RP132K101D5-TR

RP131L(DFN1616-6B) is the discontinued product as of April,2023 RP131x SERIES LOW ON RESISTANCE / LOW VOLTAGE 1A LDO NO.EA-174-230801 OUTLINE The RP131x Series are voltage-regulators with a built-in low ON-resistance transistor and output current is 1A capability. These ICs are capable of the low input voltage (Min.1.6V) and also the minimum output voltage can be set from 0.8V. (The output voltage is fixed in the IC.) Each of these ICs consists of a voltage reference unit, an error amplifier, a resistor net for setting output voltage, a chip enable circuit, current limit circuits for over-current and short, and a thermal-shutdown circuit. A standby mode with ultra low supply current can be realized with the chip enable function. The packages for these ICs are DFN1616-6B and DFN(PL)1820-6 which are suitable for high density mounting of the ICs on boards. SOT-89-5, HSOP-6J and TO-252-5-P2 with high power dissipation are also available. FEATURES • • • • • • • • • • • • • • • • • Output Current ............................................................ Min. 1A Supply Current ............................................................. Typ. 65µA Standby Current ......................................................... Typ. 0.15µA Input Voltage Range ................................................... 1.6V to 6.5V Output Voltage Range .................................................. 0.8V to 5.5V (1)(0.1V steps) Dropout Voltage............................................................ Typ. 0.5V (VOUT=2.8V, IOUT=1A) Ripple Rejection ........................................................... Typ. 70dB (f=1kHz, VOUT=2.8V) Output Voltage Accuracy .............................................. ±1.0% Temperature-Drift Coefficient of Output Voltage .......... Typ. ±100ppm/°C Line Regulation ............................................................ Typ. 0.05%/V Load Regulation ......................................................... Typ. 20mV at IOUT=300mA, Typ. 80mV at IOUT=1A Packages .................................................................... DFN1616-6B, DFN(PL)1820-6, SOT-89-5, HSOP-6J, TO-252-5-P2 Built-in Inrush current limit circuit ............................... Typ. 500mA Built-in Fold-Back Protection Circuit ........................... Typ. 250mA (Current at short mode) Built-in Thermal Shutdown Circuit .............................. Thermal Shutdown Temperature ; Typ. 165°C Released Temperature ; Typ. 135°C Built-in Auto Discharge Function ................................ D version Ceramic capacitors are recommended to be used with this IC .... 2.2µF or more (VOUT≤3.6V) 4.7µF or more (VOUT>3.6V) APPLICATIONS • • • • • (1) Power source for battery-powered equipment. Power source for portable communication equipment. Power source for electrical appliances such as cameras, VCRs and camcorders. Power source for Notebook PC. Power source for home appliances. For other voltages, please refer to MARK INFORMATIONS. RP131L(DFN1616-6B) is the discontinued product as of April,2023 RP131x NO.EA-174-230801 SELECTION GUIDE The output voltage, auto discharge function, package for the ICs can be selected at the user’s request. Product Name Package Quantity per Reel Pb Free Halogen Free RP131Lxx1∗-TR DFN1616-6B 5,000 pcs Yes Yes RP131Kxx1∗-TR DFN(PL)1820-6 5,000 pcs Yes Yes RP131Hxx1∗-T1-FE SOT-89-5 1,000 pcs Yes Yes RP131Sxx1∗-E2-FE HSOP-6J 1,000 pcs Yes Yes RP131Jxx1∗-T1-FE TO-252-5-P2 3,000 pcs Yes Yes xx : The output voltage can be designated in the range from 0.8V(08) to 5.5V(55) in 0.1V steps. (For other voltages, please refer to MARK INFORMATIONS.) ∗ : The auto discharge function at off state are options as follows. (1) (B) without auto discharge function at off state (D) with auto discharge function at off state BLOCK DIAGRAMS RP131xxx1B VDD RP131xxx1D VOUT VDD Vref Vref Current Limit Thermal Shutdown CE (1) VOUT Current Limit Thermal Shutdown GND CE GND Auto-discharge function quickly lowers the output voltage to 0V, when the chip enable signal is switched from the active mode to the standby mode, by releasing the electrical charge accumulated in the external capacitor. 