DMZ1520E
Depletion-Mode Power MOSFET
General Features
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ESD Improved Capability
Depletion Mode (Normally On)
Proprietary Advanced Planar Technology
Rugged Polysilicon Gate Cell Structure
Fast Switching Speed
RoHS Compliant
Halogen-free Available
RDS(ON) (Max.)
IDSS (min)
150V
15 Ω
200mA
SOT-23
D
Drain
Applications
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BVDSX
New Energy Vehicles
Industrial Automation
Surge Protection
Non-isolated Linear Power Supply
Normally-on Switches
Linear Amplifier
Constant Current Source
Telecom
Source
Gate
G
S
Ordering Information
Part Number
Package
Marking
Remark
DMZ1520E
SOT-23
1520
Halogen Free
Absolute Maximum Ratings
Symbol
TA=25℃ unless otherwise specified
Parameter
DMZ1520E
Unit
VDSX
Drain-to-Source Voltage[1]
150
V
VDGX
Drain-to-Gate Voltage[1]
150
V
ID
Continuous Drain Current
0.2
IDM
Pulsed Drain Current[2]
0.6
PD
Power Dissipation
0.50
W
VGS
Gate-to-Source Voltage
VESD
TL
TJ and TSTG
A
±20
V
ESD[3]
1500
V
Source to Gate ESD[3]
1500
V
Soldering Temperature
Distance of 1.6mm from case for 10 seconds
300
Gate to Source
Operating and Storage Temperature Range
℃
-55 to 150
Caution: Stresses greater than those listed in the“Absolute Maximum Ratings” may cause permanent damage to the device.
Thermal Characteristics
Symbol
RθJA
Parameter
Thermal Resistance, Junction-to-Ambient
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DMZ1520E
Unit
250
K/W
Rev. 1.0 Apr. 2022
DMZ1520E
Electrical Characteristics
OFF Characteristics
Symbol
BVDSX
ID(OFF)
IGSS
TA =25℃ unless otherwise specified
Parameter
Drain-to-Source Breakdown Voltage
Min.
Typ.
Max.
Unit
Test Conditions
150
--
--
V
VGS=-10V, ID=250µA
--
--
10
µA
VDS=150V,VGS=-10V
--
--
1.0
mA
VDS=150V,VGS=-10V
TJ=125℃
--
--
±20
uA
VGS=±20V, VDS=0V
Drain-to-Source Leakage Current
Gate-to-Source Leakage Current
ON Characteristics
Symbol
IDSS
TA =25℃ unless otherwise specified
Parameter
Saturated Drain-to-Source Current
RDS(ON)
Static Drain-to-Source On-Resistance
VGS(OFF)
Gate-to-Source Cut-off Voltage
gfs
Forward Transconductance
Min.
Typ.
Max.
Unit
Test Conditions
200
--
--
mA
VGS=0V, VDS=25V
--
10
15
Ω
VGS=0V, ID=100mA[4]
-3.5
--
-5.5
V
VDS=3V, ID=8µA
--
0.24
--
S
VDS=10V, ID=100mA
Min.
Typ.
Max.
Dynamic Characteristics
Symbol
Parameter
Essentially independent of operating temperature
CISS
Input Capacitance
--
12.8
--
COSS
Output Capacitance
--
5.4
--
CRSS
Reverse Transfer Capacitance
--
3.3
--
QG
Total Gate Charge
--
3
--
QGS
Gate-to-Source Charge
--
0.23
--
QGD
Gate-to-Drain (Miller) Charge
--
1.1
--
Resistive Switching Characteristics
Symbol
Parameter
Test Conditions
pF
VGS=-10V
VDS=25V
f=1.0MHZ
nC
VGS=-10V~0V
VDS=75V, ID=200mA
Essentially independent of operating temperature
Min.
Typ.
Max.
td(on)
Turn-on Delay Time
--
7
--
trise
Rise Time
--
16
--
td(off)
Turn-off Delay Time
--
25
--
Fall Time
--
120
--
tfall
Unit
Unit
Test Conditions
ns
VGS=-10V~0V
VDD=75V, ID=200mA
RG=20Ohm
Source-Drain Diode Characteristics
Symbol
VSD
Parameter
Diode Forward Voltage
TA=25℃ unless otherwise specified
Min
Typ.
Max.
Units
Test Conditions
--
--
1.2
V
ISD=200mA, VGS=-10V
NOTE:
[1] TJ=+25℃ to +150℃
[2] Repetitive rating, pulse width limited by maximum junction temperature.
[3]The test is based on JEDEC EIA/JESD22-A114(HBM).
[4] Pulse width≤380µs; duty cycle≤2%.
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Rev. 1.0 Apr. 2022
DMZ1520E
Typical Characteristics
Figure 2. Maximum Continuous Drain Current
vs. Case Temperature
0.6
0.25
0.5
ID,Drain Current(A)
PD,Power Dissipation(W)
Figure 1. Maximum Power Dissipation vs.
