R1524x Series
200 mA 36 V Input Ultra Low Supply Current VR
No. EA-332-230703
OUTLINE
The R1524x is an ultra-low supply current voltage regulator featuring 200 mA output current and 36 V input
voltage. This device consists of an Output Short-circuit Protection Circuit, an Over-current Protection Circuit,
and a Thermal Shutdown Circuit in addition to the basic regulator circuits. The operating temperature range is
from −40°C to 105°C, and the maximum input voltage is 36 V. All these features allow the R1524x to become
an ideal power source of electric home appliances.
The output voltages are internally fixed (refer to SELECTION GUIDE). The output voltage accuracy is ±0.6%.
The packages for this device range from high-density mounting to ultra high wattage. The R1524x is offered
in five packages; a 5-pin SOT-23-5, a 5-pin SOT-89-5, a 6-pin HSOP-6J, a 6-pin DFN(PL)1820-6, and an 8pin HSOP-8E package.
FEATURES
●
●
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Input Voltage Range (Maximum Rating) ················ 3.5 V to 36 V (50 V)
Operating Temperature Range ···························· −40°C to 105°C
Supply Current ················································· Typ. 2.2 µA
Standby Current ··············································· Typ. 0.1 µA
Dropout Voltage ··············································· Typ. 0.6 V (IOUT = 200 mA, VOUT = 5.0 V)
Output Voltage Range ······································· 1.8 V / 2.5 V / 2.8 V / 3.0 V / 3.3 V / 3.4V / 5.0 V /
5.5 V / 6.0 V / 6.4 V / 7.0 V / 8.0 V / 8.5 V / 9.0 V /
10.0 V / 10.5 V / 11.0 V / 12.0 V
*Contact our sales representatives for other voltages.
Output Voltage Accuracy ···································· ±0.6% (Ta = 25°C)
Output Voltage Temperature-Drift Coefficient ·········· Typ. ±60 ppm/°C
Line Regulation ················································ Typ. 0.01%/V (VSET + 1 V ≤ VIN ≤ 36 V)
Built-in Output Short-circuit Protection Circuit ········· Typ. 80 mA
Built-in Over-current Protection Circuit ·················· Typ. 350 mA
Built-in Thermal Shutdown Circuit ························ Thermal Shutdown Temperature: Typ. 160°C
Ceramic capacitors are recommended
to be used with this device ································ COUT = 0.1 μF or more
● Packages ······················································· SOT-23-5, SOT-89-5, HSOP-6J,
DFN(PL)1820-6, HSOP-8E
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APPLICATIONS
● Power source for home appliances such as refrigerators, rice cookers, and electric hot-water pot.
● Power source for notebook PCs, digital TVs, cordless phones, and private LAN system.
● Power source for office equipment machines such as copiers, printers, facsimiles, scanners, and projectors.
1
R1524x
No. EA-332-230703
SELECTION GUIDE
The set output voltage and the package type are user-selectable.
Selection Guide
Product Name
Package
Quantity per Reel
Pb Free
Halogen Free
R1524NxxxB-TR-FE
SOT-23-5
3,000 pcs
Yes
Yes
R1524HxxxB-T1-FE
SOT-89-5
1,000 pcs
Yes
Yes
R1524SxxxB-E2-FE
HSOP-6J
1,000 pcs
Yes
Yes
DFN(PL)1820-6
5,000 pcs
Yes
Yes
HSOP-8E
1,000 pcs
Yes
Yes
R1524KxxxB-TR
R1524SxxxH-E2-FE
xxx: Specify the set output voltage (VSET)
1.8 V (018) / 2.5 V (025) / 2.8 V (028) / 3.0 V (030) / 3.3 V (033) / 3.4 V (034) / 5.0 V (050) /
5.5 V (055) / 6.0 V (060) / 6.4 V (064) / 7.0 V (070) / 8.0 V (080) / 8.5 V (085) / 9.0 V (090) /
10.0 V (100) / 10.5 V (105) / 11.0 V (110) / 12.0 V (120)
*Contact our sales representatives for other voltages.
BLOCK DIAGRAM
Thermal Shutdown
Circuit
VDD
VOUT
Vref
Short
Current Limit
Protection
CE
GND
R1524x Block Diagram
2
R1524x
No. EA-332-230703
PIN DESCRIPTIONS
5
4
5
3
1
4
6
5
4
3
1
2
3
(mark side)
1
2
SOT-23-5 Pin Configuration
Top View
6
5
2
SOT-89-5 Pin Configuration
Bottom View
4
4
5
HSOP-6J Pin Configuration
8
6
Top View
7
6
5
Bottom View
5
2
3
3
7
8
2
1
(1)
(1)
1
6
2
1
1
DFN(PL)1820-6 Pin Configuration
1
2
3
4
4
3
HSOP-8E Pin Configuration
SOT-23-5 Pin Descriptions
Pin No.
Symbol
1
GND(2)
Description
Ground Pin
2
GND(2)
Ground Pin
3
CE
4
VOUT
Output Pin
5
VDD
Input Pin
Chip Enable Pin (Active-high)
SOT-89-5 Pin Descriptions
Pin No.
Symbol
Description
1
VOUT
Output Pin
2
GND(3)
Ground Pin
3
CE
4
GND(3)
5
VDD
Chip Enable Pin (Active-high)
Ground Pin
Input Pin
(1)
The tab on the bottom of the package enhances thermal performance and is electrically connected to GND (substrate
level). It is recommended that the tab be connected to the ground plane on the board, or otherwise be left open.
(2) The GND pin must be wired together when it is mounted on board.
(3) The GND pin must be wired together when it is mounted on board.
3
R1524x
No. EA-332-230703
HSOP-6J Pin Descriptions
Pin No.
Symbol
Description
1
VOUT
Output Pin
2
GND(1)
Ground Pin
3
CE
4
GND(1)
Ground Pin
5
GND(1)
Ground Pin
6
VDD
Chip Enable Pin (Active-high)
Input Pin
DFN(PL)1820-6 Pin Descriptions
Pin No.
Symbol
Description
1
CE
Chip Enable Pin (Active-high)
2
NC
No Connection
3
GND
4
VDD
Input Pin
5
NC
No Connection
6
VOUT
Ground Pin
Output Pin
HSOP-8E Pin Descriptions
Pin No.
Symbol
Description
1
VOUT
2
NC
No Connection
3
NC
No Connection
4
CE
Chip Enable Pin (Active-high)
5
GND
6
NC
No Connection
7
NC
No Connection
8
VDD
Input Pin
Output Pin
Ground Pin
PIN EQUIVALENT CIRCUIT DIAGRAMS
Driver
CE
VOUT
VOUT Pin
(1)
CE Pin
The GND pin must be wired together when it is mounted on board.
