TP65H050WS
650V Cascode GaN FET in TO-247 (source tab)
Description
Not Recommended for New Design
See TP65H050G4WS
for Replacement
Features
The TP65H050WS 650V, 50mΩ Gallium Nitride (GaN) FET
is a normally-off device. It combines state-of-the-art high
voltage GaN HEMT and low voltage silicon MOSFET
technologies—offering superior reliability and performance.
Transphorm GaN offers improved efficiency over silicon,
through lower gate charge, lower crossover loss, and smaller
reverse recovery charge.
Related Literature
• AN0009: Recommended External Circuitry for GaN FETs
• AN0003: Printed Circuit Board Layout and Probing
• AN0010: Paralleling GaN FETs
Ordering Information
Package
Package
Configuration
3 Lead TO-247
Source
Part Number
TP65H050WS
TP65H050WS
TO-247
(top view)
• JEDEC qualified GaN technology
• Dynamic RDS(on)eff production tested
• Robust design, defined by
— Intrinsic lifetime tests
— Wide gate safety margin
— Transient over-voltage capability
• Very low QRR
• Reduced crossover loss
• RoHS compliant and Halogen-free packaging
Benefits
• Improves efficiency/operation frequencies over Si
• Enables AC-DC bridgeless totem-pole PFC designs
— Increased power density
— Reduced system size and weight
— Overall lower system cost
• Easy to drive with commonly-used gate drivers
• GSD pin layout improves high speed design
Applications
•
•
•
•
Datacom
Broad industrial
PV inverter
Servo motor
S
Key Specifications
VDSS (V)
650
VDSS(TR)(V)
800
RDS(on)eff (mΩ) max*
G
S
D
60
QRR (nC) typ
125
QG (nC) typ
16
* Dynamic on-resistance; see Figures 17 and 18
Common Topology Power Recommendations
Cascode Schematic Symbol
July 19, 2023
TP65H050WS_v4
Cascode Device Structure
CCM bridgeless totem-pole*
3080W max
Hard-switched inverter**
3670W max
Conditions: FSW=45kHz; TJ=115°C; THEATSINK=90°C; insulator between
device and heatsink (6 mil Sil-Pad® K-10); power de-rates at lower
voltages with constant current
*
VIN=230VAC; VOUT=390VDC
** VIN=380VDC; VOUT=240VAC
© 2023 Transphorm Inc. Subject to change without notice.
1
TP65H050WS
Absolute Maximum Ratings (Tc=25°C unless otherwise stated.)
Symbol
VDSS
Parameter
Limit Value
Unit
Drain to source voltage (TJ = -55°C to 150°C)
650
Transient drain to source voltage a
800
Gate to source voltage
±20
Maximum power dissipation @TC=25°C
119
W
Continuous drain current @TC=25°C b
36
A
Continuous drain current @TC=100°C b
25
A
Pulsed drain current (pulse width: 10µs)
150
A
(di/dt)RDMC
Reverse diode di/dt, repetitive c
1600
A/µs
(di/dt)RDMT
Reverse diode di/dt, transient d
3000
A/µs
Case
-55 to +150
°C
Junction
-55 to +150
°C
-55 to +150
°C
Soldering peak temperature e
260
°C
Mounting Torque
80
N cm
Maximum
Unit
1.05
°C/W
40
°C/W
VDSS(TR)(V)
VGSS
PD
ID
IDM
TC
TJ
TS
TSOLD
-
Operating temperature
Storage temperature
V
Notes:
a. In off-state, spike duty cycle D
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