2 RP131L(DFN1616-6B) is the discontinued product as of April,2023 RP131x NO.EA-174-230801 PIN DESCRIPTIONS Top View 6 Bottom View 4 4 5 5 Top View 6 6 5 Bottom View 4 4 3 3 2 2 1 1 2 DFN1616-6B 5 1 2 6 2 1 ∗ ∗ 1 5 3 3 DFN(PL)1820-6 4 6 5 4 3 1 2 3 1 SOT-89-5 HSOP-6J 2 3 4 5 TO-252-5-P2 ∗Tab is GND level. (They are connected to the reverse side of this IC.) The tab is better to be connected to the GND, but leaving it open is also acceptable. RP131L (DFN1616-6B) Pin Description (1) Pin No. Symbol Pin Description 1 VOUT Output Pin (1) 2 VOUt Output Pin(1) 3 GND Ground Pin 4 CE 5 VDD Input Pin(1) 6 VDD Input Pin(1) Chip Enable Pin ("H" Active) When you use this IC, please make sure be wired with 1pin with 2pin and 5pin with 6pin. 3 RP131L(DFN1616-6B) is the discontinued product as of April,2023 RP131x NO.EA-174-230801 RP131K (DFN(PL)1820-6) Pin Description Pin No. Symbol Pin Description Pin (1) 1 VOUT Output 2 VOUT Output Pin(1) 3 GND Ground Pin 4 CE 5 VDD Input Pin(1) 6 VDD Input Pin(1) Chip Enable Pin ("H" Active) 1 RP131H (SOT-89-5) Pin Description Pin No. Symbol 1 NC 2 GND 3 CE 4 VDD 5 VOUT Pin Description No Connection Ground Pin Chip Enable Pin ("H" Active) Input Pin Output Pin RP131S (HSOP-6J) Pin Description Pin No. Symbol Pin Description 1 VOUT Output Pin 2 GND Ground Pin (2) 3 NC No Connection 4 CE Chip Enable Pin ("H" Active) 5 GND Ground Pin(2) 6 VDD Input Pin RP131J (TO-252-5-P2) Pin Description Pin No. Symbol Pin Description 1 VOUT Output Pin 2 GND Ground Pin (3) 3 GND Ground Pin(3) 4 CE Chip Enable Pin ("H" Active) 5 VDD Input Pin When you use this IC, please make sure be wired with 1pin with 2pin and 5pin with 6pin. When you use this IC, please make sure be wired with 2pin and 5pin. (3) When you use this IC, please make sure be wired with 2pin and 3pin. (1) (2) 4 RP131L(DFN1616-6B) is the discontinued product as of April,2023 RP131x NO.EA-174-230801 ABSOLUTE MAXIMUM RATINGS Symbol Item VIN Input Voltage VCE Input Voltage (CE Pin) VOUT Output Voltage PD Power Dissipation (1) Rating Unit 7.0 V −0.3 to 7.0 V −0.3 to VIN+0.3 V DFN1616-6B, JEDEC STD.51-7 2400 DFN(PL)1820-6, JEDEC STD.51-7 2200 SOT-89-5, JEDEC STD.51-7 2600 HSOP-6J, JEDEC STD.51-7 2700 TO-252-5-P2, JEDEC STD.51-7 3800 mW Tj Junction Temperature Range −40 to 125 °C Tstg Storage Temperature Range −55 to 125 °C ABSOLUTE MAXIMUM RATINGS Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause the permanent damages and may degrade the life time and safety for both device and system using the device in the field. The functional operation at or over these absolute maximum ratings is not assured. RECOMMENDED OPERATING CONDITIONS Symbol VIN Ta Item Input Voltage Operating Temperature Range Rating 1.6 to 6.5 −40 to 85 Unit V °C RECOMMENDED OPERATING CONDITIONS All of electronic equipment should be designed that the mounted semiconductor devices operate within the recommended operating conditions. The semiconductor devices cannot operate normally over the recommended operating conditions, even if when they are used over such ratings by momentary electronic noise or surge. And the semiconductor devices may receive serious damage when they continue to operate over the recommended operating conditions. (1) Refer to POWER DISSIPATION for detailed information. 