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BTA312G-600CTQ

BTA312G-600CTQ

  • 厂商:

    WEEN(瑞能)

  • 封装:

    TO-262-3

  • 描述:

    TRIAC 标准 600 V 12 A 通孔 I2PAK(TO-262)

  • 详情介绍
  • 数据手册
  • 价格&库存
BTA312G-600CTQ 数据手册
BTA312G-600CT 3Q Hi-Com Triac 19 September 2018 Product data sheet 1. General description Planar passivated high commutation three quadrant triac in a SOT226A (I2PAK) plastic package intended for use in circuits where high static and dynamic dV/dt and high dI/dt can occur. This "series CT" triac will commutate the full RMS current at the maximum rated junction temperature (Tj(max) = 150 °C) without the aid of a snubber. It is used in applications where "high junction operating temperature capability" is required. 2. Features and benefits • • • • • • • • • • 3Q technology for improved noise immunity High commutation capability with maximum false trigger immunity High junction operating temperature capability (Tj(max) = 150 °C) High voltage capability Less sensitve gate for high noise immunity Planar passivated for voltage ruggedness and reliability Triggering in three quadrants only Very high immunity to false turn-on by dV/dt Package meets UL94V0 flammability requirement Package is RoHS compliant 3. Applications • • • • Applications subject to high temperature Electronic thermostats (heating and cooling) High power motor controls e.g. washing machines and vacuum cleaners Rectifier-fed DC inductive loads e.g. DC motors and solenoids 4. Quick reference data Table 1. Quick reference data Symbol Parameter VDRM repetitive peak offstate voltage IT(RMS) RMS on-state current ITSM Tj Min Typ Max Unit - - 600 V - - 12 A non-repetitive peak on- full sine wave; Tj(init) = 25 °C; tp = 20 ms; Fig. 4; Fig. 5 state current - - 100 A full sine wave; Tj(init) = 25 °C; tp = 16.7 ms - - 110 A - - 150 °C junction temperature Static characteristics Conditions full sine wave; Tmb ≤ 118 °C; Fig. 1; Fig. 2; Fig. 3 BTA312G-600CT WeEn Semiconductors 3Q Hi-Com Triac Symbol Parameter Conditions Min Typ Max Unit IGT gate trigger current VD = 12 V; IT = 100 mA; T2+ G+; Tj = 25 °C; Fig. 7 - - 35 mA VD = 12 V; IT = 100 mA; T2+ G-; Tj = 25 °C; Fig. 7 - - 35 mA VD = 12 V; IT = 100 mA; T2- G-; Tj = 25 °C; Fig. 7 - - 35 mA IH holding current VD = 12 V; Tj = 25 °C; Fig. 9 - - 35 mA VT on-state voltage IT = 15 A; Tj = 25 °C; Fig. 10 - - 1.6 V Dynamic characteristics dVD/dt rate of rise of off-state voltage VDM = 402 V; Tj = 150 °C; (VDM = 67% of VDRM); exponential waveform; gate open circuit 300 - - V/µs dIcom/dt rate of change of commutating current VD = 400 V; Tj = 150 °C; IT(RMS) = 12 A; dVcom/dt = 20 V/µs; (snubberless condition); gate open circuit 8 - - A/ms Simplified outline Graphic symbol 5. Pinning information Table 2. Pinning information Pin Symbol Description 1 T1 main terminal 1 2 T2 main terminal 2 3 G gate mb T2 mounting base; main terminal 2 T2 sym051 1 2 T1 G 3 I2PAK (SOT226A) 6. Ordering information Table 3. Ordering information Type number BTA312G-600CT BTA312G-600CT Product data sheet Package Name Description Version I2PAK plastic single-ended package (I2PAK); TO-262 SOT226A All information provided in this document is subject to legal disclaimers. 19 September 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 2 / 13 BTA312G-600CT WeEn Semiconductors 3Q Hi-Com Triac 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VDRM repetitive peak off-state voltage IT(RMS) RMS on-state current ITSM non-repetitive peak onstate current 2 Conditions 2 Min Max Unit - 600 V full sine wave; Tmb ≤ 118 °C; Fig. 1; Fig. 2; Fig. 3 - 12 A full sine wave; Tj(init) = 25 °C; tp = 20 ms; Fig. 4; Fig. 5 - 100 A full sine wave; Tj(init) = 25 °C; tp = 16.7 ms - 110 A I t I t for fusing tp = 10 ms; sine-wave pulse - 50 A²s dIT/dt rate of rise of on-state current IG = 70 mA - 100 A/µs IGM peak gate current t = 20 μs - 2 A PGM peak gate power - 5 W PG(AV) average gate power - 0.5 W Tstg storage temperature -40 150 °C Tj junction temperature - 150 °C over any 20 ms period aac285-001 14 IT(RMS) (A) 12 aac285-002 16 118 °C IT(RMS) (A) 10 14 8 6 12 4 2 0 -50 0 50 100 Tmb (°C) Fig. 1. RMS on-state current as a function of mounting base temperature; maximum values BTA312G-600CT Product data sheet 10 10-2 150 10-1 1 10 surge duration (s) f = 50 Hz; Tmb = 118 °C Fig. 2. RMS on-state current as a function of surge duration; maximum values All information provided in this document is subject to legal disclaimers. 19 September 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 3 / 13 BTA312G-600CT WeEn Semiconductors 3Q Hi-Com Triac aac285-003 20 Ptot (W) 16 12 conduction angle, α (degrees) form factor a 30 60 90 120 180 2.816 1.967 1.570 1.329 1.110 α 110 Tmb(max) (°C) α = 180 118 120 90 α 126 60 30 8 134 4 142 0 0 4 8 12 150 16 IT(RMS) (A) α = conduction angle a = form factor = IT(RMS) / IT(AV) Fig. 3. Total power dissipation as a function of RMS on-state current; maximum values aac285-004 120 ITSM IT ITSM (A) t 1/f 80 Tj(init) = 25 °C max 40 0 1 102 10 number of cycles (n) 103 f = 50 Hz Fig. 4. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum values BTA312G-600CT Product data sheet All information provided in this document is subject to legal disclaimers. 19 September 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 4 / 13 BTA312G-600CT WeEn Semiconductors 3Q Hi-Com Triac aac285-005 104 ITSM IT ITSM (A) t tp Tj(init) = 25 °C max 103 (1) 102 10 10-5 10-4 10-3 10-2 tp (s) 10-1 tp ≤ 20 ms (1) dIT/dt limit Fig. 5. Non-repetitive peak on-state current as a function of pulse width; maximum values BTA312G-600CT Product data sheet All information provided in this document is subject to legal disclaimers. 19 September 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 5 / 13 BTA312G-600CT WeEn Semiconductors 3Q Hi-Com Triac 8. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit Rth(j-mb) thermal resistance from junction to mounting base half cycle; Fig. 6 - - 2.4 K/W full cycle; Fig. 6 - - 2 K/W thermal resistance from junction to ambient free air in free air - 60 - K/W Rth(j-a) aac285-006 10 Zth(j-mb) (K/W) 1 10-1 P tp 10-2 10-5 10-4 10-3 10-2 10-1 1 tp (s) t 10 Fig. 6. Transient thermal impedance from junction to mounting base as a function of pulse duration BTA312G-600CT Product data sheet All information provided in this document is subject to legal disclaimers. 19 September 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 6 / 13 BTA312G-600CT WeEn Semiconductors 3Q Hi-Com Triac 9. Characteristics Table 6. Characteristics Symbol Parameter VCL dIcom/dt Conditions Min Typ Max Unit clamping voltage - - - rate of change of commutating current - - - VD = 12 V; IT = 100 mA; T2+ G+; Tj = 25 °C; Fig. 7 - - 35 mA VD = 12 V; IT = 100 mA; T2+ G-; Tj = 25 °C; Fig. 7 - - 35 mA VD = 12 V; IT = 100 mA; T2- G-; Tj = 25 °C; Fig. 7 - - 35 mA VD = 12 V; IG = 100 A; T2+ G+; Tj = 25 °C; Fig. 8 - - 50 mA VD = 12 V; IG = 100 A; T2+ G-; Tj = 25 °C; Fig. 8 - - 60 mA VD = 12 V; IG = 100 A; T2- G-; Tj = 25 °C; Fig. 8 - - 50 mA Static characteristics IGT IL gate trigger current latching current IH holding current VD = 12 V; Tj = 25 °C; Fig. 9 - - 35 mA VT on-state voltage IT = 15 A; Tj = 25 °C; Fig. 10 - - 1.6 V VGT gate trigger voltage VD = 12 V; IT = 100 mA; Tj = 25 °C; Fig. 11 - 0.8 1 V VD = 400 V; IT = 100 mA; Tj = 150 °C; Fig. 11 0.2 0.45 - V VD = 600 V; Tj = 25 °C - - 10 µA VD = 600 V; Tj = 150 °C - 0.4 2 mA ID off-state current Dynamic characteristics dVD/dt rate of rise of off-state voltage VDM = 402 V; Tj = 150 °C; (VDM = 67% of VDRM); exponential waveform; gate open circuit 300 - - V/µs dIcom/dt rate of change of commutating current VD = 400 V; Tj = 150 °C; IT(RMS) = 12 A; dVcom/dt = 20 V/µs; (snubberless condition); gate open circuit 8 - - A/ms - - - BTA312G-600CT Product data sheet All information provided in this document is subject to legal disclaimers. 19 September 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 7 / 13 BTA312G-600CT WeEn Semiconductors 3Q Hi-Com Triac aac285-007 3 IGT (3) aac285-008 3 IL IL(25°C) IGT(25°C) (2) 2 2 (1) 1 0 -50 1 0 50 100 Tj (°C) 0 -50 150 (1) T2+ G+ (2) T2+ G(3) T2- G- 0 50 100 Tj (°C) 150 Fig. 8. Normalized latching current as a function of junction temperature Fig. 7. Normalized gate trigger current as a function of junction temperature aac285-009 3 aac285-010 25 IT (A) IH IH(25°C) 20 2 15 10 (1) 1 (2) (3) 5 0 -50 0 50 100 Tj (°C) 150 0 0 1 2 VT (V) 3 Vo = 1.037 V; Rs = 0.034 Ω (1) Tj = 150 °C; typical values (2) Tj = 150 °C; maximum values (3) Tj = 25 °C; maximum values Fig. 9. Normalized holding current as a function of junction temperature Fig. 10. On-state current as a function of on-state voltage BTA312G-600CT Product data sheet All information provided in this document is subject to legal disclaimers. 19 September 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 8 / 13 BTA312G-600CT WeEn Semiconductors 3Q Hi-Com Triac aac285-011 1.6 VGT VGT(25 °C) 1.2 0.8 0.4 -50 0 50 100 Tj (°C) 150 Fig. 11. Normalized gate trigger voltage as a function of junction temperature BTA312G-600CT Product data sheet All information provided in this document is subject to legal disclaimers. 19 September 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 9 / 13 BTA312G-600CT WeEn Semiconductors 3Q Hi-Com Triac 10. Package outline Plastic single-ended package (I2PAK); low-profile 3-lead TO-262 SOT226A A A1 E D1 D L1 b1 Q b2 L 1 2 3 c b e e 0 5 Dimensions Unit max nom min mm 10 mm scale A A1 b b1 b2 c D D1 E e 4.7 1.40 0.95 1.40 1.7 0.65 9.4 1.32 10.30 4.3 1.15 0.70 1.14 1.3 0.45 8.6 1.02 9.65 2.54 (REF) L 15.0 12.5 L1 3.0 (REF) Q 2.6 2.2 sot226a_po Outline version SOT226A References IEC JEDEC JEITA European projection Issue date 09-08-17 09-08-25 TO-262 Fig. 12. Package outline I2PAK (SOT226A) BTA312G-600CT Product data sheet All information provided in this document is subject to legal disclaimers. 