4
R1524x
No. EA-332-230703
ABSOLUTE MAXIMUM RATINGS
Absolute Maximum Ratings
Symbol
Item
Rating
Unit
−0.3 to 50
V
VIN
Input Voltage
VIN
Peak Input Voltage( 1)
60
V
VCE
Input Voltage (CE Pin)
−0.3 to 50
V
VOUT
Output Voltage
−0.3 to VIN + 0.3 ≤ 50
V
IOUT
Output Current
300
mA
PD
Power Dissipation(2)
(JEDEC STD.51-7 Test Land Pattern)
SOT-23-5
660
SOT-89-5
2600
HSOP-6J
2700
DFN(PL)1820-6
2200
HSOP-8E
2900
mW
Tj
Junction Temperature Range
−40 to 125
°C
Tstg
Storage Temperature Range
−55 to 125
°C
ABSOLUTE MAXIMUM RATINGS
Electronic and mechanical stress momentarily exceeded absolute maximum ratings may cause permanent damage
and may degrade the lifetime and safety for both device and system using the device in the field. The functional
operation at or over these absolute maximum ratings are not assured.
RECOMMENDED OPERATING CONDITIONS
Recommended Operating Conditions
Symbol
Item
VIN
Input Voltage
Ta
Operating Temperature Range
Rating
Unit
3.5 to 36
V
−40 to 105
°C
RECOMMENDED OPERATING CONDITIONS
All of electronic equipment should be designed that the mounted semiconductor devices operate within the recommended
operating conditions. The semiconductor devices cannot operate normally over the recommended operating conditions,
even if they are used over such conditions by momentary electronic noise or surge. And the semiconductor devices may
receive serious damage when they continue to operate over the recommended operating conditions.
(1)
(2)
Duration time: 200 ms
Refer to POWER DISSIPATION for detailed information.
5
R1524x
No. EA-332-230703
ELECTRICAL CHARACTERISTICS
CIN = COUT = 0.1 μF, unless otherwise noted.
The specifications surrounded by
are guaranteed by design engineering at -40°C ≤ Ta ≤ 105°C.
R1524x Electrical Characteristics
Symbol
ISS
(Ta = 25°C)
Item
Supply Current
Istandby Standby Current
Conditions
VIN = 14 V
IOUT = 0 mA
Min.
Typ.
Max.
VSET ≤ 5.0 V
2.2
6.5
5.0 V < VSET
2.5
6.8
0.1
1.0
VIN = 36 V, VCE = 0 V
Unit
μA
μA
Output Voltage
×0.994
VSET + 1 V( 1) ≤ VIN ≤ Ta = 25°C
36 V, IOUT = 1 mA −40°C ≤ Ta ≤ 105°C ×0.984
∆VOUT
/∆IOUT
Load Regulation
VIN = VSET + 3.0 V
1 mA ≤ IOUT ≤ 200 mA
∆VOUT
/∆VIN
Line Regulation
VSET + 1 V(1) ≤ VIN ≤ VSET < 3.3 V
36 V, IOUT = 1 mA
3.3 V ≤ VSET
VDIF
Dropout Voltage
IOUT = 200 mA
ILIM
Output Current Limit
VIN = VSET + 3.0 V
220
350
mA
ISC
Short Current Limit
VIN = 3.5 V, VOUT = 0 V
60
80
mA
VOUT
×1.006
×1.016
V
Refer to the Product-specific
Electrical Characteristics
-20
5
20
mV
-0.02
0.01
0.02
%/V
Refer to the Product-specific
Electrical Characteristics
VCEH
CE Pin Input Voltage, high VIN = VSET + 1 V(1)
VCEL
CE Pin Input Voltage, low
VIN = 36 V
CE Pull-down Current
VIN = 36 V, VCE = 2 V
0.2
Junction Temperature
160
°C
Junction Temperature
135
°C
IPD
TTSD
TTSR
Thermal Shutdown
Detection Temperature
Thermal Shutdown
Released Temperature
2.0
36
V
0
1.0
V
0.6
μA
All test items listed under Electrical Characteristics are done under the pulse load condition (Tj ≈ Ta = 25°C).
(1) V
SET
≤ 2.5 V, VIN = 3.5 V
6
R1524x
The specifications surrounded by
No. EA-332-230703
are guaranteed by design engineering at -40°C ≤ Ta ≤ 105°C.
R1524x
Product-specific Electrical Characteristics
VOUT (V)
VOUT (V)
Product
(Ta = 25°C)
(−40°C ≤ Ta ≤ 105°C)
Name
MIN.
TYP.
MAX.
MIN.
TYP. MAX.
R1524x018x
1.7892
1.80
1.8108
1.7712
1.80
1.8288
R1524x025x
2.4850
2.50
2.5150
2.4600
2.50
2.5400
R1524x028x
2.7832
2.80
2.8168
2.7552
2.80
2.8448
R1524x030x
2.9820
3.00
3.0180
2.9520
3.00
3.0480
R1524x033x
3.2802
3.30
3.3198
3.2472
3.30
3.3528
R1524x034x
3.3796
3.40
3.4204
3.3456
3.40
3.4544
R1524x050x
4.9700
5.00
5.0300
4.9200
5.00
5.0800
R1524x055x
5.4670
5.50
5.5330
5.4120
5.50
5.5880
R1524x060x
5.9640
6.00
6.0360
5.9040
6.00
6.0960
R1524x064x
6.3616
6.40
6.4384
6.2976
6.40
6.5024
R1524x070x
6.9580
7.00
7.0420
6.8880
7.00
7.1120
R1524x080x
7.9520
8.00
8.0480
7.8720
8.00
8.1280
R1524x085x
8.4490
8.50
8.5510
8.3640
8.50
8.6360
R1524x090x
8.9460
9.00
9.0540
8.8560
9.00
9.1440
R1524x100x
9.9400
10.0
10.0600 9.8400
10.0
10.1600
R1524x105x 10.4370
10.5
10.5630 10.3320
10.5
10.6680
R1524x110x 10.9340
11.0
11.0660 10.8240
11.0
11.1760
R1524x120x 11.9280
12.0
12.0720 11.8080
12.0
12.1920
(Ta = 25°C)
∆VOUT/∆IOUT (mV)
MIN.
-10
TYP.
10
MAX.
VDIF (V)
TYP.