5 RP131L(DFN1616-6B) is the discontinued product as of April,2023 RP131x NO.EA-174-230801 ELECTRICAL CHARACTERISTICS VIN=Set VOUT+1V, IOUT=1mA The specification in is checked and guaranteed by design engineering at −40°C≤Ta≤85°C, unless otherwise noted. RP131xxx1B/D Symbol (Ta = 25°C) Item Conditions Ta = 25°C VOUT Output Voltage −40°C ≤ Ta t≤ 85°C Typ. Max. Unit VOUT>1.5V ×0.99 ×1.01 V VOUT≤1.5V −15 15 mV VOUT>1.5V ×0.974 ×1.018 V VOUT≤1.5V −40 27 mV 0.1mA ≤ IOUT ≤ 300mA 20 40 0.1mA ≤ IOUT ≤ 1A 80 120 65 90 µA VCE=0V, VIN=6.5V 0.15 0.60 µA Line Regulation Set VOUT+0.5V ≤ VIN ≤ 6.5V ∗However, VIN ≥ 1.6V 0.05 0.1 %/V Ripple Rejection f=1kHz Ripple 0.2Vp-p IOUT=100mA ∆VOUT/ ∆IOUT Load Regulation VDIF Dropout Voltage ISS Supply Current IOUT=0mA Istandby Standby Current ∆VOUT/ ∆VIN RR Min. VIN Input Voltage ILIM Output Current Limit mV Refer to the following table (VIN=6.5V) VOUT≤3.3V 70 dB VOUT>3.3V 60 1.6 6.5 1 V A Output Voltage Temperature Coefficient −40°C≤Ta≤85°C ±100 ppm /°C ISC Short Current Limit VOUT=0V 250 mA IPD CE Pull-down Current 0.3 µA VCEH CE Input Voltage "H" VCEL CE Input Voltage "L" ∆VOUT/ ∆Ta en TTSD TTSR RLOW Output Noise Thermal Shutdown Temperature Thermal Shutdown Released Temperature Low Output Nch Tr. ON Resistance (of D version) 1.0 V 0.4 V BW=10Hz to 100kHz, IOUT=1mA 45 µVrms Junction Temperature 165 °C Junction Temperature 135 °C VIN=4.0V, VCE=0V 30 Ω All test items listed under Electrical Characteristics are done under the pulse load condition (Tj≈Ta = 25°C) except for Output Noise, Ripple Rejection, Output Voltage Temperature Coefficient, Dropout Voltage at 1A Output Current and Thermal Shutdown items. 6 RP131L(DFN1616-6B) is the discontinued product as of April,2023 RP131x NO.EA-174-230801 The specification in otherwise noted. is checked and guaranteed by design engineering at −40°C ≤ Ta ≤ 85°C, unless Dropout Voltage Output Voltage VOUT (V) (Ta = 25°C) Dropout Voltage Typ. Max. Typ. Max. 0.8 ≤ VOUT < 0.9 0.600 0.780 1.100 1.650 0.9 ≤ VOUT < 1.0 0.550 0.690 1.050 1.500 1.0 ≤ VOUT < 1.1 0.450 0.610 1.000 1.450 0.340 0.540 0.930 1.420 0.290 0.500 0.900 1.380 1.5 ≤ VOUT < 2.6 0.230 0.310 0.700 1.100 2.6 ≤ VOUT < 3.3 0.150 0.180 0.500 0.750 3.3 ≤ VOUT ≤ 5.5 0.140 0.170 0.450 0.650 1.1 ≤ VOUT < 1.2 1.2 ≤ VOUT < 1.5 Condition VDIF (V) IOUT=300mA Condition IOUT=1A 7 RP131L(DFN1616-6B) is the discontinued product as of April,2023 RP131x NO.EA-174-230801 APPLICATION INFORMATION Typical Application Circuits VOUT VDD VOUT RP131x Series CIN CE COUT GND CE Control Recommendation value of the external capacitors VOUT VOUT ≤ 3.6V VOUT > 3.6V Capacitors CIN COUT CIN COUT Kyocera 2.2µF (size:1005) Kyocera 2.2µF (size:1608) Kyocera 2.2µF (size:1608) Kyocera 4.7µF (size:1608) [CM05X5R225M06AB] [CM105X5R225K06AB] [CM105X5R225K06AB] [CM105X5R475M06AB] Technical Notes on the External Components When using this IC, consider following points: Phase Compensation In these ICs, phase compensation is made for securing stable operation even if the load current is varied. For this purpose, use a capacitor COUT with good frequency characteristics and ESR (Equivalent Series Resistance). If a tantalum capacitor is used, and its ESR of COUT is large, the loop oscillation may result. Because of this, select COUT carefully considering its frequency characteristics. PCB Layout Make VDD and GND lines sufficient. If their impedance is high, noise pickup or unstable operation may result. Connect a capacitor CIN between VDD and GND pin with a capacitance value as "Recommendation value of the external capacitors" above or more, and as close as possible to the pins. Set external components, especially the output capacitor COUT, as close as possible to the ICs, and make wiring as short as possible. 