = V(USB)– V(OUT); V(USB) = 4.6 V USB input current limit set to 2.75 A (typical) VBATDODCH Battery switch dropout voltage, discharge VBATDOCH Battery switch dropout voltage, charge 350 375 mV I(OUT)+ I(BAT)= 0.5 A 175 190 mV I(OUT)+ I(BAT)= 0.1 A 35 45 mV V(BAT): 3 V → VCH(REG), I(BAT) = –1 A 60 100 mV Charger on, V(BAT): 3 V → 4.2 V, I(BAT) = 1 A 60 100 mV POWER PATH INPUT CURRENT LIMIT IINP(LIM1) Selected input current limit, applies to USB input only Selected input switch not in dropout, I2C settings: ISET2 = LO, PSEL = LO 80 100 mA IINP(LIM2) Selected Input current limit, applies to USB input only Selected input switch not in dropout, I2C settings: ISET2 = HI, PSEL = LO 400 500 mA IINP(LIM3) Selected Input current limit, applies to either AC or USB input Selected input switch not in dropout, I2C settings: ISET2 = HI OR LO, PSEL = HI 2.75 A 4.7 V SYSTEM REGULATION VOLTAGE VSYS(REG) Output regulation voltage VSYS(REG) = V(OUT), DPPM loop not active, selected input current limit not reached. Selected input voltage (AC or USB) > 5.1 V 4.6 POWER PATH PROTECTION AND RECOVERY FUNCTIONS VINOUTSH Input-to-output short-circuit detection threshold AC and USB switches set to OFF if V(OUT) < VINOUTSH 0.6 V RSH(USBSH) OUT short circuit recovery pullup resistor V(OUT) < 1 V, internal resistor connected from USB to OUT 500 Ω RSH(ACSH) OUT short circuit recovery pullup resistor V(OUT) < 1 V, internal resistor connected from AC to OUT 500 Ω Overvoltage detection threshold Rising voltage, overvoltage detected when V(AC) > VOVP or V(USB) > VOVP Overvoltage detection hysteresis Falling voltage, relative to detection threshold 0.1 V VBATOUTSH Battery-to-output short-circuit detection threshold BAT switch set to OFF if V(BAT) – V(OUT) > VBATOUTSH 200 mV KBLK(SHBAT) Battery-to-output short-circuit blanking time constant V(DPPM) < 1v, tBLK(SHBAT) = KBLK(SHBAT) X CDPPM, CDPPM capacitor is connected from DPPM pin to AGND1 ISH(BAT) OUT short circuit recovery pullup current source V(BAT) – V(OUT) > VBATOUTSH, Internal current source connected between OUT and BAT RSH(BAT) BAT short circuit recovery resistor V(BAT)< 1 V, Internal resistor connected from OUT to BAT RDCH(BAT) BAT pulldown resistor Internal resistor connected from BAT to AGND1 when battery is not detected by ANLG1 VOVP Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 6 6.5 6.8 V 1 mS/nF 10 mA 1 kΩ 500 Ω Submit Documentation Feedback 9 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com 7.7 Electrical Characteristics – Power Path and Charge Management (Continued) over recommended operating conditions (typical values at TJ = 25°C), application circuit as in Figure 51 (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 120 200 POWER PATH TIMING CHARACTERISTICS, DPPM, AND THERMAL LOOPS NOT ACTIVE, R TMR = 50 kΩ tBOOT Boot-up time Measured from input power detection 300 ms tSW(ACBAT) Switching from AC to BAT No USB: measured from V(AC) – V(BAT) < VIN(NDT), USB detected: CE = LO (after CE hold-off time) 50 μs tSW(USBBAT) Switching from USB to BAT No AC: measured from V(USB) – V(BAT) < VIN(NDT), USB detected: CE = LO (after CE hold-off time) 50 μs tSW(PSEL) Switching from USB to AC Toggling I2C PSEL bit 50 μs tSW(ACUSB) Switching from AC to USB or USB to AC AC power removed or USB power removed 100 μs BATTERY REMOVAL DETECTION VNOBATID Battery ID resistor detection tDGL(NOBAT) Deglitch time for battery removal detection ID resistor not detected at V(OUT)– V(ANLG1) < VNOBATID ANLG1 pullup current V 0.6 00, V(OUT): 2.5 V to 4.4 V IO(ANLG1) 0.5 Set through I2C bits (BATID1,BATID2) ADC_WAIT register 1.2 ms V(OUT) - 1.2 500 kW 01 10 10 50 11 μA 60 Total accuracy 25% 25% 100 1500 FAST CHARGE CURRENT, V(OUT) > V(BAT) + 0.1 V, V(BAT) > VLOWV IO(BAT) Charge current range V(SET) Battery charge current set voltage K(SET) Battery charge current set factor IO(BAT) = K (SET) ´ V(SET) RSET 11, 100% scaling 2.475 2.500 2.525 10, 75% scaling 1.875 1.900 1.925 01, 50% scaling 1.225 1.250 1.275 00, 25% scaling 0.575 0.600 0.625 100 mA < IO(BAT) ≤ 1 A 350 400 450 1 mA < IO(BAT) ≤ 100 mA 100 400 1000 V(SET) = V(ISET1), (ISET1_1, ISET1_0) = mA V PRECHARGE CURRENT, V(OUT) > V(BAT) + 0.1 V, VBATSH < V(BAT) < VLOWV, t < t(PRECHG) V(PRECHG) ´ K (SET) IO(PRECHG) Precharge current range IO(PRECHG) = VPRECHG Precharge set voltage VPRECHG = V(ISET1) 220 VLOWV Precharge to fast-charge transition Fast charge at V(BAT) > VLOWV 2.8 tDGL(PRE) Deglitch time for fast charge to precharge transition Decreasing battery voltage, RTMR = 50 kΩ 10 RSET 150 mA 250 270 mV 3 3.2 V 22.5 ms 4.2 V CHARGE REGULATION VOLTAGE, V(OUT) > VO(BATREG) + 0.1 V Voltage options, selection through I2C VO(BATREG) Battery charge voltage 4.356 Accuracy, TA = 25°C Total accuracy V –0.5% 0.5% –1% 1% 10 150 CHARGE TERMINATION, V(BAT) > VRCH, VOLTAGE REGULATION MODE SET V(TERM) ´ K (SET) I(TERM) Charge termination current range I(TERM) = V(TERM) Battery termination detection set voltage V(TERM) = V(ISET1), (ISET1_1, SET1_0) = tDGL(TERM) Deglitch time for termination detection V(ISET1) < V(TERM), RTMR = 50 kΩ 10 Submit Documentation Feedback RSET 11, 100% scaling 240 260 280 10, 75% scaling 145 160 175 01, 50% scaling 90 110 130 00, 25% scaling 40 60 75 22.5 mA mV ms Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 7.8 Electrical Characteristics – Power Path and Charge Management (Continued) over recommended operating conditions (typical values at TJ = 25°C), circuit as in Figure 51 (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 80 100 130 mV BATTERY RECHARGE DETECTION VRCH Recharge threshold voltage New charge cycle starts if V(BAT) < VO(BATREG) – VRCH, after termination was detected tDGL(RCH) Deglitch time for recharge detection RTMR = 50 kΩ 22.5 ms DPPM FUNCTION VDPPM DPPM regulation point range V(DPPM) = RDPPM × KDPPMM × IO(DPPM) 2.6 4.4 V IO(DPPM) DPPM pin current source AC or USB Present 95 100 105 μA KDPPM DPPM scaling factor 1.139 1.15 1.162 tDGL(DPPM) DPPM de-glitch time Status bit set indicating DPPM loop active after deglitch time, RTMR = 50 kΩ μs 500 CHARGE AND PRECHARGE SAFETY TIMER tCHG Charge safety timer programmed value Safety timer range, thermal and DPPM loop not active, tCHG = RTMR × KTMR KTMR Charge timer set factor tCHGADD Total elapsed time when DPPM or thermal loop are active Fast charge on, tCHGADD is the maximum add-on time added to tCHG tPRECHG Precharge safety timer programmed value Pre charge safety timer range, thermal and DPPM loop not active, tPRECHG = KPRE × RTMR × KTMR KPRE Precharge timer set factor tPCHGADD Total elapsed time when DPPM or thermal loop are active RTMR External timer resistor limits RTMR(FLT) Timer fault recovery pullup resistor 3 5 10 0.313 0.36 0.414 2 × tCHG 30 60 0.09 0.1 0.11 2 × tPRECHG 30 Internal resistor connected from OUT to BAT after safety timer timeout s/Ω h 18 Precharge on, tPCHGADD is the maximum add-on time added to tPRECHG h min h 100 1 kΩ kΩ THERMAL REGULATION LOOP TTHREG Temperature regulation limit Charge current decreased and timer extended when TJ > TTHREG 115 135 °C CHARGER THERMAL SHUTDOWN TTHCHG Charger thermal shutdown THCHGHYS Charger thermal shutdown hystersis Charger turned off when TJ > TTHCHG Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 150 °C 30 °C Submit Documentation Feedback 11 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com 7.9 Electrical Characteristics – Linear Regulators over recommended operating conditions (typical values at TJ = 25°C), application circuit Figure 51 (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT SELECTABLE OUTPUT VOLTAGE LDOs: LDO1, LDO2 IQ(LDO12) Quiescent current, either LDO1 or LDO2 enabled, LDO0 disabled IO(LDO1,2) Output current range IQ(LDO12) = I(VIN_LDO02) I(LDO1,2) = –1 mA 15 I(LDO1,2) = –150 mA 150 Available output voltages: VO(LDO1,2)TYP = 1.25, 1.5, 1.8, 2.5, 2.85, 3, 3.2, 3.3 Output voltage, selectable through I2C. Dropout voltage, 150-mA load VO(LDO1,2) LDO1, LDO2 Output Voltage μA 160 300 Total accuracy, V(VIN_LDO02) = 3.65 V –3% 3% Line Regulation, 100-mA load, V(VIN_LDO02): V(LDO1,2)TYP + 0.5 V → 4.7 V –1% 1% –1.5% 1.5% Load regulation, load: 10 mA → 150 mA V(VIN_LDO02) > VO(LDO1,2) TYP + 0.5 V PSR(LDO12) PSRR at 20 kHz 150mA load at output, V(VIN_LDO02) – VO(LDO1,2) = 1 V ISC(LDO1,2) LDO1&2 short circuit current limit RDCH(LDO1,2) Discharge resistor ILKG(LDO1,2) Leakage current LDO off mA V mV 40 dB Output grounded 300 mA LDO disabled by I2C command 300 Ω 2 μA SIM LINEAR REGULATOR IQ(SIM) Quiescent current IO(SIM) Output current range Internally connected to OUT pin 8 Available output voltages: VO(SIM)TYP = 1.8 or 2.5 Output voltage, selectable through I2C. Dropout voltage, 8-mA load VO(SIM) SIM LDO output voltage μA 20 0.2 Total accuracy, V(OUT): 3.2 V to 4.7 V, 8 mA –5% 5% Load regulation, load: 1 mA → 8 mA, V(OUT) > VO(SIM) TYP + 0.5 V –3% 3% Line regulation, 5-mA load, V(OUT): VO(SIM) TYP + 0.5 V → 4.7 V –2% ISC(SIM) Short-circuit current limit Output grounded ILKG(SIM) Leakage current LDO off mA V V 2% 20 mA 1 μA 70 μA PROGRAMMABLE OUTPUT VOLTAGE LDOs: LDO3, LDO4, LDO5 IQ(LDO35) Quiescent current, only one of LDO3, LDO4, LDO5 is enabled IO(LDO35) Output current range IQ(LDO35) = I(VIN_LDO35) 100 Available output voltages: VO(LDO35)TYP = 1.224 V to 4.46 V, 25-mV steps Output voltage, selectable through I2C Dropout voltage, 100-mA load VO(LDO35) LDO3, LDO4, LDO5 output voltage 240 Total accuracy, 100-mA load V(VIN_LDO35) = 5 V –3% 3% Load regulation, V(VIN_LDO35) > VO(LDO35)TYP + 0.5 V, load: 1 mA → 50 mA –1% 1% Line regulation, 10-mA load, V(VIN_LDO35): VO(LDO35)TYP + 0.5 V → 4.7 V –1% 1% ISC(LDO35) Short-circuit current limit Output grounded PSR(LDO35) PSRR at 10 kHz V(VIN_LDO35) > VO(LDO3,5) + 1 V, 50-mA load at output RDCH(LDO35) Discharge resistor LDO is disabled by I2C command ILKG(LDO35) Leakage current LDO off 12 Submit Documentation Feedback mA V mV 250 mA 40 dB 400 Ω 1 μA Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 Electrical Characteristics – Linear Regulators (continued) over recommended operating conditions (typical values at TJ = 25°C), application circuit Figure 51 (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT RTC_OUT LINEAR REGULATOR IQ(RTC_OUT) Quiescent current for RTC LDO IO(RTC_OUT) Output current range Internally connected to OUT pin Fixed output voltage value ISH(RTC_OUT) RTC_OUT output voltage Short-circuit current limit ILKG(RTC_OUT) Leakage current 8 mA 200 mV 1.5 Dropout voltage, I(RTC_OUT) = –8 mA VO(RTC_OUT) μA 20 V Total accuracy, V(OUT): 2 V to 4.7 V, 8-mA load, sleep mode not set –5% 5% Load regulation, load: 1 mA → 8 mA, 2 V < V(OUT) < 4.7 V –3% 3% Line regulation, 5-mA load, V(OUT): 2 V → 4.7 V –2% 2% V(RTC_OUT) = 0 V 20 V(RTC_OUT) = 1.5 V, V(OUT) =0V TJ = 85°C 880 TJ = 25°C 250 Internally connected to VIN_LDO12 pin I(LDO0) = –1 mA mA nA LDO0 LINEAR REGULATOR IQ(LDO0) Quiescent current IO(LDO0) Output current range 15 I(LDO0) = –150 mA Fixed output voltage value Output voltage 150 mA 300 mV 3.3 Dropout voltage, I(LDO0) = –150 mA VO(LDO0) μA 160 V Total accuracy –3% 3% Line regulation, V(OUT): VO(LDO0) + 0.5 → 4.7 V, I(LDO0) = –100 mA –1% 1% Load regulation, I(LDO0) = –10 mA → –150 mA –1.5% PSR(LDO0) PSRR at 20 kHz 150-mA load at output, V(VIN_LDO12) – VO(LDO1,2) = 1 V ISC(LDO0) Short circuit current limit V(LDO0) = 0 V ILKG(LDO0) Leakage current LDO off 1.5% 40 dB 300 mA 1 μA LDO_PM LINEAR REGULATOR IQ(LD0_PM) Output current range Fixed output voltage value, V(OUT) > 4 V VO(LDO_PM) Output voltage Dropout voltage, I(LDOPM) = –12 mA Total accuracy ILKG(LDOPM) Leakage current LDO off Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 20 mA 0.7 V 3.3 0.5 –5% 5% 1 Submit Documentation Feedback μA 13 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com 7.10 Electrical Characteristics – Switched-Mode SM1 Step-Down Converter over recommended operating conditions (typical values at TJ = 25°C), VO(SM1) = 1.24 V, application circuit Figure 51 (unless otherwise noted) PARAMETER IQ(SM1) Quiescent current for SM1 IO(SM1) Output current range VO(SM1) TEST CONDITIONS MIN 10 SM1 OFF, set through I2C 0.1 Vin = 4.2 V, Vout = 1.24 V (TPS65810) 600 Vin = 4.2 V, Vout = 1.24 V (TPS65811) 750 ILKG(PSM1) P-channel leakage current RDSON(NSM1) N-channel MOSFET ON-resistance ILKG(PSM1) N-channel leakage current mA VO(SM1) = VSBY(SM1), Output voltage range, Standby ON Available output voltages: VSBY(SM1) = 0.6 V to 1.8 V, adjustable in 40-mV steps –3% UNIT μA Available output voltages: VO(SM1)TYP = 0.6 V to 1.8 V, adjustable in 40-mV steps Total accuracy, VO(SM1)TYP = VSBY(SM1) = 1.24 V, V(VIN_SM1) = 3.0 V to 4.7 V; 0 mA ≤ IO(SM1) ≤ 600 mA P-channel MOSFET ON-resistance MAX Output voltage, selectable through I2C, Standby OFF Output voltage, PWM mode RDSON(PSM1) TYP IQ(SM1) = I(VIN_ SM1), no output load, not switching V 3% Line Regulation, V(VIN_SM1): 3.0 → 4.70 V, IO(SM1) = 10 mA 0.027 %/V Load Regulation, V(VIN_SM1) = 4.7 V, IO(SM1): 60 mA → 540 mA 0.139 %/A V(VIN_SM1) = 3.6 V, 100% duty cycle set 310 V(VIN_SM1) = 3.6 V, 0% duty cycle set 220 500 mΩ 330 mΩ μA 0.1 μA 5 3 V < V(VIN_SM1) < 4.7 V (TPS65810) 900 1050 1200 3 V < V(VIN_SM1) < 4.7 V (TPS65811) 1000 1200 1400 1.3 1.5 1.7 ILIM(SM1) P- and N-channel current limit fS(SM1) Oscillator frequency PWM mode set EFF(SM1) Efficiency V(VIN_SM1) = 4.2 V, PWM mode, IO(SM1) = 300 mA, VO(SM1) = 3 V tSS(SM1) Soft-start ramp time Converter OFF→ON, VO(SM1): 5% → 95% of target value 750 μs Converter turnon delay GPIO1 pin programmed as SM1 converter enable control. Measured from V(GPIO1): LO → HI 170 μs tDLY(SM1) 14 Submit Documentation Feedback mA MHz 90% Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 7.11 Electrical Characteristics – Switched-Mode SM2 Step-Down Converter over recommended operating conditions (typical values at TJ = 25°C), VO(SM1) = 1.24 V, application circuit Figure 51 (unless otherwise noted) PARAMETER IQ(SM2) Quiescent current for SM2 IO(SM2) Output current range VO(SM2) TEST CONDITIONS RDSON(PSM2) P-channel MOSFET ON-resistance ILKG(PSM2) P-channel leakage current RDSON(NSM2) N-channel MOSFET ON-resistance ILKG(PSM2) N-channel leakage current TYP 10 SM2 OFF, set through I2C 0.1 Vin = 4.2 V, Vout = 1.24 V (TPS65810) 600 Vin = 4.2 V, Vout = 1.24 V (TPS65811) 750 MAX mA Available output voltages: VO(SM2)TYP = 1 V to 3.4 V, adjustable in 80-mV steps VO(SM2) = VSBY(SM2), Output voltage range, stand-by ON Available output voltages: VSBY(SM2) = 1 V to 3.4 V, adjustable in 80-mV steps –3% UNIT μA Output voltage, selectable through I2C, stand-by OFF Total accuracy, VO(SM2)TYP = VSM2(SBY) = 1.8 V, V(VIN_SM2) = greater of [3.0 V or (VO(SM2) + 0.3 V)] to 4.7 V; 0 mA ≤ IO(SM2) ≤ 600 mA Output voltage MIN IQ(SM2) = I(VIN_ SM2), no output load, not switching V 3% Line regulation, V(VIN_SM2) = greater of [3 V or (VO(SM2) + 0.3 V)] to 4.7 V; 0 mA ≤ IO(SM2) ≤ 600 mA 0.027 %/V Load regulation, V(VIN_SM2) = 4.7 V, IO(SM2): 60 mA → 540 mA 0.139 %/A V(VIN_SM2) = 3.6 V, 100% duty cycle set 310 V(VIN_SM2) = 3.6 V, 0% duty cycle set 220 500 mΩ 330 mΩ μA 0.1 μA 5 3 V < V(VIN_SM2) < 4.7 V (TPS65810) 900 1050 1200 3 V < V(VIN_SM2) < 4.7 V (TPS65811) 1000 1200 1400 1.3 1.5 1.7 ILIM(SM2) P- and N-channel current limit mA fS(SM2) Oscillator frequency PWM mode set EFF(SM2) Efficiency V(VIN_SM2) = 4.2 V, IO(SM2) = 300 mA, VO(SM2) = 3 V tSS(SM2) Soft-start ramp time Converter OFF→ON, VO(SM2) : 5% → 95% of target value 750 μs tDLY(SM2) Converter turnon delay GPIO2 pin programmed as SM2 converter enable control. Measured from V(GPIO2): LO → HI 170 μs MHz 90% 7.12 Electrical Characteristics – GPIOs over recommended operating conditions (typical values at TJ = 25°C), application circuit as in Figure 51 (unless otherwise noted). PARAMETER TEST CONDITIONS MIN TYP MAX UNIT GPIO1–3 VOL Low level output voltage GPIO0 IOL = 20 mA IOGPIO Low level sink current into GPIO1,2,3 V(GPIOn) = V(OUT) VIL Low level input voltage ILKG(GPIO) Input leakage current 0.5 20 0.4 V(GPIOn) = V(OUT) Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 V mA 1 Submit Documentation Feedback V μA 15 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com 7.13 Electrical Characteristics – ADC over recommended operating conditions (typical values at TJ = 25°C), V(ADC_REF) =2.535 V if external reference voltage is used, application circuit as in Figure 51 (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT ANALOG INPUTS VRNG(CH1_5) Full scale input range Ch1 to Ch5 Positive inputs (active clamp) Full scale ~ 2.535 V 0 V(ADC_R EF) V VRNG(CH6_8) Full scale input range Ch6 to Ch8 Positive inputs (active clamp), full scale ~4.7 V 0 VINTREF ×1.854 V CIN(ADC) Input capacitance (all channels) RINADC(CH1_5) Input resistance (Ch1 to Ch5) 1 ILKGADC(CH1_5) Leakage current (Ch1 to Ch5) RINADC(CH6_8) Input resistance (Ch6 to Ch8) ILKGADC(CH6_8) Leakage current (Ch6 to Ch8) Internal voltage proportional to junction temperature TJ = 25°C, ADC channel 5 input voltage RES(ADC) Resolution SAR ADC MCD(ADC) No missing codes INL(ADC) Integral linearity error ±3 LSB DNL(ADC) Differential non-linearity error ±1 LSB OFFZERO(ADC) Offset error OFFCH(ADC) Offset error match between channels GAINADC Gain error Deviation in code from the ideal full scale code (11…111) for the full scale voltage GAINCH(ADC) Gain error match Any two channels VCH5(ADC) 15 pF MΩ 100 430 540 10 1.895 Temperature coefficient nA kΩ μA V 6.5 mV/ °C 10 Bits DC ACCURACY SPECIFIED Difference between the first code transition (00...00 to 00...01) and the ideal AGND + 1 LSB 5 LSB 5 LSB ±8 LSB 2 LSB THROUGHPUT SPEED ADCCLK Sampling clock ADCTCONV Conversion time Sampling, conversion and setting Rs ≤ 200 K for CH1,CH2,CH3; Rs ≤ 500 Ω for CH6, CH7, CH8 600 750 900 kHz 44 59 68 μs 2.53 2.535 2.54 V REFERENCE VOLTAGES VINTREF Internal ADC reference voltage TA = 25°C, V(ADC_REF)=VINTREF when internal ADC reference is selected ISHRT(INTREF) Internal reference short circuit limit V(ADC_REF)= AGND1, internal reference enabled through I2C VREF(DRIFT) ADC internal reference temperature drift IQ(ADC) ADC Internal reference quiescent current Measured at OUT pin (internal reference) or ADC_REF pin (external reference) ANLG2 pin internal pullup current source ADC channel 2 bias current, set through I2C register ADC_WAIT bits (ADC_CH2I_D1_1, ADC_CH2I _D2) I(ANLG2) 6 50 0 01 10 10 50 11 ANLG1 pin internal pullup current source I(ANLG1) μA μA 25% V(OUT) - 1.2 500 kW 01 10 10 50 11 Total accuracy ppm/°C 60 –25% 00 ADC channel 1 bias current, set through I2C register ADC_WAIT bits (BATIDI_D1, BATIDI _D2) 100 40 00 Total accuracy, relative to selected value mA μA 60 10% 10% INTERNAL REFERENCE POWER CONSUMPTION PDACTIVE Power dissipation Conversion active PDARMED Power dissipation Not converting 16 Submit Documentation Feedback 2.3 mW 0.43 mW Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 7.14 Electrical Characteristics – LED and PWM Drivers over recommended operating conditions (typical values at TJ = 25°C), application circuit as in Figure 51 (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT SM3 BOOST CONVERTER, WHITE LED CONSTANT CURRENT DRIVER VVIN(SM3) Input voltage range V(OUT) = 3.3 V VOVP3 Output overvoltage trip OVP detected at V(SM3) > VOVP3 3 VHYS(OVP3) Output overvoltage hysteresis OVP not detected at V(SM3) < VOVP3 – VHYS(OVP3) VSM3REF LED current-sense threshold LED current below regulation point at V(FB3) < VSM3REF IO(SM3) LED current IO(SM3) = Current range, Vin = 3.3 V, 26.5 V(SM3REF) RFB3 DSM3SW LED-switch duty cycle Duty cycle range FREP_SM3 LED-switch duty cycle pattern repetition rate 256 pulses within repetition rate SM3_LF_OSC = 0 time SM3_LF_OSC = 1 RDSON(SM3SW) LED switch MOSFET ONresistance V(OUT) = 3.6 V; I(SM3SW) = 20 mA ILKG(SM3SW) LED switch MOSFET leakage RDSON(L3) Power stage MOSFET ONresistance ILKG(L3) Power stage MOSFET leakage IMAX(L3) Power stage MOSFET current limit 4.7 V 30 V 1.8 244 Total accuracy, IO(SM3) = 10 mA 29 252 V 260 mV 0 25 mA –10% 10% DSM3SW = 0% to 99.6%, set through I2C, 256 steps, 0.4% minimum step 122 Hz 183 1 2 μA 1 V(OUT) = 3.6 V; I(L3) = 200 mA 300 600 mΩ 600 mA 0.5 V Set through I2C, FPWM = 0.5 / 1 / 1.5 / 2 / 3 / 4.5 / 7.8 / 15.6 Hz μA 1 3 V < V(OUT) < 4.7 V Ω 400 500 PWM DRIVER, PWM OPEN-DRAIN OUTPUT VOL(PWM) FPWM Low level output voltage PWM driver frequency I(PWM) = 150 mA Frequency range Total accuracy, relative to selected value DPWM PWM driver duty cycle Duty cycle range –20% 20% DPWM = 6.25% to 100%, set through I2C, 6.25% minimum step LED_PWM DRIVER, LED_PWM OPEN-DRAIN OUTPUT DLEDPWM LED_PWM driver duty cycle Duty cycle range FREP(LEDPWM) LED_PWM driver duty cycle pattern repetition rate 256 pulses within repetition rate SM3_LF_OSC = 0 time SM3_LF_OSC = 1 VOL(LEDPWM) Low level output voltage I(LED_PWM) = 150 mA VOH(LEDPWM) High level output voltage Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 DLEDPWM = 0% to 99.6%, set through I2C, 256 steps 0.4% minimum step 122 Hz 180 0.5 V 6 V Submit Documentation Feedback 17 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com Electrical Characteristics – LED and PWM Drivers (continued) over recommended operating conditions (typical values at TJ = 25°C), application circuit as in Figure 51 (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT RGB DRIVER, RED, GREEN, AND BLUE OPEN-DRAIN OUTPUT tFLASH(RGB) Flashing period tFLASH(RGB) = 1 to 8 sec, set through I2C, 0.5 s minimum step, 8 steps Flashing period range Total accuracy –20% s 20% 2 tFLASH(ON) Flash on time Set through I C, tFLASH(ON) = 0.1 / 0.15 / 0.2 / 0.25 / 0.3 / 0.4 / 0.5 / 0.6 Flash on time range, value selectable by I2C Total accuracy relative to selected value –20% 20% DRGB = 0% to 99.98%, set through I2C, 3.23% minimum step Duty cycle Duty cycle range, value selectable through I2C ISINK(RGB) RGB output sink current V(RED) = V(GREEN) = V(BLUE) = 2 V, set through I2C RGB_ISET1,0 VOL(RGB) Low-level output voltage Output low voltage, 8-mA load, RED/GREEN/BLUE PINS Output off leakage current V(RED) = V(GREEN) = V(BLUE) = 4.7 V, all drivers disabled DRGB s 00 = (Driver set to OFF) 01 2.4 4 5.6 10 4.8 8 11.2 7 12 16.6 11 ILKG(RGB) 0.3 mA V μA 1 7.15 Electrical Characteristics – I2C Interface over recommended operating conditions (typical values at TJ = 25°C), application circuit as in Figure 51 (unless otherwise noted) PARAMETER TEST CONDITIONS MIN TYP MAX UNIT 2 I C INTERFACE LOGIC LEVELS VIH High level input voltage 1.3 6 V VIL Low level input voltage 0 0.6 V IH Input bias current μA 0.01 7.16 Timing Requirements – I2C Interface over recommended operating conditions (typical values at TJ = 25°C), application circuit as in Figure 51 (unless otherwise noted) MIN MAX UNIT I2C TIMING CHARACTERISTICS tR SCLK/SDATA rise time 300 ns tF SCLK/SDATA fall time 300 ns tW(H) SCLK pulse width, high tW(L) tSU(STA) 600 ns SCLK pulse width, low 1.3 μs Setup time for START condition 600 ns tH(STA) START condition hold time after which first clock pulse is generated 600 ns tSU(DAT) Data setup time 100 ns tH(DAT) Data hold time 0 ns tSU(STOP) Setup time for STOP condition 600 ns t(BUF) Bus free time between START and STOP condition 1.3 μs FSCL Clock Frequency 18 Submit Documentation Feedback 400 kHz Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 7.17 Trigger Timing Characteristics MIN tDELAY(TRG) MAX UNIT 0 750 µs –20% 20% 0 20.48 –20% 20% Time range, set through I2C register ADC_DELAY Trigger delay time accuracy Relative to typical value set through I2C NOM 2 tWAIT(TRG) Time range, set through I C register ADC_WAIT Trigger wait time accuracy 2 Relative to typical value set through I C ms 7.18 Dissipation Ratings θJA TA ≤ 55°C POWER RATING DERATING FACTOR ABOVE TA = 55°C 21.7°C/W 3.22 W 0.046 W/°C PACKAGE RTQ (1) (2) (1) (2) This data is based on using the JEDEC High-K board and the exposed die pad is connected to a Cu pad on the board. This is connected to the ground plane by a via matrix. The RTQ package MSL level: HIR3 at 260°C tsu(STA) tw(L) tw(H) tf tr SCL tr tf SDA START th(STA) SCL th(DAT) th(DAT) tsu(DAT) 1 2 3 STOP 7 8 9 ACK SDA START tsu(STOP) SCL 1 3 2 7 8 9 ACK SDA t(BUF) STOP Figure 1. I2C Timing Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 Submit Documentation Feedback 19 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com 7.19 Typical Characteristics 7.19.1 Power Path Management These curves were measured with application circuit shown in Figure 51 (unless otherwise noted). USB = 5 V, BAT = 3.3 V AC = 5 V, BAT = 3.3 V IBAT IBAT VAC VUSB VOUT VBAT VOUT Figure 2. Switching From AC to Battery on AC Removal VBAT Figure 3. Switching From USB to Battery on USB Removal 7.19.2 Linear Regulators 0, 1, 2 These curves were measured with the application circuit shown in Figure 51 (unless otherwise noted). 