UMW
R
STD15NF10
100V N-Channel Enhancement Mode MOSFET
Description
The STD15NF10 uses advanced trench technology
to provide excellent RDS(ON), low gate charge and
operation with gate voltages as low as 4.5V. This
device is suitable for use as a Battery protection or
in other Switching application.
General Fea
VDS = 100V ID = 20A
RDS(ON) < 75mΩ @ VGS=10V
Application
Battery protection
Load switch
Uninterruptible power supply
Absolute Maximum Ratings Tc=25℃ unless otherwise noted
Symbol
Parameter
Rating
Units
VDS
Drain-Source Voltage
100
V
VGS
Gate-Source Voltage
±20
V
ID@TC=25℃
Continuous Drain Current, VGS @ 10V1
20
A
ID@TC=100℃
Continuous Drain Current, VGS @
10V1
10
A
ID@TA=25℃
Continuous Drain Current, VGS @ 10V1
5
A
ID@TA=70℃
Continuous Drain Current, VGS @ 10V1
3.4
A
IDM
Pulsed Drain Current2
30
A
EAS
Single Pulse Avalanche Energy3
36.5
mJ
IAS
Avalanche Current
PD@TC=25℃
PD@TA=25℃
15
A
Total Power
Dissipation4
34.7
W
Total Power
Dissipation4
2
W
TSTG
Storage Temperature Range
-55 to 150
℃
TJ
Operating Junction Temperature Range
-55 to 150
℃
RθJA
Thermal Resistance Junction-ambient 1
62
℃/W
2.4
℃/W
RθJC
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Thermal Resistance
Junction-Case1
1
友台半导体有限公司
UMW
R
STD15NF10
100V N-Channel Enhancement Mode MOSFET
Symbol
BVDSS
Parameter
Drain-Source Breakdown Voltage
△BVDSS/△TJ BVDSS Temperature Coefficient
On-Resistance2
Conditions
Min.
Typ.
Max.
Unit
100
---
---
V
Reference to 25℃ , ID=1mA
---
0.098
---
V/℃
VGS=10V , ID=20A
---
65
75
VGS=0V , ID=250uA
RDS(ON)
VGS(th)
Static Drain-Source
Gate Threshold Voltage
VGS=4.5V , ID=15A
--1.0
85
---
90
2.5
mΩ
V
△VGS(th)
VGS(th) Temperature Coefficient
-----
-4.75
---
--10
mV/℃
IDSS
Drain-Source Leakage Current
VGS=VDS , ID =250uA
VDS=80V , VGS=0V , TJ=25℃
VDS=80V , VGS=0V , TJ=55℃
---
---
100
IGSS
Gate-Source Leakage Current
VGS=±20V , VDS=0V
---
---
±100
nA
gfs
Forward Transconductance
VDS=5V , ID=20A
---
28.7
---
S
Rg
Gate Resistance
VDS=0V , VGS=0V , f=1MHz
---
1.6
3.2
Ω
Qg
Total Gate Charge (10V)
---
26.2
---
Qgs
Gate-Source Charge
---
4.6
---
Qgd
Gate-Drain Charge
---
5.1
---
Td(on)
Turn-On Delay Time
---
4.2
---
Tr
VDS=80V , VGS=10V , ID=20A
uA
nC
Rise Time
VDD=50V , VGS=10V , RG=3.3
---
8.2
---
Turn-Off Delay Time
ID=20A
---
35.6
---
Fall Time
---
9.6
---
Ciss
Input Capacitance
---
1535
---
Coss
Output Capacitance
---
60
---
Crss
Reverse Transfer Capacitance
---
37
---
---
---
22
A
---
---
45
A
VGS=0V , IS=1A , TJ=25℃
---
---
1.2
V
IF=20A , dI/dt=100A/µs ,
TJ=25℃
---
30
---
nS
---
37
---
nC
Td(off)
Tf
IS
ISM
VSD
Continuous Source
VDS=15V , VGS=0V , f=1MHz
Current1,5
Pulsed Source
Current2,5
Diode Forward
Voltage2
trr
Reverse Recovery Time
Qrr
Reverse Recovery Charge
VG=VD=0V , Force Current
ns
pF
Note :
1.The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
2.The data tested by pulsed , pulse width ≦ 300us , duty cycle ≦ 2%
3.The EAS data shows Max. rating . The test condition is V DD=25V,VGS=10V,L=0.1mH,IAS=27A
4.The power dissipation is limited by 150℃ junction temperature
5.The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.