8 RP131L(DFN1616-6B) is the discontinued product as of April,2023 RP131x NO.EA-174-230801 TEST CIRCUITS VDD VOUT RP131x Series CIN CE COUT V VOUT IOUT GND CE Control Basic Test Circuit VOUT VDD VOUT A RP131x Series CIN ISS CE COUT GND CE Control Test Circuit for Supply Current Pulse Generator VDD VOUT RP131x Series P.G. CE CE Control COUT IOUT GND Test Circuit for Ripple Rejection VOUT VDD VOUT RP131x Series CIN CE Control CE COUT GND IOUTa IOUTb Test Circuit for Load Transient Response 9 RP131L(DFN1616-6B) is the discontinued product as of April,2023 RP131x NO.EA-174-230801 TYPICAL CHARACTERISTICS Typical Characteristics are intended to be used as reference data; they are not guaranteed. 1) Output Voltage vs. Output Current (Ta = 25°C) RP131x081x RP131x331x RP131x151x RP131x501x 2) Output Voltage vs. Input Voltage (Ta=25°C) RP131x081x RP131x151x 10 RP131L(DFN1616-6B) is the discontinued product as of April,2023 RP131x NO.EA-174-230801 RP131x331x RP131x501x 3) Supply Current vs. Input Voltage (Ta=25°C) RP131x081x RP131x151x RP131x331x RP131x501x 11 RP131L(DFN1616-6B) is the discontinued product as of April,2023 RP131x NO.EA-174-230801 4) Output Voltage vs. Temperature RP131x081x RP131x281x RP131x331x RP131x501x 5) Supply Current vs. Temperature RP131x081x RP131x151x 12 RP131L(DFN1616-6B) is the discontinued product as of April,2023 RP131x NO.EA-174-230801 RP131x331x RP131x501x 6) Dropout Voltage vs. Output Current RP131x081x RP131x151x RP131x331x RP131x501x 13 RP131L(DFN1616-6B) is the discontinued product as of April,2023 RP131x NO.EA-174-230801 7) Dropout Voltage vs. Set Output Voltage 8) Ripple Rejection vs. Input Bias Voltage (C1=none, C2=Ceramic 1.0µF, Ripple=0.2Vp-p, Ta=25°C) RP131x331x RP131x331x RP131x331x RP131x501x 14 RP131L(DFN1616-6B) is the discontinued product as of April,2023 RP131x NO.EA-174-230801 RP131x501x RP131x501x 9) Ripple Rejection vs. Frequency (C1=none, C2=Ceramic 4.7µF, Ta=25°C) RP131x081x RP131x151x RP131x331x RP131x501x 15 RP131L(DFN1616-6B) is the discontinued product as of April,2023 RP131x NO.EA-174-230801 10) Input Transient Response (IOUT=100mA, tr=tf=5µs, C1=none, Ta=25°C) RP131x081x RP131x151x RP131x331x RP131x501x 11) Load Transient Response (tr=tf=0.5µs, C1=Ceramic 2.2µF, VIN=VOUT+1.0V, Topt=25°C) RP131x081x RP131x151x 16 RP131L(DFN1616-6B) is the discontinued product as of April,2023 RP131x NO.EA-174-230801 RP131x331x RP131x501x RP131x081x RP131x151x RP131x331x RP131x501x 17 RP131L(DFN1616-6B) is the discontinued product as of April,2023 RP131x NO.EA-174-230801 RP131x081x RP131x151x RP131x331x RP131x501x 12) Turn On Speed with CE pin (C1=Ceramic 2.2µF, C2=Ceramic 4.7µF, Topt=25°C) RP131x081x RP131x501x 18 RP131L(DFN1616-6B) is the discontinued product as of April,2023 RP131x NO.EA-174-230801 13) Turn Off Speed with CE pin (D Version) (C1=Ceramic 2.2µF, C2=Ceramic 4.7µF, Ta=25°C) RP131x081D RP131x501D 14) Inrush Current at turning on (C1=Ceramic 2.2µF, C2=Ceramic 4.7µF, Topt=25°C) RP131x081x RP131x501x 15) Minimum Operating Voltage RP131x081x Hatched area is available for 0.8V output. 