0.25 -0.500 VIN_LDO02 = 3.65 V, Load = 10 mA to 150 mA, CO(LDO02) = 1 mF 0.2 -0.600 Line Regulation - % Load Regulation - % -0.550 -0.650 -0.700 -0.750 0.15 0.1 -0.850 0 VIN_LDO02 = 3.8 V to 4.7 V, Load = 10 mA, CO(LDO02) = 1 mF 0.05 -0.800 20 40 60 80 100 120 0 140 0 TJ - Junction Temperature - °C 20 40 60 80 100 120 140 TJ - Junction Temperature - °C Figure 4. Load Regulation vs Junction Temperature Figure 5. Line Regulation vs Junction Temperature 3.5 140 LDO 0 VIN_LDO 02 = 3.3 V, Load = 150 mA, CO(LDO02) = 1 mF 130 Dropout Voltage - mV VO - Output Voltage - V 3 2.5 VIN_LDO 02 = 3.65 V, Load = 10 mA, VO(LDO 0) = 3.3 V, VO(LDO 1,2) = 1.225 V 2 120 110 100 90 LDO 1 LDO 2 1.5 80 70 1 0 20 40 60 80 100 120 140 0 20 Figure 6. Output Voltage vs Junction Temperature 20 Submit Documentation Feedback 40 60 80 100 120 140 TJ - Junction Temperature - °C TJ - Junction Temperature - °C Figure 7. Dropout Voltage vs Junction Temperature Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 7.19.3 Linear Regulators 3, 4, 5 These curves were measured with the application circuit shown in Figure 51 (unless otherwise noted). -0.010 -0.5 VIN_LDO 35 = 3 V, Load = 10 mA to 150 mA, CO(LDO 35) = 1 mF -0.55 -0.012 Line Regulation - % Load Regulation - % -0.6 VIN_LDO 35 = 3.3 V to 4.7 V, Load = 100 mA, CO(LDO 35) = 1 mF -0.011 -0.65 -0.70 -0.75 -0.80 -0.013 -0.014 -0.015 -0.85 -0.016 -0.90 -0.017 -0.95 -1 -0.018 0 20 40 60 80 100 TJ - Junction Temperature - °C 120 140 0 Figure 8. Load Regulation vs Junction Temperature 40 60 80 100 TJ - Junction Temperature - °C 120 140 Figure 9. Line Regulation vs Junction Temperature 1.2325 140 VIN_LDO35 = 4.7 V, Load = 10 mA, VO (LDO35) = 1.228 V, 1.232 130 CO(LDO35) = 1 mF 1.2315 VO - Output Voltage - V 20 Dropout - mV 1.231 1.2305 1.23 VIN_LDO35 = 3.3 V, Load = 150 mA, CO(LDO35) = 1 mF 120 110 1.2295 100 1.229 1.2285 0 40 20 60 80 100 120 90 0 140 20 TJ - Junction Temperature - °C 40 60 80 100 120 140 TJ - Junction Temperature - °C Figure 10. Output Voltage vs Junction Temperature Figure 11. Dropout Voltage vs Junction Temperature 7.19.4 SM1 and SM2 Buck Converters These curves were measured with the application circuit shown in Figure 51 (unless otherwise noted). 100 92 90 90 80 70 Efficiency - % Efficiency - % 88 86 84 82 60 50 40 30 VIN_SM2 = 4.6 V, VO (SM2) = 1.8 V, L = 3.3 mH. CO(SM2) = 10 mF 80 78 20 VIN_SM1 = 4 V, VO(SM1) = 1.24 V, 10 L = 3.3 mH, CO(SM1) = 10 mF 0 76 0 0.1 0.2 0.4 0.3 0.5 IO - Output Current - A 0.6 0.7 Figure 12. Efficiency in Automatic PWM/PFM Mode 0 0.1 0.2 0.3 0.4 IO - Output Current - A 0.5 0.6 Figure 13. PWM Mode Efficiency vs Output Current Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 Submit Documentation Feedback 21 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com SM1 and SM2 Buck Converters (continued) These curves were measured with the application circuit shown in Figure 51 (unless otherwise noted). AC = 5 V, VIN_SM2 = 4.6 V, VO(SM2 = 1.8 V AC = 5 V, VIN_SM2 = 4.6 V, VO(SM2 = 1.8 V IO(SM2) L = 3.3 mF, CO(SM2) = 10 mF IO(SM2) L = 3.3 mF, CO(SM2) = 10 mF Figure 14. PFM Operation 22 Submit Documentation Feedback Figure 15. PFM Low Ripple Operation Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 8 Detailed Description 8.1 Overview This power management IC (PMIC) integrates a battery charger, nine LDOs, two buck converters, a white LED driver, and an RGB driver in a 56-pin QFN package. 8.2 Functional Block Diagram TPS65810 AC OUT OUT USB BAT LDO_PM LDO_PM 3.3V 10 mA AGND1 SIM,RTC LDOS SIM OUT 1.8V/2.5V 8 mA OUT RTC_OUT OUT BAT BAT ON/OFF POWER PATH CONTROL LINEAR CHARGER SYSTEM POWER CHARGE MANAGEMENT AGND1 TS DPPM TMR ISET1 OUT AGND1 1.5V 8 mA AGND1 VIN_LDO2 LDO0,1,2 LDO0 3.3V 150 mA AGND1 LDO1 LDO2 1.25V-3.3V 150 mA LDO3 LDO4 PWM DRIVER PWM RGB DRIVER RED GREEN BLUE GPIO’S GPIO1 GPIO2 GPIO3 LED_PWM DISPLAY AND I /O OUT 1.25V-3.3V 150 mA L3 SM3 SM3_SW WHITE LED DRIVER AGND1 VIN_LDO35 FB3 PGND3 CONTROL LOGIC LDO3,4,5 1.224V-4.4V 100 mA VIN_SM1 DC/DC 0.6-1.8V 600 mA 1.224V-4.4V 100 mA L1 SM1 PGND1 VIN_SM2 LDO35_REF LDO5 1.224V-4.4V 100 mA L2 1.0V-3.4V 600 mA AGND2 SM2 OUT PGND2 6 INTERNAL CHANNELS HOST INTERFACE AND SEQUENCING SCLK SDAT INT SYS_IN HOT_RST RESPWRON TRSTPWON AGND0 DISPLAY AND I /O I2C INTERFACE AND INTERRUPT CONTROLLER AGND 1 ADC INTERNAL BIAS RESET CONTROLLER OUT REFERENCE SYSTEM AGND1 OUT AGND1 8 CHANNEL MUX ANLG1 A/D CONVERTER ADC_REF ANLG2 AGND2 AGND 0, AGND 1 AND AGND 2PINS SHORTED TO EACH OTHER INSIDE TPS 65800 . ALL AGND PINS ARE INTERNALLY CONNECTED TO THE TPS 65800 THERMAL PAD AND SUBSTRATE . PGND 1, PGND 3 AND PGND 3PINS ARE NOT CONNECTED TO EACH OTHER OR TO THE TPS 65800 SUBSTRATE / POWER PAD Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 Submit Documentation Feedback 23 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com 8.3 Feature Description 8.3.1 Interrupt Controller and System Sequencing 8.3.1.1 Overview The TPS65810 has two dedicated internal controllers that execute the host interface and system sequencing tasks: a sequencing controller and an interrupt controller. The sequencing controller monitors internal and system parameters and defines the sequencing of the internal power supplies during power-up, power-down, or power fault events, and executes specific internal power supply reset operations under external hardware control or host software commands. The following parameters are monitored by the sequencing controller: • System power bus voltage (at SYS_IN pin), input supply voltage, battery pack voltage • TPS65810 thermal fault status • Integrated supply status The interrupt controller monitors multiple system status parameters and signals to the host when one of the monitored parameters toggled, as a result of a system status change. The interrupt controller inputs include all the parameters monitored by the sequencing controller plus: • Charger status • Battery pack status • ADC status Internal I2C registers enable masking of all the monitored parameters. Using those registers, the host can select which parameters trigger an interrupt or a power-good fault. Power-good faults trigger a change in the TPS65810 operating mode, as detailed in the next sections. HOST INTERFACE AND SEQUENCING TPS65810 R4 R2 R3 R 5 Figure 16 shows a simplified block diagram for the TPS65810 sections that interface to the external host. SCLK SDAT INT I2 C ENGINE INTERRUPT CONTROLLER 2 .5 V I2C REGISTERS AND NON VOLATILE MEMORY AC /USB /BAT ( HIGHER VOLTAGE ) 2. 5 V HOST RESPWRON TRSTPWON SEQUENCING AND OPERATING MODE SETTING VSYS CONTROL LOGIC 1V HOT _ RST C TRSTPWON SYS _IN OUT A 1 R 6 R 7 100K R 1 C 16 V SM 2 A 1 Figure 16. Simplified Block Diagram 24 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 Feature Description (continued) 8.3.1.2 Interrupt Controller The TPS65810 has internal block and overall system status information stored in I2C status registers. The following subsystems and system parameters are monitored: • External power supply status: AC or USB supply detected, AC or USB connected to system, AC/USB OVP • Charger status: on, off, or suspend, fast charge or precharge, termination detected, DPPM on, thermal loop ON • Battery pack status: temperature, discharge on and off • TPS65810 thermal shutdown • ADC status: conversion status, input out of range, ANLG1 high impedance detection • Integrated supplies status: output out of regulation (power-good fault) The GPIO1 and GPIO2 pins can be configured as inputs, generating an interrupt request to the host (INT:HI→LO) at the GPIO rising or falling edge. The host can use internal the INT_MASK I2C registers to define which of the monitored status variables triggers an interrupt. When a non-masked system status bit toggles state, the interrupt controller issues an interrupt, following the steps below: 1. System status bits that caused the interruption are set to HI in registers INT_ACK1 and INT_ACK2 2. An interrupt is sent to the host (INT:HI→LO) When an interrupt is sent to the host, INT is kept in the LO state and the INT_ACK register contents are latched, holding the system status that generated the currently issued interrupt request. When an interrupt request is active (INT = LO) additional changes in non-masked status registers and control signals are ignored, and the INT_ACK registers are not updated. The host must write a 0 to the INT_ACK register bit that generated the interrupt to set INT = HI and enable new updates to the INT_ACK registers. If the host stops in the middle of a WRITE or READ operation, the INT pin stays at the LO level. The TPS65810 has no reset timeout; assume that the host does not leave INT = LO and the status registers unread for a long time. The non-masked I2C register bits and internal control signals generate a new interrupt only after INT is set to HI. The non-masked power-good fault register bits generate a power-good fault when any of the non-masked bits detects that the monitored output voltage is out of regulation, independently of the INT pin level. Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 Submit Documentation Feedback 25 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com Feature Description (continued) 8.3.1.3 System Sequencing and TPS65810 Operating Modes The TPS65810 has a state machine that controls the device power-up and power-down sequencing. Figure 17 is a state diagram which shows the main operating modes. POWER UP LOAD POWER UP DEFAULTS IN I2C REGISTERS CONNECT AC , USB OR BAT PIN TO OUT PIN V(AC) > VUVLO DISABLE POWER GOOD FAULT OR DETECTION V(USB) > VUVLO INT PIN = HIGH IMPEDANCE OR POR_FLAG= HI V(BAT ) > VUVLO OFF V(OUT) < VUVLO ANY STATE ENABLE STATE V(SYS_IN) < V(LOW_SYS) OR THERMAL FAULT OR I2C SOFT_RESET REGISTER BIT SLEEP_MODE = HI (SELF-CLEARED) RESPWRON = LO POWER UP DEFAULTS LOADED IN ALL I2C REGISTERS (Except INT_ACKn) V(SYS_IN) > V(LOW_SYS) AND V(OUT) > VUVLO POWER CYCLE AND SLEEP NOT SET BY THERMAL FAULT SEQUENCE STATE START INTEGRATED SUPPLY START - UP SEQUENCE RESPWRON = LO V(HOT_RESET) = HI OR I2C SOFT_RESET REGISTER BIT SOFT_RESET = LO (SELF CLEARED ) SLEEP STATE ONLY RTC_LDO IS ON POWER PATH ACTIVE RESPWRON = 0 REGISTER CONTENTS NOT RESET INTERRUPT CLEARED PGOOD FAULT RESET STATE POWER GOOD CHECK STATE STANDBY ON : SM1 AND SM2 SET IN STANDBY MODE BY GPIO OR I 2C COMMAND STANDBY OFF : SM1 AND SM2 EXIT STANDBY MODE BY GPIO OR I2C COMMAND RESET TIMER : VALUE SET BY CAPACITOR CONNECTED TO TRSTPWON PIN I2C SOFT_RESET BIT LOCATED IN SOFT_RESET REGISTER , BIT B0 RESPWRON=LO RESPWRON=LO START SYSTEM RESET PULSE TIMER WHEN HOT_RESET=HI RESET TIMER EXPIRES PGOOD FAULT : A NON- MASKED BIT OF THE POWER _GOOD I2C REGISTER TOGGLES FROM LO TO HI POWER DOWN RAILS, WAIT 5 msec V(HOT_RESET)=LO OR I2C SOFT_RESET REGISTER BIT SOFT_RST= HI PROCESSOR STANDBY STATE RESPWRON = HI PG FOR SM1&SM2 is masked RESPWRON=HI ENABLE POWER GOOD COMPARATORS INT PIN MODE SET BY INTERRUPT CONTROLLER NO PGOOD FAULT V(HOT_RESET)=LO OR I2C SOFT_RESET REGISTER BIT SOFT_RST = HI STANDBY ON STANDBY OFF NORMAL MODE RESPWRON=HI PGOOD FAULT Figure 17. TPS65810 State Diagram 8.3.1.3.1 Power Up If the AC, USB and BAT pin voltages are below the internal UVLO threshold VUVLO (2.5 V typical) all IC blocks are disabled and the TPS65810 is not operational, with all functions OFF. When an external power source or battery with voltage greater than the VUVLO voltage threshold is applied to AC/USB or BAT pins the internal TPS65810 references are powered up, biasing internal circuits. When all the main internal supply rails are active the TPS65810 I2C registers are set to the power-up default values, shown in Table 1. 26 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 Feature Description (continued) Table 1. Integrated Supply and Drivers I2C Registers Power-Up Defaults SUPPLY POWER-UP DEFAULT OTHER BLOCKS POWER-UP DEFAULT LDO0 OFF, 3.3 V POWER PATH INPUT TO SYSTEM LDO1 1.25V, OFF PWM OFF LDO2 3.3 V, OFF PWM_LED OFF LDO3 1.505 V, OFF GPIO1 INPUT, SM1 ON/OFF CONTROL LDO4 1.811 V, OFF GPIO2 INPUT, SM2 ON/OFF CONTROL LD05 3.111 V, ON GPIO3 INPUT SIM 2.5 V, ON ADC OFF RTC_OUT ON, 1.5 V SM3 (WHITE LED) OFF LDO_PM 3.3 V, ON at OUT POWERED RGB DRIVER OFF SM1 OFF, 1.24 V INTERRUPT MASK NONE MASKED SM2 OFF, 3.32 V POWER-GOOD MASK ALL MASKED CHARGER OFF After the internal I2C register power-up defaults are loaded the power path control logic is enabled, connecting the external power source to the OUT pin. A status flag (nRAMLOAD) is set to LO in the SOFT_RESET register, indicating that the I2C registers were loaded with the power-up defaults, and the TPS65810 enters the ENABLE state. 8.3.1.3.2 Enable In the ENABLE mode the RESPWRON output is set to the LO level, the INT pin mode is set to high impedance and all the power-good comparators that monitor the integrated supply outputs are disabled. The ENABLE mode is used by the TPS65810 to detect when the main system power rail (OUT pin) is powered and ready to be used on the internal supply power-up. The OUT pin voltage is sensed by an internal low-system-voltage comparator which holds the IC in the ENABLE mode until the system power-bus voltage (OUT pin) has reached a minimum operating voltage, defined by the user. The internal comparator senses the system voltage at pin SYS_IN, and the threshold for the minimum system operating voltage at the OUT pin is set by the external divider connected from OUT pin to SYS_IN pin. The threshold voltage is calculated in Equation 1. æ R6 ö V(OUT) = V(LOW _ SYS) ´ ç 1 + R1 ÷ø è where • • R6 and R1 are external resistors V(LOW_SYS) = 1 V (typical) (1) The minimum system operating voltage must always be set above the internal UVLO threshold VUVLO. In normal application conditions the minimum system operating voltage is usually set to a value that assures that the TPS65810 integrated regulators are not operating in the dropout region. When the voltage at the SYS_IN pin exceeds the internal threshold V(LOW_SYS) the TPS65810 device is ready to start the system power sequencing, and the SEQUENCING mode is entered. 8.3.1.3.3 Sequencing The sequencing state starts immediately after the enable state. In this mode of operation the integrated supplies are turned ON. The TPS65810 sequencing timing diagram shown in Figure 18 details the internal timing delays and supply sequencing. At the end of the sequencing state the user-programmable reset timer is started, and the TPS65810 enters the reset state. Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 Submit Documentation Feedback 27 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com Power Applied AC, USB or BAT VUVLO OUT VUVLO SYS_IN VLOW_SYS RTC_OUT LDO1 LDO2 LDO4 LDO5 See Note 2 LDO3 SM1 See Note 1 SM2 See Note 1 HIGH IMPEDANCE INT HIGH IMPEDANCE HIGH IMPEDANCE RESPWRON RESET DELAY PROGRAMMED BY EXTERNAL CAPACITOR CONNECTED TO PIN TRSTPWON SEQUENCING NO POWER RESET NORMAL ENABLE 2 I C Registers Loaded From EEPROM (1) SM1 and SM2 are externally enabled by GPIO1 and GPIO2. This waveform represents the earliest time that SM1 and SM2 are enabled if GPIO1 and GPIO2 are tied high. (2) LDO5, SM1, and SM2 are all enabled at the same time. This waveform represents the earliest time that LDO5 is enabled if VIN_LDO35 is connected to OUT. LDO5 power up can be synchronized to SM1 or SM2 by connecting VIN_LDO35 to the SM1 or SM2 output, respectively. Figure 18. TPS65810 Supply Sequencing Timing 8.3.1.3.4 Reset When the reset state starts the RESPWRON output is LO. The user can program the reset timer value by selecting the value of the external capacitor connected to pin TRSTPWON, as shown in Equation 2. T(RESET) = KRESET °CTRSTPWON where • 28 KRESET is the reset timer constant (1 ms/nF typical) Submit Documentation Feedback (2) Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 The TPS65810 RESPWRON pin must be used to reset the external host. During the external host reset (RESPWRON = LO) the I2C SDA and SCL pins are not used to access TPS65810 internal registers. If a nonstandard configuration is used to reset the system the SDA and SCL lines must not be used to communicate with the TPS65810 until RESPWRON = HI, to avoid overwriting the integrated power supply internal power-up settings during the sequencing mode. The power-good comparators are masked during the reset mode. The reset mode ends when the reset timer expires, and the TPS65810 goes into the power-good check mode. The RESPWRON signal set to a high level is the proper signal to use as an indicator that the device has transitioned out of the reset state. During the power-up sequence the RESPWRON pin is asserted LOW until the RESET TIMER expires. The RESET TIME (treset = 1ms/nF × CTRSTPWON) can be programmed through a capacitor between the TRSTPWON pin and ground. When the RESPWRON signal is LO, all internal and external interrupts are ignored. As a result, the open-drain output that asserts the INT pin LO during a NORMAL MODE interrupt request is disabled. The INT pin is then asserted HI through a pullup resistor that is typically connected to VOUT. After the RESPWRON signal goes HI, the interrupt controller is given control of the INT pin. Finally, the rising edge of the RESPWRON pin must be used to indicate the PMIC has transitioned from the RESET STATE to the POWER-GOOD CHECK STATE. At that point, the interrupt controller asserts an interrupt if necessary. 8.3.1.3.5 Power-Good Check In the power-good check mode the power-good comparators are enabled, providing status on the integrated supplies output voltages. An output voltage is considered as out of regulation and generates a fault condition if the output voltage is below 90% of the target output voltage regulation value. If a power-good fault is detected the SLEEP mode is set, if a power-good fault is not detected the NORMAL mode is set. The individual supply power-good status can be masked through an I2C register PGOODFAULT_MASK. Supplies that have their power-good fault status masked do not generate a power-good fault. However, the status bit for the supply indicates that the output voltage is out of regulation. The power-good mask register bits default to masked upon power up. 8.3.1.3.6 Sleep Mode The SLEEP mode is set when a thermal fault or system low voltage fault is detected, under NORMAL operation mode set. This operation mode is also set when a power-good fault is detected during the power-good check state or the I2C bit SLEEP_MODE. In the SLEEP mode the RESPWRON output is set to LO, and the I2C registers keep the same contents as in the state preceding SLEEP mode, with the exception of the following control bits, which are reset to the default power-up values: 1. LDO1,2,3,4,5 and RTC_OUT are enabled, SIM LDO is disabled: EN_LDO register set to default values 2. LDO0 disabled, all GPIOs with no control function assigned: GPIO12, GPIO3 registers set to default values 3. White LED driver is set to OFF: SM3_SET register has all bits set to LO 4. RGB drivers are set to OFF: RGB_FLASH, RGB_RED, RGB_GREEN, RGB_BLUE registers are set to default values 5. PWM, PWM_LED drivers OFF: PWM, LED_PWM registers are set to default values 6. ADC engine reset to power-up default: ADC_SET, ADC_DELAY, ADC_WAIT registers are set to default values NOTE In SLEEP mode the power path and main internal blocks are still active, but the internal integrated supply sequencing is disabled. As a result of that, during SLEEP mode ALL integrated supplies (ALL LDO's, ALL buck Converters) are disabled. At the end of the SLEEP mode, the sequencer block uses the I2C control register values (which were reset to the default power-up values) to sequence the integrated power supplies. The SLEEP mode ends when one of the three following events occurs: 1. If SLEEP was set by thermal fault: The SLEEP mode ends only when all external input supplies and battery pack are removed and a UVLO condition is detected by the TPS65810, setting the NO POWER mode. Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 Submit Documentation Feedback 29 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com 2. If SLEEP was set by a system low voltage detection, or I2C bit SLEEP_MODE, only with battery present: Input power must be connected, setting the TPS65810 in the ENABLE mode. If no input power is inserted, the battery discharges until the TPS65810 detects a UVLO condition and enters the NO POWER mode. 3. If sleep was set by a system low voltage detection, power-good fault or SLEEP_MODE, with battery and input power present: all external input supplies connected to AC and USB pins must be removed, and then at least one of them reconnected to the system. The input power cycling triggers a transition from SLEEP mode to the ENABLE mode. 8.3.1.3.7 Normal Mode If a power-good fault is not present at the end of the power-good check mode the NORMAL mode starts. In this mode of operation the I2C registers define the TPS65810 operation, and the host has full control on operation modes, parameter settings, and so forth. The normal state operation ends if a thermal fault, system low voltage fault (V(SYS_IN) < VLOW_SYS) or power-good fault is detected. A thermal fault or system low voltage fault sets the SLEEP mode operation, a power-good fault sets the NO POWER operation mode. From the normal mode the converters SM1 and SM2 can be set in the STANDBY mode, with reduced output voltages. In NORMAL mode either an I2C register bit (SOFT_RESET register bit SOFT_RST) or a hardware input ( HOT_RESET pin set to LO) can trigger a transition to the RESET state, enabling implementation of a host reset function. In NORMAL mode an I2C register bit (SOFT_RESET register bit SLEEP_MODE) can trigger a transition to SLEEP mode. 8.3.1.3.8 Processor Standby State This state is set using an I2C register or a GPIO configured as SM1 and SM2 stand-by control. In stand-by mode operation, the SM1 and SM2 voltages are set to value distinct than the normal mode output voltage, and SM1/SM2 are set to PFM mode. The stand-by output voltage is defined in I2C registers SM1_STANDBY and SM2_STANDBY. 8.3.1.4 TPS65810 Operating Mode Controls The three operating mode controls are defined as follows: HARDWARE RESET A dedicated control pin, HOT_RESET, enables implementation of a hardware reset function. The system reset pin RESPWRON is set to LO when HOT_RESET = LO for a period longer than the internal deglitch (5 ms typical). The RESET mode is started when the HOT_RESET pin transitions from LO to HI, as shown in the state diagram. When HOT_RESET = LO all I2C registers are reset to the default power-up values. SOFTWARE RESET The external host can set the TPS65810 device in RESET mode using the I2C register SOFT_RESET, bit B0 (SOFT_RST). SOFTWARE SLEEP The external host can set the TPS65810 in SLEEP mode using the I2C register SOFT_RESET, bit B6 (SLEEP_MODE). A software reset does not affect the contents of the I2C registers. 8.3.1.5 Functionality Reference Guide – Host Interface and System Sequencing Table 2. Interrupt Controller, Open-Drain Output (INT) SYSTEM PARAMETERS MONITORED BY THE INTERRUPT CONTROLLER SUPPLY OUTPUT POWER-GOOD FAULT DETECTION (1) SYSTEM STATUS MODIFICATION ADC STATUS CHARGER STATUS TRANSITION INPUT AND OUTPUT POWER TRANSITION SM1, SM2, SM3, LDO1, LDO2, LDO3, LDO4, LDO5 Thermal Fault or GPIO 1,2 configured as external interrupt request ADC conversion end ADC Input out of range External resistive load connected to ANLG1 Charge: Pre↔ Fast ↔Done DPPM:on ↔ off Charge Suspend: on ↔ off Thermal Foldback: on ↔ off AC detected: yes ↔ no USB detected: yes ↔ no Input OVP: yes ↔ no System Power: AC ↔ USB Can be masked Individually through I2C. Blanked during initial power up (1) 30 Can be masked Individually through I2C POWER UP DEFAULT All interrupt controller inputs set to non-masked Can be masked as a group through a single I2C mask register bit For all supplies (except) for SM3 an output fault is detected if the output voltage is below 90% of the programmed regulation voltage. In the SM3 converter an output fault indicates that the output OVP threshold was reached. Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 Table 3. Events Triggering TPS65810 Operating Mode Changes POWER-GOOD FAULT DETECTION (1) EVENT How transition is triggered Operating mode change Controls HARDWARE RESET SOFTWARE RESET Integrated regulator output voltage Internal IC junction below target value: SM1, SM2, SM3, temperature LDO1, LDO2,LDO3, LDO4, LDO5 Using HOT_RST control pin I2C register control bit Sets Sleep mode or starts a new power-up cycle when power-good fault is detected (see state machine diagram). Sets Sleep mode when thermal fault is detected Generates external host reset pulse at pin RESPWON when HOT_RST = LO. Generates external host reset pulse at pin RESPWON when I2C control bit is set. Power-good fault detection comparators are blanked during initial power-up. Input and Battery power cycling required to exit sleep Pulse duration set by external capacitor. Pulse duration set by external capacitor. Can be masked Individually through I2C. Fixed Internal Threshold External Input Set through I2C 100K 2K R2 TPS 65810 HOST INTERFACE AND SEQUENCING R4 R3 R5 2K For all supplies (except) for SM3 an output fault is detected if the output voltage is below 90% of the programmed regulation voltage. In the SM3 converter an output fault indicates that the output OVP threshold was reached. 100K (1) THERMAL FAULT SCLK SDAT I2C ENGINE INTERRUPT CONTROLLER HOST INT RESPWRON TRSTPWON STATE MACHINE AND RESET CONTROLLER HOT_RST C TRSTPWON 0 .1 uF SYS_IN OUT V SM2 R6 R1 R7 100K A1 210 K C 16 100 nF 100 K A1 A1 Figure 19. Required External Components, Recommended Values, External Connections 8.3.2 Power Path and Charge Management 8.3.2.1 Overview The TPS65810 has an integrated charger with power path integrated MOSFETs. This topology, shown in Figure 20, enables using an external input power to run the system and charge the battery simultaneously. The power path has dual inputs that can be used to select either an external AC_DC adapter (AC pin) or an USB port power (USB pin) to power the end equipment main power rail (OUT pin, also referred to as the system power bus) and charge the battery pack (connected to BAT pin). Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 Submit Documentation Feedback 31 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com OUTSHORT 500Ω AC OUT I(AC) AC SWITCH OUTSHORT I(AC) / K INTAC BATSHORT 500 I(USB) USB SWITCH AC Control Loops I(USB) / K INTUSB V(OUT) 1 kΩ USB ACOFF BATOFF VO(REG) System Voltage Regulation Loop USBOFF BATTERY SWITCH I (BAT ) AC Input Current Limit Loop V (ACOC) V(USB1) V(USB2) BAT USB Control Loops BAT DISCHARGE CIRCUIT USB Input Current Limit Loop INPUT_LIM V(OUT) I(OUT) / K (SET) VO(REG) System Voltage Regulation Loop ISET1 V(ISET1) Charge Voltage Loop V (PRECHG) VREF V (SET) SCALING CHMODE DPPM V(BAT) Charge Current Loop V O(REG) V (DPPM) ATTENUATION TJ DPPM Loop VREF TMR VREF Dynamically Controlled Oscillator Timer Fault TJ(REG) Thermal Loop Charger Control Loops CONTROL SIGNALS On, Reset CHARGE CONTROL AND POWER PATH MANAGEMENT TS BAT ISET1 BATTERY STATUS DETECTION BATTERY STATUS CE CHG_UVLO LATCH SYSTEM STATUS DETECTION SYSTEM STATUS USB AC OUT CE System Power Selection Input Current Limit Selection I2C REGISTERS Charger Status Input Power Status Charge Voltage Fast Charge Current Scaling Charge Suspend TPS65810 Figure 20. TPS65810 Charger and Power Path Section Simplified Block Diagram The power path has three integrated power MOSFETs: the battery to system MOSFET (battery switch), the AC input to system MOSFET (AC switch) and the USB input to system MOSFET (USB switch). Each of those power MOSFETs can be operated either as an ON/OFF switch or as a linear pass element under distinct operating conditions, as defined by the control circuits that set the power MOSFET gate voltage. The TPS65810 regulates the voltage at the OUT pin to 4.6 V when one of the external supplies connected to pins AC or USB is powering the OUT pin. The selected input (AC or USB pin) current is limited to a value defined by I2C register settings. The input current limit function assures compatibility with USB standard requirements, and also implements a protection function by limiting the maximum current supplied by an external AC_DC adapter or USB port power terminal. 32 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 The AC power MOSFET and USB power MOSFET operating modes are set by integrated control loops. Each of the power MOSFETs is controlled by two loops: one system voltage regulation loop and one input current limiting loop. The integrated loops modulate the AC or USB power MOSFETs drain to source resistance to regulate either the OUT pin voltage or to limit the input current. If no input power is present (AC and USB input power not detected) the AC and USB power MOSFETs are turned OFF, and the battery MOSFET is turned ON, connecting the BAT pin to the OUT pin. The battery switch is turned ON when the AC or USB input power is detected and the charger function is enabled, charging the battery pack. During charge the battery MOSFET switch operation mode is defined by the charger control loops. The battery MOSFET switch drain-to-source resistance is modulated by the charge current loop and charge voltage loop to implement the battery charging algorithm. In addition to that multiple safety functions are activated (thermal shutdown, safety timers, short-circuit recovery), and additional functions (thermal loop and DPPM loop) optimize the charging process. 8.3.2.2 Power Path Management Function 8.3.2.2.1 Detecting the System Status The power path and charge management block operate independently of the other TPS65810 circuits. Internal circuits check battery parameters (pack temperature, battery voltage, charge current) and system parameters (AC and USB voltage, battery voltage detection), setting the power path MOSFETs operating modes automatically. The TPS65810 has integrated comparators that monitor the battery voltage, AC pin voltage, USB pin voltage and the OUT pin voltage. The data generated by those comparators is used by the power path control logic to define which of the integrated power path switches are active. Figure 21 shows a simplified block diagram for the system status detection. AC AC DETECTED BAT DPPM NO BATT SHORT AC OVP VOVP USB 1V USB DETECTED BAT USB OVP VOVP VOUTSH POWER PATH CONTROL LOGIC OUT SHORTED OUT BAT SHORTED VBATSH BAT BAT OUT LOWER THAN BAT OUT Figure 21. TPS65810 Systems Status Detection, Charger and Power Path Section Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 Submit Documentation Feedback 33 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com Table 4 lists the system power detection conditions. VIN(DT), VOUTSH, VBATSH, VOVP are the TPS65810 internal references, refer to the electrical characteristics in the Specifications section for additional details. Table 4. System Status Detection, Charger and Power Path Section SYSTEM STATUS DETECTION CONDITION AC input voltage detected V(AC) – V(BAT) > VIN(DT) USB input voltage detected V(USB) – V(BAT) > VIN(DT) AC overvoltage detected V(AC) > VOVP USB overvoltage detected V(USB) > VOVP AC PIN TO OUT pin OR USB TO OUT PIN short detected V(OUT) < VINOUTSH BAT pin to OUT pin short detected V(BAT) - V(OUT) > VBATOUTSH Battery supplement mode need detected V(BAT) – V(OUT) > VSUP Blank BAT to OUT short circuit detection V(DPPM) < 1V 8.3.2.2.2 Power Path Logic: Priority Algorithm The system power bus supply is automatically selected by the power path control logic, following an internal algorithm. The power path function detects an external input power connection when the input voltage exceeds the battery pack voltage. It also detects a supplement mode need (battery switch must be turned ON) when the system voltage (OUT pin) is below the battery voltage. A connected and non-selected external supply or the battery is automatically switched to the system bus, following the priority algorithm, when the external supply currently selected is disconnected from the system. The input power priority is hard-wired internally, with the AC input having the higher priority, followed by the USB input (2nd) and the battery pack (3rd). Using the I2C CHG_CONFIG register control bit CE the user can override the power path algorithm, connecting the battery to the system power bus. Take care when using the battery-tosystem connection option, as the system power bus is not connected back to the AC or USB inputs (even if those are detected) when the battery is removed. Table 5 describes the priority algorithm. Table 5. Power Path Control Logic Priority Algorithm EXTERNAL SUPPLY DETECTED CE BIT (I C CHG_CONFIG Register) 2 AC HI LO SWITCH MODE USB AC USB SYSTEM POWER SOURCE BATTERY YES NO ON OFF AC NO YES OFF ON USB YES YES ON OFF NO NO OFF OFF XX XX OFF OFF ON if Supplement mode is required, OFF otherwise AC BATTERY ON BATTERY The power path status is stored in register CHG_STAT. 8.3.2.2.3 Input Current Limit The USB input current is limited to the maximum value programmed by the host, using the I2C interface. If the system current requirements exceed the input current limit, the output voltage collapses, the charge current is reduced, and finally, the supplement mode is set. The input current limit value is set with the I2C charge control register bits PSEL and ISET2, and it is applied to the USB input ONLY. The AC input current limit is fixed to the internal short circuit limit value. Table 6. Charge-Current Scaling Through I2C 34 INPUT CURRENT LIMIT PSEL (I2C) ISET2 (I2C) USB AC LO LO 100 mA 2.75 A LO HI 500 mA 2.75 A HI LO 2.75 A 2.75 A HI HI 2.75 A 2.75 A Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 8.3.2.2.4 System Voltage Regulation The system voltage is regulated to a fixed voltage when one of the input power supplies is connected to the system. The system voltage regulation is implemented by a control loop that modulates the selected switch Rds(on). The typical system regulation voltage is 4.6 V. 8.3.2.2.5 Input Overvoltage Detection The AC and USB input voltages are monitored by voltage comparators that identify an overvoltage condition. If an overvoltage condition is detected a status register bit is set, indicating a potential fault condition. When an overvoltage condition is detected, the AC or USB switches state is not modified. If any of those switches was ON, it is kept in the ON state. During overvoltage conditions, the system voltage is still regulated, and no major safety issues are observed when not modifying the input switch state. If the input overvoltage condition results in excessive power dissipation, the thermal shutdown circuit is activated, the AC and USB switches are turned OFF, and the BAT switch is turned ON. 8.3.2.2.6 Output Short-Circuit Detection If the OUT pin voltage falls below an internal threshold VINOUTSH the AC and USB switches are turned off and internal pullup resistors are connected from AC pin to OUT pin and USB pin to OUT pin. When the short circuit is removed those resistors enable the OUT pin voltage to rise above the VINOUTSH threshold, returning the system to normal operation. 8.3.2.2.7 Battery Short-Circuit Detection If the OUT pin voltage falls below the BAT pin voltage by more than an internal threshold VBATOUTSH the battery switch is turned off and internal pullup resistor is connected between the OUT pin and the BAT pin. This resistor enables detection of the short removal, returning the system to normal operation. 8.3.2.2.8 Initial Power Path Operation During the initial TPS65810 power-up the contents of the ISET2, CE and SUSPEND bits on the control register are immediately implemented. The charger is disabled (SUSPEND=LO) and the selected input current limit is set internally to 500 mA max. 8.3.2.2.9 No-Battery Detection Circuit The ANLG1 pin may be used to detect the connection of an external resistor that is embedded in a battery pack and is used as a pack ID function. The ANLG1 pin has an internal current source connected between OUT and ANLG1, which is automatically enabled when the TPS65810 is not in SLEEP mode. The current levels for ANLG1 pin can be programmed through I2C register ADC_WAIT, bits BATID_n, as shown in Figure 22. OUT BAT 2 IC V(OUT) - V(NOBATID) _ + TPS65810 ANLG 1 PACK ID Resistor Battery Figure 22. Battery Removal Detection, ANLG1 Pin Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 Submit Documentation Feedback 35 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com An internal comparator with a fixed deglitch time, t DGL(NOBAT) monitors the ANLG1 pin voltage, if V(ANLG1) > V(OUT) – VNOBATID, a battery removed condition is detected and an internal discharge switch is activated, connecting an internal resistor from BAT pin to AGND1. Note that ANLG1 can also be used as an analog input for the ADC converter, in this case the voltage at pin ANLG1 must never exceed the V(OUT) – VNOBATID, threshold to avoid undesired battery discharge. 8.3.2.2.10 Using the Input Power to Run the System and Charge the Battery Pack The external supply connected to AC or USB pins must be capable of supplying the system power and the charger current. If the external supply power is not sufficient to run the system and charge the battery pack the TPS65810 executes a two-stage algorithm that prevents a low voltage condition at the system power bus: 1. The charge current is reduced, until the total (charger + system current) is at a level that can be supplied by the external input supply. This function is implemented by a dedicated charger control loop (see Dynamic Power Path Management for additional details). 2. The battery switch is turned ON if the charge current is reduced to zero and the input current is not enough to run the system. In this mode of operation both the battery and the external input power supply the system power ( supplement operation mode). The supplement operation mode is automatically set by the TPS65810 when the input power is switched to the OUT pin, and the OUT pin voltage falls below the battery voltage. 8.3.2.3 Battery Charge Management Function 8.3.2.3.1 Operating Modes The TPS65810 supports charging of single-cell Li-Ion or Li-Pol battery packs. The charge process is executed in three phases: precharge (or preconditioning), constant current and constant voltage. The charge parameters are selectable through I2C interface and using external components. The charge process starts when an external input power is connected to the system, the charger is enabled by the I2C register CHG_CONFIG bits CE = HI and CHGON = HI, and the battery voltage is below the recharge threshold, V(BAT) < V(RCH). When the charge cycle starts a safety timer is activated. The safety timer timeout value is set by an external resistor connected to the TMR pin. When the charger is enabled two control loops modulate the battery switch drain to source impedance to limit the BAT pin current to the programmed charge current value (charge current loop) or to regulate the BAT pin voltage to the programmed charge voltage value (charge voltage loop). If V(BAT) < 3 V (typical) the BAT pin current is internally set to 10% of the programmed charge current value. Figure 23 shows a typical charge profile for an operation condition that does not cause the IC junction temperature to exceed 125°C (typical). VO(BATREG) Preconditioning Phase Current Regulation Phase Voltage Regulation and Charge Termination Phase DONE IO(BAT) Battery Current, I(BAT) FAST-CHARGE CURRENT Charge Complete Status, Charger Off Battery voltage, V(BAT) V(LOWV) IO(PRECHG) , I(TERM) PRE-CHARGE CURRENT AND TERMINATION THRESHOLD T(PRECHG) T(CHG) DONE Figure 23. Typical Charge Cycle, Thermal Loop not Active 36 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 If the operating conditions cause the IC junction temperature to exceed 125°C the charge cycle is modified, with the activation of the integrated thermal control loop. The thermal control loop is activated when an internal voltage reference, which is inversely proportional to the IC junction temperature, is lower than a fixed, temperature stable internal voltage. The thermal loop overrides the other charger control loops and reduces the charge current until the IC junction temperature returns to 125°C, effectively regulating the IC junction temperature. OUT VREF Thermal Loop VTJ Battery Switch I(BAT) BAT I(OUT)/K(SET) ISET 1 Charge Voltage Loop V(OUT) V(BAT) VO(REG) VO(REG) System Voltage Regulation Loop Figure 24 shows a modified charge cycle, with the thermal loop active. VO(BATREG) Preconditioning Phase Current Thermal Regulation Regulation Phase Phase Voltage Regulation and Charge Termination Phase DONE IO(BAT) Battery Current, I(BAT) FAST-CHARGE CURRENT Battery Voltage, V(BAT ) PRE-CHARGE CURRENT AND TERMINATION THRESHOLD Charge Complete Status, Charger Off V(LOWV) IO(PRECHG) , I(TERM) T(THREG) IC Junction Temperature, Tj T(PRECHG) T(CHG) DONE Figure 24. Typical Charge Cycle, Thermal Loop Active Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 Submit Documentation Feedback 37 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com 8.3.2.3.2 Battery Preconditioning The TPS65810 applies a precharge current Io(PRECHG) to the battery if the battery voltage is below the V(LOWV) threshold, preconditioning deeply discharged cells. The charge current loop regulates the ISET1 pin voltage to an internal reference value, V(PRECHG). The resistor connected between the ISET1 and AGND pins, RSET, determines the precharge rate. The precharge rate programmed by RSET is always applied to a deeply discharged battery pack, independently of the input power selection (AC or USB). Use Equation 3 to calculate the precharge current. V(PRECHG) ´ K (SET) IO(PRECHG) = RSET where • • K(SET) is the charge current scaling factor V(PRECHG) is the precharge set voltage (3) 8.3.2.3.3 Constant Current Charging The constant charge current mode (fast charge) is set when the battery voltage is higher than the precharge voltage threshold. The charge current loop regulates the ISET1 pin voltage to an internal reference value, VSET. The fast charge current regulation point is defined by the external resistor connected to the ISET1 pin, RSET, as shown in the following: V(SET) ´ K (SET) IO(BAT) = RSET where • • V(SET) (2.5 V typical) is the voltage at ISET1 pin during charge current regulation K(SET) = charge- current scaling factor (4) The reference voltage V(SET) can be reduced through I2C register CHG_CONFIG bits ISET1_1 and ISET1_0. V(SET) can be selected as a percentage (75%, 50% or 25%) of the original 2.5 V typ, non-attenuated V(SET) value, effectively scaling down the charge current. The ISET1 resistor always sets the maximum charge current if the AC input is selected. When the USB input is selected, the maximum charge current is defined by the USB input current limit and the programmed charge current. If the USB input current limit is lower than the IO(OUT) value, the battery switch is set in the dropout region and the charge current is defined by the input current limit value and system load, as shown in Figure 25. I(USB) 2 .75 A BATTERY CHARGE CURRENT INPUT CURRENT 500 mA 750 mA 800 mA (800 mA DEFINED BY RSET VALUE) 300 mA I(OUT ) SYSTEM LOAD 200 mA BATTERY CHARGING, USB INPUT LIMIT SET TO 2.75 A -250 mA BATTERY DISCHARGING, SUPPLEMENT MODE SET BATTERY CHARGING, INPUT LIMIT SET TO 500 mA Figure 25. Input Current Limit Impact on Effective Charge Current 38 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 8.3.2.3.4 Charge Termination and Recharge The TPS65810 monitors the charging current during the voltage regulation phase. Charge is terminated when the charge current is lower than an internal threshold, set to 10% (typical) of the fast charge current rate. The termination point applies to both AC and USB charging. Use Equation 5 to calculate the termination point, I(TERM). V(TERM) ´ K (SET) I(TERM) = RSET where • V(TERM) is the termination detection voltage reference (5) The voltage at ISET1 pin is monitored to detect termination, and termination is detected when V(SET1) < V(TERM) (0.25 V typical). The voltage reference V(TERM) is internally set to 10% of the V(SET) reference voltage, and it is modified if the reference voltage V(SET) is scaled through I2C register CHG_CONFIG bits ISET1_1 and ISET1_0. V(TERM) is reduced by the same percentage used to scale down V(SET). Table 7 lists the charge current and termination thresholds for a 1-A charge current set (1-kΩ resistor connected to ISET1 pin), with the selected input current limit set to a value higher than the programmed charge current. The termination current is scaled for all charge current modes (AC or USB), as it is always set by the ISET1 pin external resistor value. Table 7. Charge Current and Termination Threshold Selection Example CHARGE CONTROL REGISTER BITS ISET1_1 ISET1_0 CHARGE CURRENT, (% OF TYPICAL VALUE PROGRAMMED BY ISET1 RESISTOR) 0 0 25% 0 1 50% 1 0 75% 1 1 100% V(TERM) (mV) CHARGE CURRENT (A) TERMINATION CURRENT (mA) 0.6 60 0.24 20 1.25 115 0.5 40 1.9 160 0.78 60 2.5 250 1 100 V(SET) (V) When the termination is detected, a new charge cycle starts if the voltage on the BAT pin falls below the V(RCH) threshold. A new charge start is also triggered if the charger is enabled, disabled, or re-enabled through I2C (CHG_CONFIG register bits CE or CHGON), or if both AC and USB input power are removed and then at least one of them is re-inserted. The termination is disabled when the thermal loop OR DPPM loop are active, and during supplement mode. 8.3.2.3.5 Battery Voltage Regulation, Charge Voltage The voltage regulation feedback is Implemented by sensing the BAT pin voltage, which is connected to the positive side of the battery pack. The TPS65810 monitors the battery-pack voltage between the BAT and AGND1 pins, when the battery voltage rises to the VO(REG) threshold the voltage regulation phase begins and the charging current tapers down. The charging voltage can be selected as 4.2 V or 4.365 V (typical). The default power-up voltage is 4.2 V. As a safety measure the 4.365 V charge voltage is programmed only if two distinct bits are set through I2C: VCHG=HI in the CHG_CONFIG, and CHG_VLTG=LO in the GPIO3 register. 8.3.2.3.6 Temperature Qualification The TPS65810 charger section does not monitor the battery temperature. This function may be implemented by an external host, which can measure the pack temperature by monitoring the ADC channel connected to the TS pin. An external pullup resistor must be connected to the TS pin to bias the pack thermistor, as the TPS65810 device has no internal current source connected to the TS pin. 8.3.2.3.7 Dynamic Power Path Management Under normal operating conditions, the OUT pin voltage is regulated when the AC or USB pin is powering the OUT pin and the battery pack is being charged. If the total (system + charge current) exceeds the available input current, the system voltage drops below the regulation value. Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 Submit Documentation Feedback 39 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com The dynamic power path management function monitors the system output voltage. A condition where the external input supply rating has been exceeded or the input current limit has been reached is detected when the OUT pin voltage drops below an user-defined threshold, VDPPM. Use Equation 6 to calculate the value of VDPPM. VDPPM = RDPPM ´ KDPPM ´ IDPPM where • • • RDPPM = external resistor connected to DPPM pin KDPPM = DPPM scaling factor IDPPM = DPPM pin internal current source (6) To correct this situation the DPPM loop reduces the charge current, regulating the OUT pin voltage to the userdefined VDPPM threshold. The DPPM loop effectively identifies the maximum current that can be delivered by the selected input and dynamically adjusts the charge current to guarantee that the end equipment is always powered. To minimize OUT voltage ripple during DPPM operation the VDPPM threshold must be set just below the system regulation voltage. If the charge current is reduced to zero by the DPPM and the input current is still lower than the OUT pin load, the output voltage falls below the DPPM threshold, decreasing until the battery supplement mode is set [V(OUT) = V(BAT) – VSUP(DT) ]. 8.3.2.3.8 Charger Off Mode The TPS65810 charger circuitry enters the low-power OFF mode if both AC and USB power are not detected. This feature prevents draining the battery during the absence of input supply. 8.3.2.3.9 Precharge Safety Timer The TPS65810 device activates an internal safety timer during the battery preconditioning phase. The precharge safety timer time-out value is set by the external resistor connected to TMR pin, RTMR, and the timeout constants KPRE and KTMR. Use Equation 7 to calculate the timeout value value of the precharge safety timer. TPRECHG = KPRE × RTMR × KTMR (7) The KPRE constant typical value is 0.1, setting the precharge timer value to 10% of the charge safety timer value. When the charger is in suspend mode, set through I2C register CHG_CONFIG bit CHGON or set by a pack temperature fault, the precharge safety timer is put on hold (that is, charge safety timer is not reset). Normal operation resumes when the charger exits the suspend mode. If V(BAT) does not reach the internal voltage threshold VPRECHG within the precharge timer period a fault condition is detected and the charger is turned off. If the TMR pin is left floating, an internal resistor of 50 KΩ (typical) is used to generate the time base used to set the precharge timeout value. The typical precharge timeout value can be then calculated using Equation 8. TPRECHG = KPRE × 50K × KTMR (8) 8.3.2.3.10 Charge Safety Timer As a safety mechanism the TPS65810 has a user-programmable timer that measures the total fast charge time. This timer (charge safety timer) is started at the end of the preconditioning period. The safety charge timeout value is set by the value of an external resistor connected to the TMR pin RTMR). Use Equation 9 to calculate the charge safety timer time-out value. TCHG = KTMR × RTMR (9) 2 When the charger is in suspend mode, set through I C register CHG_CONFIG bit CHGON or set by a pack temperature fault, the charge safety timer is put on hold (that is, charge safety timer is not reset). Normal operation resumes when the charger exits the suspend mode. If charge termination is not reached within the timer period a fault condition is detected, and the charger is turned off. The charge safety timer is held in reset if the TMR pin is left floating. Under this mode of operation an internal resistor, 50 kΩ typical, sets the internal charger and power path deglitch and delay times, as well as the precharge safety timer timeout value. 