RP605x Series
300mA Ultra-low Power Buck Boost DC/DC Converter with Battery Monitor
No. EA-516-210611
OVERVIEW
RP605x is an ultra-low power DC/DC converter with a Battery Monitor (BM). The battery monitor divides the
input voltage (VIN) into 1/3 or 1/4 and directly provides the buffered voltage to a low-voltage AD converter in
MCU, it monitors the remaining quantity of the battery.
KEY BENEFITS
● Long-time operation of battery powered equipment and downsizing of battery due to the ultra-low
consumption current (IQ = 0.3 µA).
● Reducing components and saving space by combining DC/DC and BM into a single chip.
● Suitable for coin batteries and USB ports due to its wide input voltage range from 1.8 V to 5.5 V
PACKAGES (unit: mm)
KEY SPECIFICATIONS
DC/DC Section
● Supply Current: Typ. 0.3 μA
● Output Current: 300 mA
● Input Voltage Range: 1.8 V to 5.5 V
● Output Voltage Range: 1.6 V to 5.2 V
● Output Voltage Accuracy: ±1.5%
Battery Monitor Section
● Output Voltage: VIN/3 (RP605xxx3x)
VIN/4 (RP605xxx4x)
● Supply Current: Typ. 0.1 μA
TYPICAL APPLICATIONS
WLCSP-20-P3
DFN(PL)2730-12
2.315 x 1.71 x 0.36
3.00 x 2.70 x 0.6
•
RP605x
Signal
VIN
CE1
BULX
PVIN
BOLX
VFB
Buck-Boost
DC/DC Converter
MCU
L
2.2µH
VOUT
VOUT
VCC
PGND
COUT1
AVIN
Signal
CIN
≥ 10µF
CE2
AGND
Battery Monitor
BM
22µF
VBM
ADC
COUT2
0.1µF to 0.22µF
APPLICATIONS
•
•
•
•
Devices with Coin Cell Battery and Lithium Ion Battery
Wearable devises including Smart watch, Smart band, and Health monitor
Low power RF Modules including: Bluetooth® LE, Zigbee, WiSun and ANT
Low power CPUs, Memory, Sensor device and Energy harvester
1
RP605x
No. EA-516-210611
SELECTION GUIDE
The DC/DC set output voltage, the division ratio of BM output, the DC/DC auto-discharge function (1), and the
package are user-selectable options.
Selection Guide
Product Name
RP605Zxx#$-E2-F
RP605Kxx#$-TR
Package
Quantity per Reel
Pb Free
Halogen Free
WLCSP-20-P3
5,000 pcs
Yes
Yes
DFN(PL)2730-12
5,000 pcs
Yes
Yes
xx: Specify the DC/DC set output voltage (VSET)
Fixed output voltage type: 1.6 V (16) to 5.2 V (52) in 0.1 V step
Refer to the Product-specific Electrical Characteristics for detail information
#: Specify the division ratio of BM output
3：VIN/3
4：VIN/4
$: Specify the DC/DC auto-discharge option.
A: DC/DC auto-discharge is not included
B: DC/DC auto-discharge is included
(1)Auto-discharge
function quickly lowers the output voltage to 0 V by releasing the electrical charge accumulated in the
external capacitor when the chip enable signal is switched from the active mode to the standby mode.
2
RP605x
No. EA-516-210611
BLOCK DIAGRAMS
PVIN
BULX
BOLX
VOUT
OVP
PGND
Switching
Control
(Buck/Boost)
CE1
VFB
CE Enable
Control
TSHUT
AVIN
AGND
UVLO
+
BM
CE2
Enable
Control
RP605xxxxA Block Diagram: DC/DC auto-discharge is not included
PVIN
BULX
BOLX
VOUT
OVP
PGND
Switching
Control
(Buck/Boost)
CE1
VFB
CE Enable
Control
TSHUT
AVIN
AGND
UVLO
+
BM
CE2
Enable
Control
RP605xxxxB Block Diagram: DC/DC auto-discharge is included
3
RP605x
No. EA-516-210611
PIN DESCRIPTIONS
Top View
Bottom View
RP605Z (WLCSP-20-P3) Pin Configuration
RP605Z Pin Description
Pin No.
