BR100N03
Rev.F Jul.-2018
描述
/
DATA SHEET
Descriptions
TO-220 塑封封装 N 沟道 MOS 场效应管。N-CHANNEL MOSFET in a TO-220 Plastic Package.
特征
/ Features
低栅电荷,低反馈电容,开关速度快。
Low gate charge, low crss, fast switching.
用途
/
Applications
用于高功率 DC/DC 转换和功率开关。
These devices are well suited for high efficiency switching DC/DC converters and switch mode power
supplies.
内部等效电路
引脚排列
12
/ Equivalent Circuit
/ Pinning
3
PIN1:G
放大及印章代码
PIN 2:D
PIN 3:S
/ hFE Classifications & Marking
见印章说明。 See Marking Instructions.
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BR100N03
Rev.F Jul.-2018
极限参数
DATA SHEET
/
Absolute Maximum Ratings(Ta=25℃)
参数
Parameter
符号
Symbol
数值
Rating
单位
Unit
VDSS
30
V
ID(Tc=25℃)
100
A
IDM
400
A
Gate-Source Voltage
VGSS
±20
V
Single Pulsed Avalanche Energy
EAS
875
mJ
PD(Tc=25℃)
100
W
TJ,TSTG
-55 to 150
℃
Drain-Source Voltage
Drain Current
Peak Drain Current
Total Power Dissipation
Junction and Storage Temperature Range
电性能参数
/ Electrical Characteristics(Ta=25℃)
参数
Parameter
Zero Gate Voltage Drain Current
符号
Symbol
BVDSS
Zero Gate Voltage Drain Current
IDSS
VDS=30V
VGS=0V
1
μA
Gate-Body Leakage Current
Forward
IGSS
VGS=±20V
VDS=0V
±0.1
μA
VDS=VGS
ID=250μA
3.0
V
IS=20A
VGS=0V
1.5
V
VGS=10V
ID=50A
3.5
4.5
mΩ
VGS=4.5V
ID=40A
5.0
7.0
mΩ
Gate Threshold Voltage
VGS(th)
Forward On Voltage
VSD
Static Drain-Source
On-Resistance
RDS(on)
Input Capacitance
Ciss
Output Capacitance
Coss
Reverse Transfer Capacitance
Crss
Total Gate Charge
QG
Gate Source Charge
QGS
Gate Drain Charge
测试条件
Test Conditions
VGS=0V
ID=250μA
VGS=0V
VDS=15V
f=1.0MHz
最小值 典型值 最大值 单位
Min
Typ
Max
Unit
30
V
1.0
9500
pF
800
pF
300
pF
50
VDS=15V
ID=16A
VGS=5V
65
nC
20.8
nC
QGD
19
nC
Turn-On Delay Time
td(on)
25.7
50
ns
Turn-On Rise Time
tr
10
20
ns
Turn-Off Delay Time
td(off)
128
200
ns
34
70
ns
Turn-Off Fall Time
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tf
VDD=15V
RGEN=6Ω
ID=1A
VGS=10V
2/6
BR100N03
Rev.F Jul.-2018
电参数曲线图
DATA SHEET
/ Electrical Characteristic Curve
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BR100N03
Rev.F Jul.-2018
外形尺寸图
DATA SHEET
/ Package Dimensions
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BR100N03
Rev.F Jul.-2018
印章说明
/
DATA SHEET
Marking Instructions
BR
****
100N03
说明:
BR:
为公司代码
100N03:
为型号代码
****:
为生产批号代码,随生产批号变化。
Company Code
Note:
BR:
100N03:
****:
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Product Type.
Lot No. Code, code change with Lot No.
5/6
BR100N03
Rev.F Jul.-2018
DATA SHEET
波峰焊温度曲线图(无铅)
/
Temperature Profile for Dip Soldering(Pb-Free)
说明:
Note:
1、预热温度 25~150℃,时间 60~90sec;
1.Preheating:25~150℃, Time:60~90sec.
2、峰值温度 255±5℃,时间持续为 5±0.5sec;
2.Peak Temp.:255±5℃, Duration:5±0.5sec.
3、焊接制程冷却速度为 2~10℃/sec.
3. Cooling Speed: 2~10℃/sec.
耐焊接热试验条件
/
Resistance to Soldering Heat Test Conditions
温度:270±5℃
包装规格
Package Type
封装形式
TO-220/F
套管包装
Package Type
封装形式
使用说明
Temp.:270±5℃
Time:10±1 sec
/ Packaging SPEC.
散件包装
TO-220/F
时间:10±1 sec.
/ BULK
Units 包装数量
Dimension
包装尺寸
3
(unit:mm )
Units/Bag
只/袋
Bags/Inner Box
袋/盒
Units/Inner Box
只/盒
Inner Boxes/Outer Box
盒/箱
Units/Outer Box
只/箱
Bag 袋
Inner Box 盒
Outer Box 箱
200
10
2,000
5
10,000
135×190
237×172×102
560×245×195
Units/Tube
只/套管
Tubes/Inner Box
套管/盒
Units/Inner Box
只/盒
Inner Boxes/Outer Box
盒/箱
Units/Outer Box
只/箱
Tube 套管
Inner Box 盒
Outer Box 箱
50
20
1,000
5
5,000
532×31.4×5.5
555×164×50
575×290×180
/ TUBE
Units 包装数量
Dimension
包装尺寸
3
(unit:mm )
/ Notices
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