Sep. 2020
IV1Q12160T4 – 1200V 160mΩ SiC MOSFET
Package:
Features:
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⚫
⚫
⚫
⚫
High blocking voltage with low on-resistance
High speed switching with low capacitance
High operating junction temperature capability
Very fast and robust intrinsic body diode
Kelvin gate input easing driver circuit design
Applications:
⚫
⚫
⚫
⚫
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Solar inverters
UPS
Motor drivers
High voltage DC/DC converters
Switch mode power supplies
Part Number
Package
IV1Q12160T4
TO247-4
Absolute Maximum Ratings (TC=25°C unless otherwise specified)
Symbol
Parameter
Value
Unit
Test Conditions
VDS
Drain-Source voltage
1200
V
VGS=0V, ID=100μA
VGS
Gate-Source voltage
-5 to 20
V
Recommended maximum
20
A
VGS=20V, TC=25°C
16
A
VGS=20V, TC=100°C
Note
ID
Drain current (continuous)
IDM
Drain current (pulsed)
50
A
Pulse width limited by SOA
Fig. 24
PTOT
Total power dissipation
138
W
TC=25°C
Fig. 22
Tstg
Storage temperature range
-55 to 175
°C
TJ
Operating junction temperature
-55 to 175
°C
TL
Solder Temperature
260
°C
Fig. 21
Wave soldering only allowed
at leads, 1.6mm from case
for 10 s
Thermal Data
Symbol
Rθ(J-C)
Parameter
Thermal Resistance from Junction to Case
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Value
Unit
Note
1.088
°C/W
Fig. 23
Rev1.0
Sep. 2020
Electrical Characteristics (TC=25°C unless otherwise specified)
Symbol
Value
Parameter
Min.
Unit
Typ.
Max.
Test Conditions
IDSS
Zero gate voltage drain
current
5
100
μA
VDS=1200V, VGS=0V
IGSS
Gate leakage current
1
+100
nA
VDS=0V, VGS=-5~20V
V
VGS=VDS, ID=1.9mA
VTH
Gate threshold voltage
2.9
RON
Static drain-source onresistance
VGS=VDS, ID=1.9mA
@ TC=175°C
1.9
mΩ
VGS=20V, ID=10A
@TJ=25°C
250
mΩ
VGS=20V, ID=10A
@TJ=175°C
160
195
Ciss
Input capacitance
885
pF
Coss
Output capacitance
38
pF
Crss
Reverse transfer
capacitance
2
pF
Eoss
Coss stored energy
16
μJ
Qg
Total gate charge
43
nC
Qgs
Gate-source charge
9
nC
Qgd
Gate-drain charge
19
nC
Rg
Gate input resistance
9.5
Ω
EON
Turn-on switching energy
139.3
μJ
EOFF
Turn-off switching energy
39.2
μJ
td(on)
Turn-on delay time
6.4
Rise time
19.4
Turn-off delay time
11.8
tr
td(off)
tf
Fall time
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ns
VDS=800V, VGS=0V,
f=1MHZ, VAC=25mV
Note
Fig. 8, 9
Fig. 4, 5, 6,
7
Fig. 16
Fig. 17
VDS=800V, ID=10A,
VGS=-5 to 20V
Fig. 18
f=1MHZ
VDS=800V, ID=10A,
VGS=-2 to 20V,
RG(ext)=5.1Ω,
L=450μH
Fig. 19, 20
14
Rev1.0
Sep. 2020
Reverse Diode Characteristics (TC=25°C unless otherwise specified)
Symbol
Value
Parameter
Min.
Typ.
4.1
Unit
Note
Max.
V
ISD=5A, VGS=0V
3.7
V
ISD=5A, VGS=0V,
TJ=175°C
VSD
Diode forward voltage
trr
Reverse recovery time
33.2
ns
Qrr
Reverse recovery charge
101.5
nC
IRRM
Peak reverse recovery current
5.6
A
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Test Conditions
Fig. 10,
11, 12
VGS=-2V/+20V,
ISD=10A, VR=800V,
di/dt=1000A/us,
RG(ext)=13.0Ω
Rev1.0
Sep. 2020
Typical Performance (curves)
Fig. 1 Output Curve @ TJ=-55°C
Fig. 2 Output Curve @ TJ=25°C
Fig. 3 Output Curve @ TJ=175°C
Fig. 4 Ron vs. Temperature
Fig. 5 Normalized Ron vs. Temperature
Fig. 6 Ron vs. IDS @ Various Temperature
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Rev1.0
Sep. 2020
Fig. 7 Ron vs. Temperature @ Various VGS
Fig. 8 Transfer Curves @ Various Temperature
Fig. 9 Threshold Voltage vs. Temperature
Fig. 10 Body Diode Curves @ TJ=-55°C
Fig. 11 Body Diode Curves @ TJ=25°C
Fig. 12 Body Diode Curves @ TJ=175°C
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Rev1.0
Sep. 2020
rd
Fig. 13 3 Quadrant Curves @ TJ=-55°C
rd
rd
Fig. 14 3 Quadrant Curves @ TJ=25°C
Fig. 15 3 Quadrant Curves @ TJ=175°C
Fig. 16 Capacitance vs. VDS
Fig. 17 Output Capacitor Stored Energy
Fig. 18 Gate Charge Characteristics
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Rev1.0
Sep. 2020
Fig. 19 Switching Energy vs. RG(ext)
Fig. 21 Continuous Drain Current vs.
Case Temperature
Fig. 23 Thermal Impedance
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Fig. 20 Switching Times vs. RG(ext)
Fig. 22 Max. Power Dissipation Derating vs.
Case Temperature
Fig. 24 Safe Operating Area
Rev1.0
Sep. 2020
Package Dimensions
Note:
1. Package Reference: JEDEC TO247, Variation AD
2. All Dimensions are in mm
3. Slot Required, Notch May Be Rounded
4. Dimension D&E Do Not Include Mold Flash
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Rev1.0
Sep. 2020
Notes
Current revision is preliminary one, for further information please contact IVCT’s Office.
Copyright©2020 InventChip Technology Co., Ltd. All rights reserved.
Related Links
http://www.inventchip.com.cn
www.inventchip.com.cn
Rev1.0
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