Symbol
Description
A5, B5
VOUT
DC/DC Output Pin
A4, B4, C4
BOLX
Boost Switching Output LX Pin
A3, B3, C3
PGND
Power Ground Pin
A2, B2, C2
BULX
Buck Switching Output LX Pin
A1, B1, C1
PVIN
Power Source Input Pin
C5
VFB
Feedback Pin
D1
AVIN
Analog Power Supply Pin
D2
CE1
DC/DC Enable Pin (Active-high)
D3
AGND
D4
CE2
Battery Monitor Enable Pin (Active-high)
D5
BM
Battery Monitor Output Pin
Analog Ground Pin
4
RP605x
No. EA-516-210611
Top View
Bottom View
12 11 10 9 8 7
7
8
9 10 11 12
*
1 2 3 4 5 6
6 5 4
3 2 1
RP605K [DFN(PL)2730-12] Pin Configuration
RP605K Pin Description
Pin No.
Symbol
Description
1
AVIN
Analog Power Supply Pin
2
CE1
DC/DC Enable Pin (Active-high)
3
AGND
4
CE2
Battery Monitor Enable Pin (Active-high)
5
BM
Battery Monitor Output Pin
6
VFB
Feedback Pin
7
VOUT
DC/DC Output Pin
8
BOLX
Boost Switching Output LX Pin
9
PGND
Power Ground Pin
10
PGND
Power Ground Pin
11
BULX
Buck Switching Output LX Pin
12
PVIN
Power Source Input Pin
Analog Ground Pin
* The tab on the bottom of the package shown by blue circle is a substrate potential (GND). It is recommended that
this tab be connected to the ground plane on the board, but it is possible to leave the tab floating.
5
RP605x
No. EA-516-210611
ABSOLUTE MAXIMUM RATINGS
Absolute Maximum Ratings
Symbol
VIN
Item
Input Voltage
Rating
Unit
−0.3 to 6.5
V
VBULX
BULX Pin Voltage
−0.3 to VIN + 0.3
V
VBOLX
BOLX Pin Voltage
−0.3 to VOUT + 0.3
V
VCE1
CE1 Pin Voltage
−0.3 to 6.5
V
VCE2
CE2 Pin Voltage
−0.3 to 6.5
V
VOUT
VOUT Pin Voltage
-0.3 to 6.5
V
VFB
VFB Pin Voltage
−0.3 to 6.5
V
VBM
BM Pin Voltage
−0.3 to VIN + 0.3
V
PD
Power Dissipation
Refer to Appendix
“POWER DISSIPATION”
Tj
Junction Temperature Range
−40 to 125
°C
Tstg
Storage Temperature Range
−55 to 125
°C
ABSOLUTE MAXIMUM RATINGS
Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause permanent damage
and may degrade the life time and safety for both device and system using the device in the field. The functional
operation at or over these absolute maximum ratings is not assured.
RECOMMENDED OPERATING CONDITIONS
Recommended Operating Conditions
Symbol
Item
Rating
RP605xxx3x
1.8 to 5.5
RP605xxx4x
2.4 to 5.5
VIN
Input Voltage
Ta
Operating Temperature
−40 to 85
Unit
V
°C
RECOMMENDED OPERATING CONDITIONS
All of electronic equipment should be designed that the mounted semiconductor devices operate within the
recommended operating conditions. The semiconductor devices cannot operate normally over the recommended
operating conditions, even if they are used over such conditions by momentary electronic noise or surge. And the
semiconductor devices may receive serious damage when they continue to operate over the recommended operating
conditions.
6
RP605x
No. EA-516-210611
ELECTRICAL CHARACTERISTICS
The specifications surrounded by
are guaranteed by design engineering at −40°C ≤ Ta ≤ 85°C.
RP605x Electrical Characteristics: DC/DC Section
Symbol
Parameter
Conditions
VOUT
IQ
ISTANDBY
Output voltage
Operating quiescent current
VIN = VCE1 = 3.6 V
VIN = VCE1 = VOUT = 3.6 V,
VSET = 3.3V, at rest
Standby current
VIN = 5.5 V, VCE1 = 0 V
ICE1H
CE1 pin input current, high
VIN = VCE1 = 5.5 V
ICE1L
CE1 pin input current, low
IVFBH
Min.