40 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 8.3.2.3.11 Timer Fault Recovery The TPS65810 provides a recovery method to deal with timer fault conditions. The following summarizes this method: • Condition 1: Charge voltage above recharge threshold, V(RCH), and timeout fault occurs. Recovery method The IC waits for the battery voltage to fall below the recharge threshold. This could happen as a result of a load on the battery, self-discharge or battery removal. When the battery falls below the recharge threshold, the IC clears the fault and starts a new charge cycle. • Condition 2: Charge voltage below recharge threshold,V(RCH), and timeout fault occurs. Recovery method Under this scenario, the IC connects an internal pullup resistor from OUT pin to BAT pin. This pullup resistor is used to detect a battery removal condition and remains on as long as the battery voltage stays below the recharge threshold. If the battery voltage goes above the recharge threshold, the IC disables the pullup resistor connection and executes the recovery method described for condition 1. All timers are reset and all timer fault conditions are cleared when a new charge cycle is started either through I2C (toggling CHG_CONFIG bits CE, CHGON) or by cycling the input power. All timers are reset and all timer fault conditions are cleared when the TPS65810 enters the UVLO mode. 8.3.2.3.12 Dynamic Timer Function The charge and precharge safety timers are programmed by the user to detect a fault condition if the charge cycle duration exceeds the total time expected under normal conditions. The expected total charge time is usually calculated based on the fast charge current rate. When the thermal loop or the DPPM loops are activated the charge current is reduced, and a false safety timer fault can be observed if this mode of operation is active for a long periods. To avoid this undesirable fault condition the TPS65810 activates the dynamic timer function when the DPPM and thermal loops are active. The dynamic timer function slows down the safety timers clock, effectively adding an extra time to the programmed timeout value as follows: 1. If the battery voltage is below the battery depleted threshold: the precharge timer value is modified while the thermal loop or the DPPM loop are active 2. If the battery voltage is above the precharge threshold: the safety timer value is modified if the DPPM or the thermal loop are active AND the battery voltage is below the recharge threshold. The TPS65810 dynamic timer function circuit monitors the voltage at pin ISET1 during precharge and fast charge. When the charger is regulating the charge current, the voltage at pin ISET1 is regulated by the control loops to either V(SET) or V(PRECHG). If the thermal loop or DPPM loops are active, the voltage at pin ISET1 is lower than V(SET) or VPRECHG, and the dynamic timer control circuit changes the safety timers clock period based on the V(SET)/V(ISET1) ratio (fast charge) or V(PRECHG)/V(ISET1) ratio (precharge). TIMER INTERNAL CLOCK PERIOD MULTIPLICATION FACTOR The maximum clock period is internally limited to twice the value of the programmed clock period, which is defined by the resistor connected to TMR pin, as shown in Figure 26. 2 1 1 2 V(SET) V(SET 1) , V(PRECHG) V(ISET 1) Figure 26. Safety Timer Internal Clock Slowdown Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 Submit Documentation Feedback 41 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com The effective charge safety timer value can then be expressed as follows: Effective precharge timeout = t(PRECHG) + t(PCHGADD) Effective charge safety timeout = t(CHG) + t(CHGADD) The added timeout values, t(PCHGADD), t(CHGADD), are equal to the sum of all time periods when either the thermal loop or DPPM loops were active. The maximum added timeout value is internally limited to 2 × t(CHG) or 2 × t(PRECHG) 8.3.2.4 Functionality Guide — System Power and Charge Management Table 8. Charge Management FAST CHARGE (1) TERMINATION CHARGE CURRENT VALUE CHARGE CURRENT SCALING IO(BAT), Programmable, 1.5 A (maximum) 25%, 50%, 75%, 100% of IO(BAT) Set through external resistor (1) PRECHARGE CURRENT CURRENT CURRENT SCALING 10% of IO(BAT) I(TERM), 10% of IO(BAT) 25%, 50%, 75%, 100% of I(TERM) value Fixed ratio Fixed ratio 2 Set through I C 2 Set through I C CHARGE VOLTAGE PRECHARGE VOLTAGE SAFETYTIMER TIMEOUT 4.2 V or 4.36 V 3V Programmable Fixed Set through external resistor POWER UP DEFAULT Charger OFF 2 Set through I C The input current limit (see Table 9) regulates the input current, effectively limiting the charge current if the input current limit is lower than the fast charge current value programmed. Table 9. Power Path Management INPUT CURRENT LIMIT INPUT CONNECTED TO OUT PIN POWER UP DEFAULT AC PIN USB PIN INPUT POWER TO SYSTEM 2.5 A typical 100 mA maximum or 500 mA maximum or 2.5 A typical Internal fixed current limit Set through I2C #1 – #2 – #3 – BATTERY TO SYSTEM AC USB Battery (when AC pin power and USB pin power are not detected ) Battery connected to system, independently of battery voltage Set through I2C, overrides internal algorithm Automatic internal algorithm TPS 65810 AC _DC Adapter Output AC AC SWITCH SYSTEM POWER BUS OUT OUT USB Power C1 10 mF USB USB SWITCH C26 22 mF BATTERY SWITCH C2 10 mF A1 Battery BAT BAT A1 Input Power to System, USB mode selected, 100 mA max A1 POWER PATH CONTROL LINEAR CHARGER TS DPPM TMR ISET1 C25 10 mF RSET 1 kW System Power Selection Input Current Limit Selection Charge Voltage Fast Charge Current Scaling Charge Suspend + C24 0.22 mF RTMR 49.9 kW RDPPM 37.4 kW 50 kW NTC C23 47 nF GND A1 I2C REGISTERS With the above components the following system parameters are set : Fast Charge Current = 1A (100% scaling, input limit=2. 5A) Safety Timer = 5hours, 30 min pre-charge DPPM threshold = 4. 3V Temp hot: 65C Temp Cold : 5C Figure 27. Required External Components, Recommended Values, External Connections 8.3.3 Linear Regulators The TPS65810 offers nine integrated linear regulators, designed to be stable over the operating load range with use of external ceramic capacitors, as long as the recommended filter capacitor values (see Figure 51 and the Pin Configuration and Functions section) are used. The output voltage can be programmed through I2C (LDO0-2, LDO3-5) or have a fixed output voltage. 42 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 8.3.3.1 Simplified Block Diagram Figure 28 shows a simplified block diagram for the LDOs. INPUT SUPPLY VREF _ I2C REGISTERS OUTPUT VOLTAGE SAMPLE ON/OFF CONTROL OUTPUT VOLTAGE + All LDOs except LDO_PM BIAS CONTROL LDO3-5 ONLY SHORT CIRCUIT PROTECTION OUTPUT VOLTAGE SETTING OUTPUT CURRENT SAMPLE Programmable LDOs only DISCHARGE CONTROL ENABLE LDO1, LDO2, LDO3-5 ONLY DISCHARGE CONTROL LDO1, LDO2, LDO3-5 ONLY Figure 28. Simplified Block Diagram 8.3.3.2 Connecting the LDO Input Supply Both LDO1-2 and LDO3-5 have uncommitted input power supply pins (VIN_LDO12, VIN_LDO35), which must be externally connected to the OUT pin. Optionally the LDO0-2 and LDO3-5 input supplies can be connected to the output of the available buck converters SM1 or SM2, as long as the resulting overall power-up sequence meets the system requirements. The RTC_OUT, SIM, LDO0 and LDO_PM linear regulators are internally connected to the OUT pin. 8.3.3.3 ON/OFF Control All the LDOs, with exception of LDO_PM LDO, have a ON and OFF control which can be set through I2C commands, facilitating host management of the distinct system power rails. The LDO_PM LDO ON and OFF control is internally hard-wired, and it is set to ON when either the AC or USB input power is detected. 8.3.3.4 Output Discharge Switch LDO1, LDO2 AND LDO3-5 have integrated switches that discharge each output to ground when the LDO is set to OFF by an I2C command. The output discharge switch function can be disabled by using I2C register control bits. The discharge switches are enabled after the initial power-up 8.3.3.5 Special Functions The RTC_OUT, SIM (Subscriber line interface module) and LDO_PM linear regulators are designed to support lower load currents. The SIM and RTC_LDO have low leakage in OFF mode, with the input pin voltage above or below the output pin voltage. The LDO_PM can be used for USB enumeration, or a status indication of input power connection. 8.3.3.6 Output Voltage Monitoring Internal power-good comparators monitor the LDO outputs and detect when the output voltage is below 90% of the programmed value. This information is used by the TPS65810 to generate interrupts or to trigger distinct operating modes, depending on specific I2C register settings. See the Interrupt Controller and System Sequencing section for additional details. Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 Submit Documentation Feedback 43 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com 8.3.3.7 Functionality Guide — Linear Regulators Table 10. Selectable Output Voltage LDO SUPPLY LDO1 OUTPUT VOLTAGE (V), SET THROUGH I2C OUTPUT DISCHARGE SWITCH ON/OFF CONTROL NUMBER OF STEPS AVAILABLE VALUES (V) Yes, enabled through I2C IO MAX (mA) ACCUR ACY % POWER UP DEFAULT 8 1.25/1.5/1.8/2.5/2.85/3/3.2/3.3 150 3 OFF, 1.25 V LDO2 Yes, set through I C Yes, enabled through I2C 8 1.25/1.5/1.8/2.5/2.85/3/3.2/3.3 150 3 OFF, 3.3 V SIM Yes, set through I2C no 2 1.8 / 2.5 8 2 ON, 2.5 V IO MAX (mA) ACCUR ACY % POWER UP DEFAULT Yes, set through I2C 2 Table 11. Programmable Output Voltage LDO SUPPLY OUTPUT VOLTAGE (V), SET THROUGH I2C OUTPUT DISCHARGE SWITCH ON/OFF CONTROL RANGE NUMBER OF STEPS MINIMUM STEP LDO3 Yes, set through I2C Yes, enabled through I2C 1.224 to 4.46 128 25 mV 100 3 OFF, 1.505 V LDO4 Yes, set through I2C Yes, enabled through I2C 1.224 to 4.46 128 25 mV 100 3 OFF, 1.811 V 1.224 to 4.46 128 25 mV 100 3 ON, 3.111 V LDO5 2 2 Yes, set through I C Yes, enabled through I C Table 12. Fixed-Output Voltage LDOs SUPPLY ON/OFF CONTROL OUTPUT VOLTAGE (V) IO MAX (mA) ACCURACY % 1.5, fixed 8 5 ON 3.3, fixed 150 3 OFF 3.3, fixed 20 5 ON if AC or USB power detected RTC_OUT Yes, through I2C LDC0 LDO_PM NO, enabled internally POWER UP DEFAULT ON /OFF , Output Voltage Discharge Control 1.5 V 8 mA 3.3 V 10 mA 1.25-3.3 V 150 mA SIM 2.2 mF C3 100 mF C4 L DO_P M RTC_O UT 1 mF LDO0 4.7 mF C8 L DO 2 4.7 mF C10 LDO1 4.7 mF C9 VIN_L DO12 4.7 mF A2 OUT 1.8 V / 2.5 V 8 mA 3.3 V 150 mA C6 AG ND2 2.2 mF C13 LDO3 2.2 mF C14 LDO4 2.2 mF C15 L DO5 0.1 mF L DO 35 _REF 1.224-4.4 V 100 mA C5 HI 1.224-4.4 V 100 mA C12 VIN_ LDO3 5 1 mF C11 1.25-3.3 V 150 mA AG ND1 PSRR L DO S 1.224-4.4 V 100 mA ON /OFF Output Voltage ON /OFF C7 1 mF I2 C REG ISTERS TPS65810 A1 Figure 29. Required External Components, Recommended Values, External Connections 44 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 8.3.4 Step-Down Switched-Mode Converters: SM1 and SM2 The TPS65810 device has two high-efficiency, step-down, synchronous converters. The integration of the power stage switching MOSFETs reduces the external component count, and only the external output inductor and filter capacitor are required. The integrated power stage supports 100% duty cycle operation. Multiple operation modes are available, enabling optimization of the overall system performance under distinct load conditions. The converters have two modes of operation: a 1.5-MHz fixed frequency pulse width modulation (PWM) mode at moderate to heavy loads, and a pulse frequency modulation (PFM) mode at light loads. The converter output voltage is programmable through I2C registers SM1_SET1 and SM2_SET1. When the SM1/SM2 converters are disabled an integrated switch automatically discharges the converter output capacitor. The discharge switch function can be disabled by setting the control bits DISCHSM1 and DISCHSM2 to LO, in I2C registers SM1_SET2 and SM2_SET2. TPS65810 SM1 OUTPUT VOLTAGE SETTING SM 1 CONVERTER EN_PFM DAC OUT VIN_SM1 PWM CONTROL PWMON EN_PWM GATE CONTROL LOGIC I2C REGISTERS PFM CONTROL POWER STAGE CURRENT COMPARATORS SM1 OPERATING MODE : ON/OFF, PWM, PFM, STANDBY SM1 DISCHARGE SWITCH ENABLE , LOW PFM RIPPLE I(L1) + _ LSM 1 C21 C22 10 µF 10 µF PGND 1 V ( V I N _ S M 1) 29 Ω + V(VIN_SM1) _ 39 Ω EN_PFM EN_PWM EN_ALL P1 SM1 CONTROL DCHGON LOGIC SM1 SM2 OUTPUT VOLTAGE SETTING SM2 OPERATING MODE : ON/OFF , PWM,PFM, PFM,STANDBY STANDBY PWM, SM1 DISCHARGE SWITCH ENABLE , LOW PFM RIPPLE VO(SM1) 3.3 µH I(L1) PFMON RESET OUT SET L1 VIN_SM2 L2 SM2 CONVERTER SAME TOPOLOGY AS SM1 CONVERTER VO(SM2) 3.3 µH LSM2 C19 10 µF PGND2 C20 10 µF SM2 SM1/SM2 PHASE CONTROL P2 Figure 30. SM1 and SM2 Converter The TPS65810 SM1 and SM2 buck converters can be set to operate only in PWM mode or to switch automatically between PFM and PWM modes. The average load current is monitored, and the PFM mode is set if the average load current is below the threshold IPFM(ENTER). When in PFM mode the load current is also monitored, and the PWM mode is set when the load current exceeds the threshold IPFM(LEAVE). Use Equation 10 to calculate the thresholds for automatic PFM/PWM switching for the SM1 converter. The same thresholds apply to the SM2 converter by replacing VIN_SM1 by VIN_SM2. V(VIN _ SM3) V(VIN _ SM3) IPFM(LEAVE) = , IPFM(ENTER) = 29 W 39 W (10) The automatic switching mode is enabled through the control bits PFM_SM1 and PFM_SM2 on I2C registers SM1_SET1 and SM2_SET1. Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 Submit Documentation Feedback 45 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com 8.3.4.1 Output Voltage Slew Rate I2C registers enable setting the output voltage slew rate, when transitioning from one programmed voltage to a new programmed voltage value. These events can be triggered by a new output voltage selection or by switching from a low-power mode (stand-by) to a normal operating mode. During a transition, the output voltage is stepped from the currently programmed voltage to the new target voltage. The slew rate from the initial voltage to the final voltage can be selected using I2C registers, SM1_SET2 and SM2_SET2, ranging from 0.24 mV/μs to 15.36 mV/μs for the SM1 converter and 0.48 to 30.72 mV/μs for the SM2 converter. If the slew rate is set to OFF the output voltage goes from the current value to the programmed value in a single step. During the transition to stand-by mode the power-good comparators are disabled. 8.3.4.2 Soft-Start SM1 and SM2 have an internal soft-start circuit that limits the inrush current during start-up. An initial delay (170 μs typical) from the converter enabled command to the converter effectively being operational is required, to assure that the internal circuits of the converter are properly biased. At the end of that initial delay the soft-start is initiated, and the internal compensation capacitor is charged with a low value current source. The soft-start time is typically 750 μs, with the output voltage ramping from 5% to 95% of the final target value. 8.3.4.3 Dropout Operation at 100% Duty Cycle The TPS65810 buck converters offer a low input to output voltage difference while still maintaining operation when the duty cycle is set to 100%. In this mode of operation the P-channel switch is constantly turned on, enabling operation with a low input voltage. The dropout operation begins if Equation 11 is true: ( V(VIN _ SM1) £ V(SM1) + I(L1) RDSON(PSM1) + RL ) where • • I(L1) = Output current plus inductor ripple current RL = DC resistance of the inductor (11) Equation 11 can be also used for the SM2 converter, replacing SM1 by SM2 and L1 by L2. 8.3.4.4 Output Voltage Monitoring The output voltage of converters SM1 and SM2 is monitored by internal comparators, and an output low voltage condition is detected when the output voltage is below 90% of the programmed value. The power-good status for SM1 and SM2 is accessible through I2C, see interrupt controller section for more details. The power-good comparators for SM1 and SM2 are disabled during the transition to stand-by mode operation. They are enabled when the transition to stand-by mode is complete. 8.3.4.5 Stand-by Mode Using the I2C SM1 and SM2 can be set in stand-by mode. In stand-by mode the PFM operation mode is set and the output voltage is defined by I2C registers SM1_STANDBY and SM2_STANDBY, and it can be set to a value different than the normal mode output regulation voltage. The stand-by mode can also be set by the GPIO pins, if those are configured as control pins that define the SM1 and SM2 operating modes. 8.3.4.6 PWM Operation During PWM operation the converters use a fast response voltage mode controller scheme with input voltage feed-forward, enabling the use of small ceramic input and output capacitors. At the beginning of each clock cycle the P-channel MOSFET switch is turned on, and the oscillator starts the voltage ramp. The inductor current ramps up until the ramp voltage reaches the error amplifier output voltage, when the comparator trips and the Pchannel MOSFET switch is turned off. Internal adaptative break-before-make circuits turn on the integrated Nchannel MOSFET switch after an internal, fixed dead-time delay, and the inductor current ramps down, until the next cycle is started. When the next cycle starts the ramp voltage is reset to its low value and the P-channel MOSFET switch is turned on again. 46 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 PWM CONTROL SECTION (SHOWN FOR SM1, SAME TOPOLOGY FOR SM2) ERROR AMP WITH “TYPE-3 LIKE” COMPENSATION OUT _ OUTPUT VOLTAGE SETTING VIN_SM1 + + OSC _ GATE CONTROL LOGIC RAMP PEAK-TO-PEAK VOLTAGE PROPORTIONAL TO VIN_SM1 L1 (L1) PGND1 VO(SM1) 3.3 mH LSM1 C21 10 mF C22 10 mF SM1 Figure 31. PWM Operation The integrated power MOSFETs current is monitored at all times and the power MOSFET is turned off if the internal short circuit current limit is reached. 8.3.4.7 Phase Control in PWM Mode The SM1 and SM2 converters operate synchronized to each other when both are in PWM mode, with converter SM1 as the master. I2C control register bits S1S2PHASE in register SM1_SET2 enables delaying the SM2 PWM clock with respect to SM1 PWM clock, selecting a phase shift from 0 to 270 degrees. The out-of-phase operation reduces the average current at the input node, enabling use of smaller input filter capacitors when both converters are connected to the same input supply. 8.3.4.8 PFM Mode Operation Using the I2C interface the SM1 and SM2 converters can have the automatic power saving PFM mode enabled. When the PFM mode is set the switching frequency is reduced and the internal bias currents are decreased, optimizing the converter efficiency under light load conditions. In PFM mode, the output voltage is monitored by a voltage comparator, which regulates the output voltage to the programmed value, VO(SM1). If the output voltage is below VO(SM1), the PFM control circuit turns on the power stage, applying a burst of pulses to increase the output voltage. When the output voltage exceeds the target regulation voltage, VO(SM1), the power stage is disabled, and the output voltage drops until it is below the regulation voltage target, when the power stage is enabled again. Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 Submit Documentation Feedback 47 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com OUT VIN_SM1 PFM CONTROL SECTION (SHOWN FOR SM1, SAME TOPOLOGY FOR SM2) GATE CONTROL LOGIC POWER STAGE PEAK CURRENT COMPARATORS _ - LSM1 + RESET + C21 10 mF C22 10 mF PGND1 I(L 1) _ VO(SM1) 3.3 mH I(L1) OUTPUT VOLTAGE COMPARATOR VO(SM1) L1 V(VIN_SM1) 29 W P1 OUT SET BIAS CONTROL + _ V(VIN_SM1) 39 W SM1 Figure 32. PFM Mode Operation During burst operation two current comparators control the power stage integrated MOSFETs. These comparators monitor the instantaneous inductor current and compare it to the internal thresholds IPFM(ENTER) and IPFM(LEAVE), turning the P-channel switch on if the inductor current is less than IPFM(LEAVE) and turning it off if the inductor current exceeds IPFM(ENTER). The N-channel switch is turned on when the P-channel MOSFET is off. The PFM output voltage comparator quiescent current may be reduced using the I2C register bits PFM_RPL1 and PFM_RPL2 in registers SM1_SET and SM2_SET. The voltage comparator quiescent current is reduced if PFM_RPL1 and PFM_RPL2 bits are set to LO, and the comparator response time (tCOMP, see Figure 33) increases. A reduction in quiescent current increases the converter efficiency at light loads, at the expense of a larger output voltage ripple when in PFM mode. The ripple is minimized if PFM_RPL1 and PFM_RPL2 bits are set to HI, at the expense of reduced efficiency under light loads. The operation under low and high ripple settings is described in Figure 33. TCOMP TCOMP TCOMP TCOMP V(OUT) OUTPUT VOLTAGE IPFM(ENTER) IPFM(LEAVE) BURST LOW RIPPLE PFM OPERATION INDUCTOR CURRENT BURST MAXIMUM EFFICIENCY PFM OPERATION Figure 33. PFM Mode Operation Waveforms When a burst of pulses is generated, the PFM current comparators control the power-stage MOSFETs to limit the inductor current to a value between the thresholds IPFM(LEAVE) and IPFM(ENTER). The number of pulses in a burst cycle is proportional to the load current, and the average current is always below IPFM(LEAVE) once PFM operation is set. The typical burst operation in PFM mode is shown in Figure 34. 48 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 BURST V(OUT) IPFM(ENTER) INDUCTOR CURRENT IPFM(LEAVE) IPFM(LEAVE) LOAD CURRENT Figure 34. Typical Burst Operation in PFM Mode The PFM operation is disabled and PWM operation set if one of the following events occur during PFM operation: • The total burst operation time exceeds 10 μs (typical). • The output voltage falls below 2% of the target regulation voltage. The PFM mode can be disabled through the serial interface to force the individual converters to stay in fixed frequency PWM mode. 8.3.4.9 Functionality Guide — Switched-Mode Step-Down Converters Table 13. Buck Converters, I2C Programmable Output Voltage SUPPLY PFM MODE SM1 PFM/PWM with automatic mode selection or PWM only. SM2 Mode of operation set through I2C STANDBY MODE Standby mode with distinct voltage available. Standby mode set through I2C or with GPIO pin OUTPUT VOLTAGE (V), SET THROUGH I2C, SEPARATE SETTINGS FOR NORMAL OR STANDBY MODE RANGE NUMBER OF STEPS MIN STEP ACC. (%) 0.6 to 1.8 32 40 mV 3 1 to 3.4 32 80 mV 3 IO MAX (mA) PWM FREQUENCY AND PHASE SLEW RATE, mV/μs, SET THROUGH I2C RANGE NO. OF STEPS MIN STEP POWER UP DEFAULT 600 1.5 MHz, 0° 0, 0.24 to 15.36 8 0.24 OFF, skip mode off, PWM only, 1.24 V (on/sby), 15.36 mV/μs 600 1.5 MHz, 0/90/180 270°, with respect to SM1, set through I2C 0, 0.48 to 30.72 8 0.48 OFF, skip mode on, PWM/PFM, 3.32 V (on/sby), 180°, 30.72 mV/μs Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 Submit Documentation Feedback 49 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com TPS65810 OUT VO(SM1) I2C REGISTERS Operating Mode Output Voltage Phase Control Discharge Control SYNC BUCK 0.6-1.8 V 600 mA VIN_ SM1 LSM 1 L1 3.3 mH SM1 C21 10 mF C22 10 mF PGND 1 VO(SM2) P1 VIN_ SM2 Operating Mode Output Voltage Phase Control Discharge Control 1.0-3.4 V 600 mA LSM 2 L2 3.3 mH SM2 C19 10 mF C20 10 mF PGND 2 P2 Figure 35. Required External Components, Recommended Values, External Connections 8.3.5 Analog-to-Digital Converter 8.3.5.1 Overview The TPS65810 has a 10-bit integrated successive approximation A/D, capable of running A/D conversions on eight distinct channels in a variety of modes. Two of the eight channels are connected to uncommitted pins ANLG1 and ANLG2, and can be used to convert external voltages. The other six channels monitor system parameters which are critical to the overall system monitoring. The channel selection is set through I2C. A dedicated set of I2C registers enables configuration of the ADC to perform a conversion cycle with either a single conversion or a multiple conversions. The ALU generates a data set containing maximum value detection, minimum value detection and average value calculation for each conversion cycle. Each cycle can be performed a single time or multiple times. 50 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 8.3.5.2 Input Channels The channels listed in Table 14 are available for selection through the I2C register ADC_SET bits CHSEL_SET bits. Table 14. ADC Input Channel Overview CHANNEL CONNECTION CH1 ANLG1 pin CH2 ANLG2 pin CH3 PARAMETER SAMPLED VOLTAGE RANGE UNDER NORMAL OPERATING CONDITIONS SPECIAL FEATURES Internal pullup current source programmable through I2C: 0/ 10/50/60 μA FULL SCALE READING (INTERNAL REFERENCE SELECTED) 2.535 V User defined User defined ISET1 pin Voltage proportional to charge current 0 V (charger off) to 2.525 V — (fast charge) CH4 TS pin Voltage proportional to pack temperature 0 V (short) to 4.7V (no thermistor) No internal pullup current, use external pullup resistor to bias pack thermistor 2.535 V CH5 Internal junction Voltage proportional to IC temperature junction temperature 1.85 V at TJ = 25°C, –6.5 mV/°C slope typ — 2.535 V CH6 RTC_OUT pin Internal LDO output voltage 0 V to 3.3 V — 4.7 V CH7 OUT pin System power bus voltage 0 V to 4.4 V — 4.7 V BAT pin Battery pack positive terminal voltage 0 V to 4.4 V — 4.7 V CH8 LSB VALUE 2.535 V 2.535 V Full scale reading ÷ 1023 8.3.5.3 Functional Overview The TPS65810 ADC can be subdivided in four sections which are defined as follows: Input Selection The input selection section has two major blocks, the input bias control and an 8 channel MUX. The input bias control provides the bias currents that are applied to pins ANLG1 and ANLG2. The bias currents for pins ANLG1 and ANLG2 are set on I2C register ADC_WAIT. The ANLG1 pin current source is automatically enabled when the input power is detected, providing the required setup to measure a battery ID resistor (ANLG1 pin). ANLG1 and ANLG2 can be used to measure external resistive loads or analog voltages. The bias current sources are always connected to the OUT pin internally. The internal MUX connects one of the monitored analog inputs to the ADC engine, following the selection defined on register ADC_SET. ADC Engine The ADC engine uses an internal or external voltage reference, as defined by the ADC_REF bit on the ADC_SET control register. If the internal reference is selected ADC_REF is connected to an internal LDO that regulates the ADC_REF pin voltage to generate the ADC supply and internal voltage reference. The internal LDO maximum output current is 6 mA typical, and a conversion must be started only after the external capacitor is fully charged. If an external reference is used it must be connected to the ADC_REF pin. When an external reference is selected the internal LDO connected to ADC_REF is disabled. Care must be taken when selecting an external reference as the ADC reference voltage, as it affects the ADC LSB absolute value. Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 Submit Documentation Feedback 51 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com Trigger Control and Synchronization The ADC engine starts a conversion of the selected input when the trigger control circuit sends a start command. The trigger control circuit starts the ADC conversion and transfers the ADC output data to the arithmetic logic unit (ALU) at the end of the conversion. It also synchronizes the data transfer from the ALU to the I2C ADC_READING register at the end of a conversion cycle, and generates the ADC status information sent to the ADC registers. An ADC engine conversion is triggered by the TPS65810 trigger control circuit using either an internal trigger or an external trigger. The internal trigger is automatically generated by the TPS65810 at the end of each ADC engine conversion, following the timing parameters set on I2C registers ADC_SET, ADC_DELAY and ADC_WAIT. The GPIO3 pin can be used as an external trigger if the bit ADC_TRG_GPIO3 is set HI, in the I2C register ADC_DELAY. In the external trigger mode a new conversion is started after the GPIO3 pin has an edge transition, following the timing parameters set on I2C registers ADC_SET, ADC_DELAY and ADC_WAIT. Arithmetic Logic Unit (ALU) The ALU performs mathematical operations on the ADC output data as defined by the I2C ADC_READING registers. It executes average calculations or minimum /maximum detection. The result of the calculations is stored in a 11 bit accumulator register (1 bit allocated for carry-over). The accumulator value is transferred to the I2C data register at the end of a conversion cycle. Figure 36 shows a simplified block diagram for the ADC. TPS65810 ANLG 1/ ANLG 2 BIAS SELECTION ADC SUPPLY AND REFERENCE SELECTION I2C BIAS CONTROL ADC REFERENCE AND SUPPLY SELECTION OUT ADC_REF 4.7 mF SUPPLY ANLG1 REF 10 BIT SUCCESSIVE APROXIMATION ADC ANLG2 ISET1 START TS TJ CURRENT SAMPLE A2 DONE 8 CHANNEL MUX ARITHMETIC LOGIC UNIT RTC_OUT TRIGGER CONTROL AND SYNCHRONIZATION OUT BAT ADC CHANNEL SELECTION ADC CONFIGURATION : TRIGGER, HOLDOFF, REPEAT MODES DELAY AND WAIT TIMING ACCUMULATOR ALU MODE : SINGLE , AVERAGE , MIN,, MAX TO I2C: STATUS AND CONVERSION DATA I2C Figure 36. ADC Simplified Block Diagram 52 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 8.3.5.3.1 ADC Conversion Cycle A conversion cycle includes all the steps required to successfully sample the selected input signal and transfer the converted data to the I2C, generating an interrupt request to the host ( pin: HI→LO). The number of individual conversions (samples) in a conversion cycle is defined by the I2C ADC_SET register bits READ_MODE settings, and can range from a single sample to 256 samples. The conversion cycle settings for the ALU is defined by register ADC_READING and it can be set to average, maximum value detection, minimum value detection or no processing (ADC engine output loaded in the accumulator directly). The conversion cycle begins with the first sampling and ends when the following occurs: • The required ALU operations are performed on the final sample, and • The ALU accumulator data is transferred to the I2C ADC_READING register, and • The register bit ADC_STATUS in the ADC_READING register is set to LO. A conversion cycle is always started by the external host when the ADC_EN bit in the ADC_SET register is toggled from LO to HI by a I2C write operation. Resetting the ADC_EN bit to LO before the current conversion cycle ends (INT: LO → HI, ADC_STATUS bit set to LO) is not recommended, as the ADC keeps its current configuration until the current conversion cycle ends. At the end of a conversion cycle the output data is stored at registers in the ALU block. The ADC_STATUS bit is set to LO ( DONE ) and an interrupt is generated (INT pin: HI→LO ) if the ADC_STATUS bit is unmasked, at the interrupt masking registers INT_MASK. It must be noted that the minimum, maximum and average values are ALWAYS calculated by the ALU for each conversion cycle. The value loaded in the I2C registers ADC READING_HI and ADC READING_LO at the end of a conversion cycle is defined by control bits ADC_READ0 and ADC_READ1 in register ADC READING_HI. The average, minimum, maximum, and last-sample values for a conversion cycle can be read if the external host executes an I2C write operation, changing the values of bits ADC_READ0 and ADC_READ1, followed by an I2C read operation on registers ADC READING_HI and ADC READING_LO. The minimum, maximum, average, and last values have the same value if a conversion cycle with only one sample is executed. The ADC_READ0 and ADC_READ1 bits can not be modified during the execution of a conversion cycle. A new conversion cycle must be started only after the current conversion cycle is completed, by toggling the ADC_EN bit from HI to LO and HI again. 8.3.5.3.2 External Trigger Operation The trigger control circuit can be programmed to use an external signal to start a conversion. The TPS65810 GPIO3 input is configurable as an ADC trigger, with ADC conversion starting on either a rising edge or falling edge. When using an external trigger the trigger delay, trigger wait time delay and trigger hold-off mode can be programmed using I2C registers. The procedure to start an externally-triggered conversion cycle has the following steps: 1. Verify that the current conversion cycle has ended (ADC_STATUS = LO, I2C register ADC_READING_HI) 2. Set ADC_EN = LO 3. Configure ADC sampling mode, ALU mode, trigger parameters, and so forth 4. Set ADC_EN = HI After step 4 the ADC is armed, waiting for an external trigger detection to start a conversion cycle. Similarly to the non-triggered mode, the ADC configuration must not be modified until the current conversion cycle ends. Note that in the external trigger mode the current cycle does not end if the converter is armed and an external trigger is not detected. 8.3.5.3.3 Detecting an External Trigger Event An external trigger event is detected when the GPIO3 input has an edge that matches the edge detection programmed in the EDGE bit, at the I2C register ADC_DELAY. The internal ADC trigger can be delayed with respect to the external trigger signal edge. The delay time value is set by the ADC_DELAY register bits DELAY_n, and can range from 0 μs (no delay) to 750 μs. A conversion is started only if the external trigger remains at its active level when the delay time expires, as shown in Figure 37. In a positive-edge detection the active trigger level is HI; in a negative-edge detection the active trigger level is LO. Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 Submit Documentation Feedback 53 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com GPIO 3 INTERNAL ADC CONVERSION START CONVERTER MODE CONVERTING ARMED TDLY(TRG) TDLY(TRG) Figure 37. ADC Conversion Triggered by GPIO3 Positive Edge Triggered Active Level Hi 8.3.5.3.4 Executing Multiple-Sample Cycles With an External Trigger When executing conversion cycles that require multiple samples it may be desirable to synchronize the input signal conversion using either an external trigger that has a periodic repetition rate or an external asynchronous trigger that indicates when the external input signal being converted is valid. The TPS65810 has additional operating modes and timing parameters that can be programmed using the I2C to configure multiple sample conversion cycles. In multiple sample cycles the host can select the wait time between samples using the bits WAITn in the ADC_WAIT register to set the wait time between samples. The wait time is measured between the end of a conversion and the start of a new conversion. With the default power-up settings (HOLDOFF=LO, ADC_DELAY register), the TPS65810 executes a multiplesample conversion cycle if the first sample is taken when the trigger is at its active level. Subsequent samples are converted at the end of the wait time, even if the trigger returns to the non-active level. The external trigger level edge is ignored until the current conversion cycle ends. CONVERSION CYCLE GPIO 3 ON INTERNAL ADC OFF CONVERSION STATUS tWAIT(TRG) tDLY(TRG) LAST SAMPLE FIRST SAMPLE Figure 38. ADC Conversion Triggered by GPIO3 Positive Edge Triggered Active Level Hi, Holdoff = LC If the sample conversion needs to be synchronized with an external trigger, during multiple sample conversion cycles, the control bit HOLDOFF must be set to HI. When the holdoff mode is active, the internal trigger starts a sample conversion only if the external trigger was detected and is at its active level at the end of the wait time, as shown in Figure 39. CONVERSION CYCLE GPIO 3 ON INTERNAL ADC CONVERSION STATUS OFF TDLY(TRG) TDLY(TRG) TWAIT(TRG) LAST SAMPLE FIRST SAMPLE Figure 39. ADC Conversion Triggered by GPIO3 Positive Edge Triggered Active Level HI, Holdoff = HI, Four Sample Cycles 54 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 When the multiple sample cycles are executed the host must configure the maximum and minimum limits for the ADC output using registers DLOLIM1, DLOLIM2, DHILIM1 and DHILIM2. A conversion cycle ends if any individual conversion result exceeds the maximum limit value or is below the minimum limit value. When an out of limit conversion is detected an interrupt is sent to the host, and the ADC_STATUS bit on register ADC READING_HI is set to DONE. 8.3.5.3.5 Continuous Conversion Operation (Repeat Mode) The TPS65810 ADC can be set to operate in a continuous conversion mode, with back-to-back conversion cycles executed. The REPEAT mode is targeted at applications where an input is continuously monitored for a period of time, and the host must be informed if the monitored input is out of the range set by I2C registers DLOLIM1, DLOLIM2, DHILIM1 and DHILIM2. In REPEAT mode each conversion is started when the ADC trigger (internal or external) is detected, and a new conversion cycle is started when the current conversion cycle ends. All the trigger and sampling modes available for normal conversion cycles are available in repeat mode. Executing I2C read operations to get the ADC readings for average, minimum, maximum and last sample values is possible in REPEAT mode. However, TI does not recommend this operation, as the REPEAT mode does not generate a DONE status flag making it difficult to synchronize the ADC data reading to the end of a conversion cycle. TI recommends using these steps for the REPEAT mode: 1. Configure the ADC conversion cycle: trigger mode, sample mode, select input signal, or others. 2. Configure the HI and LO limits for the ADC readings 3. Set the ADC_DELAY register bit REPEAT to HI 4. Toggle ADC_DELAY register bit ADC_EN bit from LO to HI 5. Monitor the INT pin. An interrupt triggered by ADC_STATUS = LO indicates that the selected input signal is out of range To exit the continuous mode the host must follow the steps below, if external trigger mode was set: 1. Exit external trigger mode 2. Set REPEAT bit to LO, effectively terminating the repeat mode. This generates an additional conversion; at the end of this conversion the ADC is ready for a new configuration. 3. Set ADC_EN to LO after on-going conversion ends. To exit the continuous mode the host must follow the steps below, if internal trigger mode was set: 1. Set REPEAT bit to LO, effectively terminating the repeat mode. 2. Set ADC_EN to LO, after on-going conversion ends 8.3.5.3.6 ADC Input Signal Range Setting The registers DHILIMn and DLOLIMn can be used by the host to set maximum and minimum limits for the DAC engine output. At the end of each conversion the ADC output is checked for the maximum and minimum limits, and a status flag is set if the converted data exceeds the high limit or is under the low limit. In multiple sample operation the converted data range is checked when all programmed samples have been converted. The host can mask or unmask interrupts caused by the ADC range status bits using the INT_MASKn registers. Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 Submit Documentation Feedback 55 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com 8.3.5.3.7 ADC State Machine Figure 40 shows the ADC state machine with all the trigger and operation modes. NO HOST STARTS NEW CONVERSION CYCLE BY SETTING ADC_EN=HI EXTERNAL TRIGGER ADC ENABLED (I2C) ? TPS 65810 READY FOR NEW CONVERSION CYCLE YES NO, ADC+EN=LO, NEED TO RECONFIGURE ADC PARAMETERS TRIGGER EDGE DETECT NO LOAD ADC CONFIGURATION DATA FROM I 2C YES START TRIGGER DELAY TRIGGER DELAY OVER NO NO, OPPOSITE TRIGGER EDGE HAPPENED BEFORE DELAY TIME TRIGGER MODE, TRIGGER DELAY SAMPLE WAIT TIME, HOLDOFF MODE REPEAT ON/OFF ALU MODE : AVG /MAX/MIN NUMBER OF SAMPLES ADC INPUT RANGE ADC CHANNEL FALLING EDGE TRIGGER EDGE MODE RISING EDGE TRIGGER VALID YES TRIGGER HI ALU RESET I2C WRITE OPERATION CONFIGURES NEXT CONVERSION CYCLE ADC_EN=LO NO TRIGGER LO HOLDOFF ON NO, HOST ENDS CURRENT CONVERSION CYCLE SETTING ADC_EN=LO NO YES, CURRENT CONVERSION CYCLE STILL ACTIVE, ADC_EN = HI YES, CHECK TRIGGER NO 1) SET ADC BUSY STATUS 2) START CONVERSION ADC ENABLED (I2C) ? YES ADC ENABLED (I2C) ? ADC CONVERSION COMPLETE NO, SEND DATA TO I2C 1) LOAD DATA IN ALU 2) ALU OUTPUT STORED IN ACCUMULATOR WAIT TIME 0 µs to 20.5 msec ALU OUTPUT DATA READY YES N CONVERSIONS ? NO NO REPEAT MODE NO, SEND DATA TO I2C YES FAULT DETECTED YES NO ALU DATA OUT OF RANGE NTH CONVERSION DONE YES 1) SET ADC_HI OR ADC_LO FAULT 2) SET ADC STATUS TO DONE 3) INT SENT TO HOST IF NON-MASKED 1 ) LOAD I2C DATA REGISTER WITH ALU DATA 2) SET ADC STATUS TO DONE 3) INT SENT TO HOST IF NON-MASKED CURRENT CYCLE ENDS Figure 40. Trigger and Operation Modes for the ADC State Machine 8.3.5.4 Battery Detection Circuit The ANLG1 pin has an internal current source connected between OUT and ANLG1, which is automatically turned on when the OUT pin voltage exceeds the minimum system voltage set by the SYS_IN pin external resistive divider. The current levels for ANLG1 pin can be programmed through I2C register ADC_WAIT, bits BATID_n. An integrated switch discharges the BAT pin to AGND1 when V(ANLG1)> V(OUT) – V(NOBATID), enabling implementation of a battery removal function if an external pack resistor ID is connected between ANLG1 and ground. The ANLG1 pin may be used to monitor other parameters than a pack ID resistor. When ANLG1 pin is used as a generic ADC analog input V(ANLG1) must never exceed V(OUT) – V(NOBATID), to avoid undesired battery discharge caused by activation of the battery pin discharge circuit. 56 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 8.3.5.5 Functionality Guide – Analog to Digital Converter Table 15. 10-Bit Successive Approximation ADC ADC INPUT CHANNELS CONVERSION COUNT CONVERTER MODE 1, 4, 8, 16, 32, 64, 128, 256 TRIGGER MODE INTERNAL EXTERNAL Charge Current, Thermistor temperature, IC junction temperature, RTC_OUT voltage, OUT voltage, Battery voltage ANLG1 and ANLG2 voltages Fixed internally Selectable through I2C GPIB, I2C driven, Repeat Selectable through I2C Selectable through I2C TRIGGER DELAY RANGE MIN STEP Single, Average, Find max value, Find min value 0 to 750 μs, 16 steps 50 μs Selectable through I2C Selectable through I2C Selectable through I2C OUT 6 INTERNAL CHANNELS WAIT TIME, MULTIPLE CONVERSIONS POWER UP DEFAULT μs: 20, 40, 60, 80, 160, 240, 320, 640 ms: 1.28, 1.92, 2.56, 5.12, 10.24, 15.36, 20.48 ADC off Selectable through I2C SYSTEM POWER BUS ADC ANLG 1 ADC CONTROL LOGIC AGND 2 8 CHANNEL MUX A/D CONVERTER EXTERNAL ANALOG ANLG 2 INPUT VOLTAGE ADC _ REF C17 4.7 mF A2 A2 Figure 41. Required External Components, Recommended Values, External Connections 8.3.6 LED and Peripheral Drivers 8.3.6.1 White LED Constant Current Driver The TPS65810 has an integrated boost converter (SM3) that is optimized to drive white LEDs connected in a series configuration. Up to six series white LEDs can be driven, with programmable current and duty cycle adjustable through a dedicated I2C register. The SM3 boost converter (SM3) has a 30-V, 500-mA, low-side integrated power stage switch that drives the external inductor. Another integrated 30-V, 25-mA switch (LED switch) is used to modulate the brightness of the external white LEDs. Figure 42 shows a simplified block diagram. Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 Submit Documentation Feedback 57 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com LSM3 3.3 mH OUT TPS65810 INDUCTOR PEAK CURRENT DETECTION L3 + _ SOFT 500 mA START OFF CONTROL LOGIC AND MINIMUM OFF TIME MAXIMUM ON TIME ON EN D1 OFF C27 1 mF POWER STAGE SWITCH GATE DRIVE PGND3 OUTPUT OVP DETECTION + SM3 _ P3 SM3_SW 28V ON LED SWITCH FREQUENCY AND DUTY CYCLE DUTY CYCLE CONTROL I2C REGISTER GATE DRIVE LED SWITCH LED LOW CURRENT _ DETECTION + FB3 RFB3 250 mV 10 W P3 Figure 42. Simplified Block Diagram The SM3 converter operates like a standard boost converter. The LED current is defined by the value of the external resistor RFB3, connected from pin FB3 to AGND1. The integrated power stage switch control monitors the LED switch current (FB3) and the integrated power stage switch current, implementing a topology that effectively regulates the LED current independently of the input voltage and number of LEDs connected. The high voltage rating of the integrated switches enables driving up to six white LEDs, connected in a series configuration. The internal LED switch, in series with the external LEDs, disconnects the LEDs from ground during shutdown. In addition, the LED switch is driven by a PWM signal that sets the duty cycle, enabling adjustment to the average LED current by modifying the settings of the I2C register SM3_SET. With this control method, the LED brightness depends on the LED-switch duty cycle only, and is independent of the PWM control signal. The duty cycle control used in the SM3 converter LED switch is implemented by generating a burst of high frequency pulses, with a pattern that is repeated periodically. For a duty cycle of 50%, all of the high frequency pulses have a 50% duty cycle. The duty cycle control sets individual pulses to 100% duty cycle when increasing the LED_PWM output duty cycle; for decreasing LED_PWM output duty cycles, individual pulses are set to 0% duty cycle. An example of distinct duty cycles is shown in Figure 43, the sum of the individual pulses ON and OFF-time over the repetition period are equivalent to the duty cycle obtained with traditional single-pulse duty cycle circuits. SM3 CONVERTER 50% DUTY CYCLE SM3 CONVERTER 50% DUTY CYCLE REPETITION PERIOD Figure 43. Example of Distinct Duty Cycles 58 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 The repetition period can be set using the register SOFT_RESET control bit SM3_LF_OSC to either 183 Hz (HI) or 122 Hz (LO). Each repetition period has a total of 256 pulses, enabling a resolution of 0.4% when programming the duty cycle. 8.3.6.1.1 SM3 Control Logic Overview The SM3 boost converter operates in a pulse frequency modulation (PFM) scheme with constant peak current control. This control scheme maintains high efficiency over the entire load current range and enables the use of small external components, as the switching frequency can reach up to 1 MHz depending on the load conditions. The LED current ripple is defined by the external inductor size. The converter monitors the sense voltage at pin FB3, and turns on the integrated power stage switch when V(FB3) is below the 250-mV (typical) internal reference voltage and the LED Switch is ON, starting a new cycle. The integrated power switch turns off when the inductor current reaches the internal 500-mA (typical) peak current limit, or if the switch is on for a period longer than the maximum on-time of 6 μs (typical). The integrated power switch also turns off when the LED switch is set to OFF. As the integrated power switch is turned off, the external Schottky diode is forward biased, delivering the stored inductor energy to the output. The main switch remains off until the FB3 pin voltage is below the internal 250-mV reference voltage and the LED switch is turned ON, when it is turned on again. This PFM peak current control scheme sets the converter in discontinuous conduction mode (DCM), and the switching frequency depends on the inductor, input/output voltage and LED current. Lower LED currents reduce the switching frequency, with high efficiency over the entire LED current range. This regulation scheme is inherently stable, allowing a wide range for the selection of the inductor and output capacitor. 8.3.6.1.2 Peak Current Control (Boost Converter) The SM3 integrated power stage switch is turned on until the inductor current reaches the DC current limit IMAX(L3) (500 mA, typical). Because of internal delays, typically around 100 ns, the actual current exceeds the DC current limit threshold by a small amount. Use Equation 12 to calculate the typical peak current limit. V(OUT) V(OUT) IP(typ) = IMAX(L3) + ´ 100 ns, or: IP(typ) = 500 mA + ´ 100 ns (12) L L The current overshoot is directly proportional to the input voltage, and inversely proportional to the inductor value. 8.3.6.1.3 Soft-Start All inductive step-up converters exhibit high in-rush current during start-up. If no special precautions are taken, voltage drops can be observed at the input supply rail during start-up, with unpredictable results in the overall system operation. The SM3 boost converter limits the inrush current during start-up by increasing the current limit in the following three steps: 1. 125 mA (typical), 2. 250 mA (typical) and 3. 500 mA (typical) The two initial steps (125 mA and 250 mA) are active for 256 power stage switching cycles. 8.3.6.1.4 Enabling the SM3 Converter The SM3_SET I2C register controls the SM3 LED-switch duty cycle. If the register is set to all zeros SM3 is set to OFF mode. When the host writes a value other than 00 in SM3_SET the SM3 converter is enabled, entering the soft-start phase and then normal operation. The SM3 converter can operate with duty cycles varying from 0.4% to 99.6%, with LED switch frequencies of 122 Hz or 180 Hz. The LED switch operating frequency is set by bit SM3_LF, in the SOFT_RESET register. 8.3.6.1.5 Overvoltage Protection The output voltage of the boost converter is sensed at pin SM3, and the integrated power stage switch is turned OFF when V(SM3) exceeds the internal overvoltage threshold VOVP3. The converter returns to normal operation when V(SM3) < VOVP3 – VHYS(OVP3). Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 Submit Documentation Feedback 59 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com 8.3.6.1.6 Under Voltage Lockout Operation When the TPS65810 device enters the UVLO mode, the SM3 converter is set to OFF mode with the power stage MOSFET switch and the LED switch open (off). 8.3.6.1.7 Thermal Shutdown Operation When the TPS65810 device enters the thermal shutdown mode, the SM3 converter is set to OFF mode with the power stage MOSFET switch and the LED switch open (off). 8.3.6.2 PWM Drivers 8.3.6.2.1 PWM Pin Driver The TPS65810 device offers one low-frequency, open-drain PWM driver, capable of driving up to 150 mA. The PWM frequency and duty cycle are defined by the PWM I2C register settings. The PWM parameters are set in I2C register PWM. Available frequency values range from 500 Hz to 15 kHz, with 8 frequency values and 16 duty cycle options (6.25% each). 8.3.6.2.2 LED_PWM Pin Driver The TPS65810 has another PWM driver output (pin LED_PWM), which is optimized to drive a backlight LED. The LED_PWM driver controls the external LED current intensity using a pulse-width control method, with duty cycle being set by the I2C register LED_PWM. The pulse width method implemented generates a burst of high frequency pulses, with a pattern that is repeated periodically. For a duty cycle of 50%, all of the high -frequency pulses have a 50% duty cycle. The duty cycle control sets individual pulses to 100% duty cycle when increasing the LED_PWM output duty cycle; for decreasing LED_PWM output duty cycles individual pulses are set to 0% duty cycle. An example of distinct duty cycles is shown in Figure 44; the sum of the individual pulses on/off time over the repetition period is equivalent to the duty cycle obtained with traditional single-pulse duty cycle circuits. LED_PWM, 50% DUTY CYCLE LED_PWM, 50% DUTY CYCLE REPETITION PERIOD Figure 44. Example of Distinct Duty Cycles The repetition period can be set using the register SOFT_RESET control bit SM3_LF_OSC to either 180 Hz (HI) or 122 Hz (LO). Each repetition period has a total of 256 pulses, enabling a resoltuion of 0.4% when programming the duty cycle. The LED_SET register enables control of the duty cycle through I2C, with duty cycle ranging from 0.4% to 99.6%. Setting the LED_SET register to all zeros forces the LED_PWM pin to 0% duty cycle (OFF). 