MAX.
1.6
2.5
1.2
2.2
0.8
2.0
40
0.6
-18
18
1.2
72
0.5
7
R1524x
No. EA-332-230703
THEORY OF OPERATION
Thermal Shutdown
R1524x has a built-in thermal shutdown circuit, which stops the regulator operation if the junction temperature
of this device increases to 160°C (Typ.) or higher. If the temperature drops to 135°C (Typ.) or lower, the
regulator restarts the operation. Unless eliminating the overheating problem, the regulator turns on and off
repeatedly and as a result, a pulse shaped output voltage is generated.
APPLICATION INFORMATION
TYPICAL APPLICATIONS
VDD
R1524x
C1
CE Control
CE
VOUT
VOUT
C2
GND
C1 = Ceramic 0.1 µF
C2 = Ceramic 0.1 µF
R1524x Typical Applications
8
R1524x
TECHNICAL NOTES
No. EA-332-230703
Phase Compensation
In the R1524x, phase compensation is provided to secure stable operation even when the load current is
varied. For this purpose, make sure to use 0.1 μF or more of a capacitor (C2).
In case of using a tantalum type capacitor and the ESR (Equivalent Series Resistance) value of the capacitor
is large, the output might be unstable. Evaluate the circuit including consideration of frequency characteristics.
Connect 0.1 μF or more of a capacitor (C1) between VDD and GND, and as close as possible to the pins.
PCB Layout
For SOT-23-5 package type, wire the following GND pins together: No. 1 and No. 2
For SOT-89-5 package type, wire the following GND pins together: No. 2 and No. 4.
For HSOP-6J package type, wire the following GND pins together: No. 2, No. 4, and No. 5.
9
R1524x
No. EA-332-230703
TYPICAL CHARACTERISTICS
Note: Typical Characteristics are intended to be used as reference data; they are not guaranteed.
1) Output Voltage vs. Output Current (Ta = 25°C)
R1524x018B
R1524x033B
2
Output Voltage VOUT (V)
1.8
Output Voltage VOUT (V)
1.6
1.4
1.2
1
0.8
0.6
VIN=3.8V
0.4
VIN=4.8V
0.2
0
0
3.6
3.3
3.0
2.7
2.4
2.1
1.8
1.5
1.2
0.9
0.6
0.3
0.0
100
200
300
400
Output Current IOUT (mA)
VIN=5.3V
6.3V
0
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
400
R1524x090B
10.0
9.0
Output Voltage VOUT (V)
Output Voltage VOUT (V)
R1524x050B
100
200
300
Output Current IOUT (mA)
VIN=7V
8V
0
100
200
300
400
Output Current IOUT (mA)
8.0
7.0
6.0
VIN=11V
5.0
12V
4.0
3.0
2.0
1.0
0.0
0
100
200
300
400
Output Current IOUT (mA)
Output Voltage VOUT (V)
R1524x120B
13
12
11
10
9
8
7
6
5
4
3
2
1
0
VIN=14V
VIN=15V
0
100
200
300
400
OutputCurrent IOUT (mA)
10
R1524x
No. EA-332-230703
2) Output Voltage vs. Input Voltage (Ta = 25°C)
2
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
R1524x033B
IOUT=1mA
50mA
100mA
0
1
2
3
4
5
Input Voltage VIN (V)
Output Voltage VOUT (V)
Output Voltage VOUT (V)
R1524x018B
3.6
3.3
3.0
2.7
2.4
2.1
1.8
1.5
1.2
0.9
0.6
0.3
0.0
6
IOUT=1mA
50mA
100mA
1.5
2.0
3.5
4.0
4.5
5.0
R1524x090B
10.0
9.0
IOUT=1mA
50mA
100mA
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 7.0
Input Voltage VIN (V)
Output Voltage VOUT (V)
Output Voltage VOUT (V)
3.0
Input Voltage VIN (V)
R1524x050B
5.5
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
2.5
8.0
7.0
6.0
5.0
4.0
3.0
IOUT=1mA
50mA
100mA
2.0
1.0
0.0
1
2
3
4
5
6
7
8
9 10 11 12
Input Voltage VIN (V)
OutputVoltage VOUT [V]
R1524x120B
13
12
11
10
9
8
7
6
5
4
3
2
1
0
IOUT=1mA
50mA
100mA
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15
InputVoltage VIN[V]
11
R1524x
No. EA-332-230703
3) Supply Current vs. Temperature
R1524x018B
R1524x033B
5.0
5.0
VIN = 14V
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40 -25
0
25
50
3.5
3.0
2.5
2.0
1.5
1.0
0.0
75 100 105
-40 -25
0
25
50
Ta (°C)
Ta (°C)
R1524x050B
R1524x090B
75 100 105
5.0
VIN = 14V
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
VIN = 14V
4.5
Supply Current Iss (μA)
Supply Current Iss (μA)
4.0
0.5
5.0
0.0
VIN = 14V
4.5
Supply Current Iss (μA)
Supply Current Iss (μA)
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
-40 -25
0
25
50
75 100 105
Ta (°C)
0.0
-40 -25
0
25
50
75 100 105
Ta (°C)
R1524x120B
5.0
VIN = 14V
Supply Current Iss (μA)
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
-40 -25
0
25
50
75 100 105
Ta (°C)
12
R1524x
No. EA-332-230703
4) Supply Current vs. Input Voltage
R1524x033B
4.0
8
3.5
7
Supply Current Iss (μA)
Supply Current ISS (μA)