Typ.
x 0.985
(Ta = 25°C)
Max. Unit
x 1.015
0.3
V
µA
0.01
1
µA
−0.025
0
0.025
µA
VIN = 5.5 V, VCE1 = 0 V
−0.025
0
0.025
µA
VFB pin input current, high
VIN = VFB = 5.5 V, VCE1 = 0 V
−0.025
0
0.025
µA
IVFBL
VFB pin input current, low
VIN = 5.5 V, VCE1 = VFB = 0 V
−0.025
0
0.025
µA
VOVP
Overvoltage Protection (OVP)
Threshold
VIN = 3.6 V , Rising (Detection)
6.0
V
VIN = 3.6 V , Falling (Release)
5.5
V
RDISN
Auto-discharge NMOS
on-resistance
VIN = 3.6 V, VCE1 = 0 V
RP605xxxxB only
100
Ω
VCE1H
CE1 pin input voltage, high
VIN = 5.5 V
VCE1L
CE1 pin input voltage, low
VIN = 1.8 V
RONP
RONN
1.0
V
0.4
V
RP605Z
VIN = 3.6 V,
ILX = −100 mA
0.12
Ω
RP605K
VIN = 3.6 V,
ILX = −100 mA
0.15
Ω
RP605Z
VIN = 3.6 V,
ILX = −100 mA
0.12
Ω
RP605K
VIN = 3.6 V,
ILX = −100 mA
0.15
Ω
140
100
20
°C
°C
ms
mA
PMOS on-resistance
NMOS on-resistance
TTSD
TTSR
Thermal Shutdown
Threshold Temperature
tSTART
Soft-start time
Tj, Rising (Detection)
Tj, Falling (Release)
VIN = VCE1 = 3.6 V
ILXLIM
BULX Limiting current
VIN = VCE1 = 3.6 V
600
900
Undervoltage Lockout (UVLO)
Threshold
VIN = VCE1, Falling (Detection)
1.40
1.50
1.65
V
VIN = VCE1, Rising (Release)
1.55
1.65
1.80
V
VUVLOF
VUVLOR
All test items listed under Electrical Characteristics are done under the pulse load condition (Tj ≈ Ta = 25°C).
Test circuit is operated under condition of “Open Loop Control” (GND = 0 V), unless otherwise specified.
7
RP605x
No. EA-516-210611
ELECTRICAL CHARACTERISTICS (Continued)
The specifications surrounded by
are guaranteed by design engineering at −40°C ≤ Ta ≤ 85°C.
RP605x Electrical Characteristics: Battery Monitor Section
Symbol
Parameter
Conditions
(Ta = 25°C)
Min.
Typ.
Max.
RP605xxx3x
VIN/3-30
VIN/3
VIN/3+30
RP605xxx4x
VIN/4-30
VIN/4
VIN/4+30
VBM
Output voltage
VIN = 3.6 V,
−10μA≤ IBM≤10μA
IBM
Output current
VIN = 3.6 V
ISSBM
Supply current
IBM = 0 μA
VCE2H
CE2 input voltage, high
VIN = 5.5 V
VCE2L
CE2 input voltage, low
VIN = 1.8 V
RDISNBM
Auto-discharge NMOS.
on-resistance
VIN = 4.0 V, VCE2 = 0 V
−10
10
0.1
Unit
mV
µA
µA
1.0
V
0.4
50
V
Ω
All test items listed under Electrical Characteristics are done under the pulse load condition (Tj ≈ Ta = 25°C)
8
RP605x
No. EA-516-210611
Product-specific Electrical Characteristics
Product Name
RP605x16xx
RP605x18xx
RP605x20xx
RP605x24xx
RP605x25xx
RP605x28xx
RP605x30xx
RP605x31xx
RP605x33xx
RP605x36xx
RP605x40xx
RP605x50xx
RP605x52xx
(Ta = 25°C)
Min.
1.576
1.773
1.970
2.364
2.463
2.758
2.955
3.054
3.251
3.546
3.940
4.925
5.122
VOUT [V]
Typ.
1.600
1.800
2.000
2.400
2.500
2.800
3.000
3.100
3.300
3.600
4.000
5.000
5.200
Max.