Case Temperature
0.4
0.3
0.2
0.2
0.15
0.1
0.05
0.1
0
25
50
75
100
125
0
150
25
50
TC,Case Temperature(℃)
Figure 3.Typical Output Characteristics
0.7
ID,Drain Current(A)
ID,Dranin-to-Source Current(A)
VGS=5V
0.5
VGS=0V
0.4
VGS=-0.5V
0.3
VGS=-1V
0.2
VGS=-1.5V
VGS=-2V
0.1
VGS=-2.5V
0.0
0.0
10.0
20.0
30.0
40.0
VDS,Drain-to-Source Voltage(V)
0.70
0.65
0.60
0.55
0.50
0.45
0.40
0.35
0.30
0.25
0.20
0.15
0.10
0.05
0.00
VGS(OFF),Gate-to-Source Cut-off Voltage
ID,Dranin-to-Source Current(A)
1
0.1
0.01
0.001
10
VDS,Drain Voltage(V)
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125
150
VDS=30V
VDS=15V
VDS=9V
VDS=3V
-6 -5 -4 -3 -2 -1 0 1 2 3 4 5 6 7 8 9 10
VGS,Gate-to-Source Voltage(V)
50.0
Figure 6. Typical Gate-to-Source Cut-off Voltage
vs. Junction Temperature
Figure 5. Maximum Rated Safe Operating Area
1
100
Figure 4. Typical Transfer Characteristics
VGS=1V
0.6
75
TC,Case Temperature(℃)
100
1.20
1.15
1.10
1.05
1.00
0.95
0.90
-50
-25
0
25
50
75
100 125 150
TJ,Junction Temperature(℃)
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DMZ1520E
Typical Application
In the application circuits of industrial automation, automotive electronics, and new energy, DMZ1520E can
be used to power LDO. As shown in Figure 7, only one DMZ1520E is used in the circuit, which can convert the
high input voltage into a stable low voltage to supply power to the LDO, and at the same time provide transient
surge suppression for the LDO. The input voltage and output voltage of the LDO satisfy the relationship:
Vs=Vout+|VGS(OFF)|. The circuit has a fast response speed, a simple structure, and can effectively save costs.
Vin
DMZ1520E
D
G
S
Vout
Vs
Figure 7. The Circuit of DMZ1520E to power supply for LDO
Using the sub-threshold characteristics of the DMZ1520E, it can form a stable current source with the
resistor R. Its basic application is shown in Figure 8:
G
Vin
S
D
R
DMZ1520E
RL
Figure 8. The Circuit of DMZ1520E and resistor form constant current source
Using the sample with VGS(OFF)=-4.3V(@VDS=3V, IDS=8uA)to test according to the circuit shown in Figure
8, the result is shown in Figure 9:
Figure 9.Typical Drain-to-Source Current
vs. Input voltage
IDS,Drain-to-Source Current(A)
1.8
1.6
1.4
1.2
1
0.8
0.6
TA=25℃
R=2KΩ
RL=5KΩ
0.4
0.2
0
0
10
20
30
40
50
60
Vin,Input voltage
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Rev. 1.0 Apr. 2022
DMZ1520E
In the Type-C/PD charger circuit, DMZ1520E and resistor R form a constant current source, which supplies
stable power to InnoSwitch. The structure of the circuit is simple, and the DMZ1520E can also provide transient
surge suppression for InnoSwitch. The circuit is shown in Figure 10:
+
DMZ1520E
-
R
BPP
InnoSwitch
Figure 10. Constant current source circuit with DMZ1520E
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Rev. 1.0 Apr. 2022
DMZ1520E
Package Dimensions
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Rev. 1.0 Apr. 2022
DMZ1520E
Published by
ARK Microelectronics Co., Ltd.
ADD: D26,UESTC National Science Park No. 1 Shuangxing Avenue, Chengdu, Sichuan.All
All Rights Reserved.
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time of sale, Testing, reliability and quality control are used to the extent ARK Microelectronics Co., Ltd
deems necessary to support this warrantee. Except where agreed upon by contractual agreement, testing of all
parameters of each product is not necessary performed.
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designs described herein. Customers are responsible for their products and applications using ARK
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Life Support Policy:
ARK Microelectronics Co., Ltd’s products are not authorized for use as critical components in life devices or
systems without the expressed written approval of ARK Microelectronics Co., Ltd.
As used herein:
1. Life support devices or systems are devices or systems which:
a. are intended for surgical implant into the human body,
b. support or sustain life,
c. whose failure to perform when properly used in accordance with instructions for used provided in the
labeling, can be reasonably expected to result in significant injury to the user.
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to perform can be reasonably expected to cause the failure of the life support device or system, or to affect
its safety or effectiveness.
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Rev. 1.0 Apr. 2022