BL-HBGR32L-3-TRB-8

BRIGHT LED ELECTRONICS CORP. Specification for Approval ● SAMPLES ATTACHED AREA DEVICE NUMBER: BL-HBGR32L-3-TRB-8 PAGE DATE 2017/11/9 1 2 3 4 5 1.0 1.0 1.0 1.0 1.0 6 7 8 9 CONTENTS 1.0 1.0 1.0 1.0 Initial Released Modify format& Device Number Modify Operating Temperature Modify Function Description Modify IC driver diagram 2018/11/30 1.1 1.1 1.1 1.1 1.1 1.1 1.1 1.1 1.1 2019/7/9 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 1.2 2019/11/6 1.3 1.3 1.3 1.3 1.3 1.3 1.3 1.3 1.3 2019/12/19 1.4 1.4 1.4 1.4 1.4 1.4 1.4 1.4 1.4 2020/11/19 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 1.5 2021/03/23 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2.0 2021/03/25 2.1 2.1 2.1 2.1 2.1 2.1 2.1 2.1 2.1 2021/03/31 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 2.2 FOR CUSTOMER’S APPROVAL STAMP OR APPROVED PURCHASE Modify IC driver diagram Add chip icon Modify the IC driver diagram Modify IC pin names, add Page1 IC driver diagram Modify function diagram SIGNATURE MANUFACTURE QUALITY ENGINEERING ISSUED APPROVED PREPARED 曾慶霖 謝皓翔 羅培娟 BRIGHT LED ELECTRONICS CORP. BL-HBGR32L-3-TRB-8 ● Features: 1. Emitted Color: Red, Green, Blue, ●Package Dimensions: 2. Lens Appearance: Water Clear. 3. 5.4x5.0x1.6mm standard package. IC 4. Applied Voltage : 5V 5. Power consumption : 0.3W G B R 6. Suitable for all SMT assembly methods. 7. Compatible with infrared and vapor phase reflow solder process. 8. Compatible with automatic placement equipment. 9. This product doesn’t contain restriction Substance, comply ROHS standard. 10. Synchronous of two-lane. 11. 8Bit(256 level)Color set. 12. 5Bit(32 level)brightness adjustment. 13. 18mA Content current output. 14. High contrast. 15. Choose positive output or negative NOTES: 1.All dimensions are in millimeters (inches). 2.Tolerance is ±0.10mm (0.004”) unless otherwise specified. 3.Specifications are subject to change without notice. output RGB tri-color LED output. 16. With self-detection signal Built-in support for continuous oscillation PWM output can be maintained static screen. ● Applications: 1. Large LED Display. 2. Soft Light Bar. 3. Full Color Display. ● Absolute Maximum Ratings(Ta=25℃) Symbol Range Unit VCC 4.5~5.5 V Vi -0.4~VDD+0.4 V Operating Temperature Topt -40℃~85℃ - Storage Temperature Tstg -40℃~105℃ - Soldering Temperature Tsol See Page7 - Parameter Supply voltage Input Voltage Ver2.2 Page: 1 of 9 BRIGHT LED ELECTRONICS CORP. BL-HBGR32L-3-TRB-8 ● Electrical characteristics(Ta=25℃) Parameter Symbol Condition Min. Typ. Max. Unit Supply Voltage VCC - 4.5 5.0 5.5 V VIH Din High Level 0.7*VCC - - V VIL Din Low Level - - 0.3*VCC V IDD VDD = 4. 5V， Iout ”OFF” - 0.5 Iout - 17 18 19 mA FCLK - - 0~5 15 MHz FPWM - - 20 - KHz The clock high level width tCLKH - 30 - - ns The clock Low level width tCLKL - 30 - - ns Data set up time tSETUP - 10 - - ns Data hold time tHOLD - 5 - - ns Symbol Condition Min Typ Max. Unit IV(R) Iout=18mA 580 900 1305 mcd IV(G) Iout=18mA 1070 1600 2400 mcd IV(B) Iout=18mA 259 400 583 mcd WLD(R) Iout=18mA 620 625 630 nm WLD(G) Iout=18mA 520 525 530 nm WLD(B) Iout=18mA 460 465 470 nm 2θ1/2 Iout=18mA - 120 - deg Input Voltage Level Static current R/G/B Constant Current Frequency of Clock signal Frequency of PWM - mA ● Optical characteristics(Ta=25℃) Parameter Luminous Intensity Dominant Wavelength View Angle Ver2.2 Page: 2 of 9 BRIGHT LED