0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
会员中心
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
BZT52C2V0

BZT52C2V0

  • 厂商:

    MSKSEMI(美森科)

  • 封装:

    SOD123

  • 描述:

    稳压二极管 Vz=2V 1.8V~2.15V Izt=5mA P=500mW SOD123

  • 数据手册
  • 价格&库存
BZT52C2V0 数据手册
BZT52Cxxx Product specification BZT52Cxxx Reference News FEATURES PACKAGE OUTLINE  Planar Die Construction  Ultra-Small Surface Mount Package  General purpose, Medium Current  Ideally Suited for Automated AssemblyProcesses PIN CONFIGURATION SOD-123 Maximum Ratings & Thermal Characteristics (Ratings at 25℃ ambient temperature unless otherwise specified.) Symbol Parameters Power Dissipation Pd 500 Forward Voltage @IF= 10mA Vf 0.9 Storage temperature range Ts -65-+150 ℃ RthA 400 K/W Thermal resistance junction to ambient air Warmewiderstand Sperrschicht –umgebende Luft 1) 2) 3) Unit Value mW 1) V 2) 1) Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with pad areas 25mm² Short duration test pulse used to minimize self-heating effect f= 1KHz Electrical Characteristics (Ratings at 25℃ ambient temperature unless otherwise specified). Zener Voltage Range Device Marking Vz@ Izt Izt Nom(V) Min(V) Max(V) mA Maximum Zener Impedance Zzk Zzt @Izk @Izt Ω Izk IR VR mA uA V Min Max mA 3) Maximum Reverse Current Typical Temperature coefficent @ IZTC= mV/ ℃ Test Current IZTC BZT52C2V0 WY 2.0 1.80 2.15 5 150 600 1.0 100 1.0 -3.5 0 5 BZT52C2V4 WX 2.4 2.2 2.6 5 100 600 1.0 50 1.0 -3.5 0 5 BZT52C2V7 W1 2.7 2.5 2.9 5 100 600 1.0 20 1.0 -3.5 0 5 BZT52C3V0 W2 3.0 2.8 3.2 5 95 600 1.0 10 1.0 -3.5 0 5 BZT52C3V3 W3 3.3 3.1 3.5 5 95 600 1.0 5 1.0 -3.5 0 5 BZT52C3V6 W4 3.6 3.4 3.8 5 90 600 1.0 5 1.0 -3.5 0 5 BZT52C3V9 W5 3.9 3.7 4.1 5 90 600 1.0 3 1.0 -3.5 0 5 BZT52C4V3 W6 4.3 4.0 4.6 5 90 600 1.0 3 1.0 -3.5 0 5 BZT52C4V7 W7 4.7 4.4 5.0 5 80 500 1.0 3 2.0 -3.5 0.2 5 BZT52C5V1 W8 5.1 4.8 5.4 5 60 480 1.0 2 2.0 -2.7 1.2 5 BZT52C5V6 W9 5.6 5.2 6.0 5 40 400 1.0 1 2.0 -2.0 2.5 5 BZT52C6V2 WA 6.2 5.8 6.6 5 10 150 1.0 3 4.0 0.4 3.7 5 BZT52C6V8 WB 6.8 6.4 7.2 5 15 80 1.0 2 4.0 1.2 4.5 5 BZT52C7V5 WC 7.5 7.0 7.9 5 15 80 1.0 1 5.0 2.5 5.3 5 BZT52C8V2 WD 8.2 7.7 8.7 5 15 80 1.0 0.7 5.0 3.2 6.2 5 BZT52C9V1 WE 9.1 8.5 9.6 5 15 100 1.0 0.5 6.0 3.8 7.0 5 BZT52C10 WF 10 9.4 10.6 5 20 150 1.0 0.2 7.0 4.5 8.0 5 Copyright© Msksemi Incorporated www.msksemi.com BZT52Cxxx Maximum Zener Impedance Zener Voltage Range Device Marking Vz@ Izt Izt Nom(V) Min(V) Max(V) mA Zzk @Izk Zzt @Izt Ω Maximum Reverse Current Typical Temperature coefficent @ IZTC= mV/ ℃ Test Current IZTC Izk IR VR mA uA V Min Max mA BZT52C11 WG 11 10.4 11.6 5 20 150 1.0 0.1 8.0 5.4 9.0 5 BZT52C12 WH 12 11.4 12.7 5 25 150 1.0 0.1 8.0 6.0 10.0 5 BZT52C13 WI 13 12.4 14.1 5 30 170 1.0 0.1 8.0 7.0 11.0 5 BZT52C15 WJ 15 13.8 15.6 5 30 200 1.0 0.1 10.5 9.2 13.0 5 BZT52C16 WK 16 15.3 17.1 5 40 200 1.0 0.1 11.2 10.4 14.0 5 BZT52C18 WL 18 16.8 19.1 5 45 225 1.0 0.1 12.6 12.4 16.0 5 BZT52C20 WM 20 18.8 21.2 5 55 225 1.0 0.1 14.0 14.4 18.0 5 BZT52C22 WN 22 20.8 23.3 5 55 250 1.0 0.1 15.4 16.4 20.0 5 BZT52C24 WO 24 22.8 25.6 5 70 250 1.0 0.1 16.8 18.4 22.0 5 BZT52C27 WP 27 25.1 28.9 2 80 300 0.5 0.1 18.9 21.4 25.3 2 BZT52C30 WQ 30 28.0 32.0 2 80 300 0.5 0.1 21.0 24.4 29.4 2 BZT52C33 WR 33 31.0 35.0 2 80 325 0.5 0.1 23.1 27.4 33.4 2 BZT52C36 WS 36 34.0 38.0 2 90 350 0.5 0.1 25.2 30.4 37.4 2 BZT52C39 WT 39 37.0 41.0 2 130 350 0.5 0.1 27.3 33.4 41.2 2 BZT52C43 WU 43 40.0 46.0 2 100 700 1.0 0.1 32.0 10.0 12.0 5 BZT52C47 WV 47 44.0 50.0 2 100 750 1.0 0.1 35.0 10.0 12.0 5 BZT52C51 WW 51 48.0 54.0 2 125 750 1.0 0.1 38.0 10.0 12.0 5 BZT52C56 XW 56 52.0 60.0 2 135 700 1.0 0.1 39.0 10.0 12.0 5 BZT52C62 6E 62 58.0 66.0 2 200 1000 1.0 0.2 47.0 10.0 12.0 5 BZT52C68 6F 68 64.0 72.0 2 250 1000 1.0 0.2 52.0 10.0 12.0 5 BZT52C75 6H 75 70.0 79.0 2 300 1000 1.0 0.2 57 10.0 12.0 5 Breakdown characteristics at Tj=constant (pulsed) Forward characteristics Copyright© Msksemi Incorporated Admissible power dissipation versus ambient temperature www.msksemi.com BZT52Cxxx Pulse thermal resistance versus pulse duration Dynamic resistance versus Zener current Capacitance versus Zener voltage Dynamic resistance versus Zener current Dynamic resistance versus Zener current