1.624
1.827
2.030
2.436
2.537
2.842
3.045
3.146
3.349
3.654
4.060
5.075
5.278
9
RP605x
No. EA-516-210611
TYPICAL APPLICATION CIRCUIT
RP605x
Signal
VIN
CE1
BULX
PVIN
BOLX
VFB
Buck-Boost
DC/DC Converter
MCU
L
2.2µH
VOUT
VOUT
VCC
PGND
COUT1
AVIN
Signal
CE2
AGND
Battery Monitor
BM
CIN
22µF
VBM
ADC
COUT2
≥ 10µF
0.1µF to 0.22µF
RP605x Typical Application Circuit
10
RP605x
No. EA-516-210611
TECHNICAL NOTES
The performance of a power source circuit using this device is highly dependent on the peripheral circuit. A
peripheral component or the device mounted on PCB should not exceed a rated voltage, a rated current or a
rated power. When designing a peripheral circuit, please be fully aware of the following points.
•
Use carefully with the distance between the VFB pin and the wiring that causes noise.
•
Noise reduction is possible by adding a filter component such as a resistor to the VFB pin
•
Use ceramic capacitors with a low equivalent series resistance (ESR), considering the bias characteristics
and input/output voltages.
•
When the built-in switches are turned off, the inductor may generate a spike-shaped high voltage. Use the
high-breakdown voltage capacitor (COUT1) which output voltage is 1.5 times or more than the set output
voltage.
•
Use an inductor that has a low DC resistance, has an enough tolerable current and is less likely to cause
magnetic saturation.
•
The CE1 and CE2 pins are neither pulled up nor pulled down, therefore an operation is not stable at open.
•
The thermal shutdown function protects the IC from fuming and ignition but does not ensure the IC’s
reliability or keep the IC below the absolute maximum ratings. The thermal shutdown function only works
on the heat generated by normal IC operation such as latch-up and overvoltage application.
•
The thermal shutdown function operates in a state over the absolute maximum ratings, therefore the
thermal shutdown function should not be used for a system design.
11
RP605x
No. EA-516-210611
THEORY OF OPERATION
DC/DC Section
Soft-start Time
Starting-up with CE1 Pin
The IC starts to operate when the CE1 pin voltage (VCE1) exceeds the threshold voltage. The threshold
voltage is preset between CE1 “High” input voltage (VCE1H) and CE1 “Low” input voltage (VCE1L). After the
start-up of the IC, soft-start circuit starts to operate. Then, after a certain period, the reference voltage (VREF)
in the IC gradually increases up to the specified value. Switching starts when VREF reaches the preset voltage,
and after that the output voltage rises as VREF increases. Soft-start time (tSTART) indicates the period from the
time soft-start circuit gets activated to the time VREF reaches the specified voltage. tSTART is not always equal
to the turn-on speed of the DC/DC converter. Note that the turn-on speed could be affected by the power
supply capacity, the output current (IOUT), the inductance and the output capacitor value (COUT1).
VCE1H
CE1 Pin Input Voltage
(VCE1)
Threshold Level
VCE1L
Soft-start Time
IC Internal Reference Voltage
(VREF)
Lx Voltage
(VLX)
Soft-start Circuit
operation starts.
Output Voltage
(VOUT)
Depending on Power Supply,
Load Current, External Components
Timing Chart: Starting-up with CE1 Pin
Starting-up with Power Supply
After the power-on, when VIN exceeds the UVLO release voltage (VUVLOR), the IC starts to operate. Then, softstart circuit starts to operate and after a certain period, VREF gradually increases up to the specified value.
Switching starts when VREF reaches the preset voltage, and after that the output voltage rises as VREF increases.
The turn-on speed of VOUT could be affected by following conditions:
1. The VIN turn-on speed determined by the power supply to the IC and the CIN
2. The output capacitor value (COUT1) and the output current (IOUT)
Input Voltage
(VIN)
VSET
VUVLOR
VUVLOF
Soft-start Time
IC Internal Reference Voltage
(VREF)
Lx Voltage
(VLX)
VOUT
Output Voltage
(VOUT)
Depending on Power Supply,
Load Current, External Components
Timing Chart: Starting-up with Power Supply
12
RP605x
No. EA-516-210611
Undervoltage Lockout (UVLO) Circuit
If the VIN becomes lower than the UVLO detector threshold (VUVLOF), the UVLO circuit starts to operate, VREF
stops, and PMOS and NMOS built-in switch transistors turn “OFF”. To restart the operation, VIN needs to be
higher than VUVLOR.
Overvoltage Protection (OVP) Circuit
If the VOUT becomes higher than the OVP detector threshold (VOVP), the OVP circuit starts to operate and turs
off the built-in switch transistors. As a result, VOUT drops according to the COUT capacitance value and the load.