R1524x018B
3.0
2.5
2.0
1.5
Ta=-40°C
1.0
25°C
0.5
0.0
6
25°C
6
105°C
5
4
3
2
1
105°C
0
Ta=-40°C
0
12
18
24
30
Input Voltage VIN (V)
36
0
6
12
18
24
30
Input Voltage VIN (V)
36
R1524x120B
Supply Current ISS (uA)
8
7
Ta=-40℃
Ta=25℃
Ta=105℃
6
5
4
3
2
1
0
0
6
12
18
24
30
36
Input Voltage VIN (V)
5) Output Voltage vs. Temperature (IOUT = 1 mA)
R1524x018B
R1524x033B
3.366
1.836
VIN = 14V
Output Voltage VOUT (V)
Output Voltage VOUT (V)
VIN = 14V
1.818
1.800
1.782
1.764
-40 -25
0
25
50
Ta (°C)
75 100 105
3.333
3.300
3.267
3.234
-40 -25
0
25
50
75 100 105
Ta (°C)
13
R1524x
No. EA-332-230703
R1524x090B
R1524x050B
5.100
9.180
VIN = 14V
Output Voltage VOUT (V)
Output Voltage VOUT (V)
VIN = 14V
5.050
5.000
4.950
4.900
-40 -25
0
25
50
9.090
9.000
8.910
8.820
75 100 105
-40 -25
0
Ta (°C)
25
50
75 100 105
Ta (°C)
R1524x120B
12.24
Output Voltage VOUT (V)
VIN = 14V
12.12
12.00
11.88
11.76
-40 -25
0
25
50
75 100 105
Ta (℃)
6) Dropout Voltage vs. Output Current
R1524x018B
R1524x033B
2.5
2.0
Ta=-40°C
Dropout Voltage VDIF (V)
Dropout Voltage VDIF [V]
2.0
1.5
1.0
Ta=-40°C
25°C
0.5
105°C
0.0
0
50
100
150
Output Current IOUT (mA)
200
25°C
1.5
105°C
1.0
0.5
0.0
0
50
100
150
200
Output Current IOUT (mA)
14
R1524x
No. EA-332-230703
R1524x090B
R1524x050B
1.0
1.5
Ta=-40°C
25°C
Dropout Voltage VDIF (V)
Dropout Voltage VDIF (V)
Ta=-40°C
105°C
1.0
0.5
0.0
0
50
100
150
200
Output Current IOUT (mA)
0.8
25°C
105°C
0.6
0.4
0.2
0.0
0
50
100
150
200
Output Current IOUT (mA)
R1524x120B
Dropout Voltage VDIF (V)
1.2
Ta=-40℃
1.0
Ta=25℃
0.8
Ta=105℃
0.6
0.4
0.2
0.0
0
50
100
150
200
Output Current IOUT (mA)
7) Dropout Voltage vs. Output Voltage (Ta = 25°C)
Dropout Voltage VDIF (V)
1.8
Iout=1mA
1.6
50mA
1.4
100mA
1.2
200mA
1.0
0.8
0.6
0.4
0.2
0.0
0
1
2
3
4
5
6
7
8
9 10 11 12
Output Voltage VOUT (V)
15
R1524x
No. EA-332-230703
8) Ripple Rejection vs. Input Voltage (Ta = 25°C, Ripple = 0.2 Vpp)
R1524x018B
R1524x033B
70
70
Ripple Rejection Ratio RR (dB)
IOUT=50mA
60
Ripple Rejection RR (dB)
f=100Hz
50
1kHz
40
30
10kHz
20
10
100kHz
0
1
3
5
7
9
11
13
f=100Hz
50
40
1kHz
30
10kHz
20
10
0
15
IOUT=50mA
60
Input Voltage VIN (V)
100kHz
2.0
R1524x050B
70
IOUT=50mA
60
f=100Hz
50
1kHz
40
30
10kHz
20
10
0
100kHz
3.5
5.0
6.0
8.0 10.0 12.0
Input Voltage VIN (V)
14.0
R1524x090B
Ripple Rejection Ratio RR (dB)
Ripple Rejection Ratio RR (dB)
70
4.0
50
f=100Hz
40
1kHz
30
20
10kHz
10
0
6.5 8.0 9.5 11.0 12.5 14.0
Input Voltage VIN (V)
IOUT=50mA
60
100kHz
9.0
10.0
11.0
12.0
13.0
Input Voltage VIN (V)
14.0
R1524x120B
Ripple Rejection Ratio RR (dB)
70
60
IOUT=50mA
50
f=100Hz
40
1kHz
30
20
10kHz
10
0
11.0
100kHz
12.0
13.0
14.0
15.0
Input Voltage VIN (V)
16
R1524x
No. EA-332-230703
9) Ripple Rejection vs. Frequency (Ta = 25°C, Ripple = 0.2 Vpp)
R1524x018B
R1524x033B
80
80
IOUT=1mA
50mA
100mA
60
Ripple Rejection (dB)
Ripple Rejection Ratio RR (dB)
VIN = 3.8V
70
50
40
30
20
10
0
0.01
1
10
100
Frequency (kHz)
IOUT=1mA
50mA
100mA
60
50
40
30
20
10
0
0.1
VIN = 5.3V
70
1000
0.01
R1524x050B
1000
80
VIN = 7.0V
70
Ripple Rejection Ratio RR (dB)
Ripple Rejection Ratio RR (dB)
1
10
100
Frequency (kHz)
R1524x090B
80
IOUT=1mA
50mA
100mA
60
50
40
30
20
10
0
0.1
0.01
0.1
1
10
100
Frequency (kHz)
IOUT=1mA
50mA
100mA
60
50
40
30
20
10
0
1000
VIN = 11.0V
70
0.01
0.1
1
10
100
Frequency (kHz)
1000
Ripple Rejection Ratio RR (dB)
R1524x120B
80
VIN=14.0V
70
60
Iout=1mA
50mA
100mA
50
40
30
20
10
0
0.01
0.1
1
10
100
1000
Frequency (kHz)
17
R1524x
No. EA-332-230703
10) Input Transient Response (Ta = 25°C)
R1524x033B
2.4
2.8
2.2
0.8
Output Voltage
1.6
1.4
C2 = 0.1 μF
10 μF
5.3
0
1
2
3
4
Time (ms)
5
4
2
3.8
3.3
2.8
6
C2=0.1μF
12.5
12
12.0
8
6.5
6
6.0
4
5.5
2
Output Voltage
0
10μF
C2=0.1μF
Input Voltage VIN (V)
Output Voltage VOUT (V)
14
10
Input Voltage
tr=tf=1μs
4.5
-1
0
3
4
5
6
4
5
6
Time (ms)
18
16
14
12
10
10.0
8
9.5
6
Output Voltage
9.0
8.5
7.5
2
3
10.5
3.5
1
2
Input Voltage
tr=tf=1μs
11.0
8.0
0
1
IOUT=1mA
11.5
4.0
-1
10μF
Time (ms)
Output Voltage VOUT (V)
IOUT=1mA
8.0
5.0
0
Output Voltage
R1524x090B
8.5
7.0
6
4.3
R1524x050B
7.5
8
4.8
1.8
-1
10
Input Voltage
tr=tf=1μs
2.3
1.2
1.0
5.8
4
C2=0.1μF
2
10μF
Input Voltage VIN (V)
1.8
Output Voltage VOUT (V)
Output Voltage VOUT (V)
