G2K3N10H
N-Channel Enhancement Mode Power MOSFET
Description
The G2K3N10H uses advanced trench technology to
provide excellent RDS(ON) , low gate charge. It can be used in
a wide variety of applications.
General Features
l
l
l
l
l
VDS
ID (at VGS = 10V)
RDS(ON) (at VGS = 10V)
RDS(ON) (at VGS = 4.5V)
100% Avalanche Tested
<
<
100V
2A
220mΩ
230mΩ
Schematic diagram
l RoHS Compliant
Application
l Power switch
l DC/DC converters
G
D
S
SOT-223
Ordering Information
Device
Package
Marking
Packaging
G2K3N10H
SOT-223
G2K3N10
2500psc/Reel
Absolute Maximum Ratings TC = 25ºC, unless otherwise noted
Parameter
Symbol
Value
Unit
VDS
100
V
ID
2
A
IDM
8
A
Gate-Source Voltage
VGS
±20
V
Power Dissipation
PD
2.4
W
TJ, Tstg
-55 To 150
ºC
Symbol
Value
Unit
RthJA
52
ºC/W
Drain-Source Voltage
Continuous Drain Current
Pulsed Drain Current
(note1)
Operating Junction and Storage Temperature Range
Thermal Resistance
Parameter
Thermal Resistance, Junction-to-Ambient
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TEL:0755-29961263
FAX:0755-29961466(A1599-V1.1)
G2K3N10H
Specifications TJ = 25ºC, unless otherwise noted
Parameter
Symbol
Test Conditions
Drain-Source Breakdown Voltage
V(BR)DSS
Zero Gate Voltage Drain Current
Gate-Source Leakage
Value
Unit
Min.
Typ.
Max.
VGS = 0V, ID = 250µA
100
--
--
V
IDSS
VDS = 100V, VGS = 0V
--
--
1
μA
IGSS
VGS = ±20V
--
--
±100
nA
Gate-Source Threshold Voltage
VGS(th)
VDS = VGS, ID = 250µA
1
1.5
2
V
Drain-Source On-Resistance
RDS(on)
VGS = 10V, ID = 2A
--
190
220
VGS = 4.5V, ID = 1A
--
195
230
Forward Transconductance
gFS
VGS = 5V, ID = 2A
--
6
--
--
434
--
--
11
--
--
10
--
--
13
--
--
2.5
--
--
1.3
--
--
6
--
--
4
--
--
18
--
--
5
--
Static Parameters
mΩ
S
Dynamic Parameters
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Turn-on Delay Time
td(on)
Turn-on Rise Time
tr
Turn-off Delay Time
td(off)
Turn-off Fall Time
VGS = 0V,
VDS = 50V,
f = 1.0MHz
VDD = 50V,
ID = 2A,
VGS = 10V
VDD = 50V,
ID = 2A,
RG = 2.5Ω
tf
pF
nC
ns
Drain-Source Body Diode Characteristics
Continuous Body Diode Current
IS
TC = 25ºC
--
--
2
A
Body Diode Voltage
VSD
TJ = 25ºC, ISD = 2A, VGS = 0V
--
--
1.2
V
Reverse Recovery Charge
Qrr
--
0.34
--
nC
Reverse Recovery Time
Trr
IF = 2A, VGS = 0V
di/dt=100A/us
--
98
--
ns
Notes
1.
Repetitive Rating: Pulse width limited by maximum junction temperature
2.
Identical low side and high side switch with identical RG
www.gofordsemi.com
TEL:0755-29961263
FAX:0755-29961466(A1599-V1.1)
G2K3N10H
Gate Charge Test Circuit
Switch Time Test Circuit
EAS Test Circuit
www.gofordsemi.com
TEL:0755-29961263
FAX:0755-29961466(A1599-V1.1)
G2K3N10H
Typical Characteristics TJ = 25ºC, unless otherwise noted
Figure 1. Output Characteristics
8
10V
7
6
5
3V
4
3
2
VGS= 2.5V
6
5
4
25℃
3
2
1
1
0
VDS= 5V
7
3.5V
3.3V
4V
ID, Drain Current (A)
8
ID, Drain Current (A)
Figure 2. Transfer Characteristics
0
1
2
3
0
4
0
VDS, Drain-to-Source Voltage (V)
260
VGS= 4.5V
VGS= 10V
140
100
0
1
2
3
600
Ciss
400
300
200
0
Coss
10
20
30
40
50
6
4
2
0
5
10
15
60
VDS Drain-Source Voltage(V)
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8
Is, Reverse Drain Current (A)
Capacitance(pF)
700
Crss
VDD =50V
ID = 2A
Figure 6. Source-Drain Diode Forward
800
0
5
Qg Gate Charge(nC)
Figure 5. Capacitance
100
4
10
0
4
ID-Drain Current(A)
500
3
Figure 4. Gate Charge
Vgs Gate-Source Voltage(V)
RDS(on),On-Resistance(mΩ)
300
180
2
VGS, Gate-to-Source Voltage (V)
Figure 3. Drain Source On Resistance
220
1
TEL:0755-29961263
VSD, Source-to-Drain Voltage (V)
FAX:0755-29961466(A1599-V1.1)
G2K3N10H
Typical Characteristics TJ = 25ºC, unless otherwise noted
VGS = 10V,
ID = 2A
VGS = 4.5V
ID = 1A
Figure 8. Safe Operation Area
ID, Drain Current(A)
RDS(on), (Normalized)
Figure 7. Drain-Source On-Resistance
TJ, Junction Temperature (ºC)
VDS, Drain-Source Voltage(V)
ZthJC, Thermal Impedance (ºC/W)
Figure 9. Normalized Maximum Transient
Thermal Impedance
52°C/W
Pulse Width (s)
www.gofordsemi.com
TEL:0755-29961263
FAX:0755-29961466(A1599-V1.1)
G2K3N10H
SOT-223 Package Information
www.gofordsemi.com
TEL:0755-29961263
FAX:0755-29961466(A1599-V1.1)
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