Overcurrent Protection Circuit
Overcurrent protection circuit supervises the inductor peak current (the peak current flowing through
PMOS Tr (SW1) in each switching cycle, and if the current exceeds the BULX current limit (ILXLIM),
it turns off PMOS Tr (SW1). ILXLIM of the RP605x is set to Typ. 0.9 A.
BULX
PVIN
BOLX
L
SW1
SW2
SW4
VOUT
SW3
PGND
Simplified Diagram of Output Switches
Thermal Shutdown Circuit
When the junction temperature exceeds the thermal shutdown detector threshold TTSD (Typ.140°C), the output
of the DC/DC section is shut off and self-heating is suppressed. The DC/DC restarts when the junction
temperature falls below the thermal shutdown release threshold TTSR (Typ.100°C), and the soft-start function
is operated like as CE1’s start-up.
13
RP605x
No. EA-516-210611
VFM Mode
The VFM (Variable Frequency Modulation) mode is adopted as a switching method to achieve a high efficiency
under light load conditions. A switching frequency varies depending on values of input voltage (VIN), output
voltage (VOUT), and output current (IOUT). Check the actual characteristics to avoid the switching noise.
A switching starts when VOUT drops below the lower-limit reference voltage (VREFL). When VOUT exceeds the
upper-limit reference voltage (VREFH), a constant voltage is output by a hysteresis control which stops the
switching.
In order to operate within the rated characteristic of inductor and avoid the deteriorated band frequency of
DC superimposed characteristics, when the inductor current (IL) exceeds LX current limit (ILXLIM), the
operation shifts to off-cycle. And when IL drops below the valley current limit (ILXVAL), the operation shifts to
on-cycle.
VOUT
VREFH
VOUT
VREFL
ILXLIM
VREFH
VREFL
ILXLIM
I L
I L
0
0
No Load
Light Load
VREFH
VREFH
VOUT
VOUT
VREFL
ILXLIM
VREFL
ILXLIM
I L
I L
ILXVAL
0
Medium Load
ILXVAL
0
Heavy Load
14
RP605x
No. EA-516-210611
Battery Monitor Section
Timing Chart of Typical Application Circuit
VIN
VCE2
VBM
tW
tW
ADC
Sampling
RP605x Timing Chart of Typical Application Circuit
The RP605x can monitor the battery voltage by connecting BM pin with ADC input pin in MCU. The RP605x
allows the CE2 pin to control the battery monitor's start and stop according to the sampling cycle from the ADC,
reducing the power consumption of the entire system.
During the battery voltage monitoring, waiting time (tw) is needed, recommended tw ≥ 10ms, for the CE2 pin
to gain stable VBM.
15
RP605x
No. EA-516-210611
APPLICATION INFORMATION
PCB Layout
RP605Z (Package: WLCSP-20-P3) PCB Layout
Top Layer
Bottom Layer
RP605K (Package: DFN(PL)2730-12) PCB Layout
Top Layer
Bottom Layer
16
RP605x
No. EA-516-210611
TYPICAL CHARACTERISTICS
Note: Typical Characteristics are intended to be used as reference data; they are not guaranteed.