4.8
Input Voltage VIN (V)
6.8
12
IOUT=1mA
6.3
8.8
Input Voltage
2.0
6.8
10.8
IOUT=1mA
Input Voltage VIN (V)
R1524x018B
0
-1
0
1
2
3
4
5
6
Time (ms)
R1524x120B
Output Voltage VOUT (V)
13.5
13.0
12.5
12
10
8
Output Voltage
6
12.0
11.5
11.0
10.5
16
14
Input Voltage
tr=tf=1μs
14.0
10μF
C2=0.1μF
-1
0
1
2
3
4
5
6
4
2
0
Input Voltage VIN (V)
20
18
IOUT=1mA
Time (ms)
18
R1524x
No. EA-332-230703
11) Load Transient Response (Ta = 25°C)
1.8
10μF
1.2
10
4.5
0
1
2
3
4
5
6
7
8
3.6
3.3
3.0
2.7
R1524x090B
13.5
0
12.6
Output Voltage
4.5
C2=0.1μF
4.0
10μF
3.5
3.0
Output Current IOUT (mA)
6.0
Output Voltage VOUT (V)
14.4
20
5.0
10μF
R1524x050B
40
5.5
C2=0.1μF
2.1
-100 0 100 200 300 400 500 600 700 800
9
7.5
6.5
0
Output Voltage
Time (µs)
1mA
20
3.9
Time (ms)
Output Current
tr=tf=0.5μs
1mA
4.2
8.0
7.0
Output Current
tr=tf=0.5μs
2.4
C2=0.1μF
-1
40
Output Current IOUT (mA)
Output Voltage
1.5
4.8
0
2.4
2.1
5.1
20
11.7
9.9
9.0
8.1
7.2
5.4
Time (µs)
Output Current
tr=tf=0.5μs
1mA
10.8
6.3
-100 0 100 200 300 400 500 600 700 800
40
Output Voltage
C2=0.1μF
10μF
20
0
Output Current IOUT (mA)
1mA
30
Output Voltage VOUT (V)
Output Current
tr=tf=0.5μs
0.9
Output Voltage VOUT (V)
R1524x033B
Output Current (mA)
Output Voltage VOUT (V)
R1524x018B
-100 0 100 200 300 400 500 600 700 800
Time (µs)
R1524x120B
18.0
16.8
Output Voltage VOUT (V)
15.6
Output Current
tr=tf=0.5μs
1mA
14.4
13.2
Output Voltage
12.0
10.8
9.6
C2=0.1μF
10μF
8.4
7.2
20
0
Output Current IOUT (mA)
40
19.2
-100 0 100 200 300 400 500 600 700 800
Time (μs)
19
R1524x
No. EA-332-230703
12) CE Transient Response (Ta = 25°C)
900
CE Input Voltage 800
3
700
Output Voltage 600
2
1
500
0V
0
400
300
C2=0.1μF
200
C2=10μF
Inrush Current
4
3
2
1
0
3.8V
100
0
-0.2 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
Time (ms)
CE Input Voltage
0V
1.8
1.5
1.2
0.9
0.6
0.3
0.0
-0.3
Output Voltage VOUT (V)
3.8V
4
Inrush Current (mA)
Output Voltage VOUT (V)
5
C2=10μF, IOUT=1mA
Input Voltage CE (V)
R1524x018B
C2=0.1μF, IOUT=100mA
C2=0.1μF, IOUT=1mA
C2=10μF, IOUT=100mA
Output Voltage
-2
-1
0
1
2 3 4
Time (ms)
5
6
7
8
R1524x033B
3.3
5V
CE Input Voltage
Output Voltage
0V
2.2
700
500
1μF
0.0
800
600
C2=0.1μF
1.1
900
10μF
400
300
200
100
Inrush Current
Output Voltage VOUT (V)
Output Voltage VOUT (V)
4.4
Inrush Current (mA)
5.5
0
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
5V
0V
C2=10μF
IOUT=1mA
C2=10μF,IOUT=100mA
& C2=0.1μF,IOUT=1mA
C2=0.1μF
IOUT=100mA
Output Voltage
-2
-0.20.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
CE Input Voltage
0
2
4
Time (ms)
6
8
10
12
14
Time (ms)
R1524x050B
6.0
4.0
2.0
5V
0V
CE Input Voltage
Output Voltage
10μF
400
300
200
100
Inrush Current
-0.2 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
Time (ms)
0
5V
7.0
700
500
1μF
8.0
800
600
C2=0.1μF
0.0
900
Output Voltage VOUT (V)
Output Voltage VOUT (V)
8.0
Inrush Current (mA)
10.0
CE Input Voltage
0V
6.0
C2=10μF
IOUT=1mA
5.0
4.0
C2=10μF,IOUT=100mA
& C2=0.1μF,IOUT=1mA
3.0
2.0
C2=0.1μF
IOUT=100mA
1.0
0.0
Output Voltage
-2
0
2
4
6
8
10
12
14
Time (ms)
20
R1524x
No. EA-332-230703
R1524x090B
9.0
5V
CE Input Voltage
Output Voltage
0V
6.0
12.0
700
500
1μF
0.0
14.0
800
600
C2=0.1μF
3.0
900
10μF
400
300
200
100
Inrush Current
Output Voltage VOUT (V)
Output Voltage VOUT (V)
12.0
5V
0V
CE Input Voltage
10.0
Inrush Current (mA)
15.0
C2=10μF
IOUT=1mA
8.0
6.0
C2=10μF,IOUT=100mA
& C2=0.1μF,IOUT=1mA
4.0
C2=0.1μF
IOUT=100mA
2.0
0.0
0
Output Voltage
-2
-0.20.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
0
2
4
Time (ms)
6
8
10
12
14
Time (ms)
12.0
9.0
0V
CE Input Voltage 900
5V
800
Output Voltage
6.0
700
600
3.0
500
C2=0.1μF
0.0
400
10μF
300
200
100
Inrush Current
20.0
18.0
16.0
14.0
12.0
10.0
8.0
6.0
4.0
2.0
0.0
5V
Output Voltage VOUT (V)
15.0
Inrush Current (mA)
Output Voltage VOUT (V)
R1524x120B
0
C2=10μF, Iout=1mA
C2=10μF, Iout=100mA
C2=0.1μF, Iout=1mA
C2=0.1μF, Iout=100mA
Output Voltage
-2
-0.2 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
CE Input Voltage
0V
0
2
4
6
8
10
12
14
Time (ms)
Time (ms)
13) Power-on Transient Response (Ta = 25°C, VCE = 5 V)
R1524x033B
3
2
1
0
0V
8.0
Input
Voltage
Output
Voltage
300
C2=0.1μF
200
C2=10μF
100
Inrush Current