19 RP131L(DFN1616-6B) is the discontinued product as of April,2023 RP131x NO.EA-174-230801 ESR vs. Output Current When using these ICs, consider the following points: The relations between IOUT (Output Current) and ESR of an output capacitor are shown below. The conditions when the white noise level is under 40µV (Avg.) are marked as the hatched area in the graph. Measurement conditions Frequency Band : 10Hz to 3MHz Temperature : −40°C to 85°C C1 : 2.2µF (Kyocera, CM05X5R225M04AD) C2 : 2.2µF (Kyocera, CM105X5R225K06AE) 4.7µF (Kyocera, CM105X5R475M06AB) RP131x081x RP131x151x RP131x331x RP131x501x 20 RP131L(DFN1616-6B) is the discontinued product as of April,2023 POWER DISSIPATION DFN1616-6B PD-DFN1616-6B-(85125150)-JE-B The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following measurement conditions are based on JEDEC STD. 51. Measurement Conditions Item Measurement Conditions Environment Mounting on Board (Wind Velocity = 0 m/s) Board Material Glass Cloth Epoxy Plastic (Four-Layer Board) Board Dimensions 76.2 mm × 114.3 mm × 0.8 mm Copper Ratio Outer Layer (First Layer): Less than 95% of 50 mm Square Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square Through-holes  0.2 mm × 25 pcs Measurement Result (Ta = 25°C, Tjmax = 125°C) Item Measurement Result Power Dissipation 2400 mW Thermal Resistance (ja) ja = 41°C/W Thermal Characterization Parameter (ψjt) ψjt = 11°C/W ja: Junction-to-Ambient Thermal Resistance ψjt: Junction-to-Top Thermal Characterization Parameter 4000 Power Dissipation (mW) 3500 3000 2500 2400 2000 1500 1000 500 0 0 25 50 75 85 100 Ambient Temperature (°C) 125 150 Power Dissipation vs. Ambient Temperature Measurement Board Pattern The above graph shows the power dissipation of the package at Tjmax = 125°C and Tjmax = 150°C. Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of use and the total years of use must be limited as follows: Total Hours of Use 13,000 hours Total Years of Use (4 hours/day) 9 years i RP131L(DFN1616-6B) is the discontinued product as of April,2023 DFN1616-6B PACKAGE DIMENSIONS Ver. A  1.30r0.05 (3X0.15) B 0.70r0.05 X4 1.60 0.05 4 6 0.25r0.05 1.60 A INDEX 0.4max. 0.1r0.05 3 0.5 0.20r0.05 1 0.05 M AB Bottom View S 0.05 S DFN1616-6B Package Dimensions (Unit: mm) * The tab on the bottom of the package shown by blue circle is a substrate potential (GND). It is recommended that this tab be connected to the ground plane pin on the board but it is possible to leave the tab floating. i RP131L(DFN1616-6B) is the discontinued product as of April,2023 POWER DISSIPATION DFN(PL)1820-6 PD-DFN(PL)1820-6-(85125150)-JE-B The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following measurement conditions are based on JEDEC STD. 51. Measurement Conditions Item Environment Board Material Board Dimensions Measurement Conditions Mounting on Board (Wind Velocity = 0 m/s) Glass Cloth Epoxy Plastic (Four-Layer Board) 76.2 mm × 114.3 mm × 0.8 mm Outer Layer (First Layer): Less than 95% of 50 mm Square Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square  0.2 mm × 36 pcs Copper Ratio Through-holes Measurement Result (Ta = 25°C, Tjmax = 125°C) Item Measurement Result Power Dissipation Thermal Resistance (ja) Thermal Characterization Parameter (ψjt) 2200 mW ja = 45°C/W ψjt = 18°C/W ja: Junction-to-Ambient Thermal Resistance ψjt: Junction-to-Top Thermal Characterization Parameter 3000 Power Dissipation (mW) 2700 2500 2700 2000 2200 1500 1000 500 0 0 25 50 75 85 100 Ambient Temperature (°C) 125 150 Power Dissipation vs. Ambient Temperature Measurement Board Pattern The above graph shows the power dissipation of the package at Tjmax = 125°C and Tjmax = 150°C. Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of use and the total years of use must be limited as follows: Total Hours of Use 13,000 hours Total Years of Use (4 hours/day) 9 years i RP131L(DFN1616-6B) is the discontinued product as of April,2023 PACKAGE DIMENSIONS DFN(PL)1820-6 Ver. A 1.6r0.1 A 1.80 0.20r0.1 B 5 4 6 2.00 1.0r0.1 ͤ INDEX 0.6MAX. 3 0.05 S 0.05min S 0.25r0.1 0.25r0.1 X4 0.05 0.05 M AB 0.5 2 1 0.1NOM. 0.3r0.1 Bottom View DFN(PL)1820-6 Package Dimensions (Unit: mm) * The tab on the bottom of the package is substrate level (GN'). It is recommended that the