Technical Datasheet
CP30_1160005
Cool Power Technologies
30W Isolated DC/DC Converter
Features
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Wide input voltage range: 4.5 – 9Vin
High Efficiency – 88.5% typical @ Full Load
Output: 5 V at 6 A, 30W max
Tiny 0.94” X 0.94” x 0.35” max ht (Thru-hole)
0.94” X 0.94” x 0.396” Surface Mount
1” x 1” x 0.41” Encapsulated Product
RoHS 3 Directive 2015/863/EU
No minimum load/capacitance required
Withstands 15V input transients
Fixed-frequency operation
Meets UL94, V-0 flammability rating
Full protection (OTP, OCP, OVP, UVLO w/auto-restart)
Remote ON/OFF - positive or negative enable logic options
Output voltage trim range: ±10% (industry-standard trim equations)
Weight: 0.266 oz [7.54 g] (open frame), 0.67 oz [19g] (encapsulated)
2250VDC isolation (open frame), 1600VDC (encapsulated)
Complies with UL/CSA60950-1, TUV per IEC/EN60950-1, 2nd edition
Compliant to REACH (EC) No 1907/2006, 205 SVHC update
Designed to meet Class B conducted emissions per FCC and EN55032 when used with external
filter (see EMC Compliance section below.)
Description
The “Cool Power Technologies” CP30_1160005 DC-DC converter is an open frame isolated 1” X 1” DCDC module that conforms to industry standard pinout and trim equations. The converter operates over
an input voltage range of 4.5 to 9 VDC, and provides a tightly regulated output voltage with an output
current rating of 6 A. The standard feature set includes remote On/Off (positive or negative enable),
input undervoltage lockout, output overvoltage protection, overcurrent and short circuit protections,
output voltage trim and overtemperature shutdown with hysteresis. The high efficiency of the
CP30_1160005 allows operation over a wide ambient temperature range with minimal derating.
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Technical Datasheet
CP30_1160005
TABLE OF CONTENTS
SECTION
PAGE
FEATURES & DESCRIPTION
APPLICATION DIAGRAM
ELECTRICAL SPECIFICATIONS
CHARACTERISTIC PERFORMANCE CURVES
CHARACTERISTIC WAVEFORMS
1
2
3
6
7
APPLICATION NOTES
• RIPPLE MEASUREMENTS TEST SET-UP
• OUTPUT VOLTAGE TRIM EQUATIONS
• THERMAL DERATING
• EMC COMPLIANCE
MECHANICAL OUTLINE & PCB FOOTPRINT
9
9
10
11
13
14
ORDERING INFORMATION
16
APPLICATION DIAGRAM
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Technical Datasheet
CP30_1160005
ELECTRICAL SPECIFICATIONS
4.5–9Vin, 5V/6Aout
Conditions: TA = 25 ºC, Airflow = 300 LFM, Vin = 5 VDC, Cin = 220 µF, unless otherwise specified.
Input Characteristics
Parameter
Conditions
Min
Typ
Max
Unit
Operating Input Voltage Range
4.5
5
9
VDC
Input Under-Voltage Lock-out
Turn-on Threshold
Turn-off Threshold
4.3
3.3
4.4
3.5
4.5
3.7
VDC
Input Voltage Transient
100ms
15
VDC
Maximum Input Current
VIN = 4.5VDC; Iout = 6A
8
A
Input Standby Current
Converter Disabled
5
20
mA
Input No-Load Current
Converter Enabled
160
240
mA
RMS
100
200
mA
Input Reflected Ripple Current
5Hz to 50MHz
See Fig 14 for setup
50
100
mAPK-PK
Input Voltage Ripple Rejection
120Hz
50
Short Circuit Input Current
dB
All
-
0.1
1
A2/s
Conditions
Min
Typ
Max
Unit
4.925
5.00
5.075
VDC
6
A
8
10
A
Inrush Current
Output Characteristics
Parameter
Output Voltage Set point
Output Current
0
Output Current Limit Inception
6.5
Peak Short-Circuit Current
10mΩ Short
11
18
A
RMS Short-Circuit Current
10mΩ Short
1.1
1.5
ARMS
4700
uF
40
75
mVPK-PK
±0.02
±0.04
±0.1
±0.1
5.15
%Vo
%Vo
V
External Load Capacitance
Output Ripple and Noise
20 MHz bandwidth
Output Regulation
Line:
Load:
Overall Output Regulation:
0
1 uF Ceramic +
10uF Tantalum
See Fig 15 for setup
Over line, load & temp.