-0.2 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
Time (ms)
Input Voltage
6.4
0
-100
Output Voltage VOUT (V)
3.8V
Inrush Current (mA)
Output Voltage VOUT (V)
4
5.3V
4.8
Output Voltage
3.2
1.6
0.0
0V
C2=0.1μF
1μF
10μF
900
800
700
600
500
400
300
200
100
Inrush Current
Inrush Current (mA)
R1524x018B
0
-0.20.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
Time (ms)
21
R1524x
No. EA-332-230703
R1524x090B
R1524x050B
12.0
Output Voltage VOUT (V)
6.0
Output Voltage
700
9.0
4.0
600
2.0
500
0.0
C2=0.1μF
0V
400
1μF
300
10μF
200
100
Inrush Current
900
Input Voltage
11V
800
Output
700
600
6.0
3.0
0.0
500
C2=0.1μF
0V
400
1μF
300
10μF
200
100
0
0
Inrush Current
-0.20.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
Inrush Current (mA)
15.0
800
7V
Output Voltage VOUT (V)
8.0
Inrush Current (mA)
900
Input Voltage
10.0
-0.20.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
Time (ms)
Time (ms)
R1524x120B
900
800
700
600
500
400
300
200
100
0
Input Voltage
14V
Inrush Current (mA)
OutputVoltage VOUT (V)
15.0
12.0
9.0
6.0
3.0
0.0
Output Voltage
C2=0.1uF
0V
10uF
Inrush Current
-0.2 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8
Time (ms)
14) Load Dump (Ta = 25°C)
60
50
40
30
20
10
0
1.84
1.83
1.82
1.81
1.80
1.79
Input Voltage VIN (V)
Output Voltage VOUT (V)
Input Voltage
Output Voltage
C2=0.1μF
-10
0
10
20
30
Time (ms)
40
50
60
6.8
60
6.3
50
5.8
40
5.3
30
Input Voltage
4.8
20
10
4.3
3.8
0
Output Voltage
3.3
C2=0.1μF
2.8
10μF
Input Voltage VIN (V)
R1524x033B
Output Voltage VOUT (V)
R1524x018B
2.3
1.8
-10
0
10
20
30
40
50
60
Time (ms)
22
R1524x
60
12.5
60
8.0
50
12.0
50
7.5
40
11.5
40
7.0
30
Input Voltage
6.5
20
6.0
10
5.5
0
Output Voltage
5.0
C2=0.1μF
4.5
10μF
Output Voltage VOUT (V)
8.5
Input Voltage VIN (V)
Output Voltage VOUT (V)
R1524x050B
4.0
3.5
11.0
30
Input Voltage
10.5
20
10
10.0
9.5
0
Output Voltage
9.0
C2=0.1μF
8.5
10μF
Input Voltage VIN (V)
No. EA-332-230703
R1524x090B
8.0
-10
0
10
20
30
40
50
7.5
60
Time (ms)
-10
0
10
20
30
40
50
60
Time (ms)
60
Output Voltage VOUT (V)
50
40
30
Input Voltage
20
10
13.0
12.0
C2=0.1uF
11.5
11.0
0
Output Voltage
12.5
-10
0
10
20
Input Voltage VIN (V)
R1524x120B
10uF
30
40
50
60
Time (ms)
23
R1524x
No. EA-332-230703
15) Cranking (Ta = 25°C)
R1524x090B
20
16.5
20
7.5
15
15.0
15
10
Input Voltage
6.5
5
0
6.0
C2=0.1μF
10μF
5.5
5.0
4.5
4.0
3.5
3.0
0
1
2
3
4
5
6
7
10.5
Time (ms)
5
0
C2=0.1μF
9.0
10μF
7.5
6.0
4.5
1.5
8
10
Input Voltage
12.0
3.0
Output Voltage
-1
13.5
Input Voltage VIN (V)
7.0
Output Voltage VOUT (V)
8.0
Input Voltage VIN (V)
Output Voltage VOUT (V)
R1524x050B
Output Voltage
-1
0
1
2
3
4
5
6
7
8
Time (ms)
R1524x120B
Output Voltage VOUT (V)
15.0
Input Voltage
15
13.5
10
12.0
5
10.5
9.0
7.5
C2=0.1uF
10uF
0
Input Voltage VIN (V)
20
16.5
6.0
4.5
3.0
1.5
Output Voltage
-1 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14
Time (ms)
24
R1524x
No. EA-332-230703
Input Transient/Load Transient vs. Output Capacity (C2)
R1524 performs a stable operation by using 0.1 µF of ceramic capacitor as the output capacitor. However,
the variation of output voltage may not meet the demand of the system when input voltage and load current
vary. In such cases, the variation of output voltage can be minimized significantly by using 10 µF or higher
ceramic capacitor. When using an electrolytic capacitor for the output line, place the electrolytic capacitor
outer side of the ceramic capacitor arranged close to the IC.
Input Transient Response
Load Transient Response
R1524x033B
R1524x033B
IOUT=1mA
4.8
8
Input Voltage
tr=tf=1μs
5.3
5.1
10
6
4.8
4
4.3
2
3.8
0
Output Voltage
3.3
2.8
C2=0.1μF
10μF
Output Voltage VOUT (V)
5.8
12
Input Voltage VIN (V)
Output Voltage VOUT (V)
6.3
2.3
1.8
40
4.2
3.9
3.6
Output Voltage
3.3
3.0
C2=0.1μF
2.7
10μF
2.4
-1
0
1
2
3
4
5
1mA
Output Current
tr=tf=0.5μs
4.5
20
0
Output Current IOUT (mA)
6.8
2.1
-100 0 100 200 300 400 500 600 700 800
6
Time (µs)
Time (ms)
ESR vs. Output Current
It is recommended that a ceramic type capacitor be used for this device. However, other types of capacitors
having lower ESR can also be used. The relation between the output current (IOUT) and the ESR of output
capacitor is shown below.