8.3.6.2.3 RGB Driver The TPS65810 has a dedicated driver for an RGB external LED. Three outputs are available (pins RED, GREEN, BLUE), with common settings for operation mode (flash on/off, flash period, flash on time), LED current and phase delay between outputs. The TPS65810 RGB driver continually flashes the external LEDs connected to the RED, GREEN and BLUE pins using the flash operation parameters defined in register RGB_FLASH. The currents for the external LEDs can be programmed through I2C, and external resistors are not required to limit the LED current. However, they can be added to set the LED current if the available I2C values are not compatible with the current application, as shown in Figure 45. 60 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 OUT RED RRED RGRN RBLUE FLASH CONTROL ILEDR GREEN LED LED CURRENT SETTINGS CONTROL ILEDG LOGIC RGB DUTY CYCLE CONTROL BLUE ILEDB Figure 45. Limiting the External LED Current The flashing-mode parameters defined in register RGB_FLASH enable setting the flashing period from 1 to 8 seconds in 0.5-sec steps, or to continuous operation. Flashing operation is enabled by setting the FLASH_EN bit in register RGB_FLASH to HI. This bit must be set HI to enable the RGB current-sink channels. Each driver has an individual duty cycle control. The duty cycle modulation method used is similar to the PWM_LED duty cycle control, with high frequency pulses being generated when the driver (RED, GREEN, or BLUE pins) is ON. The repetition period for the RGB drivers has a total of 32 pulses, enabling a 3.125% resolution when programming the individual RED, GREEN and BLUE drivers duty cycles. The duty cycles for each driver can be set individually using control bits on registers RGB_RED, RGB_GREEN and RGB_BLUE. The RGB drivers can be programmed to sink 4, 8, or 12 mA, with no external current limiting resistor. Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 Submit Documentation Feedback 61 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com 8.3.6.3 Functionality Guide — LED And Peripheral Drivers Table 16. White Led Constant Current Driver PWM DRIVER SM3 LED CURRENT DUTY CYCLE RANGE NUMBER OF STEPS Off (0%), 0.4% to 99.6% Set through I2C 256 OUTPUT VOLTAGE IO (TYP) MAX ACCURACY (%) 5 V to 25 V Set by external resistor 25 mA 25 EFFICIENCY (%) POWER UP DEFAULT 80 Off (0%) Table 17. Open-Drain PWM Drivers PWM DUTY CYCLE DRIVER NUMBER OF STEPS MIN STEP IO(MAX) mA POWER UP DEFAULT RANGE PWM FREQUENCY (kHz) PWM 0.5/1/1.5/2/3/ 4.5/7.8/15.6 Set through I2C Off (0%), 6.25% to 100 Set through I2C 8 6.25% 150 Off(0%) LED_PWM 15.625 or 23.4 , set through I2C Off(0%), 0.4% to 99.6% Set through I2C 256 0.4% 150 Off (0%) Table 18. RGB Open-Drain LED Driver FLASH PERIOD (SAME FOR RGB) DRIVER RED, GREEN, BLUE BRIGHTNESS (INDIVIDUAL R/G/B CONTROL) FLASH ON TIME (SAME FOR RGB) RANGE NUMBER OF STEPS MIN STEP RANGE NUMBER OF STEPS MIN STEP DUTY (%) NUMBE R OF STEPS MIN STEPS No flash, or 1 to 8 s Set through I2C 16 0.5 s 0.1 to 0.6 s Set through I2C 8 0.1 s Off (0%), 3.125 to 96.87 Set through I2C 32 3.125% IO mA POWER UP DEFAULT 0/4/8/12 Flash Off, 0 mA, 0% brightness duty cycle TPS65810 OUT DISPLAY AND I/O SM3_SW 4.7 mH L3 WHITE LED DRIVER SM3 FB3 PGND3 PWM DRIVER LSM3 D1 RFB3 C18 100 pF 10 W P3 WHITE LEDS PWM EXTERNAL PERIPHERALS LED_PWM RED RGB DRIVER C27 1 mF GREEN BLUE AGND0 RGB LED A0 Figure 46. Required External Components, Recommended Values, External Connections 62 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 Table 19. SM3 Duty Cycle Settings DEC B7-B0 DCPU DEC B7-B0 DCPU DEC B7-B0 DCPU DEC B7-B0 DCPU DEC B7-B0 DCPU 0 0000 0000 – 52 0011 0100 0.203 104 0110 1000 0.406 156 1001 1100 0.609 208 1101 0000 0.813 1 0000 0001 0.004 53 0011 0101 0.207 105 0110 1001 0.41 157 1001 1101 0.613 209 1101 0001 0.816 2 0000 0010 0.008 54 0011 0110 0.211 106 0110 1010 0.414 158 1001 1110 0.617 210 1101 0010 0.82 3 0000 0011 0.012 55 0011 0111 0.215 107 0110 1011 0.418 159 1001 1111 0.621 211 1101 0011 0.824 4 0000 0100 0.016 56 0011 1000 0.219 108 0110 1100 0.422 160 1010 0000 0.625 212 1101 0100 0.828 5 0000 0101 0.02 57 0011 1001 0.223 109 0110 1101 0.426 161 1010 0001 0.629 213 1101 0101 0.832 6 0000 0110 0.023 58 0011 1010 0.227 110 0110 1110 0.43 162 1010 0010 0.633 214 1101 0110 0.836 7 0000 0111 0.027 59 0011 1011 0.23 111 0110 1111 0.434 163 1010 0011 0.637 215 1101 0111 0.84 8 0000 1000 0.031 60 0011 1100 0.234 112 0111 0000 0.438 164 1010 0100 0.641 216 1101 1000 0.844 9 0000 1001 0.035 61 0011 1101 0.238 113 0111 0001 0.441 165 1010 0101 0.645 217 1101 1001 0.848 10 0000 1010 0.039 62 0011 1110 0.242 114 0111 0010 0.445 166 1010 0110 0.648 218 1101 1010 0.852 11 0000 1011 0.043 63 0011 1111 0.246 115 0111 0011 0.449 167 1010 0111 0.652 219 1101 1011 0.855 12 0000 1100 0.047 64 0100 0000 0.25 116 0111 0100 0.453 168 1010 1000 0.656 220 1101 1100 0.859 13 0000 1101 0.051 65 0100 0001 0.254 117 0111 0101 0.457 169 1010 1001 0.66 221 1101 1101 0.863 14 0000 1110 0.055 66 0100 0010 0.258 118 0111 0110 0.461 170 1010 1010 0.664 222 1101 1110 0.867 15 0000 1111 0.059 67 0100 0011 0.262 119 0111 0111 0.465 171 1010 1011 0.668 223 1101 1111 0.871 16 0001 0000 0.063 68 0100 0100 0.266 120 0111 1000 0.469 172 1010 1100 0.672 224 1110 0000 0.875 17 0001 0001 0.066 69 0100 0101 0.27 121 0111 1001 0.473 173 1010 1101 0.676 225 1110 0001 0.879 18 0001 0010 0.07 70 0100 0110 0.273 122 0111 1010 0.477 174 1010 1110 0.68 226 1110 0010 0.883 19 0001 0011 0.074 71 0100 0111 0.277 123 0111 1011 0.48 175 1010 1111 0.684 227 1110 0011 0.887 20 0001 0100 0.078 72 0100 1000 0.281 124 0111 1100 0.484 176 1011 0000 0.688 228 1110 0100 0.891 21 0001 0101 0.082 73 0100 1001 0.285 125 0111 1101 0.488 177 1011 0001 0.691 229 1110 0101 0.895 22 0001 0110 0.086 74 0100 1010 0.289 126 0111 1110 0.492 178 1011 0010 0.695 230 1110 0110 0.898 23 0001 0111 0.09 75 0100 1011 0.293 127 0111 1111 0.496 179 1011 0011 0.699 231 1110 0111 0.902 24 0001 1000 0.094 76 0100 1100 0.297 128 1000 0000 0.5 180 1011 0100 0.703 232 1110 1000 0.906 25 0001 1001 0.098 77 0100 1101 0.301 129 1000 0001 0.504 181 1011 0101 0.707 233 1110 1001 0.91 26 0001 1010 0.102 78 0100 1110 0.305 130 1000 0010 0.508 182 1011 0110 0.711 234 1110 1010 0.914 27 0001 1011 0.105 79 0100 1111 0.309 131 1000 0011 0.512 183 1011 0111 0.715 235 1110 1011 0.918 28 0001 1100 0.109 80 0101 0000 0.313 132 1000 0100 0.516 184 1011 1000 0.719 236 1110 1100 0.922 29 0001 1101 0.113 81 0101 0001 0.316 133 1000 0101 0.52 185 1011 1001 0.723 237 1110 1101 0.926 30 0001 1110 0.117 82 0101 0010 0.32 134 1000 0110 0.523 186 1011 1010 0.727 238 1110 1110 0.93 31 0001 1111 0.121 83 0101 0011 0.324 135 1000 0111 0.527 187 1011 1011 0.73 239 1110 1111 0.934 32 0010 0000 0.125 84 0101 0100 0.328 136 1000 1000 0.531 188 1011 1100 0.734 240 1111 0000 0.938 33 0010 0001 0.129 85 0101 0101 0.332 137 1000 1001 0.535 189 1011 1101 0.738 241 1111 0001 0.941 34 0010 0010 0.133 86 0101 0110 0.336 138 1000 1010 0.539 190 1011 1110 0.742 242 1111 0010 0.945 35 0010 0011 0.137 87 0101 0111 0.34 139 1000 1011 0.543 191 1011 1111 0.746 243 1111 0011 0.949 36 0010 0100 0.141 88 0101 1000 0.344 140 1000 1100 0.547 192 1100 0000 0.75 244 1111 0100 0.953 37 0010 0101 0.145 89 0101 1001 0.348 141 1000 1101 0.551 193 1100 0001 0.754 245 1111 0101 0.957 38 0010 0110 0.148 90 0101 1010 0.352 142 1000 1110 0.555 194 1100 0010 0.758 246 1111 0110 0.961 39 0010 0111 0.152 91 0101 1011 0.355 143 1000 1111 0.559 195 1100 0011 0.762 247 1111 0111 0.965 40 0010 1000 0.156 92 0101 1100 0.359 144 1001 0000 0.563 196 1100 0100 0.766 248 1111 1000 0.969 41 0010 1001 0.16 93 0101 1101 0.363 145 1001 0001 0.566 197 1100 0101 0.77 249 1111 1001 0.973 42 0010 1010 0.164 94 0101 1110 0.367 146 1001 0010 0.57 198 1100 0110 0.773 250 1111 1010 0.977 43 0010 1011 0.168 95 0101 1111 0.371 147 1001 0011 0.574 199 1100 0111 0.777 251 1111 1011 0.98 44 0010 1100 0.172 96 0110 0000 0.375 148 1001 0100 0.578 200 1100 1000 0.781 252 1111 1100 0.984 45 0010 1101 0.176 97 0110 0001 0.379 149 1001 0101 0.582 201 1100 1001 0.785 253 1111 1101 0.988 46 0010 1110 0.18 98 0110 0010 0.383 150 1001 0110 0.586 202 1100 1010 0.789 254 1111 1110 0.992 47 0010 1111 0.184 99 0110 0011 0.387 151 1001 0111 0.59 203 1100 1011 0.793 255 1111 1111 0.996 48 0011 0000 0.188 100 0110 0100 0.391 152 1001 1000 0.594 204 1100 1100 0.797 49 0011 0001 0.191 101 0110 0101 0.395 153 1001 1001 0.598 205 1100 1101 0.801 50 0011 0010 0.195 102 0110 0110 0.398 154 1001 1010 0.602 206 1100 1110 0.805 51 0011 0011 0.199 103 0110 0111 0.402 155 1001 1011 0.605 207 1100 1111 0.809 Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 Submit Documentation Feedback 63 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com Table 20. RGB Duty Cycle Control Settings RGB_D4 RGB_D3 RGB_D2 RGB_D1 RGB_D0 64 DC(%) FLASH_PER3 FLASH_PER2 FLASH_PER1 FLASH_PER0 0 0 0 0 0 0.00 0 0 0 0 1 0 0 0 0 1 3.23 0 0 0 1 1.5 0 0 0 1 0 6.45 0 0 1 0 2 0 0 0 1 1 9.68 0 0 1 1 2.5 0 0 1 0 0 12.90 0 1 0 0 3 0 0 1 0 1 16.13 0 1 0 1 3.5 0 0 1 1 0 19.35 0 1 1 0 4 0 0 1 1 1 22.58 0 1 1 1 4.5 0 1 0 0 0 25.80 1 0 0 0 5 0 1 0 0 1 29.03 1 0 0 1 5.5 0 1 0 1 0 32.25 1 0 1 0 6 0 1 0 1 1 35.48 1 0 1 1 6.5 0 1 1 0 0 38.70 1 1 0 0 7 0 1 1 0 1 41.93 1 1 0 1 7.5 0 1 1 1 0 45.15 1 1 1 0 8 0 1 1 1 1 48.38 1 1 1 1 Continuous 1 0 0 0 0 51.60 1 0 0 0 1 54.83 1 0 0 1 0 58.05 FLASH_ON2 FLASH_ON1 FLASH_ON0 ON_TIME (s) 1 0 0 1 1 61.23 0 0 0 0.1 1 0 1 0 0 64.50 0 0 1 0.15 1 0 1 0 1 67.73 0 1 0 0.2 1 0 1 1 0 70.95 0 1 1 0.25 1 0 1 1 1 74.18 1 0 0 0.3 1 1 0 0 0 77.40 1 0 1 0.4 1 1 0 0 1 80.63 1 1 0 0.5 1 1 0 1 0 83.85 1 1 1 0.6 1 1 0 1 1 87.08 1 1 1 0 0 90.30 1 1 1 0 1 93.53 1 1 1 1 0 96.75 1 1 1 1 1 99.98 Submit Documentation Feedback P(s) Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 Table 21. PWM Frequency and Duty Cycle Settings PWM FREQUENCY TABLE PWM_D DUTY CYCLE PWM_F2 PWM_F1 PWM_F0 F (Hz) PWM2_D3 PWM2_D2 PWM2_D1 PWM2_D0 D_cycle (pu) 0 0 0 15600 0 0 0 0 0.0625 0 0 1 7800 0 0 0 1 0.125 0 1 0 4500 0 0 1 0 0.1875 0 1 1 3000 0 0 1 1 0.25 1 0 0 2000 0 1 0 0 0.3125 1 0 1 1500 0 1 0 1 0.375 1 1 0 1000 0 1 1 0 0.4375 1 1 1 500 0 1 1 1 0.5 1 0 0 0 0.5625 1 0 0 1 0.625 1 0 1 0 0.6875 1 0 1 1 0.75 1 1 0 0 0.8125 1 1 0 1 0.875 1 1 1 0 0.9375 1 1 1 1 1 Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 Submit Documentation Feedback 65 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com 8.3.7 General-Purpose I/Os — GPIO 1, 2, 3 The TPS65810 device integrates 3 general-purpose, open-drain ports (GPIOs) that can be configured as selectable inputs or outputs. When configured as outputs the output level can be set to LO or HI through I2C commands. When the GPIOs are configured as inputs the action to be taken when a transition or HI/LO level is detected at the GPIO pin is selectable through I2C. When configured as inputs the GPIOs can be set in the following modes which are defined as follows: Interrupt request In this mode of operation, a transition at the GPIO pin generates an interrupt request at the interrupt controller. The GPIO interrupt request can be masked at the INT_MASK register. This operation mode is available for GPIOs 1 and 2. SM1 and SM2 control The GPIOs can be used to turn the converters SM1 and SM2 ON/OFF, as well as setting them in stand-by mode. This control mode is available for GPIO1 (SM1 on/off and SM1/SM2 standby) and GPIO2 (SM2 on/off control). ADC trigger GPIO3 can be configured as an external ADC trigger. The GPIO3 trigger configuration bit is located at the ADC register ADC_DELAY. 8.3.7.1 GPIOs Input Level Configuration When using I2C commands, the GPIO1 and GPIO2 pins can be configured as logic output signals or as levelcontrolled inputs which enables (or disables) the switch mode converters SM1 and/or SM2. These pins may also be configured as rising- or falling-edge-triggered inputs to externally control the generation of an interrupt signal (INT), if desired. The GPIO3 pin may be used as an external trigger source to start an A/D conversion cycle or as a logic output. See Figure 47 for a description of the logic used for GPIO1 and GPIO2 inputs when configured for edgetriggered interrupt generation. The signal from the GPIO pin input is double-latched before being sent to the interrupt controller logic. The inversion of the Q output from the first flip-flop must be HI to allow the output latch to be cleared when a READ command occurs. On the initial edge of the GPIO signal, the Q output of the flip-flop is set (HI). The INT line is asserted (LO) after the initial selected edge from the GPIO pin. On the next falling (or rising) edge of the GPIO pin, the interrupt can again be cleared (which allows the INT pin to go back high). The INT signal is cleared (set back HI) after an I2C READ operation is performed. Thus, two successive edges of the GPIO signal, followed by an I2C READ command, are required to clear the INT pin output. If no I2C READ commands occur, repeatedly applying edges to the GPIO pin does not toggle the state of the INT pin output. In addition to an I2C READ command after two GPIO edges, a UVLO event or reconfiguration of the GPIO pins as outputs also deasserts the INT signal. 2 I C INTACK READ Command? Multiplexer S1 GPIO Signal Pin D Q INT D INT Q CLR S2 C SET Equivalent circuit for internal logic when configured as edge interrupt with no masking ENB HI = Rising Edge, LO = Falling Edge UVLO GPIO Config = OUTPUT Figure 47. GPIO 1 or GPIO2 Configured as an Interrupt Request Input 66 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 8.3.7.2 Function Implementation: I2C Commands Versus GPIO Commands Some of the GPIO SM1/SM2 control functions overlap I2C register control functions. Table 22 lists the TPS65810 action when the command of the GPIOs and I2C registers commands are not compatible with each other. Table 22. GPIO Commands and I2C Registers Commands SM1 AND SM2 I2C COMMAND GPIO COMMAND SM1 OR SM2 MODE SET CONVERTER DISABLED CONVERTER DISABLED DISABLED CONVERTER ENABLED DON’T CARE ENABLED DON’T CARE CONVERTER ENABLED ENABLED ON/OFF STANDBY DO NOT SET STANDBY DON’T CARE NORMAL SET STANDBY SET STANDBY STANDBY DON’T CARE DO NOT SET STANDBY NORMAL 8.3.7.2.1 GPIO Configuration Table Table 23 lists the I2C register settings required to program the available GPIO modes. The GPIO pins logic level is available at register SM1_STANDBY, bits B5, B6 and B7. Table 23. Recommended GPIO Configuration Procedure GPIO MODE GPIO3 = OUTPUT I2C REGISTERS GPIO3 AND ADC_DELAY GPIO2 = OUTPUT GPIO12 GPIO2=INPUT, SM2 ENABLE GPIO1 = OUTPUT GPIO1=INPUT, HOST INTERRUPT REQUEST GPIO1=INPUT, SM1 ENABLE GPIO1=INPUT, SM1/SM2 STANDBY CONTROL ADDITIONAL DETAILS GPIO3I/O=HI AND GPIO3OUT = HI GPIO3 PIN SET TO HIGH IMPEDANCE MODE GPIO3I/O=HI AND GPIO3OUT = LO V(GPIO3) = VOL GPIO3I/O=LO AND ADC_TRG_GPIO3 = HI AND EDGE_GPIO3 = HI GPIO3 pin rising edge triggers ADC conversion GPIO3I/O=LO AND ADC_TRG_GPIO3 = HI AND EDGE_GPIO3=LO GPIO3 pin falling edge triggers ADC conversion GPIO2I/O=HI AND GPIO2OUT = HI GPIO2 PIN SET TO HIGH IMPEDANCE MODE GPIO2I/O=HI AND GPIO2OUT = LO V(GPIO2) = VOL GPIO2I/O=LO AND GPIO2INT = HI AND GPIO2LVL=HI AND GPIO2SM2=LO INT pin HI→LO→HI at V(GPIO2) falling edge GPIO2I/O=LO AND GPIO2INT = HI AND GPIO2LVL=HI AND GPIO2SM2=LO INT pin HI→LO→HI at V(GPIO2) rising edge GPIO2I/O=LO AND GPIO2INT = LO AND GPIO2LVL=HI AND GPIO2SM2 = HI SM2 converter ON at V(GPIO2) = HI GPIO2I/O=LO AND GPIO2INT = LO AND GPIO2LVL=LO AND GPIO2SM2 = HI SM2 converter ON at V(GPIO2) = LO GPIO1I/O=HI AND GPIO1OUT = HI GPIO1 PIN SET TO HIGH IMPEDANCE MODE GPIO1I/O=HI AND GPIO1OUT = LO V(GPIO1) = VOL GPIO1I/O=LO AND GPIO1INT = HI AND GPIO1LVL=HI AND GPIO1SM1=LO AND GPIO1SMSBY = LO INT pin HI→LO→HI at V(GPIO1) falling edge GPIO1I/O=LO AND GPIO1INT = HI AND GPIO1LVL=LO AND GPIO1SM1=LO AND GPIO1SMSBY = LO INT pin HI→LO→HI at V(GPIO1) rising edge GPIO1I/O=LO AND GPIO1INT = LO AND GPIO1LVL=HI AND GPIO1SM1 = HI AND GPIO1SMSBY = LO SM1 converter ON at V(GPIO1) = HI GPIO1I/O=LO AND GPIO1INT = LO AND GPIO1LVL=LO AND GPIO1SM1 = HI AND GPIO1SMSBY = LO SM1 converter ON at V(GPIO1) = LO GPIO1I/O=LO AND GPIO1INT = LO AND GPIO1LVL=HI AND GPIO1SM1=LO AND GPIO1SMSBY = HI SM1/SM2 converter stand-by set at V(GPIO1) = HI GPIO1I/O=LO AND GPIO1INT = LO AND GPIO1LVL=LO AND GPIO1SM1=LO AND GPIO1SMSBY = HI SM1/SM2 converter stand-by set at V(GPIO1) = LO GPIO3 GPIO3 =INPUT ADC CONVERSION START TRIGGER GPIO2=INPUT, HOST INTERRUPT REQUEST I2C REGISTER BIT SETTING GPIO12 AND GPIO3 GPIO12 AND GPIO3 GPIO12 GPIO12 AND GPIO3 GPIO12 AND GPIO3 GPIO12 AND GPIO3 Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 Submit Documentation Feedback 67 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com 8.3.7.3 Functionality Guide – General-Purpose Inputs and Outputs Table 24. GPIO3 Functions CONFIGURED AS OUTPUT CONFIGURED AS INPUT POWER-UP DEFAULT OUTPUT LEVEL IO(MAX) mA A/D CONVERSION START TRIGGER HI or LO at output set through I2C 5 Falling or rising edge selected through I2C Input, no mode selected Table 25. GPIO2 Functions CONFIGURED AS OUTPUT CONFIGURED AS INPUT POWER-UP DEFAULT OUTPUT LEVEL IO(MAX) mA HI or LO at output set through I2C 5 HOST INTERRUPT REQUEST SM2 ENABLE Set INT pin to LO through I2C when GPIO2 pin edge is detected. Rising or falling edge detection selected through I2C GPIO2 level sets SM2 converter ON/OFF operation. GPIO2 pin level (HI or LO) for ON operation selected through I2C Input, SM2 enable, SM2 ONat GPIO2 = HI The host interrupt request and SM2 enable GPIO2 functions are mutually exclusive, and they must NOT be configured simultaneously Table 26. GPIO1 Functions CONFIGURED AS OUTPUT OUTPUT LEVEL CONFIGURED AS INPUT IO(MAX) mA HOST INTERRUPT REQUEST SM1 ENABLE SM1 AND SM2 STANDBY CONTROL 5 Set INT pin to LO through I2C when GPIO1 pin edge is detected. Rising or falling edge detection set through I2C GPIO1 level sets SM1 converter ON/OFF operation. GPIO2 pin level (HI or LO) for ON operation set through I2C GPIO1 level sets SM2 and SM1 converters in stand-by mode. GPIO1 pin level (HI or LO) for stand-by mode set selected through I2C HI or LO at output set through I2C POWER-UP DEFAULT Input, SM1 enable, SM1 ONat GPIO1 = HI The host interrupt request, SM1 enable and SM1/SM2 stand-by control GPIO1 functions are mutually exclusive, and they must NOT be configured simultaneously. TPS65810 GPIO1 CONFIGURATION MODES: 1-OUTPUT 2-SM1/SM2 STANDBY CONTROL INPUT 3-SM1 ON/OFF CONTROL INPUT 4-INTERRUPT REQUEST CONTROL INPUT GENERATES INT PIN HI®LO TRANSITION I2C SETTINGS GPIO FUNCTION GPIO GPIO2 CONTROL AND MODE CONFIGURATION MODES: 1-OUTPUT 2-SM2 ON/OFF CONTROL 3-INTERRUPT REQUEST CONTROL INPUT 4-GENERATES INT PIN HI®LO TRANSITION GPIO3 CONFIGURATION MODES: 1-OUTPUT 2-ADC TRIGGER CONTROL 3-LDC0 ENABLE 4-CHARGE VOLTAGE SELECTION Figure 48. Required External Components, Recommended Values, External Connections 68 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 8.4 Device Functional Modes 8.4.1 Sleep Mode The device enters the Sleep mode if a thermal fault or a system low voltage fault is detected. For a detailed description of which registers are reset to their default state and which registers keep their state, reference the section on System Sequencing and TPS65810 Operating Modes. 8.4.2 Normal Mode The device enters the Normal mode after all power-good checks pass. In this mode, the I2C registers define the operation of the device. 8.5 Programming 8.5.1 Serial Interface 8.5.1.1 Overview The TPS65810 device is compatible with a host-controlled environment, with internal parameters and status information accessible through an I2C interface. An I2C communication port provides a simple way for an I2C-compatible host to access system status information and reset fault modes, functioning as a SLAVE port enabling I2C-compatible hosts to WRITE to or to READ from internal registers. The TPS65810 I2C port is a 2-wire bidirectional interface using SCL (clock) and SDA (data) pins; the SDA pin is open-drain and requires an external pullup. The I2C is designed to operate at SCL frequencies up to 400 kHz. The standard 8-bit command is supported, the CMD part of the sequence is the 8-bit register address to READ from or to WRITE to. 8.5.1.2 Register Default Values The internal TPS65810 registers are loaded during the initial power-up from an internal, non-volatile memory bank. The power-up default values are described in the sections detailing the registers functionality. The register contents remain intact as long as OUT pin voltage remains above the internal UVLO threshold, VUVLO. All register bits are reset to the internal power up default when the OUT pin voltage falls below the VUVLO threshold or if the HOT_RESET pin is set to LO. 8.5.1.3 I2C Address The I2C specification contains several global addresses, which the slaves on the bus are required to respond to. The TPS65810 only responds (ACK) to addresses: 0x90 and 0x91 and does not respond (NACK) to any other address. Table 27. TPS65810 I2C Read and Write Address BIT BYTE MSB 6 5 4 3 2 1 LSB TPS65810 I C WRITE ADDRESS 1 0 0 1 0 0 0 0 TPS65810 I2C READ ADDRESS 1 0 0 1 0 0 0 1 B7 B6 B5 B4 B3 B2 B1 B0 2 I/O DATA BUS 8.5.1.4 Incremental Read The TPS65810 does not support incremental read operations. Each register must be accessed in a single read operation. 8.5.1.5 I2C Bus Release The TPS65810 I2C engine does not create START or STOP states on the I2C bus during normal operation. Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 Submit Documentation Feedback 69 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com 8.5.1.6 Sleep Mode Operation When the sleep mode is set SDAT is held LO by the TPS65810. The overall system operation is not affected, as in sleep mode all TPS65810 integrated supplies are disabled and no power is available for any external devices connected to the TPS65810 SDAT pin. When sleep mode ends the SDAT pin is released before the TPS65810 integrated regulated supplies are enabled. See section on System Sequencing and TPS65810 Operating Modes for additional details on sleep mode operation. 8.5.1.7 I2C Communication Protocol Table 28 lists the conventions used when describing the communication protocol. Table 28. I2C Naming Conventions Used CONDITION CODE START sent from host S STOP sent from host P TPS65810 I2C slave address sent from host, bus direction set from host to TPS65810 (WRITE) hA0 TPS65810 register address sent from TPS65810, bus direction is from TPS65810 to host (READ) hA1 Non-valid I2C slave address sent from host hA_N Valid TPS65810 register address sent from host HCMD Non-valid TPS65810 register address sent from host HCMD_N I/O data byte (8 bits) sent from host to TPS65810 hDATA I/O data byte (8 bits) sent from TPS65810 to host bqDATA Acknowledge (ACK) from host hA Not acknowledge (NACK) from host hN Acknowledge (ACK) from TPS65810 bqA Not acknowledge (NACK) from TPS65810 bqN STOP CONDITION (P) START CONDITION (S) STOP CONDITION (P) START CONDITION (S) BIT 7 MSB BIT0 LSB BIT 6 ACKNOWLEDGE STOP CONDITION (hA or bqA ) (P) SCL STOP CONDITION (P) START CONDITION (S) BIT 7 MSB BIT 6 SDA DATA CHANGE ALLOWED SCL BIT 7 MSB BIT 6 BIT 5-1 BIT 0 LSB NOT STOP ACKNOWLEDGE CONDITION (hN or bqN) (P) SDA DATA LINE STABLE SCL SDA Figure 49. I2C operation waveforms For normal data transfers, SDA is allowed to change only when SCL is low, and one clock pulse is used per bit of data. The SDA line must remain stable whenever the SCL line is high, as SDA changes when SCL is high are reserved for indicating the start and stop conditions. Each data transfer is initiated with a start condition and terminated with a stop condition. When addressed, the TPS65810 device generates an acknowledge bit after the reception of each byte by pulling the SDA line Low. The master device (microprocessor) must generate an extra clock pulse that is associated with the acknowledge bit. After the acknowledge or not acknowledge bit, the TPS65810 device leaves the data line high, enabling a STOP condition generation. 70 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 8.5.1.8 I2C Read and Write Operations The TPS65810 device supports the standard I2C one-byte Write. The basic I2C read protocol has the following steps: • Host sends a start and sets TPS65810 I2C slave address in write mode • The TPS65810 device acknowledges (ACKs) that this is a valid I2C address and that the bus is configured for write • Host sends TPS65810 register address • The TPS65810 device acknowledges (ACKs) that this is a valid register and stores the register address to be read • Host sends a repeated start and TPS65810 I2C slave address, reconfiguring the bus for read • The TPS65810 device acknowledges (ACKs) that this is a valid address and that bus is reconfigured • Bus is in read mode, TPS65810 device begins sending data from selected register The I2C write protocol is similar to the read, without the need for a repeated start and bus being set in write mode. In a WRITE, it is not necessary to end each 1-byte WRITE command with a STOP; a START has the same effect (repeated start). SCLK SDAT ... A6 ... .. A0 R/W ACK 0 Start R7 0 Slave Address hA0 .. ... R0 Register Address hCMD bqA ACK A6 .. ... A0 R/W ACK 1 0 0 bqA Slave Address hA1 S D7 .. D0 Slave Drives the Data bqDATA bqA ACK Master Drives ACK and Stop hA P Repeated Start, can be replaced by a STOP and START ... SCLK SDAT Start A6 A5 ... A4 ... A0 R/W ACK 0 0 Slave Address hA0 bqA R7 R6 R5 Register Address hCMD ... ... R0 ACK D7 0 bqA D6 D5 ... Host Sends Data hDATA D0 ACK 0 bqA P Figure 50. I2C read and write operations The host can complete a READ or a WRITE sequence with either a STOP or a START. 