FTS01N15G
150V N-Channel Enhancement Mode MOSFET
General Features
➢
➢
➢
➢
➢
ESD improved capability
High dense cell design for extremely low RDS(ON).
Rugged polysilicon gate cell structure
RoHS compliant
Halogen-free available
BVDSX
RDS(ON) (Typ.)
ID
150V
0.45 Ω
1.3A
SOT-223
➢
➢
➢
D
D
Applications
G
Relay driver
High speed line driver
Logic level translator
G
D
S
S
Ordering Information
Part Number
Package
Marking
Remark
FTS01N15G
SOT-223
01N15G
Halogen Free
Absolute Maximum Ratings
Symbol
TA =25℃ unless otherwise specified
Parameter
FTS01N15G
Unit
VDSX
Drain-to-Source Voltage[1]
150
V
VDGX
Drain-to-Gate Voltage[1]
150
V
ID
Continuous Drain Current
1.3
IDM
Pulsed Drain Current[2]
5.2
Power Dissipation
1.5
W
0.012
W/℃
±20
V
PD
VGS
VESD
TL
TJ and TSTG
Derating Factor above 25℃
Gate-to-Source Voltage
Gate Source
ESD[3]
A
6000
Source to Gate ESD[3]
5000
Soldering Temperature
Distance of 1.6mm from case for 10 seconds
300
Operating and Storage Temperature Range
V
℃
-55 to 150
Caution: Stresses greater than those listed in the“Absolute Maximum Ratings” may cause permanent damage to the device.
Thermal Characteristics
Symbol
RθJA
Parameter
Thermal Resistance, Junction-to-Ambient
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FTS01N15G
Unit
83.3
℃/W
Rev. 1.0 Feb. 2022
FTS01N15G
Electrical Characteristics
OFF Characteristics
Symbol
BVDSX
TA =25℃ unless otherwise specified
Parameter
Drain-to-Source Breakdown Voltage
IDSS
Drain-to-Source Leakage Current
IGSS
Gate-to-Source Leakage Current
Min.
Typ.
Max.
Unit
Test Conditions
150
--
--
V
VGS=0V, ID=250µA
--
--
1
µA
VDS=150V,VGS=0V
--
--
20
--
--
-20
ON Characteristics
Symbol
µA
VGS=+20V, VDS=0V
VGS=-20V, VDS=0V
TA =25℃ unless otherwise specified
Parameter
Min.
Typ.
Max.
Unit
Test Conditions
RDS(ON)
Static Drain-to-Source On-Resistance
--
0.45
1
Ω
VGS=5V,ID=1A [4]
VGS(th)
Gate Threshold Voltage
1.5
--
2.5
V
VGD=0V, ID=250µA
Forward Transconductance
--
860
--
mS
VDS=5V, ID=175mA
gfs
Dynamic Characteristics
Symbol
Parameter
Essentially independent of operating temperature
Min.
Typ.
Max.
CISS
Input Capacitance
--
320.5
--
COSS
Output Capacitance
--
120.5
--
CRSS
Reverse Transfer Capacitance
--
27.4
--
QG
Total Gate Charge
--
9.5
--
QGS
Gate-to-Source Charge
--
2.1
--
QGD
Gate-to-Drain (Miller) Charge
--
3.8
--
Resistive Switching Characteristics
Symbol
Parameter
Min.
Typ.
Max.
Turn-on Delay Time
--
6.5
--
trise
Rise Time
--
5.8
--
td(off)
Turn-off Delay Time
--
67.0
--
Fall Time
--
16.0
--
ARK Microelectronics Co., Ltd.
Test Conditions
pF
VGS=0V
VDS=10V
f=1.0MHZ
nC
VDS=60V
ID=1.8A
VGS=5V
Essentially independent of operating temperature
td(on)
tfall
Unit
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Unit
Test Conditions
ns
VGS=10V
VDD=50V
RG=50 Ω
RD=250 Ω
Rev. 1.0 Feb. 2022
FTS01N15G
Source-Drain Diode Characteristics
Symbol
VSD
Parameter
Diode Forward Voltage
TA =25℃ unless otherwise specified
Min
Typ.
Max.
Unit
Test Conditions
--
--
1.2
V
ISD=1A[4], VGS=0V
NOTE:
[1] TJ=+25℃ to +150℃
[2] Repetitive rating, pulse width limited by maximum junction temperature.
[3] The test is based on JEDEC EIA/JESD22-A114 (HBM).
[4] Pulse width≤380µs; duty cycle≤2%.
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Rev. 1.0 Feb. 2022
FTS01N15G
Typical Characteristics
Figure 2. Maximum Continuous Drain Current
vs. Case Temperature
1.6
1.4
ID,Drain Current(A)
PD,Power Dissipation(W)
Figure 1. Maximum Power Dissipation vs.