4.85
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Technical Datasheet
CP30_1160005
ELECTRICAL SPECIFICATIONS (continued)
4.5–9Vin, 5V/6Aout
Conditions: TA = 25 ºC, Airflow = 300 LFM, Vin = 5 VDC, Cin = 220 µF, unless otherwise specified.
Absolute Maximum Ratings
Parameter
Input Voltage
Operating Temperature
Tref , see Thermal
Derating section
Conditions
Min
Continuous Operation
Max
Unit
0
9
VDC
Open Frame
-40
+123
Encapsulated Module
-40
+105
°C
-55
+125
°C
Max
Unit
Storage Temperature
Typ
Feature Characteristics
Parameter
Conditions
Min
Switching Frequency
410
Output Voltage Trim Range
Output Over-voltage Protection
Over-temperature Protection
Peak Backdrive Output Current
during startup into prebiased
output
Backdrive Output Current in OFF
state
Power On to Output Turn-ON Time
Enable to Output Turn-ON Time
Output Enable ON/OFF
Negative Enable
Converter ON
Converter OFF
Positive Enable
Converter ON
Converter OFF
Enable Pin Current Source/Sink
Output Voltage Overshoot @
Startup
Auto-Restart Period
Typ
-10
Non-latching
115
130
kHz
+10
%
140
%
Avg. PCB temp,
non-latching
135
Sinking current from
external voltage source
equal to VOUT – 0.6V and
connected to the output
via 1Ω resistor.
COUT=220µF, Aluminum
350
500
mA
Converter disabled
0
5
mA
VOUT = 0.9*VOUT_NOM
10
20
mS
VOUT = 0.9*VOUT_NOM
10
20
mS
-0.7
2.4
0.8
15
VDC
VDC
2.4
-0.7
0.25
20
1.2
1
VDC
VDC
mA
0
2
%Vo
All voltages are
WRT –Vin.
Converter has internal
pull-up voltage, thus
positive enable is
normally on, negative
normally off.
(OVP, OCP)
100
°C
ms
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Technical Datasheet
CP30_1160005
ELECTRICAL SPECIFICATIONS (continued)
4.5–9Vin, 5V/6Aout
Conditions: Ta = 25 ºC, Airflow = 300 LFM, Vin = 5 VDC, Cin = 220 µF, unless otherwise specified.
Efficiency
Parameter
Conditions
Full Load
Vin = 5Vin
50% Load
Min
Typ
Max
Unit
87.5
88.5
%
88
90
%
Min
Typ
Max
Unit
40
100
mV
Dynamic Response
Parameter
Load Change 25%-50% or 50%–
75% of Iout Max, di/dt = 0.1 A/µs
Conditions
Cout = 1 µF ceramic
+ 10 µF tantalum
See Fig 15
Settling Time to 1% of Vout
Load Change 25%-75% or 75%–
25% of Iout Max, di/dt = 0.2 A/µs
50
Cout = 1 µF ceramic
+ 2000 µF Oscon
µS
30
Settling Time to 1% of Vout
50
mV
50
µS
1000
pF
Isolation Specifications
Isolation Capacitance
10
MΩ
Open Frame
2250
VDC
Encapsulated
1600
VDC
Isolation Resistance
Isolation Voltage – Input to Output
Reliability
Per Telcordia SR-332, Issue 2:
Method I, Case 3
(IO=80% of IO_max, TA=40°C,
airflow = 200 lfm, 90% confidence)
MTFB
4,399,181
Hours
FITs
(failures in 109 hours)
227
/109
Hours
Notes:
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Technical Datasheet
CP30_1160005
CHARACTERISTIC CURVES:
5
95%
90%
Power Dissipation (W)
Efficiency
85%
80%
75%
70%
Vin=4.5V
65%
Vin=5V
60%
Vin=7V
55%
Vin=9V
3
2
Vin=4.5V
Vin=5V
1
Vin=7V
Vin=9V
50%
0
0.6
1.2
1.8
2.4
3
3.6
4.2
Output Current (A)
4.8
5.4
6
0.6
Figure 1. Efficiency vs Output Current, 300lfm
airflow, 25°C ambient.
6
6
5
5
N/C ~40LFM (0.2 m/s)
4
100 LFM (0.5 m/s)
3
1.2
1.8
2.4
3
3.6
4.2
Output Current (A)
4.8
5.4
6
Figure 2. Power Dissipation vs. Load Current,
300lfm airflow, 25°C ambient.