tab be connected to the ground plane on the board, or otherwise be left floating. i RP131L(DFN1616-6B) is the discontinued product as of April,2023 POWER DISSIPATION SOT-89-5 Ver. A The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following measurement conditions are based on JEDEC STD. 51-7. Measurement Conditions Item Environment Board Material Board Dimensions Copper Ratio Through-holes Measurement Conditions Mounting on Board (Wind Velocity = 0 m/s) Glass Cloth Epoxy Plastic (Four-Layer Board) 76.2 mm × 114.3 mm × 0.8 mm Outer Layer (First Layer): Less than 95% of 50 mm Square Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square I 0.3 mm × 13 pcs Measurement Result (Ta = 25°C, Tjmax = 125°C) Item Measurement Result Power Dissipation Thermal Resistance (Tja) Thermal Characterization Parameter (ȥjt) 2600 mW Tja = 38°C/W ȥjt = 13°C/W Tja: Junction-to-Ambient Thermal Resistance ȥjt: Junction-to-Top Thermal Characterization Parameter 4000 Power Dissipation (mW) 3500 3200 3000 2200 22 2 220 200 00 2500 2600 2000 1500 1000 500 0 㻜 㻞㻡 㻡㻜 㻣㻡 85 㻝㻜㻜 㻝㻞㻡 㻝㻡㻜 Ambient Temperature (°C) Power Dissipation vs. Ambient Temperature Measurement Board Pattern The above graph shows the power dissipation of the package at Tjmax = 125°C and Tjmax = 150°C. Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of use and the total years of use must be limited as follows: Total Hours of Use Total Years of Use (4 hours/day) 13,000 hours 9 years i RP131L(DFN1616-6B) is the discontinued product as of April,2023 627 PACKAGE DIMENSIONS Ver. A 4.5±0.1 1.5±0.1 0.4±0.3 2 5 4.35±0.1 ȭ1.0 1 4 4 2.5±0.1 1.00±0.2 5 0.4±0.1 0.3±0.2 0.42±0.1 0.1 S 3 0.4±0.1 3 2 1 0.3±0.2 1.6±0.2 S 0.42±0.1 0.42±0.1 0.47±0.1 1.5±0.1 1.5±0.1 627 Package Dimensions i RP131L(DFN1616-6B) is the discontinued product as of April,2023 POWER DISSIPATION HSOP-6J Ver. A The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following measurement conditions are based on JEDEC STD. 51-7. Measurement Conditions Item Environment Board Material Board Dimensions Copper Ratio Through-holes Measurement Conditions Mounting on Board (Wind Velocity = 0 m/s) Glass Cloth Epoxy Plastic (Four-Layer Board) 76.2 mm × 114.3 mm × 0.8 mm Outer Layer (First Layer): Less than 95% of 50 mm Square Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square I 0.3 mm × 28 pcs Measurement Result (Ta = 25°C, Tjmax = 125°C) Item Measurement Result Power Dissipation Thermal Resistance (Tja) Thermal Characterization Parameter (ȥjt) 2700 mW Tja = 37°C/W ȥjt = 7°C/W Tja: Junction-to-Ambient Thermal Resistance ȥjt: Junction-to-Top Thermal Characterization Parameter 4000 3400 Power Dissipation (mW) 3500 3000 2500 2700 2000 1500 1000 500 0 㻜 㻞㻡 㻡㻜 㻣㻡 85 㻝㻜㻜 㻝㻞㻡 㻝㻡㻜 Ambient Temperature (°C) Power Dissipation vs. Ambient Temperature Measurement Board Pattern The above graph shows the power dissipation of the package at Tjmax = 125°C and Tjmax = 150°C. Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of use and the total years of use must be limited as follows: Total Hours of Use Total Years of Use (4 hours/day) 13,000 hours 9 years i RP131L(DFN1616-6B) is the discontinued product as of April,2023 +623- PACKAGE DIMENSIONS Ver. A +623- Package Dimensions i RP131L(DFN1616-6B) is the discontinued product as of April,2023 POWER DISSIPATION T2--5 Ver. A The power dissipation of the package is dependent on PCB material, layout, and environmental conditions. The following measurement conditions are based on JEDEC STD. 51-7. Measurement Conditions Item Environment Measurement Conditions Mounting on Board (Wind Velocity = 0 m/s) Board Material Board Dimensions Glass Cloth Epoxy Plastic (Four-Layer Board) 76.2 mm × 114.3 mm × 0.8 mm