8.5.1.9 Valid Write Sequences The TPS65810 device always ACKs its own address. If the CMD points to an allowable READ or WRITE address, bq writes the address into its RAM address register and sends an ACK. If the CMD points to a non-allowed address, bq does NOT write the address into its RAM address register and sends a NACK. Table 29. Valid Write Sequence Address Registers S S S hA0 hA0 hA0 bqA bqA bqA hCMD hCMD_N Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 bqA bqN Submit Documentation Feedback 71 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com 8.5.1.10 One-Byte Write The data is written to the addressed register when the bq ACK ending the one byte write sequence is received. The host can cancel a WRITE by sending a STOP or START before the trailing edge of the bq ACK clock pulse. Table 30. One-Byte Write Address Register S hA0 bqA hCMD bqA hDATA bqA 8.5.1.11 Valid Read Sequences The TPS65810 always ACKs its own address. Table 31. Valid Read Sequence ACK Register S hA1 bqA Upon receiving hA1, TPS65810 starts at wherever the RAM address register is pointing. The START and the STOP both act as priority interrupts. If the host has been interrupted and is not sure where it left off it can send a STOP and reset the TPS65810 state machine to the WAIT state; once in WAIT state, the TPS65810 ignores all activity on the SCL and SDA lines until it receives a START. A repeated START and START in the I2C specification are both treated as a START. Table 32. Valid Read Sequence Address Registers S S S hA0 hA0 hA1 bqA bqA bqA hCMD hCMD bqDATA bqA bqA hN P S P hA1 bqA bqDATA hN P 8.5.1.12 Non-Valid Sequences Table 33. Incremental Read Sequences S hA1 bqA bqDATA hA bqDATA hA bqDATA hA bqDATA hA ... bqDATA hA P A START followed by an address which is not bqA0 or bqA1 is NACKED. Table 34. START and Non-HA0 or Non-HA1 Address S hA_N bqN If the CMD points to a non-allowed READ address (reserved registers), bq sends a NACK back to the host, and it does not load the address in the RAM address register. Note that TPS65810 NACKS whether a stop is sent or not. Table 35. Attempt to Specify Non-Allowed READ Address S S hA0 hA0 bqA bqA hCMD_N hCMD_N bqN bqN P If the host attempts to WRITE to a READ-ONLY or non-accessible address TPS65810 ACKS the CMD containing the allowed READ address, loads the address into the address register and NACKS after the host sends the next data byte. After issuing the NACK TPS65810 returns to WAIT state. A subsequent hA1 READ could read this address. Table 36. Attempt to Specify Non-Allowed WRITE Address S 72 Submit Documentation Feedback hA0 bqA hCMD bqA hDATA bN Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 8.6 Register Maps Table 37. TPS65810 Internal Register Map Hex Name Description Additional Details 0 RESERVED_01 RESERVED FACTORY ONLY 1 RESERVED_02 RESERVED FACTORY ONLY 2 PGOOD Output voltage status for linear regulators and DC–DC buck converters 3 INTMASK1 Interrupt request masking settings 4 INTMASK2 Interrupt request masking settings 5 INT_ACK1 Masked interrupt request register, latched 6 INT_ACK2 Masked interrupt request register, latched 7 PGOODFAULT_MASK System Reset masking settings 8 SOFT_RESET Generates a software reset 9 CHG_CONFIG Battery charger configuration A CHG_STAT Battery charger status B EN_LDO Linear regulator ON/OFF control C LDO12 LDO1 and LDO2 output voltage setting D LDO3 LDO3 output voltage settings E LDO4 LDO4 output voltage settings F LDO5 LDO5 output voltage settings 10 SM1_SET1 SM1 Buck converter ON/OFF control and output voltage setting, normal mode 11 SM1_SET2 SM1 Buck converter configuration 12 SM1_STANDBY SM1 Buck converter stand-by mode ON/OFF and stand-by output voltage setting 13 SM2_SET1 SM2 Buck converter ON/OFF control and output voltage setting, normal mode 14 SM2_SET2 SM2 Buck converter configuration 15 SM2_STANDBY SM2 Buck converter stand-by mode ON/OFF and stand-by output voltage setting 16 SM3_SET SM3 White LED driver ON/OFF control and settings 17 RGB_FLASH Overall RGB driver timing settings 18 RGB_RED RGB driver: RED duty cycle and output current setting 19 RGB_GREEN RGB driver: GREEN duty cycle and output current setting 1A RGB_BLUE RGB driver: BLUE duty cycle and output current setting 1B GPIO12 GPIO1 and GPIO2 configuration 1C GPIO3 GPIO2 and GPIO3 configuration, battery charge voltage selection 1D PWM PWM output configuration 1E ADC_SET ADC On/OFF control, ADC configuration 1F ADC reading_hi ADC data output 20 ADC reading_lo ADC data output 21 DHILIM1 ADC Maximum threshold setting 22 DHILIM2 ADC Maximum threshold setting 23 DLOLIM1 ADC Minimum threshold setting 24 DLOLIM2 ADC Minimum threshold setting 25 ADC_DELAY ADC configuration: conversion delay 26 ADC_WAIT ADC configuration: wait and repeat operation 27 LED_PWM LED_PWM configuration 2E RESERVED_03 RESERVED Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 FACTORY ONLY Submit Documentation Feedback 73 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com 8.6.1 Sequencing and Operating Modes – I2C Registers The I2C registers that control sequencing-related functions are shown in Table 38. The HEX address for each register is shown by the register name, together with the R or W functionality for the register bits. Shaded values indicate default initial power-up values. Table 38. I2C Registers – Sequencing and Operating Modes B7 B6 B5 B4 B3 B2 B1 B0 SM3_LF_OSc NOT USED nRAMLOAD SOFT RST NOT USED RAM RESET FLAG SOFTWARE RESET CONTROL NOT USED RAM DEFAULTS LOADED NOT ACTIVE NOT USED RAM DEFAULTS NOT LOADED SET RESET MODE (reset to LO internally) Soft_reset, Address = 08, All Bits R/W, Bits B7/B6/B1/B0 Apply to Sequencing. Bit Name STBY MODE SLEEP MODE NOT USED NOT USED Function SET SM1 AND SM2 IN STANDBY MODE SET TPS65810 IN SLEEP MODE NOT USED NOT USED When 0 NOT ACTIVE NOT ACTIVE NOT USED NOT USED When 1 When 1 SET SM1 AND SM2 IN STANDBY SET SLEEP MODE (reset to LO internally) NOT USED NOT USED NOT RELATED TO SEQUENCING See SM3 SECTION Some host algorithms need to identify when the power-up defaults are loaded in the RAM, to start routines that initialize specific RAM registers. If that functionality is required the nRAMLOAD bit must be set to HI by the host when entering the NORMAL operation mode. The nRAMLOAD bit is reset to LO by the TPS65810 when the power-up defaults are loaded in the I2C registers (V(OUT) < VUVLO OR V(HOT_RESET) = LO), enabling the host algorithm to detect that the RAM registers need to be initialized. The integrated supplies status is available in a dedicated register, shown below. The host can select which integrated supply outputs trigger a power-good fault condition using the PGOODFAULT_MASK register. When a non-masked power-good status register bit toggles state, the sequence controller generates a transition in the TPS65810 state machine, indicated as a PGOOD FAULT in TPS65810 state diagram. The power-good status register and mask register are shown below: Table 39. System Status Monitored By Sequencing Controller B7 B6 B5 B4 B3 B2 B1 B0 PGOOD LDO4 PGOOD LDO5 PGOOD, Address = 02, All Bits Read Only - Power Up Defaults Show System Status When Exiting Power Down Bit name Function PGOOD SM1 PGOOD SM2 PGOOD SM3 SM1 OUTPUT STATUS SM2 OUTPUT STATUS SM3 OVP STATUS PGOOD LDO1 PGOOD LDO2 PGOOD LDO3 LDO1 OUTPUT LDO2 OUTPUT LDO3 OUTPUT LDO4 OUTPUT LDO5 OUTPUT STATUS STATUS STATUS STATUS STATUS When 0 OK OK OK OK OK OK OK OK When 1 FAULT FAULT FAULT FAULT FAULT FAULT FAULT FAULT PGOODFAULT_MASK, Address = 07, All Bits R/W Bit name MASK_PSM1 MASK_PSM2 MASK_PSM3 MASK_PLDO1 MASK_PLDO2 MASK_PLDO3 MASK_PLDO4 MASK_PLDO5 MASK PGOOD FAULT BY SM1 MASK PGOOD FAULT BY SM2 MASK PGOOD FAULT BY SM3 MASK PGOOD FAULT BY LDO1 MASK PGOOD FAULT BY LDO2 MASK PGOOD FAULT BY LDO3 MASK PGOOD FAULT BY LDO4 MASK PGOOD FAULT BY LDO5 When 0 UNMASKED UNMASKED UNMASKED UNMASKED UNMASKED UNMASKED UNMASKED UNMASKED When 1 MASKED MASKED MASKED MASKED MASKED MASKED MASKED MASKED Function 74 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 8.6.2 System Status — I2C Registers The I2C registers that have system status data are shown below. The HEX address for each register is shown by the register name, together with the R or W functionality for the register bits. Those registers are valid, after an initial power up, when the TPS65810 enters the normal operation mode. Table 40. System Status Monitored By Interrupt Controller B7 B6 B5 B4 B3 B2 B1 B0 PGOOD LDO4 PGOOD LDO5 PGOOD, Address = 02, All Bits Read Only - Power Up Defaults Show System Status When Exiting Power Down Bit name PGOOD SM1 PGOOD SM2 PGOOD SM3 Function SM1 OUTPUT STATUS SM2 OUTPUT STATUS SM3 OVP STATUS PGOOD LDO1 PGOOD LDO2 PGOOD LDO3 LDO1 OUTPUT LDO2 OUTPUT LDO3 OUTPUT LDO4 OUTPUT LDO5 OUTPUT STATUS STATUS STATUS STATUS STATUS When 0 OK OK OK OK OK OK OK OK When 1 FAULT FAULT FAULT FAULT FAULT FAULT FAULT FAULT ADC STATUS REGISTER ADC_READING_HI, B7: CONVERSION COMPLETE; INTERNAL STATUS BITS (NO I2C REGISTER BIT AVAILABLE: INPUT OUT OF RANGE (HI OR LO), ANLG1 PIN IMPEDANCE TO AGND2 EXCEEDS 1 mΩ. See additional details in the Analog-to-Digital Converter section. OTHER SYSTEM STATUS: THERMAL FAULT DETECTED 8.6.3 Interrupt Controller – I2C Registers The I2C registers that control an interrupt generation (INT: HI→LO) are shown below. The HEX address for each register is shown by the register name, together with the R or W functionality for the register bits. Shaded values indicate default initial power-up values. Table 41. Interrupt and Power-Good Fault Managerment Register B7 B6 B5 B4 B3 B2 B1 B0 INTMASK1, Address = 03, All Bits R/W Bit name MASK_ISM1 MASK_ISM2 MASK_ISM3 MASK_ILDO1 MASK_ILDO2 MASK_ILDO3 MASK_ILDO4 MASK_ILDO5 Function MASK INT by SM1 PGOOD FAULT MASK INT by SM2 PGOOD FAULT MASK INT by SM3 PGOOD FAULT MASK INT by LDO1 PGOOD FAULT MASK INT by LDO2 PGOOD FAULT Mask INT by LDO3 PGOOD FAULT MASK INT by LDO4 PGOOD FAULT MASK INT by LDO5 PGOOD FAULT When 0 UNMASKED UNMASKED UNMASKED UNMASKED UNMASKED UNMASKED UNMASKED UNMASKED When 1 MASKED MASKED MASKED MASKED MASKED MASKED MASKED MASKED MASK_IGPIO2 MASK_IGPIO1 MASK_ITHSHU T MASK_ICHGS T MASK_IADC_H I MASK_IADC_L O MASKS INT BY MASKS INT BY MASKS INT BY MASKS INT BY MASKS INT BY ADC END OF ANLG1 HIGH GPIO2 EDGE GPIO1 EDGE THERMAL CONVERSION IMPEDANCE TRANSITION TRANSITION FAULT MASK INT BY CHG_STAT REGISTER BITS MASK INT BY ADC INPUT ABOVE HI LIMIT MASK INT BY ADC INPUT BELOW LO LIMIT INTMASK2, Address = 04, All Bits R/W Bit name Function MASK_IADC MASK_IANLG1 When 0 UNMASKED UNMASKED UNMASKED UNMASKED UNMASKED UNMASKED UNMASKED UNMASKED When 1 MASKED MASKED MASKED MASKED MASKED MASKED MASKED MASKED INT_ACK1, Address = 05, All Bits R/W Bit name ACK_SM1 ACK_SM2 ACK_SM3 ACK_LDO1 ACK_LDO2 ACK_LDO3 ACK_LDO4 ACK_LDO5 Function SM1 INT REQUEST SM2 INT REQUEST SM3 INT REQUEST LDO1 INT REQUEST LDO2 INT REQUEST LDO3 INT REQUEST LDO4 INT REQUEST LDO5 INT REQUEST When 0 CLEAR FLAG CLEAR FLAG CLEAR FLAG CLEAR FLAG CLEAR FLAG CLEAR FLAG CLEAR FLAG CLEAR FLAG When 1 SM1 PGOOD FAULT GENERATED INT SM2 PGOOD FAULT GENERATED INT SM3 OVP FAULT GENERATED INT LDO1 PGOOD FAULT GENERATED INT LDO2 PGOOD FAULT GENERATED INT LDO3 PGOOD FAULT GENERATED INT LDO4 PGOOD FAULT GENERATED INT LDO5 PGOOD FAULT GENERATED INT Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 Submit Documentation Feedback 75 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com Table 41. Interrupt and Power-Good Fault Managerment Register (continued) B7 B6 B5 B4 B3 B2 B1 B0 INT_ACK2, Address = 06, All Bits Read Only Bit name ACK_ADC ACK_ANLG1 ACK_GPIO2 ACK_GPIO1 ACK_THSHUT ACK_CHGSTA T ACK_ADC_HI ACK_ADC_LO Function ADC INT REQUEST 1 ANLG1 COMPARATO R INT REQUEST GPIO2 INT REQUEST GPIO1 INT REQUEST THERMAL FAULT INT REQUEST CHARGER INT REQUEST ADC INT REQUEST 2 ADC INT REQUEST 3 When 0 CLEAR FLAG CLEAR FLAG CLEAR FLAG CLEAR FLAG CLEAR FLAG CLEAR FLAG CLEAR FLAG CLEAR FLAG ADC DONE GENERATED INT REQUEST ANLG1 HIGH IMPEDANCE DETECTION GENERATED INT REQUEST THERMAL FAULT GENERATED INT REQUEST CHARGER STATUS CHANGE GENERATED INT REQUEST ADC INPUT ABOVE HI LIMIT GENERATED INT REQUEST ADC INPUT BELOW LO LIMIT GENERATED INT REQUEST When 1 GPIO2 EDGE GENERATED INT REQUEST GPIO1 EDGE GENERATED INT REQUEST PGOODFAULT_MASK, Address = 07, All Bits R/W Bit name PGOOD SM1 PGOOD SM2 PGOOD SM3 PGOOD LDO1 PGOOD LDO2 PGOOD LDO3 PGOOD LDO4 PGOOD LDO5 Function MASK PGOOD FAULT BY SM1 MASK PGOOD FAULT BY SM2 MASK PGOOD FAULT BY SM3 MASK PGOOD FAULT BY LDO1 MASK PGOOD FAULT BY LDO2 MASK PGOOD FAULT BY LDO3 MASK PGOOD FAULT BY LDO4 MASK PGOOD FAULT BY LDO5 When 0 UNMASKED UNMASKED UNMASKED UNMASKED UNMASKED UNMASKED UNMASKED UNMASKED When 1 MASKED MASKED MASKED MASKED MASKED MASKED MASKED MASKED 8.6.4 Charge and System Power Management — I2C Registers The I2C registers that control charger and power path related functions are shown below. The HEX address for each register is shown by the register name, together with the R or W functionality for the register bits. Shaded values indicate default initial power-up values. Note that the CHG_STAT register contents are valid only when either AC or USB power are applied to the TPS65810. The output of linear regulator LDO_PM can be used as an indicator of external input power detection; if LDO_PM is in regulation the CHG_STAT register contents are valid. Table 42. CHG_CONFIG Address B7 B6 B5 B4 B3 B2 B1 B0 ISET1_1 ISET1_0 ISET2 PSEL CE (1) USB CURRENT LIMIT SELECTED INPUT CURRENT LIMIT SYSTEM POWER SELECTION 100 mA USE USB CURRENT LIMIT BATTERY TO SYSTEM 500 mA INPUT CURRENT LIMIT SET TO MAXIMUM INPUT POWER TO SYSTEM (1) CHG_CONFIG, Address = 9, All Bits R/W Bit name VCHG CHGON NOT USED Function CHARGE VOLTAGE SELECTION SUSPEND CHARGE NOT USED When 0 4.36 V CHARGE SUSPENDED NOT USED When 1 4.20 V CHARGE ON NOT USED (1) 76 CHARGE CURRENT SCALING FACTOR 00= 0.25 10=0.75 01= 0.5 11= 1 Note: Relative to charge current programmed by external ISET pin resistor. The CE bit state is latched inside the charger control logic (CE latch) during an OUT pin UVLO event, prior to resetting the charge control register bit CE to its power up default value. The charger CE latch controls the charger and power path state as long as the TPS65810 is in UVLO mode and an external supply is connected to the charger block. The CE latch is reset to its power-up value (CE = HI) only when the input power is removed from the charger block. The CE latch is disabled and the CE charge control register bit sets the charger and power path MOSFETs state when the TPS65810 exits the UVLO mode. This feature avoids a host software loop when the host algorithm requires a depleted (or absent) battery to be connected to the system bus while input power is present. Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 Table 43. GPIO3 Address B7 B6 B5 B4 B3 B2 B1 B0 LDO0_ENABLE CHARGE _VLTG NOT USED GPIO2 _INTSRC GPIO1 _INTSRC GPIO2 _SM2 See Table 23 CHARGE VOLTAGE SELECTION SAFETY BIT NOT USED See Table 23 Table 23 See Table 23 GPIO3, Address = 1C, All Bits R/W (1) Bit name GPIO3i/O GPIO3_LEVEL Function See Table 23 See Table 23 When 0 4.2 V When 1 4.36 V (1) Only bit B4 controls charger-related functionality Table 44. CHG_STAT Address B7 B6 B5 B4 B3 B2 B1 B0 STAT2 INP_OV CHG_STAT, Address = A, All Bits Read Only– Power Up Defaults Show System Status When Exiting Power Down Bit name BAT_STAT (1) (2) INPUT _PWR THDPPM_ON ACPG (3) USBPG (3) THERMAL LOOP AND DPPM STATUS AC INPUT POWER STATUS USB INPUT POWER STATUS Function BATTERY SUPPLEMENT MODE STATUS SELECTED INPUT POWER STATUS When 0 SUPPLEMENT MODE OFF AC INPUT SELECTED BOTH OFF AC NOT DETECTED USB NOT DETECTED When 1 SUPPLEMENT MODE ON USB INPUT SELECTED DPPM ON OR THERMAL ON AC DETECTED USB DETECTED (1) (2) (3) STAT1 CHARGE STATUS 00 = FAULT/SUSPEND/OFF 01 = CHARGE DONE 10 = FAST CHARGE ON 11 = PRECHARGE AC OR USB INPUT OVP DETECTION NO OVP OVP DETECTED The battery supplement is entered when V(BAT) – V(OUT) > 60 mV (typical), and it ends when V(BAT) – V(OUT) < 20 mV. When the system power bus current exceeds the input current limit or the external supply current capability, the supplement mode is set. An oscillatory behavior for BAT_STAT bit can happen if the battery switch dropout voltage is less than 20 mV (typical) when in supplement mode. The BAT_STAT is always masked internally, and does not generate interrupts. The ACPG and USBPG bits have valid data only when V(LDO_PM) > 2 V. 8.6.5 Linear Regulators — I2C Registers The I2C registers that control LDO-related functions are shown below. The HEX address for each register is shown by the register name, together with the R or W functionality for the register bits. Shaded values indicate default initial power-up values. Table 45. Linear Regulators Registers B7 B6 B5 B4 B3 LDO2_EN LDO3_EN LDO4_EN LDO5_EN B2 B1 B0 SIM_SET SIM EN1 RTC_EN EN_LDO: Address = B, All Bits R/W Bit name LDO1_EN Function SIM LDO output voltage LDO1…5 ON/OFF CONTROL SIM/RTC ON/OFF CONTROL When 0 OFF OFF OFF OFF OFF 2.5 V, ON OFF OFF When 1 ON ON ON ON ON 1.8 V ON ON LDO1_2 SET LDO1_1 SET LDO1_0 SET LDO2_DISCH LDO2_2 SET LDO2_1 SET LDO2_0 SET LDO12: Address = C, All Bits R/W Bit name LDO1_DISCH Function LDO1 output discharge switch enable When 0 When 1 OFF ON LDO1 OUTPUT VOLTAGE SETTING 000 010 100 110 = 1.25 V = 1.8 V = 2.85 V = 3.2 V 001 011 110 111 = 1.5 V = 2.5 V =3V = 3.3 V LDO2 output discharge switch enable OFF Default = 1.25 V ON LDO2 OUTPUT VOLTAGE SETTING 000 010 100 110 = 1.25 V = 1.8 V = 2.85 V = 3.2 V 001 011 110 111 = 1.5 V = 2.5 V =3V = 3.3 V Default = 3.3 V LDO3_1 SET LDO3_0 SET LDO3, Address = D, All Bits R/W Bit name LDO3_DISCH Function LDO3 output discharge switch enable When 0 OFF When 1 ON LDO3_6 SET LDO3_5 SET LDO3_4 SET LDO3_3 SET LDO3_2 SET LDO3 OUTPUT VOLTAGE SETTING See Table 46 for LDO3-5 output voltage setting, Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 Power-up default = 1.505 V Submit Documentation Feedback 77 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com Table 45. Linear Regulators Registers (continued) B7 B6 B5 B4 B3 B2 B1 B0 LDO4_6 SET LDO4_5 SET LDO4_4 SET LDO4_3 SET LDO4_2 SET LDO4_1 SET LDO4_0 SET LDO4, Address = E, All Bits R/W Bit name LDO4_DISCH Function LDO4 output discharge switch enable When 0 OFF When 1 ON LDO4 OUTPUT VOLTAGE SETTING See Table 46 for LDO3-5 output voltage setting, Power-up default = 1.811 V LDO5, Address = F, All Bits R/W Bit name LDO5_DISCH Function LDO5 output discharge switch enable When 0 OFF When 1 ON LDO5_6 SET LDO5_5 SET LDO5_4 SET LDO5_3 SET LDO5_2 SET LDO5_1 SET LDO5_0 SET LDO5 OUTPUT VOLTAGE SETTING See Table 46 for LDO3-5 output voltage setting, Power-up default = 3.111 V GPIO3, Address = 1C, All Bits R/W. NOTE: ONLY BIT B5 CONTROLS LDO-RELATED FUNCTIONALITY Bit name GPIO3i/O GPIO3 LEVEL CHARGE _VLTG NOT USED GPIO2 _INTSRC GPIO1 _INTSRC GPIO2 _SM2 See Table 23 NOT USED See Table 23 See Table 23 See Table 23 LDO0 ON/OFF CONTROL Function When 0 LDO0 ENABLE See Table 23 See Table 23 When 1 LDO0 OFF LDO0 ON Table 46. LDO 3–5 Programming Step Values 78 Step B6–B0 Vset Step B6–B0 Vset Step B6–B0 Vset Step B6-B0 Vset 0 000 0000 1.224 32 010 0000 2.040 64 100 0000 2.015 96 110 0000 2.856 1 000 0001 1.250 33 010 0001 2.066 65 100 0001 2.040 97 110 0001 2.882 2 000 0010 1.275 34 010 0010 2.091 66 100 0010 2.907 98 110 0010 3.723 3 000 0011 1.301 35 010 0011 2.117 67 100 0011 2.933 99 110 0011 3.749 4 000 0100 1.326 36 010 0100 2.142 68 100 0100 2.958 100 110 0100 3.774 5 000 0101 1.352 37 010 0101 2.168 69 100 0101 2.984 101 110 0101 3.800 6 000 0110 1.377 38 010 0110 2.193 70 100 0110 3.009 102 110 0110 3.825 7 000 0111 1.403 39 010 0111 2.219 71 100 0111 3.035 103 110 0111 3.851 8 000 1000 1.428 40 010 1000 2.244 72 100 1000 3.060 104 110 1000 3.876 9 000 1001 1.454 41 010 1001 2.270 73 100 1001 3.086 105 110 1001 3.902 10 000 1010 1.479 42 010 1010 2.295 74 100 1010 3.111 106 110 1010 3.927 11 000 1011 1.505 43 010 1011 2.321 75 100 1011 3.137 107 110 1011 3.953 12 000 1100 1.530 44 010 1100 2.346 76 100 1100 3.162 108 110 1100 3.978 13 000 1101 1.556 45 010 1101 2.372 77 100 1101 3.188 109 110 1101 4.004 14 000 1110 1.581 46 010 1110 2.397 78 100 1110 3.213 110 110 1110 4.029 15 000 1111 1.607 47 010 1111 2.423 79 100 1111 3.239 111 110 1111 4.055 16 001 0000 1.632 48 011 0000 2.448 80 101 0000 3.264 112 111 0000 4.080 17 001 0001 1.658 49 011 0001 2.474 81 101 0001 3.290 113 111 0001 4.106 18 001 0010 1.683 50 011 0010 2.499 82 101 0010 3.315 114 111 0010 4.131 19 001 0011 1.709 51 011 0011 2.525 83 101 0011 3.341 115 111 0011 4.157 20 001 0100 1.734 52 011 0100 2.550 84 101 0100 3.366 116 111 0100 4.182 21 001 0101 1.760 53 011 0101 2.576 85 101 0101 3.392 117 111 0101 4.208 22 001 0110 1.785 54 011 0110 2.601 86 101 0110 3.417 118 111 0110 4.233 23 001 0111 1.811 55 011 0111 2.627 87 101 0111 3.443 119 111 0111 4.259 24 001 1000 1.836 56 011 1000 2.652 88 101 1000 3.468 120 111 1000 4.284 25 001 1001 1.862 57 011 1001 2.678 89 101 1001 3.494 121 111 1001 4.310 26 001 1010 1.887 58 011 1010 2.703 90 101 1010 3.519 122 111 1010 4.335 27 001 1011 1.913 59 011 1011 2.729 91 101 1011 3.545 123 111 1011 4.361 28 001 1100 1.938 60 011 1100 2.754 92 101 1100 3.570 124 111 1100 4.386 29 001 1101 1.964 61 011 1101 2.780 93 101 1101 3.596 125 111 1101 4.412 30 001 1110 1.989 62 011 1110 2.805 94 101 1110 3.621 126 111 1110 4.437 31 001 1111 2.015 63 011 1111 2.831 95 101 1111 3.647 127 111 1111 4.463 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 8.6.6 Switched-Mode Step-Down Converters — I2C Registers The I2C registers that control buck converter-related functions are shown below. The HEX address for each register is shown by the register name, together with the R or W functionality for the register bits. Shaded values indicate default initial power-up values. Table 47. Switched-Mode Step-Down Converters Registers B7 B6 B5 B4 B3 B2 B1 B0 SM1 EN PFM_RPL1 PFM_SM1 SetV4_SM1 SetV3_SM1 SetV2_SM1 SetV1_SM1 SetV0_SM1 SM1 ON/OFF CONTROL SM1 PFM FUNCTION OPERATION SM1 PFM MODE ON/OFF CTRL When 0 OFF MAXIMIZE EFFICIENCY PWM/PFM When 1 ON MINIMIZE OUTPUT RIPPLE Only PWM SM1_SET1, Address = 10, All Bits R/W Bit name Function SM1 OUTPUT VOLTAGE REGULATION VALUE, STANDBY MODE NOT SET See Table 48 for SM1, SM2 voltage setting, Power up default=1.24 V SM1_SET2, Address = 11, All Bits R/W Bit name NOT USED STANDBY_SM 1 DISCHSM1 Function NOT USED SM1 STANDBY MODE ON SM1 output discharge switch enable When 0 NOT USED OFF OFF When 1 NOT USED ON ON S1S2PHASE_1 S1S2PHASE_0 SM2 PWM CLOCK DELAY, WITH RESPECT TO SM1 PWM CLOCK SLEWSM1_2 SLEWSM1_1 SLEWSM1_0 SM1 OUTPUT SLEW RATE SETTING 00 = 0° 01 = 90° 10 = 180° 11 = 270° Default = 180° 000 = 0.24 010 = 0.96 100 = 5.84 110 = 15.36 001 = 0.48 011 = 1.92 101 = 7.68 111 = IMMEDIATE Unit: mV/μs Default= 15.36 SetV4_SM1SL SetV3_SM1SL SetV2_SM1SL SM1_STANDBY, Address = 12, B4-B0 R/W, B7-B5 Read Only Bit name GPIO3LVL Function GPIO3 pin logic level GPIO2LVL GPIO1LVL GPIO2 pin logic GPIO1 pin logic level level When 0 LO LO LO When 1 HI HI HI SetV1_SM1SL SetV0_SM1SL SM1 OUTPUT VOLTAGE REGULATION VALUE, STANDBY MODE SET See Table 48 for SM1, SM2 voltage setting, Power-up default = 1.24 V SM2_SET1, Address = 13, All Register Bits R/W Bit name SM2 EN PFM_RPL2 PFM_SM2 SM2 ON/OFF CONTROL SM2 PFM FUNCTION OPERATION SM2 PFM MODE ON/OFF CTRL When 0 OFF MAXIMIZE EFFICIENCY PWM/PFM When 1 ON MINIMIZE OUTPUT RIPPLE ONLY PWM Function SetV4_SM2 SetV3_SM2 SetV2_SM2 SetV1_SM2 SetV0_SM2 SM2 OUTPUT VOLTAGE REGULATION VALUE, STANDBY MODE NOT SET See Table 48 for SM1, SM2 voltage setting, Power-up default = 3.32 V SM2_SET2, Address = 14, All Register Bits R/W Bit name NOT USED STANDBY_SM 2 DISCHSM2 NOT USED NOT USED Function NOT USED SM2 STANDBY MODE ON SM2 output discharge switch enable NOT USED NOT USED When 0 NOT USED OFF OFF NOT USED NOT USED When 1 NOT USED ON ON NOT USED NOT USED SetV4_SM2SL SetV3_SM2SL SLEWSM2_2 SLEWSM2_1 SLEWSM2_0 SM2 OUTPUT SLEW RATE SETTING 000 = 0.48 010 = 1.92 100 = 7.68 110 = 30.72 001 = 0.096 011 = 3.84 101 = 15.36 111 = IMMEDIATE Unit: mV/μs Default = 30.72 SM2_STANDBY, Address = 15, All Register Bits R/W Bit name NOT USED NOT USED NOT USED Function NOT USED NOT USED NOT USED When 0 NOT USED NOT USED NOT USED When 1 NOT USED NOT USED NOT USED SetV2_SM2SL SetV1_SM2SL SetV0_SM2SL SM1 OUTPUT VOLTAGE REGULATION VALUE, STANDBY MODE SET See Table 48 for SM1, SM2 voltage setting, Power up default=3.32 V Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 Submit Documentation Feedback 79 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com Table 48. Programmable Settings for SM1 and SM2 (Including STANDBY) SetV4_ SM SetV3_ SM SetV2_ SM SetV1_ SM SetV0_ SM 0 0 0 0 0 0 0 0 0 1 0 0 0 1 0 0 0 0 1 0 0 1 0 0 0 0 Vset SM1 Vset SM2 SetV4_ SM SetV3_ SM SetV2_ SM SetV1_ SM SetV0_ SM Vset SM1 Vset SM2 0.6 1 1 0 0 0 0 1.24 2.28 0.64 1.08 1 0 0 0 1 1.28 2.36 0.68 1.16 1 0 0 1 0 1.32 2.44 1 0.72 1.24 1 0 0 1 1 1.36 2.52 0 0 0.76 1.32 1 0 1 0 0 1.4 2.6 1 0 1 0.8 1.4 1 0 1 0 1 1.44 2.68 0 1 1 0 0.84 1.48 1 0 1 1 0 1.48 2.76 0 1 1 1 0.88 1.56 1 0 1 1 1 1.52 2.84 0 1 0 0 0 0.92 1.64 1 1 0 0 0 1.56 2.92 0 1 0 0 1 0.96 1.72 1 1 0 0 1 1.6 3 0 1 0 1 