Output Current (A)
Output Current (A)
4
200 LFM (1.0 m/s)
2
1
N/C ~40LFM (0.2 m/s)
4
100 LFM (0.5 m/s)
3
200 LFM (1.0 m/s)
2
1
0
0
25
40
55
70
85
25
40
55
70
85
Ambient Temperature (°C)
Ambient Temperature (°C)
Figure 3. Output Current Derating vs Ambient
Temperature & Airflow (converter mounted vertically
with air flowing from Vin to Vout, Vin = 5 V.)
Figure 4. Output Current Derating vs Ambient
Temperature & Airflow (converter mounted vertically
Vin = 5 V - Encapsulated module)
Figure 5. Thermal Image of CP30B1160005
Full load, 55C Ambient, 100LFM airflow
Tmax = 123C
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Technical Datasheet
CP30_1160005
CHARACTERISTIC WAVEFORMS:
Figure 6. Input Reflected Ripple Current (100mA/div),
time scale – 1uS/div. Vin=Vin_nom, full load
(see Fig 14)
Figure 7. Output Voltage Ripple (20mV/div),
time scale – 1uS/div. Vin=Vin_nom, full load
Cout=1.0uF ceramic + 10uF Tantalum (see Fig 15)
Figure 8. Startup Waveform via Enable (Neg ENBL),
time scale 10mS/div. Vin=Vin_nom, Iout=no load
Cout=0, Ch1=Vout (2V/div), Ch2=enable (10V/div)
Figure 9. Startup Waveform via Input Voltage,
time scale 10mS/div. Vin=Vin_nom, Iout=full load
Cout=2200uF, Ch1=Vout (2V/div), Ch2=Vin (5V/div)
Figure 10. Startup Waveform via Enable (Neg ENBL),
time scale 4mS/div. Vin=Vin_nom, Iout=no load
Cout=2200uF, Ch1=Vout (2V/div), Ch2=enable (10V/div)
Figure 11. Load Transient Response (50mV/div),
di/dt=0.1A/uS, 50%-75%-50% of full load, Cout=Fig15
time scale: 200uS/div. Ch1=Vout, Ch2=Iout (2A/div)
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Technical Datasheet
CP30_1160005
Figure 12. Load Transient Response (50mV/div),
di/dt=0.1A/uS, 25% - 50% - 25% of full load, Cout=Fig15
time scale: 200uS/div. Ch1=Vout, Ch2=Iout (2A/div)
Figure 13. Load Load Transient Response 50mV/div),
di/dt=0.2A/uS, 25% - 75% - 25% of full load +2200uF
time scale: 200uS/div. Ch1=Vout, Ch2=Iout (2A/div)
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Technical Datasheet
CP30_1160005
Application Notes
INPUT REFLECTED RIPPLE TEST SETUP:
TO OSCILLOSCOPE
Current Probe
Vin(+)
Lsource:
1 uH
DC
Source
Csource: 1000 uF
ESR < 0.03 OHM
@ 20 ºC, 100 kHz
220 uF
ESR < 0.1 OHM
Vin(-)
Note: Measure input reflected-ripple current with a simulated source inductance (LSOURCE) of 1 uH.
Capacitor CSOURCE offsets possible source impedance.
Figure 14. Input Reflected-ripple Current Test Setup.
OUTPUT RIPPLE TEST SETUP:
COPPER STRIP
Vout(+)
1.0 uF
10 uF
SCOPE
RESISTIVE
LOAD
Vout(-)
Use a 1.0µF X7R ceramic capacitor and 10µF @35V low ESR tantalum capacitor. Scope measurement
made using a BNC socket. Position the load 3 in. [76mm] from module.
Figure 15. Peak-to-Peak Output Noise Measurement Test Setup.
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Technical Datasheet
CP30_1160005
Application Notes (cont)
OUTPUT VOLTAGE TRIM:
Output voltage adjustment is accomplished by connecting an external resistor between the Trim Pin
and either the +Vout or –Vout pins.
•
TRIM UP EQUATION:
Rtrim_up ( Ω )
12750
− 2050
Vdes − 5
Where Rtrim_up is the resistance value in ohms and Vdes is the desired output voltage.
E.g. to trim the output up 10%,
R trim_up
Enable
12750
− 2050 ⋅ Ω
5.5 − 5
or Rtrim_up = 23.45 kOhm.
-Vout
Rtrim_up
-Vin
Rload
Trim
+Vin
+Vout
Figure 16. Trim UP circuit configuration
•
TRIM-DOWN EQUATION:
Rtrim_down ( Ω )
5100 ⋅ ( Vdes − 2.5)
5 − Vdes
− 2050
Where Rtrim_down is the resistance value in ohms and Vdes is the desired output voltage.
