NJM17431F25A-TE1

NJM17431 ADJUSTABLE PRECISION SHUNT REGULATOR ■FEATURES ■GENERAL DESCRIPTION  Operating Voltage  Precision Voltage Reference     VREF to 36V 2.495V  0.8 2.5V  0.8 Adjustable Output Voltage by external resistance Wide Safety Operating Boundary Area Bipolar Technology Package SOT-23-5 SOT-89-3 ■APPLICATION     The NJM17431 is adjustable precision shunt regulator. The output voltage may be set to any value between VREF (about 2.5V) and 36V by two external resistors. The NJM17431 is improved the reference voltage accuracy ( 0.8) and safety operating boundary area connected large capacitance. Therefore, the NJM17431 is suitable for various applications. Industrial Equipment Home Electrical Appliance Replacement from Zener Diode Other ■BLOCK DIAGRAM CATHODE CATHODE REFERENCE + REFERENCE V REF ANODE Ver.1.2 http://www.njr.com/ ANODE -1- NJM17431 ■PIN CONFIGURATION 4 5 1 Pin Assign 2 1 3 2 3 1. REFERENCE 1. REFERENCE 2. ANODE 2. ANODE 3. CATHODE 3. CATHODE 4. N.C. 5. N.C. Package SOT-89-3 SOT-23-5 Product Number NJM17431Uxx NJM17431FxxA ■PRODUCT NAME INFORMATION NJM17431 - U/F - 24/25 - A - (TE1) Part Number Package VREF U: SOT-89-3 F: SOT-23-5 24: 2.495V 25: 2.5V Pin assign Taping Form Option ■ORDERING INFORMATION MARKING WEIGHT (mg) MOQ (pcs) 181 61 1,000 Sn2Bi 171 61 1,000 15 3,000 15 3,000 HALOGEN- TERMINAL FREE FINISH PRODUCT NAME PACKAGE RoHS NJM17431U24 SOT-89-3 Yes Yes Sn2Bi NJM17431U25 SOT-89-3 Yes Yes NJM17431F24A SOT-23-5 Yes Yes Sn2Bi AK5x (“x” is Lot) NJM17431F25A SOT-23-5 Yes Yes Sn2Bi AK4x (“x” is Lot) Ver.1.2 http://www.njr.com/ -2- NJM17431 ■ABSOLUTE MAXIMUM RATINGS PARAMETER SYMBOL MAXIMUM RATINGS UNIT REMARK VKA 37 (1) V ANODE-CATHODE Pin IK  100 to 150 mA ANODE-CATHODE Pin IREF  0.05 to 10 480 (2) 650 (3) mA – mW – Cathode Voltage Continuous Cathode Voltage Reference Input Current SOT-23-5 Power Dissipation PD 450 (4) 1300 (5) SOT-89-3 Junction Temperature Tjmax 150 C – Operating Temperature Range Topr  40 to 125 C – Storage Temperature Range Tstg  50 to 150 C – (1) Unless specified, all voltage value are with respect to the anode pin. (2) Mounted on glass epoxy board. (76.2×114.3×1.6mm: based on EIA/JEDEC standard, 2Layers) (3) Mounted on glass epoxy board. (76.2×114.3×1.6mm: based on EIA/JEDEC standard, 4Layers), internal Cu area: 74.2×74.2mm (4) Mounted on glass epoxy board. (76.2×114.3×1.6mm: based on EIA/JEDEC standard size, 2Layers) (5) Mounted on glass epoxy board. (76.2×114.3×1.6mm: based on EIA/JEDEC standard, 4Layers) (For 4Layers: Applying 74.2×74.2mm inner Cu area and a thermal via hole to a board based on JEDEC standard JESD51-5) ■RECOMMENDED OPERATING CONDITIONS PARAMETER SYMBOL RATINGS Cathode Voltage VKA VREF to 36 V ANODE-CATHODE Pin Cathode Current IK 0.5 to 100 mA ANODE-CATHODE Pin Ver.1.2 http://www.njr.com/ UNIT REMARK -3- NJM17431 ■ELECTRICAL CHARACTERISTICS PARAMETER (Unless other noted, IK=10mA、Ta=25C) SYMBOL Reference Voltage VREF TEST CONDITIONS VKA= VREF (6) MIN. TYP. MAX. 2.495V ver. 2.475 2.495 2.515 2.5V ver. 2.480 2.500 2.520 UNIT V Reference Input Voltage Change Over Temperature Range ∆VREF (dev) VKA=VREF (6) Ta= - 40˚C to +85˚C - 8 17 mV Reference voltage temperature coefficient ∆VREF (ppm) VKA=VREF (6) Ta= - 40˚C to +85˚C - 30 - ppm/C Reference Voltage Change vs. Cathode Voltage Change ∆VREF/ ∆VKA ∆VKA=10V-VREF (7) ∆VKA=36V-10V - -2.0 -1 -3.7 -2.2 mV/V IREF R1=10kΩ, R2=∞ (7) - 1 2.8 µA Reference