SLG5NT1464V
Ultra-small 40 mΩ 1.0 A GreenFET 3
Load Switch with Discharge
General Description
Pin Configuration
ON
1
The product is packaged in an ultra-small 1.0 x 1.0 mm package.
D
2
SLG5NT1464V
The SLG5NT1464V is designed for load switching applications. The part comes with one 40 mΩ 1.0 A rated MOSFET
controlled by a single ON control pin. The MOSFET’s ramp
rate is adjustable depending on the input current level of the
ON pin.
4
GND
3
S
Features
•
•
•
•
•
•
•
4-pin STDFN
(Top View)
One 40 mΩ 1.0 A MOSFET
One integrated VGS Charge Pump
User selectable ramp rate with external resistor
Integrated Discharge Resistor
Over Temperature Protection
Pb-Free / Halogen-Free / RoHS compliant
STDFN 4L, 1.0 x 1.0 x 0.55 mm
Block Diagram
S
D
1.0 A
Charge
Pump Out
Current Detect
Slew Rate Control
ON
Silego Technology, Inc.
000-005NT1464-101
CMOS Input
Rev 1.01
Revised December 11, 2013
SLG5NT1464V
Pin Description
Pin #
Pin Name
Type
Pin Description
1
ON
Input
Turns on MOSFET. Configurable slew rate control depending on input current.
2
D
MOSFET
Drain of Power MOSFET
3
S
MOSFET
Source of Power MOSFET
4
GND
GND
Ground
Ordering Information
Part Number
Type
Production Flow
SLG5NT1464V
STDFN 4L
Extended Commercial, -20 °C to 70 °C
SLG5NT1464VTR
STDFN 4L (Tape and Reel)
Extended Commercial, -20 °C to 70 °C
Application Diagram
Current
Controls
Ramp Rate
ON
3.3 V
R1
SLG5NT1464V
Control
IC
D
GND
S
Adjustable Ramp Rate vs. ON Pin Current (5.5 V, 25 °C)
I_ON
TSLEW (typ)
20 μA
0.56 V/ms
50 μA
1.34 V/ms
100 μA
2.53 V/ms
150 μA
3.71 V/ms
200 μA
4.68 V/ms
250 μA
5.63 V/ms
Adjustable Slew Rate (ON Pin 2)
SLG5NT1464V has a built in configurable slew control feature. The configurable slew control uses current detection method on
Pin 2. When ON voltage rise above ON_VIH_INI (1.2 V typical), the slew control circuit will measure the current flowing into Pin
2. Based on the current flowing into pin 2, different slew rates will be selected by the internal control circuit. See I_ON vs. Tslew
table on page 2. The slew rate is configurable by selecting a different R1 resistor value as shown on application diagram on page
2. Calculating the R1 value depends on both the desired slew rate, and the VOH level of the device driving the ON Pin 2.
ON_Current = (GPIO_VOH – ON_VREF (1.05 V typical)) / R1
000-005NT1464-101
Page 2 of 8
SLG5NT1464V
Absolute Maximum Ratings
Parameter
Description
VD
Power Supply
TS
Storage Temperature
ESDHBM
WDIS
ESD Protection
Conditions
Human Body Model
Min.
Typ.
Max.
Unit
--
--
6
V
-65
--
150
°C
2000
--
--
V
--
--
0.5
W
--
--
1.5
A
Package Power Dissipation
MOSFET IDSPK Peak Current from Drain to Source For no more than 1 ms with 1% duty cycle
Note: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating
only and functional operation of the device at these or any other conditions above those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect reliability.
Electrical Characteristics
TA = -20 to 70 °C (unless otherwise stated)
Parameter
VD
IDD
Description
Conditions
Min.
Power Supply Voltage
-20 to 70°C
when OFF
Power Supply Current (PIN 2)
Typ.
Max.