ELECTRONICS CORP. BL-HBGR32L-3-TRB-8 ● Circuit diagram 佰鴻工業股份有限公司 BRIGHT LED ELECTRONICS CORP 4 VCC B R 4 VCC B 3 GND G 5 COUT R G 2 CIN IC 6 DOUT 1 DIN 2CIN 1DIN IC 5 COUT 6 DOUT 3 GND VCC VCC COUT DOUT R0 4 3 4 3 4 3 5 2 5 2 5 2 6 1 1 6 6 1 R1 CIN Controller DIN GND GND R1=R0≒500Ω ● IC’s function diagram Adjustable current module FB 0UT3 0UT2 0UT1 Brightness control Brightness control Brightness control Constant current drive output D0UT C0UT Constant current Constant current drive output drive output Basis DIN CIN Input processing PWM module Count comparison Count comparison Count comparison Shaping array array array waveform output Oscillator reference count Shift register VCC GND Shift register Shift register Shift register (Global) LDD power supply processing V0UT Ver2.2 Page: 3 of 9 BRIGHT LED ELECTRONICS CORP. BL-HBGR32L-3-TRB-8 ● Sequence Chart t SDI 0*32 LED1 LED2 Start Frame LED Frame LED3 ------- LEDN 1*32 End Frame Data Field Start Frame 32 Bits 00000000 00000000 00000000 00000000 8 Bits 8 Bits 8 Bits 8 Bits MSB LED Frame 32 Bits Sign MSB 111 Global 3 Bits DIN LSB BLUE Green Red 8 Bits 8 Bits 8 Bits 5 Bits 7 LSB 6 5 4 3 2 1 0 CIN End Frame 32 Bits 11111111 11111111 11111111 11111111 8 Bits 8 Bits 8 Bits 8 Bits CIN DIN Start Frame 32 bits 1 1 Sign 1 D4 D3 D2 D1 D0 B7B6--B1B0 G7G6--G1G0 R7R6- -R1R0 1 1 D4 LED2 32bits data LED 32bits data ●Global 5-Bit Brightness adjustment DATA MSB←→LSB 1 Global Driving Current ●B/G/R 8-Bit Gray scale adjustment DATA MSB←→LSB Duty Cycle 00000 0/31(min) 00000000 0/255(min) 00001 1/31 00000001 1/255 00010 2/31 00000010 2/255 … … … … 11110 30/31 11111110 254/255 11111 31/31(max) 11111111 255/255(max) Ver2.2 Page: 4 of 9 BRIGHT LED ELECTRONICS CORP. BL-HBGR32L-3-TRB-8 ● Tapping and packaging specifications(Units: mm) ● Package Method: (unit : mm) 10bag/box 1000 pcs/reel 200 Bar Code Label 245 220 220 Aluminum Foil Bag 185 645 6 box/carton 210 470 Ver2.2 Page: 5 of 9 BRIGHT LED ELECTRONICS CORP. BL-HBGR32L-3-TRB-8 ● Reliability Test Classification Test Item Reference Standard Operation Life MIL-STD-750:1026 MIL-STD-883:1005 JIS-C-7021 :B-1 High Temperature MIL-STD-202:103B High Humidity JIS-C-7021 :B-11 Endurance Storage Test High MIL-STD-883:1008 Temperature JIS-C-7021 :B-10 Storage Low Temperature JIS-C-7021 :B-12 Storage Temperature MIL-STD-202:107D Cycling MIL-STD-750:1051 MIL-STD-883:1010 JIS-C-7021 :A-4 Thermal Shock MIL-STD-202:107D Environmental MIL-STD-750:1051 Test MIL-STD-883:1011 Solder MIL-STD-202:201A Resistance MIL-STD-750:2031 JIS-C-7021 :A-1 Test Conditions VCC=5V Iout =18mA Ta=Under room temperature Test time=1,000hrs Ta=+65℃±5℃ RH=90%-95% Test time=240hrs Result 0/20 0/20 High Ta=+85℃±5℃ Test time=1,000hrs 0/20 Low Ta=-35℃±5℃ Test time=1,000hrs 0/20 -35℃ ~ +25℃ ~ +85℃ ~ +25℃ 60min 20min 60min 20min Test Time=5cycle -35℃±5℃ ~+85℃±5℃ 20min 20min Test Time=10cycle Preheating： 140℃-160℃,within 2 minutes. Operation heating： 260℃(Max.), within 10seconds. (Max.) 0/20 0/20 0/20 ● Judgment criteria of failure for the reliability Measuring items Symbol Luminous intensity Iv ( mcd) Note: Measuring conditions VCC=5V Iout =18mA 1. U means the upper limit of specified characteristics. Judgment criteria for failure Below S1X0.5 S means initial value. 