VDD
VOUT
R1524xxxxB
C1
CE
GND
C2
IOUT
ESR
C1 = Ceramic 0.1 μF, C2 = Ceramic 0.1 μF
25
R1524x
R1524x018B
100
100
10
10
1
0.1
0.01
VIN=3.5V to 36V
1000
Equivalent Series Resistance ESR
(Ω)
VIN=3.5V to 36V
1000
Equivalent Series Resistance ESR
(Ω)
R1524x033B
1
0.1
0
50
100
150
200
0.01
0
Output Current IOUT (mA)
200
VIN=9V to 36V
1000
Equivalent Series Resistance ESR
(Ω)
Equivalent Series Resistance ESR
(Ω)
150
100
100
10
10
1
0.1
1
0.1
0
50
100
150
200
Output Current IOUT (mA)
VIN=12V to 36V
1000
0.01
0
50
100
150
200
Output Current IOUT (mA)
R1524x120B
Equivalent Series Resistance ESR
(Ω)
100
R1524x090B
VIN=5V to 36V
1000
50
Output Current IOUT (mA)
R1524x050B
0.01
No. EA-332-230703
Measurement Conditions
Frequency Band: 10 Hz to 2 MHz
100
Measurement Temperature: −40°C to 105°C
10
Hatched area: Noise level is 40 μV (average)
or below
Ceramic Capacitors:
CIN = 0.1 μF, Murata, GRM188R71H104JA93D
COUT = 0.1 μF, TDK, CGA3E2X7R1E104K
1
0.1
0.01
0
50
100
150
200
Output Current IOUT (mA)
26
POWER DISSIPATION
SOT-23-5
PD-SOT-23-5-(105125150)-E-A
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51-7.
Measurement Conditions
Item
Environment
Board Material
Board Dimensions
Measurement Conditions
Mounting on Board (Wind Velocity = 0 m/s)
Glass Cloth Epoxy Plastic (Four-Layer Board)
76.2 mm × 114.3 mm × 0.8 mm
Outer Layer (First Layer): Less than 95% of 50 mm Square
Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square
Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square
φ 0.3 mm × 7 pcs
Copper Ratio
Through-holes
Measurement Result
Item
(Ta = 25°C, Tjmax = 125°C)
Measurement Result
Power Dissipation
660 mW
Thermal Resistance (θja)
θja = 150°C/W
Thermal Characterization Parameter (ψjt)
ψjt = 51°C/W
θja: Junction-to-Ambient Thermal Resistance
ψjt: Junction-to-Top Thermal Characterization Parameter
1000
900
830
Power Dissipation PD (mW)
800
700
600
660
500
400
300
200
100
0
0
25
105
50
75
100 125
Ambient Temperature (°C)
150
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
The above graph shows the power dissipation of the package at Tjmax = 125°C and Tjmax = 150°C.
Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of
use and the total years of use must be limited as follows:
Total Hours of Use
13,000 hours
Total Years of Use (4 hours/day)
9 years
i
SOT-23-5
PACKAGE DIMENSIONS
DM-SOT-23-5-JE-B
2.9±0.2
1.1±0.1
1.9±0.2
0.8±0.1
(0.95)
4
1
2
0~0.1
0.2min.
+0.2
1.6-0.1
5
2.8±0.3
(0.95)
3
0.4±0.1
+0.1
0.15-0.05
SOT-23-5 Package Dimensions
i
POWER DISSIPATION
SOT-89-5
PD-SOT-89-5-(105125150)-JE-A
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51-7.
Measurement Conditions
Item
Environment
Board Material
Board Dimensions
Copper Ratio
Through-holes
Measurement Conditions
Mounting on Board (Wind Velocity = 0 m/s)
Glass Cloth Epoxy Plastic (Four-Layer Board)
76.2 mm × 114.3 mm × 0.8 mm
Outer Layer (First Layer): Less than 95% of 50 mm Square
Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square
Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square
φ 0.3 mm × 13 pcs
Measurement Result
(Ta = 25°C, Tjmax = 125°C)
Item
Measurement Result
Power Dissipation
Thermal Resistance (θja)
Thermal Characterization Parameter (ψjt)
2600 mW
θja = 38°C/W
ψjt = 13°C/W
θja: Junction-to-Ambient Thermal Resistance
ψjt: Junction-to-Top Thermal Characterization Parameter
4000
Power Dissipation PD (mW)
3500
3200
3000
2500
2600
2000
1500
1000
500
0
0
25
105
50
75
100 125
Ambient Temperature (°C)
150
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
The above graph shows the power dissipation of the package at Tjmax = 125°C and Tjmax = 150°C.
Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of
use and the total years of use must be limited as follows:
Total Hours of Use
Total Years of Use (4 hours/day)
13,000 hours
9 years
i
SOT-89-5
PACKAGE DIMENSIONS
DM-SOT-89-5-JE-B
4.5±0.1
1.5±0.1
0.4±0.3
2
5
4.35±0.1
φ1.0
1
4
4
2.5±0.1
1.00±0.2
5
0.4±0.1
0.3±0.2
0.42±0.1
0.1 S
3
0.4±0.1
3
2
1
0.3±0.2
1.6±0.2
S
0.42±0.1
0.42±0.1
0.47±0.1
1.5±0.1
1.5±0.1
SOT-89-5 Package Dimensions
i
POWER DISSIPATION
HSOP-6J
PD-HSOP-6J-(105125150)-JE-A
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51-7.
Measurement Conditions
Item
Environment
Board Material
Board Dimensions
Copper Ratio
Through-holes
Measurement Conditions
Mounting on Board (Wind Velocity = 0 m/s)
Glass Cloth Epoxy Plastic (Four-Layer Board)
76.2 mm × 114.3 mm × 0.8 mm
Outer Layer (First Layer): Less than 95% of 50 mm Square
Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square
Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square
φ 0.3 mm × 28 pcs
Measurement Result
(Ta = 25°C, Tjmax = 125°C)
Item
Measurement Result
Power Dissipation
Thermal Resistance (θja)
Thermal Characterization Parameter (ψjt)
2700 mW
θja = 37°C/W
ψjt = 7°C/W
θja: Junction-to-Ambient Thermal Resistance
ψjt: Junction-to-Top Thermal Characterization Parameter
4000
3400
3500
Power Dissipation PD (mW)
3000
2500
2700
2000
1500
1000
500
0
0
25
105
50
75
100
125
Ambient Temperature (°C)
150
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
The above graph shows the power dissipation of the package at Tjmax = 125°C and Tjmax = 150°C.
Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of
use and the total years of use must be limited as follows:
Total Hours of Use
Total Years of Use (4 hours/day)
13,000 hours
9 years
i
HSOP-6J
PACKAGE DIMENSIONS
DM-HSOP-6J-JE-A
HSOP-6J Package Dimensions
i
POWER DISSIPATION
DFN(PL)1820-6
PD-DFN(PL)1820-6-(105125150)-JE-C
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51.