DC/DC Section
1) Efficiency vs. Output Current
RP605x33xx, Ta = 25°C
2) Output Voltage vs. Output Current
RP605x33xx, Ta = 25°C
3) Standby Current vs. Temperature
RP605x33xx, VIN = 5.5V
17
RP605x
No. EA-516-210611
4) Output Current vs. Input Voltage
RP605x16xx, VIN = 1.8 to 3.6V, IOUT = (IIN = 300mA)
RP605x33xx, VIN = 1.8 to 5.5V, IOUT = (IIN = 300mA)
RP605x52xx, VIN = 2.3 to 5.5V, IOUT = (IIN = 300mA)
5) Output Ripple vs. Output Current
RP605x33xx, Ta = 25°C
18
RP605x
No. EA-516-210611
6) Output Voltage vs. Input Voltage
RP605x33xx, IOUT = 1mA, Ta = 25°C
RP605x33xx, IOUT = 100mA, Ta = 25°C
7) Starting-up/ Shutting-down Waveform with CE1 Pin
RP605x33xB, VIN = 3.6V, CE1 = 0V ↔ 3.6V, IOUT = 0mA, Ta = 25°C
(at Starting-up)
8) VOUT Pin Waveform
RP605x33xx, VIN = 3.6V, IOUT = 10mA, Ta = 25°C
(at Shutting-down)
RP605x33xx, VIN = 3.6V, IOUT = 100mA, Ta = 25°C
19
RP605x
No. EA-516-210611
9) Load Transient Response
RP605x33xx, VIN = 3.6V, IOUT = 0.01mA ↔ 100mA, Ta = 25°C
10) Input Transient Response
RP605x33xx, VIN = 2.5V ↔ 4.5V, IOUT = 1mA,
Ta = 25°C
RP605x33xx, VIN = 2.5V ↔ 4.5V, IOUT = 100mA,
Ta = 25°C
11) Supply Current vs. Temperature
RP605x33xx
20
RP605x
No. EA-516-210611
Battery Monitor Section
12) Output Voltage vs. Temperature
RP605xxx3x, VIN = 3.6V
RP605xxx4x, VIN = 3.6V
13) Output Voltage vs. Input Voltage
RP605xxx3x, VIN = 5.5V to Minimum Voltage,
Ta = 25°C
RP605xxx4x, VIN = 5.5V to Minimum Voltage,
Ta = 25°C
14) Supply Current vs. Temperature
RP605xxx3x, VIN = 3.6V
RP605xxx4x, VIN = 3.6V
21
RP605x
No. EA-516-210611
15) Supply Current vs. Input Voltage
RP605xxx3x, VIN = 5.5V to Minimum Voltage,
Ta = 25°C
RP605xxx4x, VIN = 5.5V to Minimum Voltage,
Ta = 25°C
16) Starting-up/ Shutting-down Waveform with CE2 Pin
RP605xxx3x, VIN = 3.6V, Ta = 25°C
RP605xxx4x, VIN = 3.6V, Ta = 25°C
RP605xxx3x, VIN = 5.5V, Ta = 25°C
RP605xxx4x, VIN = 5.5V, Ta = 25°C
22
RP605x
No. EA-516-210611
Test Circuit
RP605x
Signal
VIN
CE1
BULX
PVIN
BOLX
Buck-Boost
DC/DC Converter
VFB
MCU
L
2.2µH
VOUT
VOUT
VCC
PGND
COUT1
AVIN
Battery Monitor
CE2
Signal
22µF
AGND
BM
VBM
CIN
ADC
COUT2
≥ 10µF
0.1µF ～ 0.22µF
Test Circuit for Typical Characteristics
Measurement Components
Symbol
Capacitance
Manufacture
Parts number
CIN
COUT1
COUT2
10μF
22μF
0.1μF
Murata
Taiyo Yuden
Murata
GRM155R60J106M
JMK107BBJ226MA
GRM155R61A104K
L
2.2μH
TDK
MLP2520H2R2ST0S1
Measurement Components for Typical Characteristics
23
POWER DISSIPATION
WLCSP-20-P3
PD-WLCSP-20-P3-(85125)-JE-B
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51.
Measurement Conditions
Item
Measurement Conditions
Environment
Mounting on Board (Wind Velocity = 0 m/s)
Board Material
Glass Cloth Epoxy Plastic (Four-Layer Board)
Board Dimensions
101.5 mm x 114.5 mm x 1.6 mm
Copper Ratio
Outer Layer (First Layer): 10%
Inner Layers (Second and Third Layers): 99.5 x 99.5mm 100%
Outer Layer (Fourth Layer): 10%
Measurement Result
(Ta = 25°C, Tjmax = 125°C)
Item
Measurement Result
Power Dissipation
1210 mW
Thermal Resistance (θja)
θja = 82°C/W
θja: Junction-to-Ambient Thermal Resistance
1400
1210
Power Dissipation (mW)
1200
1000
800
600
400
200
0
0
25
50
75 85 100
Ambient Temperature (°C)
125
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
i
PACKAGE DIMENSIONS
WLCSP-20-P3
DM-WLCSP-20-P3-JE-A
WLCSP-20-P3 Package Dimensions
i
Visual Inspection Criteria
WLCSP
VI-160823
No.
1
Inspection Items
Package chipping
2
Si surface chipping
3
No bump
Marking miss
4
Inspection Criteria
Figure
A≥0.2mm is rejected
B≥0.2mm is rejected
C≥0.2mm is rejected
And, Package chipping to Si surface
and to bump is rejected.
A≥0.2mm is rejected
B≥0.2mm is rejected
C≥0.2mm is rejected
But, even if A≥0.2mm, B≤0.1mm is
acceptable.