Input Current Change Over Temperature Range ∆IREF (dev) R1=10kΩ, R2=∞ (7) Ta= - 40˚C to +85˚C - 0.25 0.5 µA Minimum Cathode Current IMIN VKA=VREF (6) - 0.25 0.5 mA OFF State Cathode Current IOFF - 0.1 1.0 µA Dynamic Impedance ΙZKAΙ VKA=36V, VREF=0V (8) VKA=VREF, IK=1mA to 100mA, f≤1kHz (6) - 0.2 0.5 Ω Reference Input Current The maximum value of “Dynamic Impedance“, “Reference Voltage Change” and “Reference Input Current Change” are determined based on sampling evaluation from the initial production lots, and thus not tested in the production test. Therefore, these values are for the reference design purpose only. (6): TestCircuitFig.1 (7): Test CircuitFig.2 (8): Test Circuit Fig.3 ■ TEST CIRCUIT INPUT VKA INPUT VKA IK IK R1 VREF Fig.1. Test Circuit for VKA=VREF VO=VKA=VREF Ver.1.2 R2 INPUT VKA IOFF IREF VREF Fig.2. Test Circuit for VKA >VREF Fig.3. Test Circuit for IOFF R1   VO  V KA  V REF  1    IREF  R1  R2  http://www.njr.com/ -4- NJM17431 ■THERMAL CHARACTERISTICS PARAMETER SYMBOL Junction-to-ambient thermal resistance VALUE SOT-23-5 260 (2) 195 (3) SOT-89-3 200 (4) 130 (5) SOT-23-5 60 (2) 70 (3) SOT-89-3 67 (4) 65 (5) θja Junction-to-Top of package characterization parameter UNIT ψjt °C /W °C /W (2) Mounted on glass epoxy board. (76.2×114.3×1.6mm: based on EIA/JEDEC standard, 2Layers) (3) Mounted on glass epoxy board. (76.2×114.3×1.6mm: based on EIA/JEDEC standard, 4Layers), internal Cu area: 74.2×74.2mm (4) Mounted on glass epoxy board. (76.2×114.3×1.6mm: based on EIA/JEDEC standard size, 2Layers) (5) Mounted on glass epoxy board. (76.2×114.3×1.6mm: based on EIA/JEDEC standard, 4Layers) (For 4Layers: Applying 74.2×74.2mm inner Cu area and a thermal via hole to a board based on JEDEC standard JESD51-5) ■POWER DISSIPATION vs. AMBIENT TEMPERATURE NJM17431F Power Dissipation NJM17431U Power Dissipation (Topr=-40ºC to +125ºC, Tj=150ºC) (Topr=-40ºC to +125ºC, Tj=150ºC) 1600 800 700 1400 (3) on 4 Layers Board 1200 Package Power : Pd [mW] 600 Package Power : Pd [mW] (5) on 4 Layers Board (2) on 2 Layers Board 500 400 300 1000 800 600 (4) on 2 Layers Board 200 400 100 200 0 0 -50 -25 0 25 50 75 100 125 150 -50 -25 Ambient Temperature : Ta [ºC] Ver.1.2 http://www.njr.com/ 0 25 50 75 100 125 150 Ambient Temperature : Ta [ºC] -5- NJM17431 ■TYPICAL CHARACTERISTICS Reference Voltage vs. Cathode Current Reference Voltage vs. Temperature VKA=VREF, Ta=25°C 2.55 2.54 2.54 Reference Voltage:VREF [V] Reference Voltage:VREF [V] VKA=VREF, IK=10mA 2.55 2.53 2.52 2.51 2.50 2.49 2.48 2.47 2.53 2.52 2.51 2.50 2.49 2.48 2.47 2.46 2.46 2.45 2.45 0.1 1 10 Cathode Current:IK [mA] -50 100 Reference Input Current vs. Temperature Reference Voltage:VREF [V] Reference Current:IREF [μA] 2.0 1.5 1.0 0.5 25 50 75 100 125 150 Temperature:Ta [°C] R1=0Ω to 150kΩ, R2=10kΩ, IK=10mA, Ta=25°C 2.50 2.5 0 Reference Voltage vs. Cathode Voltage R1=10kΩ, R2=, IK=10mA 3.0 -25 2.48 2.46 2.44 2.42 2.40 0.0 -50 -25 0 25 50 75 100 125 150 Temperature:Ta [°C] 0 10 20 30 Cathode Voltage:VKA [V] 40 Dynamic Impedance vs. Frequency IK=1mA to 100mA, VKA=V REF, Ta=25°C Dynamic Impedance:|ZKA| [Ω] 0.5 0.4 0.3 0.2 0.1 0.0 0.01 Ver.1.2 0.1 1 10 Frequency:f [kHz] 100 http://www.njr.com/ -6- NJM17431 ■TYPICAL CHARACTERISTICS Safety Operating Boundary Condition VKA=VREF, Ta=25°C Cathode Current:IK [mA] 100 Unstable Operation Region 80 60 Stable Operation Region 40 20 0 0.01 0.1 1 10 Output Capacitor:COUT [µF] 100 Safety Operating Boundary Condition Test Circuit RIN=30Ω VKA IK V+ COUT Note) Oscillation might occur while operating within the range of safety curve. So that, it is necessary to make ample margins by taking considerations of fluctuation of the device. Ver.1.2 http://www.njr.com/ -7- NJM17431 SOT-23-5 Unit: mm ■PACKAGE DIMENSIONS 2.9 ±0.2 0 ∼15 ° 1.9 ±0.2 4 0.6 2.8 ±0.2 1.6 +0.2 -0.1 0.2 5 2 1 3 0.1 0.95 ±0.1 +0.1 -0.03 0.4 ±0.1 0.1 0.1max 1.1 ±0.1 0.6max ■EXAMPLE OF SOLDER PADS DIMENSIONS 2. 