Measurement Conditions
Item
Measurement Conditions
Environment
Mounting on Board (Wind Velocity = 0 m/s)
Board Material
Glass Cloth Epoxy Plastic (Four-Layer Board)
Board Dimensions
76.2 mm × 114.3 mm × 0.8 mm
Outer Layer (First Layer): Less than 95% of 50 mm Square
Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square
Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square
0.2 mm × 36 pcs
Copper Ratio
Through-holes
Measurement Result
(Ta = 25°C, Tjmax = 125°C)
Item
Measurement Result
Power Dissipation
2200 mW
Thermal Resistance (ja)
ja = 45°C/W
Thermal Characterization Parameter (ψjt)
ψjt = 18°C/W
ja: Junction-to–ambient thermal resistance.
ψjt: Junction–to-top of package thermal characterization parameter.
3000
2700
Power Dissipation PD (mW)
2500
2200
2000
1500
1000
500
0
0
25
105
50
75
100
125
Ambient Temperature (°C)
150
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
The above graph shows the power dissipation of the package at Tjmax = 125°C and Tjmax = 150°C.
Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of
use and the total years of use must be limited as follows:
Total Hours of Use
13,000 hours
Total Years of Use (4 hours/day)
9 years
i
PACKAGE DIMENSIONS
DFN(PL)1820-6
DM-DFN(PL)1820-6-JE-B
DFN(PL)1820-6 Package Dimensions
*
*
∗ The tab on the bottom of the package is substrate level (GND/VDD). It is recommended that the tab be connected to
the ground plane/the VDD pin on the board, or otherwise be left floating.
i
POWER DISSIPATION
HSOP-8E
PD-HSOP-8E-(105125150)-JE-B
The power dissipation of the package is dependent on PCB material, layout, and environmental conditions.
The following measurement conditions are based on JEDEC STD. 51-7.
Measurement Conditions
Item
Measurement Conditions
Environment
Mounting on Board (Wind Velocity = 0 m/s)
Board Material
Glass Cloth Epoxy Plastic (Four-Layer Board)
Board Dimensions
76.2 mm × 114.3 mm × 0.8 mm
Copper Ratio
Outer Layer (First Layer): Less than 95% of 50 mm Square
Inner Layers (Second and Third Layers): Approx. 100% of 50 mm Square
Outer Layer (Fourth Layer): Approx. 100% of 50 mm Square
Through-holes
φ 0.3 mm × 21 pcs
Measurement Result
(Ta = 25°C, Tjmax = 125°C)
Item
Measurement Result
Power Dissipation
2900 mW
Thermal Resistance (θja)
θja = 34.5°C/W
Thermal Characterization Parameter (ψjt)
ψjt = 10 °C/W
θja: Junction-to–ambient thermal resistance.
ψjt: Junction–to-top of package thermal characterization parameter.
4000
3600
3500
Power Dissipation PD (mW)
3000
2900
2500
2000
1500
1000
500
0
0
25
50
75
100 105 125
150
Ambient Temperature (°C)
Power Dissipation vs. Ambient Temperature
Measurement Board Pattern
The above graph shows the power dissipation of the package at Tjmax = 125°C and Tjmax = 150°C.
Operating the device in the hatched range might have a negative influence on its lifetime. The total hours of
use and the total years of use must be limited as follows:
Total Hours of Use
Total Years of Use (4 hours/day)
13,000 hours
9 years
i
PACKAGE DIMENSIONS
HSOP-8E
DM-HSOP-8E-JE-B
HSOP-8E Package Dimensions
i
1.
2.
3.
4.
5.
6.
7.
8.
9.
10.
11.
12.
13.
The products and the product specifications described in this document are subject to change or discontinuation of production without
notice for reasons such as improvement. Therefore, before deciding to use the products, please refer to our sales representatives for the
latest information thereon.
The materials in this document may not be copied or otherwise reproduced in whole or in part without the prior written consent of us.
This product and any technical information relating thereto are subject to complementary export controls (so-called KNOW controls)
under the Foreign Exchange and Foreign Trade Law, and related politics ministerial ordinance of the law. (Note that the complementary
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or program changes.) Accordingly, when exporting or carrying abroad this product, follow the Foreign Exchange and Foreign Trade
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release of such information is not to be construed as a warranty of or a grant of license under our or any third party's intellectual property
rights or any other rights.
The products listed in this document are intended and designed for use as general electronic components in standard applications (office
equipment, telecommunication equipment, measuring instruments, consumer electronic products, amusement equipment etc.). Those
customers intending to use a product in an application requiring extreme quality and reliability, for example, in a highly specific application
where the failure or misoperation of the product could result in human injury or death should first contact us.
• Aerospace Equipment
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• Life Maintenance Medical Equipment
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In case your company desires to use this product for any applications other than general electronic equipment mentioned above, make
sure to contact our company in advance. Note that the important requirements mentioned in this section are not applicable to cases
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We are making our continuous effort to improve the quality and reliability of our products, but semiconductor products are likely to fail
with certain probability. In order to prevent any injury to persons or damages to property resulting from such failure, customers should be
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The products have been designed and tested to function within controlled environmental conditions. Do not use products under conditions
that deviate from methods or applications specified in this datasheet. Failure to employ the products in the proper applications can lead
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or any consequential damages resulting from misuse or misapplication of the products.
Quality Warranty
8-1. Quality Warranty Period
In the case of a product purchased through an authorized distributor or directly from us, the warranty period for this product shall be
one (1) year after delivery to your company. For defective products that occurred during this period, we will take the quality warranty
measures described in section 8-2. However, if there is an agreement on the warranty period in the basic transaction agreement,
quality assurance agreement, delivery specifications, etc., it shall be followed.
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When it has been proved defective due to manufacturing factors as a result of defect analysis by us, we will either deliver a substitute
for the defective product or refund the purchase price of the defective product.
Note that such delivery or refund is sole and exclusive remedies to your company for the defective product.
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With respect to any defect of this product found after the quality warranty period, the defect will be analyzed by us. On the basis of
the defect analysis results, the scope and amounts of damage shall be determined by mutual agreement of both parties. Then we
will deal with upper limit in Section 8-2. This provision is not intended to limit any legal rights of your company.
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The X-ray exposure can influence functions and characteristics of the products. Confirm the product functions and characteristics in the
evaluation stage.
WLCSP products should be used in light shielded environments. The light exposure can influence functions and characteristics of the
products under operation or storage.
Warning for handling Gallium and Arsenic (GaAs) products (Applying to GaAs MMIC, Photo Reflector). These products use Gallium (Ga)
and Arsenic (As) which are specified as poisonous chemicals by law. For the prevention of a hazard, do not burn, destroy, or process
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