BZT52Cxxx
Product specification
BZT52Cxxx
Reference News
FEATURES
PACKAGE OUTLINE
Planar Die Construction
Ultra-Small Surface Mount Package
General purpose, Medium Current
Ideally Suited for Automated AssemblyProcesses
PIN CONFIGURATION
SOD-123
Maximum Ratings & Thermal Characteristics (Ratings at 25℃ ambient temperature unless otherwise specified.)
Symbol
Parameters
Power Dissipation
Pd
500
Forward Voltage @IF= 10mA
Vf
0.9
Storage temperature range
Ts
-65-+150
℃
RthA
400
K/W
Thermal resistance junction to ambient air Warmewiderstand Sperrschicht
–umgebende Luft
1)
2)
3)
Unit
Value
mW
1)
V
2)
1)
Device mounted on ceramic PCB: 7.6mm x 9.4mm x 0.87mm with pad areas 25mm²
Short duration test pulse used to minimize self-heating effect
f= 1KHz
Electrical Characteristics (Ratings at 25℃ ambient temperature unless otherwise specified).
Zener Voltage Range
Device
Marking
Vz@ Izt
Izt
Nom(V)
Min(V)
Max(V)
mA
Maximum Zener
Impedance
Zzk
Zzt
@Izk
@Izt
Ω
Izk
IR
VR
mA
uA
V
Min
Max
mA
3)
Maximum
Reverse Current
Typical
Temperature
coefficent @
IZTC= mV/ ℃
Test
Current
IZTC
BZT52C2V0
WY
2.0
1.80
2.15
5
150
600
1.0
100
1.0
-3.5
0
5
BZT52C2V4
WX
2.4
2.2
2.6
5
100
600
1.0
50
1.0
-3.5
0
5
BZT52C2V7
W1
2.7
2.5
2.9
5
100
600
1.0
20
1.0
-3.5
0
5
BZT52C3V0
W2
3.0
2.8
3.2
5
95
600
1.0
10
1.0
-3.5
0
5
BZT52C3V3
W3
3.3
3.1
3.5
5
95
600
1.0
5
1.0
-3.5
0
5
BZT52C3V6
W4
3.6
3.4
3.8
5
90
600
1.0
5
1.0
-3.5
0
5
BZT52C3V9
W5
3.9
3.7
4.1
5
90
600
1.0
3
1.0
-3.5
0
5
BZT52C4V3
W6
4.3
4.0
4.6
5
90
600
1.0
3
1.0
-3.5
0
5
BZT52C4V7
W7
4.7
4.4
5.0
5
80
500
1.0
3
2.0
-3.5
0.2
5
BZT52C5V1
W8
5.1
4.8
5.4
5
60
480
1.0
2
2.0
-2.7
1.2
5
BZT52C5V6
W9
5.6
5.2
6.0
5
40
400
1.0
1
2.0
-2.0
2.5
5
BZT52C6V2
WA
6.2
5.8
6.6
5
10
150
1.0
3
4.0
0.4
3.7
5
BZT52C6V8
WB
6.8
6.4
7.2
5
15
80
1.0
2
4.0
1.2
4.5
5
BZT52C7V5
WC
7.5
7.0
7.9
5
15
80
1.0
1
5.0
2.5
5.3
5
BZT52C8V2
WD
8.2
7.7
8.7
5
15
80
1.0
0.7
5.0
3.2
6.2
5
BZT52C9V1
WE
9.1
8.5
9.6
5
15
100
1.0
0.5
6.0
3.8
7.0
5
BZT52C10
WF
10
9.4
10.6
5
20
150
1.0
0.2
7.0
4.5
8.0
5
Copyright© Msksemi Incorporated
www.msksemi.com
BZT52Cxxx
Maximum Zener
Impedance
Zener Voltage Range
Device
Marking
Vz@ Izt
Izt
Nom(V)
Min(V)
Max(V)
mA
Zzk
@Izk
Zzt
@Izt
Ω
Maximum
Reverse Current
Typical
Temperature
coefficent @
IZTC= mV/ ℃
Test
Current
IZTC
Izk
IR
VR
mA
uA
V
Min
Max
mA
BZT52C11
WG
11
10.4
11.6
5
20
150
1.0
0.1
8.0
5.4
9.0
5
BZT52C12
WH
12
11.4
12.7
5
25
150
1.0
0.1
8.0
6.0
10.0
5
BZT52C13
WI
13
12.4
14.1
5
30
170
1.0
0.1
8.0
7.0
11.0
5
BZT52C15
WJ
15
13.8
15.6
5
30
200
1.0
0.1
10.5
9.2
13.0
5
BZT52C16
WK
16
15.3
17.1
5
40
200
1.0
0.1
11.2
10.4
14.0
5
BZT52C18
WL
18
16.8
19.1
5
45
225
1.0
0.1
12.6
12.4
16.0
5
BZT52C20
WM
20
18.8
21.2
5
55
225
1.0
0.1
14.0
14.4
18.0
5
BZT52C22
WN
22
20.8
23.3
5
55
250
1.0
0.1
15.4
16.4
20.0
5
BZT52C24
WO
24
22.8
25.6
5
70
250
1.0
0.1
16.8
18.4
22.0
5
BZT52C27
WP
27
25.1
28.9
2
80
300
0.5
0.1
18.9
21.4
25.3
2
BZT52C30
WQ
30
28.0
32.0
2
80
300
0.5
0.1
21.0
24.4
29.4
2
BZT52C33
WR
33
31.0
35.0
2
80
325
0.5
0.1
23.1
27.4
33.4
2
BZT52C36
WS
36
34.0
38.0
2
90
350
0.5
0.1
25.2
30.4
37.4
2
BZT52C39
WT
39
37.0
41.0
2
130
350
0.5
0.1
27.3
33.4
41.2
2
BZT52C43
WU
43