4 1 .0 0.7 0 .95 Ver.1.2 0 .95 http://www.njr.com/ -8- NJM17431 SOT-89-3 ■PACKAGE DIMENSIONS Unit: mm 1.5 ±0.15 0 .4 5 4.5 ± 0.3 2 1 3 0.42 ± 0.1 4 .2 5 ma x 0.4 ±0.1 0.8min 2. 5 ± 0. 3 1.6 0.42 ±0.1 0.47 ±0.1 0.4 +0.15 -0.05 1.5 1.5 ■EXAMPLE OF SOLDER PADS DIMENSIONS 1.5 0.7 3.0 2.0 1.0 1.5 Ver.1.2 1.0 1.0 1.5 http://www.njr.com/ -9- NJM17431 SOT-23-5 ■PACKING SPEC Unit: mm TAPING DIMENSIONS SYMBOL A B D0 D1 E F P0 P1 P2 T T2 K0 W W1 Feed direction P0 φD0 T B W1 W F E P2 A K0 φ D1 P1 T2 DIMENSION 3.3±0.1 3.2±0.1 1.55 1.05 1.75±0.1 3.5±0.05 4.0±0.1 4.0±0.1 2.0±0.05 0.25±0.05 1.82 1.5±0.1 8.0±0.3 5.5 REMARKS BOTTOM DIMENSION BOTTOM DIMENSION THICKNESS 0.1MAX REEL DIMENSIONS W1 SYMBOL A B C D E W W1 E A D B C DIMENSION φ180±1 φ 60±1 φ 13±0.2 φ 21±0.8 2±0.5 9±0.5 1.2±0.2 W TAPING STATE Insert direction Sealing with covering tape (TE1) Drawing direction Empty tape Device attaching tape more than 20pitch 3000pcs/reel Empty tape Covering tape more than 20pitch reel more than 1 round PACKING STATE Label Label Put a reel into a box Ver.1.2 http://www.njr.com/ - 10 - NJM17431 SOT-89-3 ■PACKING SPEC Unit: mm TAPING DIMENSIONS Feed dir ect ion P0 T E φ D0 B W1 W F P2 P1 A T2 SYMBOL A B D0 E F P0 P1 P2 T T2 W W1 DIMENSION 4.9±0.1 4.5±0.1 1.5 +0.1 0 1.5±0.1 5.65±0.1 4.0±0.1 8.0±0.1 2.0±0.05 0.3±0.05 2.0 12.0±0.3 9.5 REMARKS BOTTOM DIMENSION BOTTOM DIMENSION THICKNESS 0.1MAX REEL DIMENSIONS W1 E SYMBOL A B C D E W W1 B A D C DIMENSION φ180±1 φ 60±1 φ 13±0.2 φ 21±0.8 2±0.5 13±0.5 1.2±0.2 W TAPING STATE Insert direction Sealing with covering tape (TE1) Empty tape Feed direction 40mm MIN. D e vi ce s 1000pcs/reel Empty tape 40mm MIN. Covering tape 500mm MIN. PACKING STATE Label Label Put a reel into a box Ver.1.2 http://www.njr.com/ - 11 - NJM17431 ■RECOMMENDED MOUNTING METHOD INFRARED REFLOW SOLDERING METHOD ＊Recommended reflow soldering procedure f 260C e 230C 220C d 180C 150C Room Temp. a b a：Temperature ramping rate b：Pre-heating temperature time c：Temperature ramp rate d：220C or higher time e：230C or higher time f：Peak temperature g：Temperature ramping rate c g : 1 to 4C /s : 150 to 180C : 60 to 120s : 1 to 4C /s : Shorter than 60s : Shorter than 40s : Lower than 260C : 1 to 6C /s The temperature indicates at the surface of mold package. Ver.1.2 http://www.njr.com/ - 12 - NJM17431 ■REVISION HYSTORY Ver.1.2 Date Revision Changes 21.May.2020 Ver.1.0 New Release 16.Sep.2020 Ver.1.1 Added NJM17431F24A 16.Sep.2021 Ver.1.2 Added NJM17431Uxx http://www.njr.com/ - 13 - NJM17431 [ CAUTION ] 1. NJR strives to produce reliable and high quality semiconductors. NJR’s semiconductors are intended for specific applications and require proper maintenance and handling. To enhance the performance and service of NJR's semiconductors, the devices, machinery or equipment into which they are integrated should undergo preventative maintenance and inspection at regularly scheduled intervals. Failure to