Copyright© Msksemi Incorporated Thermal differential resistance versus Zener voltage www.msksemi.com BZT52Cxxx Dynamic resistance versus Zener voltage Temperature dependence of Zener voltage versus Zener voltage Change of Zener voltage versus junction temperature Temperature dependence of Zener voltage versus Zener voltage Change of Zener voltage versus junction temperature Change of Zener voltge from turn-on up to the point of thermal equilibrium versus Zener voltage Copyright© Msksemi Incorporated www.msksemi.com BZT52Cxxx PACKAGE MECHANICAL DATA Symbol A A1 A2 b c D E E1 L L1 θ Dimensions In Millimeters Max Min 1.050 1.250 0.000 0.100 1.050 1.150 0.450 0.650 0.080 0.150 1.500 1.700 2.600 2.800 3.550 3.850 0.500 REF 0.250 0.450 0° 8° Dimensions In Inches Min Max 0.041 0.049 0.000 0.004 0.041 0.045 0.018 0.026 0.003 0.006 0.059 0.067 0.102 0.110 0.140 0.152 0.020 REF 0.010 0.018 0° 8° Note: 1.Controllng dlmenslon:in mlllmeters. 2.General tolerance:± 0.05mm. 3.The pad layout Is for reference purposes only. REEL SPECIFICATION P/N PKG QTY BZT52Cxxx SOD-123 3000 Copyright© Msksemi Incorporated www.msksemi.com BZT52Cxxx Attention ■ Any and all MSKSEMI Semiconductor products described or contained herein do not handle applications that require extremely high levels of reliability, such as life-support have specifications that can systems, aircraft's control systems, or other applications whose failure can be reasonably expected to result in serious physical and/or material damage. Consult with your MSKSEMI Semiconductor representative nearest you before using any MSKSEMI Semiconductor products described or contained herein in such applications. ■ MSKSEMI Semiconductor assumes no responsibility for equipment failures that result from using products at values that exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in products specificationsof any andall MSKSEMI Semiconductor products described orcontained herein. ■ Specifications of any and all MSKSEMI Semiconductor products described or contained herein stipulate the performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment. To verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test devices mounted in the customer’sproducts orequipment. ■ MSKSEMI Semiconductor. strives to supply high-quality high-reliability products. However, any and all semiconductor products fail with someprobability. It is possiblethat these probabilistic failures could give rise to accidents or events that could endanger human lives, that could give rise to smoke or fire, or that could cause damage to other property. When designing equipment, adopt safety measures so that these kinds of accidents or events cannot occur. Such measures include but are not limited to protective circuits anderror prevention circuitsfor safedesign, redundant design, and structural design. ■ In the event that any or all MSKSEMI Semiconductor products(including technical data, services) described or contained herein are controlled under any of applicable local export control laws and regulations, such products must not be exported without obtaining the export license from theauthorities concerned in accordance with the above law. ■ No part of this publication may be reproduced or transmitted in any form or by any means, electronic or mechanical, including photocopying and recording, or any information storage or retrieval system, or otherwise, without the prior written permission of MSKSEMI Semiconductor. ■ Information (including circuit diagrams and circuit parameters) herein is for example only ; it is not guaranteed for volume production. MSKSEMI Semiconductor believes information herein is accurate and reliable, but no guarantees are made or implied regarding its use or any infringementsof intellectual property rights or other rightsof third parties. ■ Any and all information described or contained herein are subject to change without notice due to product/technology improvement, etc. Whendesigning equipment, referto the "Delivery Specification" for the MSKSEMI Semiconductor productthat you intend to use. Copyright© Msksemi Incorporated www.msksemi.com
BZT52C2V0 价格&库存

很抱歉,暂时无法提供与“BZT52C2V0”相匹配的价格&库存,您可以联系我们找货

免费人工找货