RS1MF

RS1AF~RS1MF Rev.G Aug.-2018  描述 / DATA SHEET Descriptions 快恢复二极管，反向电压：50V~1000V，正向电流：1.0A，薄型 SMAF 封装。 Surface Mount Fast Recovery Rectifiers, Reverse Voltage：50 to1000V,Forward Current:1.0A ,SMAF thin package. 特征 / Features 玻璃钝化芯片，反向恢复时间快，无铅符合欧盟 RoHS 指令 2011/65/EU，适用表面贴装。无卤产品。 Features: Glass Passivated Chip Junction,Fast reverse recovery time,Lead free in comply with EU ROHS 2011/65/EU directives,For surface mounted applications.Halogen free product.  用途 / Applications 一般用途. General purpose. 内部等效电路 / Equivalent Circuit 引脚排列 / Pinning 印章代码 / Marking 见印章说明。See Marking Instructions. http://www.fsbrec.com 1/7 RS1AF~RS1MF Rev.G Aug.-2018 极限参数 / DATA SHEET Absolute Maximum Ratings(Ta=25℃) 参数 Parameter 符号 Symbol Maximum Repetitive Peak Reverse Voltage Maximum RMS voltage 数值 Rating RS1AF RS1BF RS1DF RS1GF RS1JF RS1KF RS1MF VRRM 50 100 200 400 600 800 1000 V VRMS 35 70 140 280 420 560 700 V 400 600 800 1000 V Maximum DC Blocking VDC 50 100 200 Voltage Maximum Average Forward Rectified Current IF（AV） at Ta = 65℃ Peak Forward Surge Current 8.3 ms Single Half Sine Wave Superimposed IFSM on Rated Load (JEDEC Method) Typical Junction Ci 1） Capacitance Typical Thermal RθJA Resistance 2） Operating and Storage Tj,Tstg Temperature Range Note: 1）Measured at 1MHz and applied reverse voltage of 4V D.C 2）P.C.B. mounted with 2.0" X 2.0" (5 X 5 cm) copper pad areas. 电性能参数 单位 Unit 1.0 A 30 A 15 pF 80 ℃/W -55~+150 ℃ / Electrical Characteristics(Ta=25℃) 参数 Parameter Maximum Instantaneous Forward Voltage Maximum DC Reverse Current at Rated DC Blocking Voltage Maximum Reverse Recovery Time 符号 Symbol VF 测试条件 Test Conditions 数值 Rating RS1AF RS1BF RS1DF RS1GF RS1JF RS1KF RS1MF 单位 Unit IF=1.0A 1.3 V Ta=25℃ 5.0 μA Ta=125℃ 50 μA IR IF=0.5A trr http://www.fsbrec.com IR=1.0A Irr=0.25A 150 250 500 ns 2/7 RS1AF~RS1MF Rev.G Aug.-2018 电参数曲线图 DATA SHEET / Electrical Characteristic Curve http://www.fsbrec.com 3/7 RS1AF~RS1MF Rev.G Aug.-2018 外形尺寸图 DATA SHEET / Package Dimensions http://www.fsbrec.com 4/7 RS1AF~RS1MF Rev.G Aug.-2018 印章说明 / DATA SHEET Marking Instructions http://www.fsbrec.com 5/7 RS1AF~RS1MF Rev.G Aug.-2018 印章说明 / DATA SHEET Marking Instructions RS1A **** 说明： RS1A： 为型号代码 ****  ： 为生产批号追溯码，第 1 个*为年月代码，后面 3 个*为当月小批号代码  Note: RS1A： Product Type Code ****：    Lot No. Code，The 1st * means:YM Code，The last 3 * means:little Lot No Code http://www.fsbrec.com 6/7 RS1AF~RS1MF Rev.G Aug.-2018 DATA SHEET 回流焊温度曲线图(无铅) / Temperature Profile for IR Reflow Soldering(Pb-Free) 说明： Note: 1、预热温度 150～180℃，时间 60～90sec; 1.Preheating:150~180℃, Time:60~90sec. 2、峰值温度 245±5℃，时间持续为 5±0.5sec; 2.Peak Temp.:245±5℃, Duration:5±0.5sec. 3、焊接制程冷却速度为 2～10℃/sec. 3. Cooling Speed: 2~10℃/sec. 耐焊接热试验条件 / Resistance to Soldering Heat Test Conditions 温度：260±5℃ 包装规格 Time:10±1 sec / REEL Package Type 封装形式 使用说明 Temp.:260±5℃ / Packaging SPEC. 卷盘包装 SMAF 时间：10±1 sec. Units 包装数量 Dimension 包装尺寸 3 (unit：mm ) Units/Reel 只/卷盘 Reels/Inner Box 卷盘/盒 Units/Inner Box 只/盒 Inner Boxes/Outer Box 盒/箱 Units/Outer Box 只/箱 Reel Inner Box 盒 Outer Box 箱 3000 5 15000 5 75000 7〞×11 185X180X105 390X385X205 / Notices http://www.fsbrec.com 7/7