Case Temperature
1.2
0.8
0.4
1.2
1
0.8
0.6
0.4
0.2
0
0
25
50
75
100
125
150
25
50
TC,Case Temperature(℃)
Figure 3.Typical Output Characteristics
ID,Dranin-to-Source Current(A)
ID,Drain Current(A)
VGS=4.5V
5
VGS=4V
4
VGS=3.5V
2
VGS=3V
VGS=2V
0
0
2
VDS=3V
6
5
4
3
2
1
0
4
6
8
VDS,Drain Voltage(V)
0
10
1
Figure 5. Typical Capacitance vs.
Drain-to-Source Voltage
2
3
4
5
6
7
8
9
VGS,Gate-to-Source Voltage(V)
10
Figure 6. Typical Gate Charge vs.
Gate-to-Source Voltage
500
VGS,Gate-to-Source Voltage(V)
5
450
400
C,Capacitance(pF)
150
Figure 4. Typical Transfer Characteristics
VGS=5V
1
125
7
7
3
100
TC,Case Temperature(℃)
8
6
75
350
CISS
300
250
200
150
100
COSS
50
CRSS
5
10
15
20
VDS,Drain Voltage(V)
ARK Microelectronics Co., Ltd.
3
2
1
0
0
0
4
0
25
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4 /7
2
4
6
QG,Gate Charge(nC)
8
10
Rev. 1.0 Feb. 2022
FTS01N15G
Figure 8. Drain-to-Source On-Resistance
vs. Drain Current
1.6
1.4
1
1.2
RDS(ON) (Ω)
ID,Dranin-to-Source Current(A)
Figure 7. Maximum Rated Safe Operating Area
10
0.1
0.01
1.0
0.8
0.6
0.4
0.2
0.001
0.0
1
10
VDS,Drain Voltage(V)
100
0
Figure 9. Drain-to-Source On-Resistance
vs. Junction Temperature
2
3
4
5
6
7
8
ID,Dranin-to-Source Current(A)
9
10
Figure 10. Gate Threshold Voltage vs.
Junction Temperature
2.4
1
2.2
VGS(th) (V)
0.8
RDS(ON) (Ω)
1
0.6
0.4
2
1.8
1.6
0.2
1.4
1.2
0
-50
0
50
100
Tj,Junction Temperature(℃)
ARK Microelectronics Co., Ltd.
-50
150
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5 /7
0
50
100
Tj,Junction Temperature(℃)
150
Rev. 1.0 Feb. 2022
FTS01N15G
Package Dimensions
SOT-223
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Rev. 1.0 Feb. 2022
FTS01N15G
Published by
ARK Microelectronics Co., Ltd.
ADD: D26,UESTC National Science Park No. 1 Shuangxing Avenue, Chengdu, Sichuan.
All Rights Reserved.
Disclaimers
ARK Microelectronics Co., Ltd. reserves the right to make change without notice in order to improve
reliability, function or design and to discontinue any product or service without notice. Customers should obtain
the latest relevant information before orders and should verify that such information is current and complete. All
products are sold subject to ARK Microelectronics Co., Ltd’s terms and conditions supplied at the time of
order acknowledgement.
ARK Microelectronics Co., Ltd. warrants performance of its hardware products to the specifications at the
time of sale, Testing, reliability and quality control are used to the extent ARK Microelectronics Co., Ltd
deems necessary to support this warrantee. Except where agreed upon by contractual agreement, testing of all
parameters of each product is not necessary performed.
ARK Microelectronics Co., Ltd. does not assume any liability arising from the use of any product or circuit
designs described herein. Customers are responsible for their products and applications using ARK
Microelectronics Co., Ltd’s components. To minimize risk, customers must provide adequate design and
operating safeguards.
ARK Microelectronics Co., Ltd. does not warrant or convey any license either expressed or implied under its
patent rights, nor the rights of others. Reproduction of information in ARK Microelectronics Co., Ltd’s data
sheets or data books is permissible only if reproduction is without modification or alteration. Reproduction of this
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not responsible or liable for such altered documentation.
Resale of ARK Microelectronics Co., Ltd’s products with statements different from or beyond the parameters
stated by ARK Microelectronics Co., Ltd. for the product or service voids all express or implied warrantees for
the associated ARK Microelectronics Co., Ltd’s product or service and is unfair and deceptive business
practice. ARK Microelectronics Co., Ltd is not responsible or liable for any such statements.
Life Support Policy:
ARK Microelectronics Co., Ltd’s products are not authorized for use as critical components in life devices or
systems without the expressed written approval of ARK Microelectronics Co., Ltd.
As used herein:
1. Life support devices or systems are devices or systems which:
a. are intended for surgical implant into the human body,
b. support or sustain life,
c. whose failure to perform when properly used in accordance with instructionsfor used provided in the
labeling, can be reasonably expected to result in significantinjury to the user.
2. A critical component is any component is any component of a life support device or system whose failure
to perform can be reasonably expected to cause the failure of the life support device or system, or to affect
its safety or effectiveness.
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Rev. 1.0 Feb. 2022
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