S2M

S2A~S2M Rev. B Mar.-2021 DATA SHEET 描述 / Descriptions 表面贴装整流二极管，反向电压：50V~1000V，正向电流：2.0A，SMA 封装。 Surface Mount General Purpose Silicon Rectifiers, Reverse Voltage：50 to1000V,Forward Current:2.0A ,SMA package. 特征 / Features 玻璃钝化芯片，无铅符合欧盟 RoHS 指令 2011/65/EU，适用表面贴装。无卤产品。 Glass Passivated Chip Junction, Lead free in comply with EU RoHS 2011/65/EU directives, For surface mounted applications. HF product. 用途 / Applications 一般用途. General purpose. 内部等效电路 / Equivalent Circuit 引脚排列 / Pinning 印章代码 / Marking 见印章说明。See Marking Instructions. http://www.fsbrec.com 1/6 S2A~S2M Rev. B Mar.-2021 极限参数 / DATA SHEET Absolute Maximum Ratings(Ta=25℃) 参数 Parameter 符号 Symbol Maximum Repetitive Peak Reverse Voltage Maximum RMS voltage Maximum DC Blocking Voltage Maximum Average Forward Rectified Current Peak Forward Surge Current 8.3 ms Single Half Sine Wave Superimposed on Rated Load (JEDEC Method) Typical Junction Capacitance at VR=4V f=1MHz Typical Thermal ） Resistance 1 Operating and Storage Temperature Range 数值 Rating 单位 Unit S2A S2B S2D S2G S2J S2K S2M VRRM 50 100 200 400 600 800 1000 V VRMS 35 70 140 280 420 560 700 V VDC 50 100 200 400 600 800 1000 V IF（AV） 2.0 A IFSM 50 A Cj 25 pF RθJA 65 ℃/W -55~+150 ℃ Tj,Tstg Note: 1）P.C.B. mounted with 2.0 X 2.0" (5 X5cm) copper pad areas. 电性能参数 / Electrical Characteristics(Ta=25℃) 参数 Parameter Maximum Instantaneous Forward Voltage Maximum DC Reverse Current at Rated DC Blocking Voltage 符号 Symbol VF 测试条件 Test Conditions 数值 Rating S2A S2B S2D S2G S2J S2K S2M 单位 Unit IF=2.0A 1.1 V Ta=25℃ 5.0 μA Ta=125℃ 100 μA IR http://www.fsbrec.com 2/6 S2A~S2M Rev. B Mar.-2021 DATA SHEET 电参数曲线图 / Electrical Characteristic Curve http://www.fsbrec.com 3/6 S2A~S2M Rev. B Mar.-2021 DATA SHEET 外形尺寸图 / Package Dimensions SMA http://www.fsbrec.com 4/6 S2A~S2M Rev. B Mar.-2021 DATA SHEET 印章说明 / Marking Instructions http://www.fsbrec.com 5/6 S2A~S2M Rev. B Mar.-2021 DATA SHEET 回流焊温度曲线图(无铅) / Temperature Profile for IR Reflow Soldering(Pb-Free) 说明： Note: 1、预热温度 25～150℃，时间 60～90sec; 1.Preheating:25~150℃, Time:60~90sec. 2、峰值温度 245±5℃，时间持续为 5±0.5sec; 2.Peak Temp.:245±5℃, Duration:5±0.5sec. 3、焊接制程冷却速度为 2～10℃/sec. 3. Cooling Speed: 2~10℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度：260±5℃ 时间：10±1 sec. Temp.:260±5℃ Time:10±1 sec 包装规格 / Packaging SPEC. 卷盘包装 / REEL Package Type 封装形式 SMA Units 包装数量 Dimension 包装尺寸 (unit：mm3) Units/Reel 只/卷盘 Reels/Inner Box 卷盘/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Reel Inner Box 盒 Outer Box 箱 5000 2 10000 7 70000 13〞×12 336X336X40 380X335X366 使用说明 / Notices http://www.fsbrec.com 6/6