properly maintain equipment and machinery incorporating these products can result in catastrophic system failures 2. The specifications on this datasheet are only given for information without any guarantee as regards either mistakes or omissions. The application circuits in this datasheet are described only to show representative usages of the product and not intended for the guarantee or permission of any right including the industrial property rights. All other trademarks mentioned herein are the property of their respective companies. 3. To ensure the highest levels of reliability, NJR products must always be properly handled. The introduction of external contaminants (e.g. dust, oil or cosmetics) can result in failures of semiconductor products. 4. NJR offers a variety of semiconductor products intended for particular applications. It is important that you select the proper component for your intended application. You may contact NJR's Sale's Office if you are uncertain about the products listed in this datasheet. 5. Special care is required in designing devices, machinery or equipment which demand high levels of reliability. This is particularly important when designing critical components or systems whose failure can foreseeably result in situations that could adversely affect health or safety. In designing such critical devices, equipment or machinery, careful consideration should be given to amongst other things, their safety design, fail-safe design, back-up and redundancy systems, and diffusion design. 6. The products listed in this datasheet may not be appropriate for use in certain equipment where reliability is critical or where the products may be subjected to extreme conditions. You should consult our sales office before using the products in any of the following types of equipment.        7. 8. 9. Ver.1.2 Aerospace Equipment Equipment Used in the Deep Sea Power Generator Control Equipment (Nuclear, steam, hydraulic, etc.) Life Maintenance Medical Equipment Fire Alarms / Intruder Detectors Vehicle Control Equipment (Automobile, airplane, railroad, ship, etc.) Various Safety Devices NJR's products have been designed and tested to function within controlled environmental conditions. Do not use products under conditions that deviate from methods or applications specified in this datasheet. Failure to employ the products in the proper applications can lead to deterioration, destruction or failure of the products. NJR shall not be responsible for any bodily injury, fires or accident, property damage or any consequential damages resulting from misuse or misapplication of the products. The products are sold without warranty of any kind, either express or implied, including but not limited to any implied warranty of merchantability or fitness for a particular purpose. Warning for handling Gallium and Arsenic (GaAs) Products (Applying to GaAs MMIC, Photo Reflector). These products use Gallium (Ga) and Arsenic (As) which are specified as poisonous chemicals by law. For the prevention of a hazard, do not burn, destroy, or process chemically to make them as gas or power. When the product is disposed of, please follow the related regulation and do not mix this with general industrial waste or household waste. The product specifications and descriptions listed in this datasheet are subject to change at any time, without notice. http://www.njr.com/ - 14 -