No bump is rejected.
To reject incorrect marking, such as
another product name marking or
5
6
7
No marking
Reverse direction of
marking
Defective marking
8
Scratch
9
Stain and Foreign
material
another lot No. marking.
To reject no marking on the package.
To reject reverse direction of marking
character.
To reject unreadable marking.
(Microscope: X15/ White LED/ Viewed
from vertical direction)
To reject unreadable marking
character by scratch.
(Microscope: X15/ White LED/ Viewed
from vertical direction)
To reject unreadable marking
character by stain and foreign material.
(Microscope: X15/ White LED/ Viewed
from vertical direction)
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DFN(PL)2730-12
POWER DISSIPATION
Ver. A
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51-7.
Measurement Conditions
Item
Measurement Conditions
Environment
Mounting on Board (Wind Velocity = 0 m/s)
Board Material
Glass Cloth Epoxy Plastic (Four-Layer Board)
Board Dimensions
76.2 mm × 114.3 mm × 0.8 mm
Copper Ratio
Outer Layer (First Layer): Less than 95% of 50 mm Square
Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square
Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square
Through-holes
0.3 mm × 23 pcs
(Ta = 25°C, Tjmax = 125°C)
Measurement Result
Item
Measurement Result
Power Dissipation
3100 mW
Thermal Resistance (ja)
ja = 32°C/W
Thermal Characterization Parameter (ψjt)
ψjt = 8°C/W
ja: Junction-to-Ambient Thermal Resistance
ψjt: Junction-to-Top Thermal Characterization Parameter
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
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PACKAGE DIMENSIONS
DFN(PL)2730-12
DM-DFN(PL)2730-12-JE-B
DFN(PL)2730-12 Package Dimensions (Unit: mm)
i
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
The products and the product specifications described in this document are subject to change or discontinuation of production without
notice for reasons such as improvement. Therefore, before deciding to use the products, please refer to our sales representatives for the
latest information thereon.
The materials in this document may not be copied or otherwise reproduced in whole or in part without the prior written consent of us.
This product and any technical information relating thereto are subject to complementary export controls (so-called KNOW controls)
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export controls are inapplicable to any application-specific products, except rockets and pilotless aircraft, that are insusceptible to design
or program changes.) Accordingly, when exporting or carrying abroad this product, follow the Foreign Exchange and Foreign Trade
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release of such information is not to be construed as a warranty of or a grant of license under our or any third party's intellectual property
rights or any other rights.
The products listed in this document are intended and designed for use as general electronic components in standard applications (office
equipment, telecommunication equipment, measuring instruments, consumer electronic products, amusement equipment etc.). Those
customers intending to use a product in an application requiring extreme quality and reliability, for example, in a highly specific application
where the failure or misoperation of the product could result in human injury or death should first contact us.
• Aerospace Equipment
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In case your company desires to use this product for any applications other than general electronic equipment mentioned above, make
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We are making our continuous effort to improve the quality and reliability of our products, but semiconductor products are likely to fail
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Quality Warranty
8-1. Quality Warranty Period
In the case of a product purchased through an authorized distributor or directly from us, the warranty period for this product shall be
one (1) year after delivery to your company. For defective products that occurred during this period, we will take the quality warranty
measures described in section 8-2. However, if there is an agreement on the warranty period in the basic transaction agreement,
quality assurance agreement, delivery specifications, etc., it shall be followed.
8-2. Quality Warranty Remedies
When it has been proved defective due to manufacturing factors as a result of defect analysis by us, we will either deliver a substitute
for the defective product or refund the purchase price of the defective product.
Note that such delivery or refund is sole and exclusive remedies to your company for the defective product.
8-3. Remedies after Quality Warranty Period
With respect to any defect of this product found after the quality warranty period, the defect will be analyzed by us. On the basis of
the defect analysis results, the scope and amounts of damage shall be determined by mutual agreement of both parties. Then we
will deal with upper limit in Section 8-2. This provision is not intended to limit any legal rights of your company.
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The X-ray exposure can influence functions and characteristics of the products. Confirm the product functions and characteristics in the
evaluation stage.
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products under operation or storage.
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and Arsenic (As) which are specified as poisonous chemicals by law. For the prevention of a hazard, do not burn, destroy, or process
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Please contact our sales representatives should you have any questions or comments concerning the products or the technical
information.
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