19 September 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 10 / 13 BTA312G-600CT WeEn Semiconductors 3Q Hi-Com Triac Right to make changes — WeEn Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. 11. Legal information Data sheet status Document status [1][2] Product status [3] Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] [2] [3] Definition Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. WeEn Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local WeEn Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between WeEn Semiconductors and its customer, unless WeEn Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the WeEn Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, WeEn Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. WeEn Semiconductors takes no responsibility for the content in this document if provided by an information source outside of WeEn Semiconductors. In no event shall WeEn Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, WeEn Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of WeEn Semiconductors. Product data sheet Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications — Applications that are described herein for any of these products are for illustrative purposes only. WeEn Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Please consult the most recently issued document before initiating or completing a design. The term 'short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.ween-semi.com. BTA312G-600CT Suitability for use — WeEn Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an WeEn Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. WeEn Semiconductors and its suppliers accept no liability for inclusion and/or use of WeEn Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Customers are responsible for the design and operation of their applications and products using WeEn Semiconductors products, and WeEn Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the WeEn Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. WeEn Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using WeEn Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). WeEn does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific WeEn Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. WeEn Semiconductors accepts no liability for inclusion and/or use of nonautomotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without WeEn Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond WeEn Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies WeEn Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond WeEn Semiconductors’ standard warranty and WeEn Semiconductors’ product specifications. All information provided in this document is subject to legal disclaimers. 19 September 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 11 / 13 BTA312G-600CT WeEn Semiconductors 3Q Hi-Com Triac Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. BTA312G-600CT Product data sheet All information provided in this document is subject to legal disclaimers. 19 September 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 12 / 13 BTA312G-600CT WeEn Semiconductors 3Q Hi-Com Triac 12. Contents 1. General description......................................................1 2. Features and benefits.................................................. 1 3. Applications.................................................................. 1 4. Quick reference data....................................................1 5. Pinning information......................................................2 6. Ordering information....................................................2 7. Limiting values............................................................. 3 8. Thermal characteristics............................................... 6 9. Characteristics..............................................................7 10. Package outline........................................................ 10 11. Legal information..................................................... 11 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved For more information, please visit: http://www.ween-semi.com For sales office addresses, please send an email to: salesaddresses@ween-semi.com Date of release: 19 September 2018 BTA312G-600CT Product data sheet All information provided in this document is subject to legal disclaimers. 19 September 2018 © WeEn Semiconductors Co., Ltd. 2018. All rights reserved 13 / 13
BTA312G-600CTQ
物料型号:BTA312G-600CT