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2
友台半导体有限公司
UMW
R
STD15NF10
100V N-Channel Enhancement Mode MOSFET
Typical Characteristics
37.0
55
ID= 1 2 A
VGS=10V
44
36.5
RD S O N( m Ω )
ID Drain Current (A)
VGS=7V
VGS=5V
33
36.0
VGS=4.5V
35.5
22
35.0
VGS=3V
11
34.5
34.0
4
0
0
1
2
3
4
5
VDS , Drain-to-Source Voltage (V)
6
8
10
VGS (V)
Fig.1 Typical Output Characteristics
Fig.2 On-Resistance vs. Gate-Source
Voltage
12
IS Source Current(A)
10
8
6
TJ=150℃
4
TJ=25℃
2
0
0.00
0.25
0.50
0.75
1.00
Normalized On Resistance
VSD , Source-to-Drain Voltage (V)
Fig.3 Forward Characteristics Of Reverse
diode
2.5
1.8
2.0
1.4
Normalized VGS(th) (V)
Fig.4 Gate-Charge Characteristics
1.5
1
0.6
1.0
0.2
-50
0
50
100
0.5
-50
150
Fig.5 Normalized VGS(th) vs. TJ
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0
50
100
150
e ra ture (
TJ , J u n c t i o n T e m p℃)
TJ ,Junction Temperature (℃ )
Fig.6 Normalized RDSON vs. TJ
3
友台半导体有限公司
UMW
R
STD15NF10
100V N-Channel Enhancement Mode MOSFET
10000
100.00
F=1.0MHz
100us
10.00
1000
1ms
-ID (A)
Capacitance (pF)
Ciss
10ms
100ms
DC
1.00
Coss
100
Crss
0.10
Tc=25o C
Single Pulse
10
1
5
9
13
17
21
0.01
25
0.1
VDS , Drain to Source Voltage (V)
Fig.7 Capacitance
1
10
100
-VDS (V)
1000
Fig.8 Safe Operating Area
Normalized Thermal Response (RθJC)
1
DUTY=0.5
0.2
0.1
0.1
0.05
0.02
0.01
0.01
PDM
SINGLE PULSE
TON
T
D = TON/T
TJpeak = TC + PDM x RθJC
0.001
0.00001
0.0001
0.001
0.01
0.1
1
10
t , Pulse Width (s)
Fig.9 Normalized Maximum Transient Thermal Impedance
EAS=
VDS
90%
BVDSS
1
L x IAS2 x
2
BVDSS
BVDSS-VDD
VDD
IAS
10%
VGS
Td(on)
Tr
Ton
Td(off)
Tf
Toff
VGS
Fig.11 Unclamped Inductive Switching Waveform
Fig.10 Switching Time Waveform
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友台半导体有限公司
UMW
R
STD15NF10
100V N-Channel Enhancement Mode MOSFET
Package Mechanical Data TO-252
E
A
B2
Dimensions
C2
L
V1
Ref.
Millimeters
H
D
Min.
C
B
G
V2
D1
V1
E1
A2
V1
L2
Min.
Typ.
Max.
A
2.10
2.50
0.083
0.098
0
0.10
0
0.004
B
0.66
0.86
0.026
0.034
B2
5.18
5.48
0.202
0.216
C
0.40
0.60
0.016
0.024
C2
0.44
0.58
0.017
0.023
D
5.90
6.30
0.232
5.30REF
E
6.40
E1
4.63
0.248
0.209REF
6.80
0.252
0.268
0.182
G
4.47
4.67
0.176
0.184
H
9.50
10.70
0.374
0.421
L
1.09
1.21
0.043
0.048
L2
1.35
1.65
0.053
0.065
7°
V1
DETAIL A
Inches
Max.
A2
D1
DETAIL A
Typ.
V2
0°
7°
6°
0°
6°
Ordering information
Order code
UMW STD15NF10L
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Package
Baseqty
Delivery mode
TO-252
2500
Tape and reel
5
友台半导体有限公司
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