Outer Layer (First Layer): Less than 95% of 50 mm Square Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square I 0.3 mm × 21 pcs Copper Ratio Through-holes Measurement Result Item (Ta = 25°C, Tjmax = 125°C) Measurement Result Power Dissipation Thermal Resistance (Tja) 3800 mW Tja = 26°C/W Thermal Characterization Parameter (ȥjt) ȥjt = 7°C/W Tja: Junction-to-Ambient Thermal Resistance ȥjt: Junction-to-Top Thermal Characterization Parameter 4800 Power Dissipation (mW) 5000 4000 3800 3000 2000 1000 0 㻜 㻞㻡 㻡㻜 㻣㻡 85 㻝㻜㻜 㻝㻞㻡 㻝㻡㻜 Ambient Temperature (°C) Power Dissipation vs. Ambient Temperature Measurement Board Pattern The above graph shows the power dissipation of the package at Tjmax = 125°C and Tjmax = 150°C. Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of use and the total years of use must be limited as follows: Total Hours of Use Total Years of Use (4 hours/day) 13,000 hours 9 years i RP131L(DFN1616-6B) is the discontinued product as of April,2023 PACKAGE DIMENSIONS 723 Ver. A 723 Package Dimensions The tab on the bottom of the package shown by blue circle is a substrate potential (GND). It is recommended thatthis tab be connected to the ground plane on the board but it is possible to leave the tab floating. i 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. The products and the product specifications described in this document are subject to change or discontinuation of production without notice for reasons such as improvement. Therefore, before deciding to use the products, please refer to our sales representatives for the latest information thereon. The materials in this document may not be copied or otherwise reproduced in whole or in part without the prior written consent of us. This product and any technical information relating thereto are subject to complementary export controls (so-called KNOW controls) under the Foreign Exchange and Foreign Trade Law, and related politics ministerial ordinance of the law. (Note that the complementary export controls are inapplicable to any application-specific products, except rockets and pilotless aircraft, that are insusceptible to design or program changes.) Accordingly, when exporting or carrying abroad this product, follow the Foreign Exchange and Foreign Trade Control Law and its related regulations with respect to the complementary export controls. The technical information described in this document shows typical characteristics and example application circuits for the products. The release of such information is not to be construed as a warranty of or a grant of license under our or any third party's intellectual property rights or any other rights. The products listed in this document are intended and designed for use as general electronic components in standard applications (office equipment, telecommunication equipment, measuring instruments, consumer electronic products, amusement equipment etc.). Those customers intending to use a product in an application requiring extreme quality and reliability, for example, in a highly specific application where the failure or misoperation of the product could result in human injury or death should first contact us. • Aerospace Equipment • Equipment Used in the Deep Sea • Power Generator Control Equipment (nuclear, steam, hydraulic, etc.) • Life Maintenance Medical Equipment • Fire Alarms / Intruder Detectors • Vehicle Control Equipment (automotive, airplane, railroad, ship, etc.) • Various Safety Devices • Traffic control system • Combustion equipment In case your company desires to use this product for any applications other than general electronic equipment mentioned above, make sure to contact our company in advance. Note