0 1 1.8 1 1 0 1 0 1.64 3.08 0 1 0 1 1 1.04 1.88 1 1 0 1 1 1.68 3.16 0 1 1 0 0 1.08 1.96 1 1 1 0 0 1.72 3.24 0 1 1 0 1 1.12 2.04 1 1 1 0 1 1.76 3.32 0 1 1 1 0 1.16 2.12 1 1 1 1 0 1.8 3.4 0 1 1 1 1 1.2 2.2 1 1 1 1 1 0.6 1 Table 49. Programmable Settings for SM1 and SM2 Phase and Slew Rate SM1, SM2 PHASE SMX_SLEW RATE, SMX = SM1 OR SM2 S1S2_PHASE1 S1S2_PHASE0 SLEWX_2 SLEWX_1 SLEWX_0 SM1 mV/μs SM2 mV/μs 0° 0 0 0 0.24 0.48 PHASE 0 0 0 1 90° 0 0 1 0.48 0.96 1 0 180° 0 1 0 0.96 1.92 1 1 270° 0 1 1 1.92 3.84 1 0 0 3.84 7.68 1 0 1 7.68 15.36 1 1 0 15.36 1 1 1 30.72 Immediate 8.6.7 ADC – I2C Registers The I2C registers that control ADC-related functions are shown below. The HEX address for each register is shown by the register name, together with the R or W functionality for the register bits. Default, initial power-up values are shown in bold. In the timing equations, replace Bn with 1 for HI state, and 0 for LO state. Table 50. ADC Registers B7 B6 B5 B4 B3 B2 B1 B0 ADC_ENABLE ADC_REF_EN CHSEL2_SET CHSEL1_SET CHSEL0_SET READ_MODE2 READ_MODE1 READ_MODE0 ADC ON/OFF CONTROL ADC REFERENCE SELECTION When 0 OFF Internal When 1 ON External ADC_SET, Address = 1E, All Bits R/W Bit Name Function ADC CHANNEL SELECTION 011 = V(TS) 000 = ANLG1 100 = Tj 001 = ANLG2 101 = 010 = V(ISET1) V(RTC_OUT) ADC SAMPLING SETTINGS 110 = V(OUT) 111 = V(BAT) Default = ANLG1 000 = 1 001= 4 010 = 8 011 = 16 100 = 32 101 = 64 110 = 128 111 = 256 Default = 1 ADC READING_HI, Address = 1F, Bits B3/B4 R/W, All Other Bits Read Only Bit Name Function 80 ADC_STATUS CURRENT CONVERSION STATUS NOT USED NOT USED Submit Documentation Feedback NOT USED NOT USED ADC_READ1 ADC_READ0 D10 ADC AVERAGE CARRYOVER BIT ALU OUTPUT DATA SELECTION D9_MSB D8 ADC CONVERSION OUTPUT BITS Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 Table 50. ADC Registers (continued) B7 B6 B5 When 0 DONE NOT USED NOT USED When 1 BUSY NOT USED NOT USED B4 B3 B2 00=LAST 10 = MAXIMUM 01=AVERAGE 11 = MINIMUM Default= LAST B1 B0 VALID ONLY AFTER ADC CONVERSION ENDS SEE ADC_READING_LO ADC READING_LO, Address = 20, Read Only Bit Name D7 D6 Function Value D5 D4 D3 D2 D1 D0_LSB ADC CONVERSION OUTPUT BITS, VALID ONLY AFTER ADC CONVERSION ENDS VALUE=[B10*512 + B9*256 + B8*128 + B7*64 + B6*32 + B5*16 + B4*8 + B3*4 + B2*2 + B1] * [ VRNG(CHn) / 1023]; Unit=Volts, The LSB bit value is proportional to the ADC reference voltage - See VRNG(CHn) in electrical parameters DHILIM1, Address = 21, All Bits R/W Bit Name NOT USED NOT USED Function NOT USED NOT USED NOT USED DHILIM10 DHILIM9 DHILIM8 ADC MAX INPUT LIMIT RANGE SETTING (3 MSBs) RESERVED DHILIM2, Address = 22, All Bits R/W Bit Name DHILIM7 DHILIM6 DHILIM5 Function DHILIM4 DHILIM3 DHILIM2 DHILIM1 DHILIM0_LSB DLOLIM9 DLOLIM8 ADC MAX INPUT LIMIT RANGE SETTING (8 LSBs) DLOLIM1, Address = 23, All Bits R/W Bit Name NOT USED NOT USED Function NOT USED NOT USED NOT USED RESERVED DLOLIM10 ADC MIN INPUT LIMIT RANGE SETTING (3 MSBs) DLOLIM2, Address = 24, All Bits R/W Bit Name DLOLIM7 DLOLIM6 DLOLIM5 Function DLOLIM4 DLOLIM3 DLOLIM2 DLOLIM1 DLOLIM0_LSB Delay_1 Delay_0 ADC MIN INPUT LIMIT RANGE SETTING (8 LSBs) ADC_DELAY, Address = 25, All Bits R/W Bit Name EDGE _GPIO3 HOLDOFF REPEAT USE GPIO3 AS ADC TRIGGER GPIO3 TRIGGER MODE ADC HOLDOFF ON/OFF CONTROL REPEAT MODE ON/OFF When 0 OFF Falling Edge OFF OFF When 1 ON Rising Edge ON ON BATIDI_D1 BATIDI_D0 Function ADC_TRG_GPIO3 Delay_3 Delay_2 ADC EXTERNAL TRIGGER DELAY SETTING tDLY(TRIG)= B4*400 + B3 * 200 + B2*100 + B1* 50, Units = μs Default = 0 μs ADC_WAIT, Address = 26, All Bits R/W Bit Name Function ADC_cH2I_D1 ADC_cH2I_D0 ANLG2 PULL-UP CURRENT SOURCE VALUE ANLG1 PULL-UP CURRENT SOURCE VALUE 11:60 μA, 10:50 μA, 01:10 μA,00: 0 Default= 00 11:60 μA, 10:50 μA, 01:10 μA, 00: WEAK PULL UP Default: 00 When 0 When 1 WAIT_D3 WAIT_D2 WAIT_D1 WAIT_LSB ADC SAMPLE WAIT TIME, MULTIPLE SAMPLES MODE 0000 = 0 0001 = 0.02 0010 = 0.04 0011 = 0.06 Units = ms Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 0100 0101 0110 0111 = 0.08 = 0.16 = 0.24 = 0.32 1000 1001 1010 1011 = 0.64 = 1.28 = 1.92 = 2.56 1100 = 5.12 1101 = 10.24 1110 = 15.36 1111 = 20.48 Default = 0 Submit Documentation Feedback 81 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com 8.6.8 White LED, PWM Drivers — I2C Registers The I2C registers that control LED AND PWM driver related functions are shown below. The HEX address for each register is shown by the register name, together with the R or W functionality for the register bits. Shaded values indicate default initial power-up values. In the equations replace Bn with 1 for HI state, and 0 for LO state. Table 51. White LED, PWM Drivers Registers B7 B6 B5 SM3_I6 set SM3_I5 set B4 B3 B2 B1 B0 SM3_I4 set SM3_I3 set SM3_I2 set SM3_I1 set SM3_I0 set FLASH_PER1 FLASH_PER0 SM3_SET, Address = 16, All Bits R/W Bit Name SM3_I7 set Function SM3 DUTY CYCLE CONTROL Value See Table 19 for SM3 duty cycle settings, default = 0 (OFF) RGB_FLASH, Address = 17, All Bits R/W Bit Name FLASH_EN Function FLASH MODE ON/OFF CTRL When 0 OFF When 1 ON FLASH_ON2 FLASH_ON1 FLASH_ON0 FLASH_PER3 FLASH_PER2 FLASH MODE ON TIME FLASH MODE PERIOD See Table 20 for RGB ON TIME settings, default = 0.1 See Table 20 for RGB FLASH settings, default = 1 RGB_RED, Address = 18, All Bits R/W Bit Name Function RGB_ISET1 RGB_ISET0 RGB LED CURRENT SETTINGS When 0 00= 0 10= 8 mA 01= 4 mA 11=12 mA When 1 PHASE PWMR_D4 PWMR_D3 PHASE CONTROL PWMR_D2 PWMR_D1 PWMR_D0 REG DRIVER DUTY CYCLE CONTROL GREEN out of Φ with RED & BLUE See Table 20 for RGB_RED DUTY settings, default = 0 BLUE out of Φ with RED & GREEN RGB_GREEN, Address = 19, All Bits R/W Bit Name NOT USED NOT USED NOT USED Function NOT USED NOT USED NOT USED PWMG_D4 PWMG_D3 GREEN DRIVER DUTY CYCLE CONTROL PWMG_D2 PWMG_D1 PWMG_D0 Value NOT USED NOT USED NOT USED See Table 20 for RGB_GREEN DUTY settings, default = 0 RGB_BLUE, Address = 1A, All Bits R/W Bit Name NOT USED NOT USED NOT USED Function NOT USED NOT USED NOT USED PWMB_D4 PWMB_D3 BLUE DRIVER DUTY CYCLE CONTROL PWMB_D2 PWMB_D1 Value NOT USED NOT USED NOT USED See Table 20 for RGB_BLUE DUTY settings, default = 0 PWM1_F2 PWM_F1 PWMB_D0 PWM, Address = 1D, All Bits R/W Bit Name PWM_EN Function PWM ON/OFF CONTROL When 0 Disabled When 1 Enabled PWM_F0 PWM DRIVER FREQUENCY SETTINGS 000 = 15.6 kHz 001 = 7.8 kHz 010 = 4.5 kHz 011 = 3 kHz 100 = 2 kHz 101 = 1.5 kHz 110 = 1 kHz 111 = 500 Hz Default = 15.6 kHz LPWM_5 set LPWM_4 set PWM_D3 PWM_D2 PWM_D1 PWM_D0 PWM DRIVER DUTY CYCLE SETTINGS See Table 21 for PWM DUTY settings, default = 0.0625 LED_PWM, Address = 27, All Bits R/W Bit Name LPWM_7 set LPWM_6 set Function Value 82 LPWM_3 set LPWM_2 set LPWM_1 set LPWM_0 set LED_PWM DRIVER DUTY CYCLE CONTROL See Table 19 for LED_PWM DUTY settings, default = 0 (OFF) Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 8.6.9 GPIOs — I2C Registers The I2C registers that control GPIO-related functions are shown below. The HEX address for each register is shown by the register name, together with the R or W functionality for the register bits. Shaded values indicate default initial power-up values. Table 52. GPIOs Registers B7 B6 B5 B4 B3 B2 B1 B0 GPIO1I/O GPIO2OUT GPIO1OUT GPIO2LVL GPIO1LVL GPIO1SMSBY GPIO1SM1 GPIO1 CONTROLS SM1 ON/OFF GPIO12, Address = 1B, All Bits R/W Bit Name GPIO2I/O GPIO2 MODE GPIO1 MODE SET GPIO2 LEVEL (OUTPUT ONLY) SET GPIO1 LEVEL (OUTPUT ONLY) GPIO2 EDGE AND LEVEL DETECTION GPIO1 EDGE AND LEVEL DETECTION GPIO 1 CONTROLS SM1 AND SM2 STANDBY ON/OFF When 0 INPUT INPUT LOW LOW RISING EDGE, LO LEVEL RISING EDGE, LO LEVEL DISABLED DISABLED When 1 OUTPUT OUTPUT HIGH HIGH FALLING EDGE, HI LEVEL FALLING EDGE, HI LEVEL ENABLED ENABLED GPIO3I/O GPIO3OUT LDO0_EN CHG_VOLT NOT USED GPIO2 INT GPIO1 INT GPIO2SM2 GPIO3 MODE SET GPIO3 LEVEL (OUTPUT ONLY) LDO0 ON/OFF CONTROL CHARGE VOLTAGE SAFETY BIT NOT USED GPIO2 TRIGGERS INT:HI→LO GPIO1 TRIGGERS INT:HI→LO SM2 ON/OFF CONTROL Function GPIO3, Address = 1C, All Bits R/W Bit Name Function When 0 INPUT LOW OFF 4.20 V NOT USED DISABLED DISABLED DISABLED When 1 OUTPUT HIGH ON 4.36 V NOT USED ENABLED ENABLED ENABLED Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 Submit Documentation Feedback 83 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com 9 Application and Implementation NOTE Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality. 9.1 Application Information The target application for this device is a smart phone operated from a single Lithium Ion battery that can be recharged from either a USB port or an AC adaptor. 84 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 9.2 Typical Applications 9.2.1 SM1, SM2 Converter Design Example AC _ DC ADAPTER OUTPUT VSIM V RTC_OUT V LDO_PM V L DO 0 V L DO 1 V L DO 2 + - GND USB VOUT POWER + C1 - C2 10 uF 10 uF 2 . 2 uF C3 GND C4 VOUT C5 Supercap 7 AC 6 USB A1 V SM2 1 uF C7 1 uF C8 4 . 7 uF C9 4. 7 uF C 10 4 . 7 uF SIM OUT 9 A2 SYSTEM 4 RTC _ OUT POWER 17 BAT 18 R 12 10 KΩ C 25 Battery 10 uF TS 12 32 LDO 0 TMR 13 37 LDO 1 DPPM R TMR 49 . 9 K R DPPM 37 . 4 K 14 33 LDO 2 VIN _SM 1 47 A1 47 nF C 23 1 0 . 1 uF C 13 2 . 2 uF GND LSM 1 V SM1 3. 3 uH C 14 2 . 2 uF C 15 2 . 2 uF SM 1 44 30 LDO 35 _ REF VOUT VIN _ SM 2 50 LSM 2 L 2 51 26 LDO 5 3 . 3 uH SM 2 49 2 V SM2 0 . 1 uF C 16 1 nF A1 R2 2K R3 2K 210 K R6 R4 100 K R5 100 K P2 SM 3 SW 40 20 TRSTPWON 31 SYS _ IN LSM 3 2 SCLK 3 SDAT SM 3 42 INT PGND 24 1K ADC _ REF ANLG 1 43 GPIO 1 BAT 54 GPIO 3 PWM 34 LED _ PWM 36 RED 55 GREEN 53 GPIO 2 R 10 1K V LDO_PM BLUE PWRGND DATA CLOCK ANALOG EXTERNAL HOST A1 INPUTS VOUT RGB LED NOTES : ALARM 4 . 7 uF EXTERNAL EXTERNAL 1 RESET C 29 R8 100 K P3 PERIPHERALS AGND 0 16 A1 R 11 100 KΩ R FB3 10 56 57 M1 V SM2 ADC C 18 3 38 C 27 100 pF P3 23 ANLG 2 R9 C 28 1 uF WHITE LEDS FB 3 41 21 RESPWRON 22 TURN ON SWITCH VOUT D1 100 pF A2 4 . 7 uH L 3 39 19 4 . 7 uF 10 uF PGND 2 52 C TRSTPWON 100 K C 20 C 19 10 uF 15 HOT _ RST 100 K 10 uF P1 27 LDO 4 25 AGND C 22 C 21 10 uF 1 45 PGND 28 LDO 3 RESET SWITCH VOUT VOUT L 1 46 29 VIN _ LDO 35 R7 R1 VSIM BUS 1K C 24 0 . 22 uF BAT 10 LDO _ PM C 12 V LDO 5 22 uF C 26 ISET 1 11 35 VIN _ LDO 12 1 uF C 11 V LDO 3 C 17 8 R SET 5 48 AGND V SM2 OUT 1 uF C6 V LDO 4 TPS65810 A0 1) RESISTOR VALUES IN OHMS 2) THE FOLLOWING PARAMETERS ARE PROGRAMMED : - R TMR = 49.9K: 6 HOUR CHARGE SAFETY TIMER , 30 MIN PRE-CHARGE SAFETY TIMER - R SET = 1K: 1A CHARGE CURRENT (NO SCALING , INPUT LIMIT=2. 5A), 100 mA TERMINATION AND PRE -CHARGE CURRENTS : 25 mA WHITE LED CURRENT - R FB 3 = 10 OHMS - C TRSTPWON =100 nF : 100mSEC RESET PULSE WIDTH - R DPPM = 37.4K: V(DPPM ) = 4.3V ADC TRIGGER SYSTEM_ON GND A1 A 2 A 3 P1 P 2 P3 3) THE CAPACITOR VALUES SHOWN IN THE APPLICATION DIAGRAM MAY BE LARGER THAN THE MINIMUM REQUIRED VALUES INDICATED IN THE PIN DESCRIPITON TABLE 4) THE VALUES SHOWN IN THE APPLICATION DIAGRAM MATCH THE COMPONENT VALUES USED IN THE HPA 129 EVM, SEE DESIGN NOTES SECTION FOR COMPONENT SELECTION DETAILS 5) AFTER GPIOS ARE SET TO HI THE HOST NEEDS TO TURN ON M1 IN LESS THAN 1 SEC (WITH R8=100 K AND C29=4.7uF) TO KEEP THE SYSTEM RUNNING UNDER BATTERY POWER ONLY Figure 51. TPS65810 Application Diagram, Recommended External Components Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 Submit Documentation Feedback 85 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com Typical Applications (continued) 9.2.1.1 Design Requirements Use values listed in Table 53 as the design conditions and parameters for the SM1 or SM2 converter design example. Table 53. Design Parameter DESIGN PARAMETER EXAMPLE VALUE VIN_SM1/2 4.6 V typical (may be less if input source is limited) VOUT_SM1/2 1.24 V IO(MAX) 0.6 A fSW 1500 kHz fC 25 kHz Use Equation 13 to calculate the target inductance for this design application. L t arget = V(OUT) 0.3 ´ IO(MAX) æ V(OUT) ö ç1 ÷ ç VIN _ MAX ÷ø è ´ = 3.35 mH fSW where • 3.3 µH is a good target value (13) Use Equation 14 to calculate the target capacitance for this design application. 1 C= = 10.5 mF 2 L (2 ´ p ´ fC ) where • 10 µ is a good target value (14) 9.2.1.2 Detailed Design Procedure 9.2.1.2.1 Inductor and Capacitor Selection — Converters SM1 and SM2 SM1 and SM2 are designed with internal voltage mode compensation and the stabilization is based on the selection of an LC filter that has a corner frequency around 27 kHz. TI does not recommend using LC values that would be outside the range of 13 kHz to 40 kHz. Use Equation 15 to calculate the corner frequency of the output LC filter for L = 3.3 µH and C = 10 µF which are the standard recommended LC values. 1 F= = 27.7 kHz 2p LC (15) The inductor value, along with the input voltage VIN, output voltage VOUT and switching frequency f define the ripple current. Typically the ripple current target is 30% of the full load current. At light loads it is desirable for ripple current to be less then 150% of the light load current. The inductor must be chosen with a rating to handle the peak ripple current, if a current of an inductor gets higher than its rated saturation level (DCR), the inductance starts to fall off, and the inductor’s ripple current increases exponentially. The DCR of the inductor plays an important role in efficiency and size of the inductor. Larger diameter wire has less DCR but may increase the size of the inductor Use Equation 16 to calculate the target inductor value. If an inductor value was already selected, use Equation 17 to calculate the ripple current of the inductor under static operating conditions. The ripple amplitude can be calculated during the ON-time (positive ramp) or during the OFF-time (negative ramp). Calculating the ripple using the off time is the easiest method because the voltage of the inductor is the output voltage. 86 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 It arget = V(OUT) 0.3 ´ IO(MAX) æ V(OUT) ö ç1 ÷ ç VIN _ MAX ÷ø è ´ f (16) æ V(OUT) ö ç1 ÷ VIN ø VL V(OUT) è DIL = ´ Dt = ´ L L f (17) Use Equation 18 to calculate the peak current because of the output load and ripple current. DI IL max = IO(MAX) + L 2 (18) For a faster transient response, a lower inductor and higher capacitance allows the output current to ramp faster, while the addition capacitance holds up the output longer (a 2.2-μH inductor in combination with a 22-μF output capacitor are recommended). The highest inductor current occurs at the maximum input voltage. The peak inductor current during a transient may be higher than the steady state peak current and must be considered when selecting an inductor. Monitoring the inductor current for non-saturation operation during a transient of 1.2 × ILmax at VIN_MAX ensures adequate saturation margin. Table 54 lists recommended inductors for typical operating conditions. Table 54. Inductors for Typical Operation Conditions DEVICE INDUCTOR VALUE TYPE DCDC3 converter 3.3 μH CDRH2D14NP-3R3 Sumida 3.3 μH PDS3010-332 Coilcraft 3.3 μH VLF4012AT-3R3M1R3 TDK 2.2 μH VLF4012AT-2R2M1R5 TDK 2.2 μH NR3015T2R2 Taoup-Uidem 3.3 μH CDRH2D18/HPNP-3R3 Sumida 3.3 μH VLF4012AT-3R3M1R3 TDK DCDC2 converter DCDC1 converter COMPONENT SUPPLIER 2.2 μH VLCF4020-2R2 TDK 3.3 μH CDRH3D14/HPNP-3R2 Sumida 3.3 μH CDRH4D28C-3R2 Sumida 3.3 μH MSS5131-332 Coilcraft 2.2 μH VLCF4020-2R2 TDK 9.2.1.2.2 Output Capacitor Selection, SM1, SM2 Converters The advanced Fast Response voltage mode control scheme of the SM1, SM2 converters implemented in the TPS65020 allow the use of small ceramic capacitors with a typical value of 10 μF for a 3.3-μH inductor, without having large output voltage under and overshoots during heavy load transients. Ceramic capacitors having low ESR values have low output voltage ripple, and recommended values and manufacturers are listed in Table 27. Often, because of the low ESR, the ripple current rating of the ceramic capacitor is adequate to meet the inductor’s currents requirements. Use Equation 19 to calculate the RMS ripple current. V(OUT) 1æ ö VIN 1 VRMSCout = ´ç + ESR ÷ L´f è 8 ´ COUT ´ f ø (19) At nominal load current, the inductive converters operate in PWM mode. The overall output voltage ripple is the sum of the voltage spike caused by the output capacitor ESR plus the voltage ripple caused by charging and discharging the output capacitor: The output voltage ripple is maximum at the highest input voltage Vin. Use Equation 20 to calculate the voltage spike caused by the output capacitor ESR (VRMSCout). Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 Submit Documentation Feedback 87 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 1* V RMSCout + L VOUT VIN f ǒ8 1 Cout www.ti.com f Ǔ ) ESR (20) At light load currents, the converters operate in PFM and the output voltage ripple is dependent on the output capacitor value. The output voltage ripple is set by the internal PFM output voltage comparator delay and the external capacitor. The typical output voltage ripple is less than 1% of the nominal output voltage. Table 55 lists recommend I/O capacitors for typical operating conditions. Table 55. Input and Output Capacitors for Typical Operation Conditions CAPACITOR VALUE CASE SIZE COMPONENT SUPPLIER COMMENTS 22 μF 1260 TDK C3216X5R0J226M Ceramic 22 μF 1260 Taiyo Yuden JMK316BJ226ML Ceramic 10 μF 0805 Taiyo Yuden JMK212BJ106M Ceramic 10 μF 0805 TDK C2012X5R0J106M Ceramic 22 μF 0805 TDK C2012X5R0J226MT Ceramic 22 μF 0805 Taiyo Yuden JMK212BJ226MG Ceramic 9.2.1.2.3 Input Capacitor Selection, SM1, SM2 Converters Buck converters have a pulsating input current that can generate high input voltage spikes at VIN. A low ESR input capacitor is required to filter the input voltage, minimizing the interference with other circuits connected to the same power supply rail. Each DC–DC converter requires a 10-μF ceramic input capacitor on its input pin. 9.2.1.2.4 Output Voltage Selection, SM1, SM2 Converters Typically the output voltage is programmed by the I2C. An external divider can be added to raise the output voltage, if the available I2C values do not meet the application requirements. Take care with this special option, because this external divider (gain factor) would apply to any selected I2C output voltage value for this converter. Use Table 54 to calculate the value of R1 with R2 = 20 kΩ. æV ö R1 = ç SMxOUT - 1÷ R2 è VFB ø where • • 88 VSMxOUT is the desired output voltage and R1/R2 is the feedback divider VFB is the I2C selected voltage Submit Documentation Feedback (21) Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 9.2.1.3 Application Curves The application curves were measured with the application circuit shown in Figure 51 (unless otherwise noted). VIN_SM2 VO_SM2 AC = 5 V, VIN_SM2 = 4 V, VO(SM2) = 1.8 V, IO(SM2) = 0 mA to 600 mA, VO(SM2) AC = 5 V, VIN_SM2 = 3 V (DC) + 1 V (AC), VO(SM2) = 1.8 V, IO(SM2) = 100 mA, L = 3.3 mF, CO(SM1) = 10 mF, CH1 = VIN_SM2, CH2 = VO(SM2) L = 3.3 mF, CO(SM1) = 10 mF, CH1 = VO_SM2, CH3 = IO(SM2) IO(SM2) Figure 52. Line Transient AC = 5 V, VIN_SM2/SM2 = 4 V, VO(SM2) = 1.8 V, IO(SM2) = 600 mA, Figure 53. Load Transient SM2 Voltage SM1 Voltage AC = 5 V, VIN_SM2/SM2 = 4 V, VO(SM2) = 1.8 V, IO(SM2) = 600 mA, L = 3.3 mF, CO(SM1) = 10 mF L = 3.3 mF, CO(SM1) = 10 mF SM1 Current SM2 Current Figure 54. Transient - SM1 Start-Up BAT = 4 V, DC = 0% L3 = 4.7 mF, CO(SM3) = 10 mF, CH1 = L3, CH4 = SM3 Figure 55. Transient - SM2 Start-Up BAT = 4 V, DC = 0% L3 = 4.7 mF, CO(SM3) = 10 mF, CH1 = L3, CH4 = SM3 Figure 56. SM3 White LED Driver Soft-Start Figure 57. SM3 Led Current vs PWM Duty Cycle Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 Submit Documentation Feedback 89 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com 9.2.2 Charger Design Example TPS 65810 AC _DC Adapter Output AC SWITCH AC SYSTEM POWER BUS OUT OUT USB Power C1 10 mF USB USB SWITCH C26 22 mF BATTERY SWITCH C2 10 mF A1 Battery BAT BAT A1 POWER PATH CONTROL A1 LINEAR CHARGER TS DPPM TMR ISET1 C25 10 mF RSET 1 kW System Power Selection Input Current Limit Selection + C24 0.22 mF Charge Voltage Fast Charge Current Scaling Charge Suspend RTMR 49.9 kW RDPPM 37.4 kW 50 kW NTC C23 47 nF GND A1 I2C REGISTERS With the above components the following system parameters are set : Fast Charge Current = 1A (100% scaling, input limit=2. 5A) Safety Timer = 5hours, 30 min pre-charge DPPM threshold = 4. 3V Temp hot: 65C Temp Cold : 5C Figure 58. Required External Components, Recommended Values, External Connections 9.2.2.1 Design Requirements Use values listed in Table 56 as the design conditions and parameters for the charger design example. Table 56. Design Parameter DESIGN PARAMETER EXAMPLE VALUE V(OUT) 4.6 V; (OUT pin is input to charger) Fast-charge current, IPGM 1A DPPM-OUT threshold 4.3 V; (charging current reduces when OUT falls to this level) Safety timer 5h Battery short-circuit delay, tDELAY 47 μs; (delays BAT short circuit during hot plug of battery) TS temperature range Disabled K(SET) 400 V(SET) 2.5 V KDPPM 1.15 IDPPM 100 μA KTMR 0.36 s/Ω 9.2.2.2 Detailed Design Procedure 9.2.2.2.1 Program the Fast Charge Current Level: Use Equation 22 to calculate the fast-charge current level. K (SET) ´ V(SET) = 1 kW RISET = IPGM (22) 9.2.2.2.2 Program the DPPM_OUT Voltage Level Use Equation 23 to calculate the DPPM_OUT voltage level which is the level at which the charging current is reduced. VDPPM _ OUT RDPPM = = 3.74 kW KDPPM ´ IDPPM (23) 90 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 9.2.2.2.3 Program the BAT Short Circuit Delay Use Equation 24 to calculate the BAT short-circuit delay which is used to insert the battery. C DPPM + t DELAY I DPPM + 4.7 Nf (24) 9.2.2.2.4 Program the 5-Hour Safety Timer Use Equation 25 to calculate the value of the safety timer. t ´ 3600 s/hr RTMR = SAFETY -HR = 50 kW K TMR (25) 10 Power Supply Recommendations The power path control of this device allows it to be used with an input voltage from an AC adapter, a USB port, or a single-cell lithium ion (Li-Ion) battery. The AC and USB inputs must be well regulated and range from 4.35 to 5.5 V. 11 Layout 11.1 Layout Guidelines The PCB layout for a switching power supply is an important step of the design, especially for high peak current and high switching frequency converters. To avoid stability and EMI problems, TI recommends that short and wide traces be used for the main current path and for the power ground tracks. The input capacitor, output capacitor and the inductor must be placed as close as possible to the IC. Use a common ground node for power ground and a different one for analog ground to minimize the effects of ground noise. Both these ground nodes must be connected together at a point close to one of the IC ground pins. The PGNDx pins are the ground connections for the power stage and therefore carry high DC and AC peak currents. A low impedance connection between the PGNDx pins and the power ground plane is recommended. No other pins must be connected to the PGNDx pins. The AGNDx pins serve as the ground connections for the internal analog circuitry of the device. These pins must be connected directly to the PCB ground plane using vias. Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 Submit Documentation Feedback 91 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com 11.2 Layout Example COUT COUT COUT COUT L2 VDCDC2 CIN PGND2 CIN VIN L1 VDCDC1 VIN PGND1 Figure 59. Converter Layout Example 92 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 TPS65810, TPS65811 www.ti.com SLVS658C – MARCH 2006 – REVISED JANUARY 2016 12 Device and Documentation Support 12.1 Device Support 12.1.1 Third-Party Products Disclaimer TI'S PUBLICATION OF INFORMATION REGARDING THIRD-PARTY PRODUCTS OR SERVICES DOES NOT CONSTITUTE AN ENDORSEMENT REGARDING THE SUITABILITY OF SUCH PRODUCTS OR SERVICES OR A WARRANTY, REPRESENTATION OR ENDORSEMENT OF SUCH PRODUCTS OR SERVICES, EITHER ALONE OR IN COMBINATION WITH ANY TI PRODUCT OR SERVICE. 12.2 Related Documentation For related documentation see the following: • Differences Between the TPS65800/810/820 PMIC Devices, SLVA248 • Optimizing Resistor Dividers at a Comparator Input, SLVA450 • TPS658xxEVM Integrated Single-Cell, Lithium-Ion Battery- and Power-Management IC With I2C, LED Drives, Two Synchronous Buck, Boost, and Multiple LDOs, SLVU154 12.3 Related Links The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to sample or buy. Table 57. Related Links PARTS PRODUCT FOLDER SAMPLE & BUY TECHNICAL DOCUMENTS TOOLS & SOFTWARE SUPPORT & COMMUNITY TPS65810 Click here Click here Click here Click here Click here TPS65811 Click here Click here Click here Click here Click here 12.4 Community Resources The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help solve problems with fellow engineers. Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and contact information for technical support. 12.5 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 12.6 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.7 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 Submit Documentation Feedback 93 TPS65810, TPS65811 SLVS658C – MARCH 2006 – REVISED JANUARY 2016 www.ti.com 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 94 Submit Documentation Feedback Copyright © 2006–2016, Texas Instruments Incorporated Product Folder Links: TPS65810 TPS65811 PACKAGE OPTION ADDENDUM www.ti.com 4-Nov-2023 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TPS65810RTQT LIFEBUY QFN RTQ 56 250 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 85 TPS 65810 TPS65811RTQR LIFEBUY QFN RTQ 56 2000 RoHS & Green NIPDAU Level-3-260C-168 HR -40 to 125 TPS 65811 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of