Enable
-Vout
-Vin
Rload
Trim
+Vin
Rtrim_down
+Vout
Figure 17. Trim DOWN circuit configuration
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Technical Datasheet
CP30_1160005
Application Notes (cont)
Thermal Derating
•
It is preferable that the DC-DC module have an unobstructed flow of air across it for best
thermal performance. Components taller than ~ 2mm in front of the module can deflect airflow
and possibly create hotspots.
•
Significant cooling is achieved through conductive flow from the modules I/O pins to the host
PCB. Sufficiently large traces connecting the dc-dc converter to the source and load will help
ensure thermal derating performance will meet or exceed the derating curves published in this
datasheet.
•
If the module is expected to be operated near the load limits defined in the derating curves, insystem verification of module derating performance should be performed to ensure long-term
system reliability. Peak temperatures are to be measured using infrared thermography or by
gluing a fine gauge (AWG #40) thermocouple at the Tref location(s) shown below. Temperature
at the specified location(s) should be kept below 123ºC for open frame units, 105ºC for
encapsulated modules in order to maintain optimum converter reliability.
Open Frame
Encapsulated
Input Undervoltage Lockout
•
The converter is disabled until the input voltage has exceeded the UVLO turn-on threshold.
Once the input voltage exceeds this level (see Input Under-Voltage Lock-out in Electrical
Specifications table) the module will commence soft-start. Hysteresis of (typically) 1-3 volts
minimizes the likelihood of pulling the input voltage below the turn-off threshold during startup
which could create an undesirable on/off cycling condition. The converter will continue to
operate until the input voltage subsequently falls below the UVLO turn-off threshold.
Enable Pin Function
•
The module has a remote enable function that allows it to be turned on or off remotely. The
Enable pin is referenced to the negative input pin (-Vin) of the converter. Modules can be
ordered with either negative or positive enable.
•
The negative enable option the module will not turn on unless the enable pin is connected to –
Vin. The positive enable option allows the converter to turn on as soon as voltage sufficient to
exceed the UVLO of the converter has been applied to the input terminals. In this case the
module is turned off by connecting the Enable pin to –Vin. On/off thresholds are located in the
Electrical Specifications table.
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Technical Datasheet
CP30_1160005
Application Notes (cont)
Output Overvoltage Protection
•
The module has an independent feedback loop that will disable the output of the converter if a
voltage greater than about 125% of the nominal set point is detected. When this threshold is
reached, the converter will shut down and remain off for the amount of time specified by the
Auto-Restart Period. The converter will attempt a restart once this period of time has elapsed.
Output Overtemperature Protection
•
To provide protection under certain fault conditions, the unit is equipped with a thermal
shutdown circuit. The unit will shutdown if the average PCB temperature exceeds approx.
135ºC, but the thermal shutdown is not intended as a guarantee that the unit will survive
temperatures beyond its rating. The module will automatically restart once it has cooled below
the shutdown temperature minus hysteresis (typically 20 deg C.)
SMT Version Layout Considerations (if applicable)
•
Copper traces with sufficient cross-section must be provided for all output & input pins. SMT
pads tied to internal power/ground planes must have multiple vias around each SMT pad to
couple expected current loads from module pins into internal traces/planes. One 0.024”
(0.6mm) diameter via for each 4A of expected source or load current must be provided as close
to the termination as possible, preferably in the direction of current flow from SMT pad to load.
Vias must be at least 0.024” (0.6 mm) away from the SMT pad to prevent solder from flowing
into the vias.
•
SMT pads on the host card are to be 0.075” (1.9mm) diameter. Solder paste screen opening
should be 0.070” diameter and the screen should be 0.006” (0.15 mm) thick (other thicknesses
are possible; 0.006” provides a good compromise between solder volume and coplanarity
compensation.)
Paralleling Converters
•
Modules may be paralleled but it is recommended that the total power draw not exceed the
output power rating of a single module. External sharing controllers are recommended for
reliability and to ensure equal distribution of the load to the converters.
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Technical Datasheet
CP30_1160005
Application Notes (cont)
EMC Compliance
To meet Class B compliance for EN55032 (CISPR 32) or FCC part 15 sub part j, the following input
filter is required:
Figure 18. EMI Filter
L1 =
C1 =
C2 =
C3 =
C4,C5 =
0.63 mH Common Mode Inductor (Pulse P0469)
1000uF