Unit
2.5
--
5.5
V
--
0.1
1
μA
when ON, No load
--
18
30
μA
Static Drain to Source
ON Resistance
TA 25°C MOSFET
--
40
50
mΩ
TA 70°C MOSFET
--
50
55
mΩ
IDS
Operating Current
VD = 2.5 V to 5.5 V
--
--
1.0
A
TDelay_ON
ON pin Delay Time
50% ON to Ramp Begin
Input Current (PIN 1) = 20 μA,
VD = 5 V, Source_Cap = 10 μF,
RL = 20 Ω
0
2.4
4.0
ms
RDSON
Configurable 1
50% ON to 90% VS
TTotal_ON
Total Turn On Time
Example: Input Current (PIN 1) = 20
μA, VD = 5 V, Source_Cap = 10 μF,
RL = 20 Ω
--
TSLEWRATE
RDIS
ON_VREF
Slew Rate
--
Configurable 1
10% VS to 90% VS
Example: Input Current (PIN 1) = 20
μA, VD = 5 V, Source_Cap = 10 μF,
RL = 20 Ω
11.7
ms
--
0.56
ms
V/ms
--
V/ms
Discharge Resistance
100
150
300
Ω
ON Pin Reference Voltage2
0.99
1.05
1.10
V
Internal Charge Pump ON
1.2
--
VDD
V
Internal Charge Pump OFF
-0.3
0
0.3
V
ON_VIH_INI Initial Turn On Voltage
ON_VIL
Low Input Voltage on ON pin
ON_R
Input Impedance on ON pin
100
--
--
MΩ
Thermal shutoff turn-on temperature
--
120
--
°C
THERMOFF Thermal shutoff turn-off temperature
--
100
--
°C
THERMTIME Thermal shutoff time
--
--
1
ms
THERMON
TDelay_OFF
TFALL
OFF Delay Time
50% ON to VS Fall, VD = 5 V,
RL = 20 Ω
--
6.5
20
μs
VS Fall Time
90% VS to 10% VS, VD = 5 V,
RL = 20 Ω
--
1.2
2
μs
Notes:
1. Refer to table for configuration details.
2. Voltage before ON pin resistor needs to be higher than 1.2 V to generate required ION
000-005NT1464-101
Page 3 of 8
SLG5NT1464V
Slew Rate vs. ON Current
Slew Rate (V/ms) Vs. ON Current, T = 25C
10%VS to 90%VS, RL = 20 ohm, CL = 10uF
7.00
6.00
V/ms
5.00
VD = 2.5V
4.00
VD = 3.3V
3.00
VD = 5V
VD = 5.25V
2.00
VD = 5.5V
1.00
0.00
0
50
100
150
200
250
ON Current (uA)
TTotal_ON vs. On Current
Ttotal_on vs ON Current. 50%ON to 90%VS, T = 25C, RL =
20 ohm, CL = 10uF
14.00
12.00
Ttota
al_on (ms)
10.00
VD = 2.5V
8.00
VD = 3.3V
6.00
VD = 5V
VD = 5.25V
4.00
VD = 5.5V
2.00
0.00
0
50
100
150
200
250
ON Current (uA)
000-005NT1464-101
Page 4 of 8
SLG5NT1464V
TTotal_ON, TON_Delay and Slew Rate Measurement
ON
50% ON
50% ON
TOFF_DELAY
90% VS
VS
90% VS
TON_DELAY
10% VS
10% VS
Slew Rate (V/ms)
TFALL
TTotal_ON
SLG5NT1464V Layout Suggestion
800
Recommended Land Pattern
210
Unit: μm
410
810
190
Exposed Pad
200
1800
000-005NT1464-101
Page 5 of 8
SLG5NT1464V
Package Top Marking System Definition
Pin 1 Identifier
000-005NT1464-101
XX
Serial Number
Page 6 of 8
SLG5NT1464V
Package Drawing and Dimensions
4 Lead STDFN Package 1.0 x 1.0 mm
000-005NT1464-101
Page 7 of 8
SLG5NT1464V
Tape and Reel Specifications
Max Units
Leader (min)
Nominal
Reel &
Package # of
Package Size
Hub Size
Length
Type
Pins
per Reel per Box
Pockets
[mm]
[mm]
[mm]
STDFN 4L
Green
4
1.0 x 1.0 x 0.55
8000
8000
178 / 60
200
400
Trailer (min)
Pockets
Length
[mm]
Tape
Width
[mm]
200
400
8
Part
Pitch
[mm]
2
Carrier Tape Drawing and Dimensions
Pocket BTM Pocket BTM
Package
Length
Width
Type
STDFN 4L
Green
Pocket
Depth
Index Hole
Pitch
Pocket
Pitch
Index Hole
Diameter
Index Hole Index Hole
to Tape
to Pocket Tape Width
Edge
Center
A0
B0
K0
P0
P1
D0
E
F
W
1.16
1.16
0.63
4
2
1.5
1.75
3.5
8
Refer to EIA-481 specification
Recommended Reflow Soldering Profile
Please see IPC/JEDEC J-STD-020: latest revision for reflow profile based on package volume of 0.55 mm3 (nominal). More
information can be found at www.jedec.org.
000-005NT1464-101
Page 8 of 8
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