器件简介:该器件是一个平面钝化高共通三象限双向可控硅,封装在SOT226A (I2PAK)塑料包中,适用于高静态和动态dV/dt以及高dI/dt的电路中。它在最大额定结温(Tj(max) = 150°C)下无需辅助器件即可完成全RMS电流的换流。

引脚分配:共有3个引脚,1号引脚为T1主端子,2号引脚为T2主端子,3号引脚为G门极。

参数特性: - 重复峰值关断电压(VDRM):最大600V - 有效值通态电流(IT(RMS)):最大12A - 非重复峰值通态电流(ITSM):最大100A - 结温(T):最大150°C

功能详解: - 3Q技术,提高噪声免疫力 - 高换流能力,最大误触发免疫 - 高结工作温度能力(Tj(max) = 150°C) - 高电压能力 - 门极触发电流较低,提高噪声免疫力 - 平面钝化,提高电压鲁棒性和可靠性 - 仅在三个象限触发 - 非常高的抗dV/dt误触发能力 - 封装满足UL94V0阻燃要求 - 封装符合RoHS标准

应用信息: - 高温环境下的应用 - 电子恒温器(加热和冷却) - 大功率电机控制,例如洗衣机和吸尘器 - 整流器供电的直流感性负载,例如直流电机和螺线管

封装信息:12PAK塑料单端包(SOT226A),低轮廓3引脚TO-262。
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