2. After each test, remove test pieces, wait for 2 hours and test pieces have returned to ambient temperature, then take next measurement. Ver2.2 Page: 6 of 9 BRIGHT LED ELECTRONICS CORP. BL-HBGR32L-3-TRB-8 ● Handling Precautions IR-Reflow RAMP-UP 3°c/s max Max260°C MAX10S 255°C 245°C TEMPERATURE(°c) 240°C 217°C 200°C 30 sec Max 150°C RAMP-UP 3°c/s max RAMP-DOWN 6°c/s max 60-120S 60-120S TIME(sec) 1、Avoid any external stress applied to the resin while the LEDs are at high temperature, especially during soldering. 2、Avoid rapid cooling or any excess vibration during temperature ramp-down process 3、Although the soldering condition is recommended above, soldering at the lowest possible temperature is feasible for the LEDs ●IRON Soldering 350℃ Within 3 sec, one time only. Ver2.2 Page: 7 of 9 BRIGHT LED ELECTRONICS CORP. BL-HBGR32L-3-TRB-8 ● Handling Precautions Compare to epoxy encapsulant that is hard and brittle, silicone is softer and flexible. Although its characteristic significantly reduces thermal stress, it is more susceptible to damage by external mechanical force. As a result, special handling precautions need to be observed during assembly using silicone encapsulated LED products. Failure to comply might lead to damage and premature failure of the LED. 1. Handle the component along the side surfaces by using forceps or appropriate tools.(pic.1) 2. Do not directly touch or handle the silicone lens surface. It may damage the internal circuitry. (pic.2,pic.3) 3. Do not stack together assembled PCBs, containing exposed LEDs. Impact may scratch the silicone lens or damage the internal circuitry. (pic.4) 4. The outer diameter of the SMD pickup nozzle should not exceed the size of the LED to prevent air leaks. The inner diameter of the nozzle should be as large as possible. (pic.5) 5. A pliable material is suggested for the nozzle tip to avoid scratching or damaging the LED surface during pickup. (pic.5) 6. The dimensions of the component must be accurately programmed in the pick-and-place machine to insure precise pickup and avoid damage during production. (pic.5) Pic.1 Pic.2 Pic.3 Pic.4 Pic.5 Ver2.2 Page: 8 of 9 BRIGHT LED ELECTRONICS CORP. BL-HBGR32L-3-TRB-8 ● Notes for designing: Care must be taken to provide the current limiting resistor in the circuit so as to drive the LEDs within the rated figures. Also, caution should be taken not to overload LEDs with instantaneous voltage at the turning ON and OFF of the circuit. When using the pulse drive care must be taken to keep the average current within the rated figures. Also, the circuit should be designed so as be subjected to reverse voltage when turning off the LEDs. ● Storage: In order to avoid the absorption of moisture, it is recommended to solder LEDs as soon as possible after unpacking the sealed envelope. If the envelope is still packed, to store it in the environment as following: (1) Temperature : 5℃-30℃(41℉)Humidity : RH 60﹪ Max. (2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be: a. Completed within 24 hours. b. Stored at less than 20% RH. (3) Devices require baking before mounting, if: 2a or 2b is not met. (4) If baking is required, devices must be baked under below conditions: 48 hours at 60℃±5℃. ● Package and Label of Products: (1) Package: Products are packed in one bag of 1000 pcs (one taping reel) and a label is attached to each bag. (2) Label: BRIGHT LED LOGO Part No. Quantity BIN. Sealing Date XXXXX x xx xx xx Year Month Day Manufacture Location Ver2.2 Page: 9 of 9