40.0
46.0
2
100
700
1.0
0.1
32.0
10.0
12.0
5
BZT52C47
WV
47
44.0
50.0
2
100
750
1.0
0.1
35.0
10.0
12.0
5
BZT52C51
WW
51
48.0
54.0
2
125
750
1.0
0.1
38.0
10.0
12.0
5
BZT52C56
XW
56
52.0
60.0
2
135
700
1.0
0.1
39.0
10.0
12.0
5
BZT52C62
6E
62
58.0
66.0
2
200
1000
1.0
0.2
47.0
10.0
12.0
5
BZT52C68
6F
68
64.0
72.0
2
250
1000
1.0
0.2
52.0
10.0
12.0
5
BZT52C75
6H
75
70.0
79.0
2
300
1000
1.0
0.2
57
10.0
12.0
5
Breakdown characteristics
at Tj=constant (pulsed)
Forward characteristics
Copyright© Msksemi Incorporated
Admissible power dissipation versus ambient temperature
www.msksemi.com
BZT52Cxxx
Pulse thermal resistance versus pulse duration
Dynamic resistance versus Zener current
Capacitance versus Zener voltage
Dynamic resistance versus Zener current
Dynamic resistance versus Zener current
Copyright© Msksemi Incorporated
Thermal differential resistance versus Zener voltage
www.msksemi.com
BZT52Cxxx
Dynamic resistance versus Zener voltage
Temperature dependence of Zener voltage versus Zener voltage
Change of Zener voltage versus junction temperature
Temperature dependence of Zener voltage versus Zener voltage
Change of Zener voltage versus junction temperature
Change of Zener voltge from turn-on up to the point of thermal
equilibrium versus Zener voltage
Copyright© Msksemi Incorporated
www.msksemi.com
BZT52Cxxx
PACKAGE MECHANICAL DATA
Symbol
A
A1
A2
b
c
D
E
E1
L
L1
θ
Dimensions In Millimeters
Max
Min
1.050
1.250
0.000
0.100
1.050
1.150
0.450
0.650
0.080
0.150
1.500
1.700
2.600
2.800
3.550
3.850
0.500 REF
0.250
0.450
0°
8°
Dimensions In Inches
Min
Max
0.041
0.049
0.000
0.004
0.041
0.045
0.018
0.026
0.003
0.006
0.059
0.067
0.102
0.110
0.140
0.152
0.020 REF
0.010
0.018
0°
8°
Note:
1.Controllng dlmenslon:in mlllmeters.
2.General tolerance:± 0.05mm.
3.The pad layout Is for reference purposes only.
REEL SPECIFICATION
P/N
PKG
QTY
BZT52Cxxx
SOD-123
3000
Copyright© Msksemi Incorporated
www.msksemi.com
BZT52Cxxx
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at values that
exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or other parameters) listed in
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performance, characteristics, and functions of the described products in the independent state, and are not guarantees of the
performance, characteristics, and functions of the described products as mounted in the customer’s products or equipment. To
verify symptoms and states that cannot be evaluated in an independent device, the customer should always evaluate and test
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production. MSKSEMI Semiconductor believes information herein is accurate and
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implied regarding its use or any infringementsof intellectual property rights or other rightsof third parties.
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product/technology improvement, etc. Whendesigning equipment, referto the "Delivery Specification" for the MSKSEMI
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Copyright© Msksemi Incorporated
www.msksemi.com
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