that the important requirements mentioned in this section are not applicable to cases where operation requirements such as application conditions are confirmed by our company in writing after consultation with your company. We are making our continuous effort to improve the quality and reliability of our products, but semiconductor products are likely to fail with certain probability. In order to prevent any injury to persons or damages to property resulting from such failure, customers should be careful enough to incorporate safety measures in their design, such as redundancy feature, fire containment feature and fail-safe feature. We do not assume any liability or responsibility for any loss or damage arising from misuse or inappropriate use of the products. The products have been designed and tested to function within controlled environmental conditions. Do not use products under conditions that deviate from methods or applications specified in this datasheet. Failure to employ the products in the proper applications can lead to deterioration, destruction or failure of the products. We shall not be responsible for any bodily injury, fires or accident, property damage or any consequential damages resulting from misuse or misapplication of the products. Quality Warranty 8-1. Quality Warranty Period In the case of a product purchased through an authorized distributor or directly from us, the warranty period for this product shall be one (1) year after delivery to your company. For defective products that occurred during this period, we will take the quality warranty measures described in section 8-2. However, if there is an agreement on the warranty period in the basic transaction agreement, quality assurance agreement, delivery specifications, etc., it shall be followed. 8-2. Quality Warranty Remedies When it has been proved defective due to manufacturing factors as a result of defect analysis by us, we will either deliver a substitute for the defective product or refund the purchase price of the defective product. Note that such delivery or refund is sole and exclusive remedies to your company for the defective product. 8-3. Remedies after Quality Warranty Period With respect to any defect of this product found after the quality warranty period, the defect will be analyzed by us. On the basis of the defect analysis results, the scope and amounts of damage shall be determined by mutual agreement of both parties. Then we will deal with upper limit in Section 8-2. This provision is not intended to limit any legal rights of your company. Anti-radiation design is not implemented in the products described in this document. The X-ray exposure can influence functions and characteristics of the products. Confirm the product functions and characteristics in the evaluation stage. WLCSP products should be used in light shielded environments. The light exposure can influence functions and characteristics of the products under operation or storage. Warning for handling Gallium and Arsenic (GaAs) products (Applying to GaAs MMIC, Photo Reflector). These products use Gallium (Ga) and Arsenic (As) which are specified as poisonous chemicals by law. For the prevention of a hazard, do not burn, destroy, or process chemically to make them as gas or power. When the product is disposed of, please follow the related regulation and do not mix this with general industrial waste or household waste. Please contact our sales representatives should you have any questions or comments concerning the products or the technical information. Official website https://www.nisshinbo-microdevices.co.jp/en/ Purchase information https://www.nisshinbo-microdevices.co.jp/en/buy/